CN101935483A - Low-temperature conductive ink and preparation method thereof - Google Patents
Low-temperature conductive ink and preparation method thereof Download PDFInfo
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- CN101935483A CN101935483A CN 201010293059 CN201010293059A CN101935483A CN 101935483 A CN101935483 A CN 101935483A CN 201010293059 CN201010293059 CN 201010293059 CN 201010293059 A CN201010293059 A CN 201010293059A CN 101935483 A CN101935483 A CN 101935483A
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Abstract
The invention relates to low-temperature conductive ink and a preparation method thereof, and the conductive ink is prepared by the following raw materials by weight percent: 20-30% of thermosetting resin, 65-70% of flaky metal powder, 1-5% of spherical metal powder, 1-2% of coupling agent, 2-5% of curing agent and 0-1% of dispersant. The preparation method of the conductive ink comprises the steps of preparation of component A: fully mixing the raw materials of the thermosetting resin, the flaky metal powder, the spherical metal powder and the coupling agent for component A according to the weight percent, then using a three-roll grinder for grinding and dispersion for 5 to 8 times and leading the component A to form a uniform mixed phase; and preparation of component B: using a stirring machine for dispersion of the curing agent and the dispersant for a component B, and leading the component B to form the uniform mixed phase. The conductive ink has the characteristics of simple operation, capabilities of saving energy consumption and cost and the like, and can be used as a conductive adhesive at normal temperature.
Description
Technical field
The present invention relates to electrically conductive ink, particularly a kind of low-temperature conductive ink and preparation method thereof also can be used as the normal temperature conductive resin.
Background technology
Low-temperature conductive ink is made by fine metal powder and low-temperature curing thermal resin and is applicable to reticulated printing.Can be widely used in thin film switch, Flexible brush electricity,, all can use on the sheet materials such as PET and PC, good printing, electroconductibility, oxidation-resistance, hardness and extremely strong sticking power are arranged at VC.Be widely used in communication goods (mobile telephone), computer (notebook), portable type electronic product, consumer electronics, the network hardware (server etc.), Medical Instruments, domestic electronic appliances and electronicss such as space flight and national defence.Its performance is excellent in far away the traditional circuit equipment, and has environmental protection, characteristics such as efficient and energy-conservation, and its cost is also approaching with traditional material, and very big application prospect is arranged.
Yet general low-temperature pulp must heated baking after the printing in application; And temperature spends general 20 minutes more than 80 degrees centigrade.If can reduce this link of heated baking, or heat under lower temperature, this can reduce energy consumption, saves cost, accelerates efficient.And the not anti-high temperature of the material that has, the bad application of low-temperature pulp.This low-temperature conductive ink is synthetic by metal-powder and thermoplastic resin lappingout, is suitable for not anti-pyritous material, does not perhaps have the condition heating product.Can be used for electricity among a small circle and lead the electrocondution slurry of less demanding thin film switch, flexible circuit, screened circuit, computor-keyboard circuit and other cryogenic materials; The conductive adhesive and the conductive seal that are used for multiple materials such as metal, plastics, film, glass are simultaneously done conductive resin etc.
Summary of the invention
The object of the present invention is to provide a kind of good low-temperature conductive ink, can be used for thin film switch, flexible print circuit, at computer keyboard, keyboard of notebook computer and such as field of household appliances such as microwave oven, washing machine can be among a small circle application.Be used for conductive adhesive simultaneously and conductive seal is done conductive resin.
Another object of the present invention is to provide a kind of preparation method of electrically conductive ink.
The objective of the invention is to be achieved through the following technical solutions, a kind of electrically conductive ink is characterized in that, this electrically conductive ink is formed by the feedstock production of following mass percentage content respectively:
The A component:
Thermosetting resin 20-30%;
Flaky metal powder 65-70%;
Spherical metal-powder 1-5%;
Coupling agent 0.5-1%;
The B component:
Solidifying agent 2-5%;
Dispersion agent 0.1-0.5%.
Described thermosetting resin is a Resins, epoxy.
Described flaky metal powder radius is the flaky metal powder of 0.1-10 μ m; Select copper powder, silver powder or nickel powder for use.
The spherical powder that described spherical metal-powder radius is 0.1-6 μ m; Select copper powder, silver powder or nickel powder for use.
Described coupling agent is a silane coupling agent, KH-550, KH-551, KH-590 or KH-602.
Described solidifying agent is selected modified amine curing agent for use, modified fatty amine, modified aromatic amine or modified multicomponent amine.
Described dispersion agent is a DA type dispersion agent.
The present invention gives the preparation method of this electrically conductive ink, and this method comprises the steps:
Preparation A component: with 20-30% thermosetting resin, 65-70% flaky metal powder, the spherical metal-powder of 1-5% and the 0.5-1% coupling agent raw material thorough mixing of weight percent, use three-roll grinder to disperse 5 to 8 times then according to one kilogram of every grinding all over 3-15 minute, make it to form uniform mixed phase, standby;
Preparation B component: with the 2-5% solidifying agent and the 0.1-0.5% dispersion agent of mass percent, use stirrer to disperse, make it to form uniform mixed phase, standby;
A component and B component are mixed under normal temperature or low temperature, promptly get electrically conductive ink.
Resins, epoxy+curative systems that the present invention uses is that normal temperature or low temperature are realized solidified down.Therefore, this slurry A component can realize film-forming with after the B component mixes mutually in normal temperature or under the low temperature when using.Reduce this link of heated baking; Perhaps in general 50 ℃ of heating down.Can be applicable to not anti-pyritous material among a small circle, be used for conductive adhesive simultaneously and conductive seal is done conductive resin etc.
Embodiment
Below by specific embodiment the present invention is described in further detail.Need to prove that following embodiment only is used to illustrate the present invention, but be not limited to practical range of the present invention.
Unless otherwise indicated, the following raw material add-on that adopts of the present invention is mass percent.
Embodiment 1
The A component:
Resins, epoxy 25%;
Flake silver powder 67%
Spherical silver powder 3.5%;
KH-550 1％
The B component:
Modified fatty amine 3%;
DA type dispersion agent 0.5%.
It is 0.1-10 μ m that metal-powder described in the above-mentioned electrically conductive ink component requires to select plate, radius for use.
It is 0.1-6 μ m that metal-powder described in the above-mentioned electrically conductive ink component requires to select spherical powder, radius for use.
Preparation A component: with above-mentioned thermosetting resin Resins, epoxy, sheet metal silver powder, spherical argent powder and coupling agent KH-550 raw material thorough mixing, use three-roll grinder (SDV1300, Switzerland's cloth are reined in) to grind then and disperse (one kilogram every all over 3 minutes) 6 times, make it to form uniform mixed phase, promptly get the A component.
Preparation B component: with above-mentioned curing agent modified aliphatic amide and DA type dispersion agent, use stirrer to disperse, make it to form uniform mixed phase, promptly get the B component.
A component and B component at normal temperatures or after mixing under the low temperature, are promptly got electrically conductive ink.
Embodiment 2
The A component:
Resins, epoxy 20%;
Sheet nickel powder 70%
Spherical nickel powder 3.5%;
KH-551 1％
The B component:
Modified aromatic amine 5%;
DA type dispersion agent 0.5%.
It is 0.1-10 μ m that metal-powder described in the above-mentioned electrically conductive ink component requires to select plate, radius for use.
It is 0.1-6 μ m that metal-powder described in the above-mentioned electrically conductive ink component requires to select spherical powder, radius for use.
Preparation A component: with above-mentioned thermosetting resin Resins, epoxy, sheet metal nickel by powder, spherical metallic nickel powder and coupling agent KH-551 raw material thorough mixing, use three-roll grinder (SDV1300, Switzerland's cloth are reined in) to grind then and disperse (one kilogram every all over 5 minutes) 6 times, make it to form uniform mixed phase, promptly get the A component.
Preparation B component: with above-mentioned curing agent modified aromatic amine and DA type dispersion agent, use stirrer to disperse, make it to form uniform mixed phase, promptly get the B component.
A component and B component at normal temperatures or after mixing under the low temperature, are promptly got electrically conductive ink.
Embodiment 3
The A component:
Resins, epoxy 28%;
Flake silver powder 65%
Spherical silver powder 2.5%;
KH-590 1％
The B component:
Modified multicomponent amine 3%;
DA type dispersion agent 0.5%.
It is 0.1-10 μ m that metal-powder described in the above-mentioned electrically conductive ink component requires to select plate, radius for use.
It is 0.1-6 μ m that metal-powder described in the above-mentioned electrically conductive ink component requires to select spherical powder, radius for use.
Preparation A component: with above-mentioned thermosetting resin Resins, epoxy, sheet metal silver powder, spherical argent powder and coupling agent KH-590 raw material thorough mixing, use three-roll grinder (SDV1300, Switzerland's cloth are reined in) to grind then and disperse (one kilogram every all over 8 minutes) 5 times, make it to form uniform mixed phase, promptly get the A component.
Preparation B component: with above-mentioned curing agent modified polyamine and DA type dispersion agent, use stirrer to disperse, make it to form uniform mixed phase, promptly get the B component.
A component and B component at normal temperatures or after mixing under the low temperature, are promptly got electrically conductive ink.
Embodiment 4
The A component:
Resins, epoxy 30%;
Flake silver powder 65%
Spherical silver powder 1.5%;
KH-602 0.5％
The B component:
Modified multicomponent amine 2.5%;
DA type dispersion agent 0.5%.
It is 0.1-10 μ m that metal-powder described in the above-mentioned electrically conductive ink component requires to select plate, radius for use.
It is 0.1-6 μ m that metal-powder described in the above-mentioned electrically conductive ink component requires to select spherical powder, radius for use.
Preparation A component: with above-mentioned thermosetting resin Resins, epoxy, sheet metal silver powder, spherical argent powder and coupling agent KH-602 raw material thorough mixing, use three-roll grinder (SDV1300, Switzerland's cloth are reined in) to grind then and disperse (one kilogram every all over 10 minutes) 7 times, make it to form uniform mixed phase, promptly get the A component.
Preparation B component: with above-mentioned curing agent modified polyamine and DA type dispersion agent, use stirrer to disperse, make it to form uniform mixed phase, promptly get the B component.
A component and B component at normal temperatures or after mixing under the low temperature, are promptly got electrically conductive ink.
Embodiment 5
The A component:
Resins, epoxy 25%;
Flake copper 66%
Spherical copper powder 5%;
KH-550 1％
The B component:
Modified multicomponent amine 2.9%;
DA type dispersion agent 0.1%.
It is 0.1-10 μ m that metal-powder described in the above-mentioned electrically conductive ink component requires to select plate, radius for use.
It is 0.1-6 μ m that metal-powder described in the above-mentioned electrically conductive ink component requires to select spherical powder, radius for use.
Preparation A component: with above-mentioned thermosetting resin Resins, epoxy, sheet metal copper powder, spherical metallic copper powder and coupling agent KH-550 raw material thorough mixing, use three-roll grinder (SDV1300, Switzerland's cloth are reined in) to grind then and disperse (one kilogram every all over 15 minutes) 7 times, make it to form uniform mixed phase, promptly get the A component.
Preparation B component: with above-mentioned curing agent modified polyamine DA type dispersion agent, use stirrer to disperse, make it to form uniform mixed phase, promptly get the B component.
A component and B component at normal temperatures or after mixing under the low temperature, are promptly got electrically conductive ink.
Embodiment 6
The A component:
Resins, epoxy 26%;
Flake copper 70%;
Spherical copper powder 1%;
KH-550 0.8％；
The B component:
Modified fatty amine 2%;
DA type dispersion agent 0.2%.
It is 0.1-10 μ m that metal-powder described in the above-mentioned electrically conductive ink component requires to select plate, radius for use.
It is 0.1-6 μ m that metal-powder described in the above-mentioned electrically conductive ink component requires to select spherical powder, radius for use.
Preparation A component: with above-mentioned thermosetting resin Resins, epoxy, sheet metal copper powder, spherical metallic copper powder and coupling agent KH-550 raw material thorough mixing, use three-roll grinder (SDV1300, Switzerland's cloth are reined in) to grind then and disperse (one kilogram every all over 10 minutes) 8 times, make it to form uniform mixed phase, promptly get the A component.
Preparation B component: with above-mentioned curing agent modified aliphatic amide DA type dispersion agent, use stirrer to disperse, make it to form uniform mixed phase, promptly get the B component.
A component and B component at normal temperatures or after mixing under the low temperature, are promptly got electrically conductive ink.
Claims (8)
1. an electrically conductive ink is characterized in that, this electrically conductive ink is formed by the feedstock production of following mass percentage content respectively:
The A component:
Thermosetting resin 20-30%;
Flaky metal powder 65-70%;
Spherical metal-powder 1-5%;
Coupling agent 0.5-1%;
The B component:
Solidifying agent 2-5%;
Dispersion agent 0.1-0.5%.
2. a kind of electrically conductive ink according to claim 1 is characterized in that, described thermosetting resin is a Resins, epoxy.
3. a kind of electrically conductive ink according to claim 1 is characterized in that, described flaky metal powder radius is the flaky metal powder of 0.1-10 μ m; Select copper powder, silver powder or nickel powder for use.
4. a kind of electrically conductive ink according to claim 1 is characterized in that, the spherical powder that described spherical metal-powder radius is 0.1-6 μ m; Select copper powder, silver powder or nickel powder for use.
5. a kind of electrically conductive ink according to claim 1 is characterized in that, described coupling agent is a silane coupling agent, KH-550, KH-551, KH-590 or KH-602.
6. a kind of electrically conductive ink according to claim 1 is characterized in that described solidifying agent is selected modified amine curing agent for use, modified fatty amine, modified aromatic amine or modified multicomponent amine.
7. a kind of electrically conductive ink according to claim 1 is characterized in that, described dispersion agent is a DA type dispersion agent.
8. the preparation method of a kind of electrically conductive ink according to claim 1 is characterized in that, this method comprises the steps:
Preparation A component: with 20-30% thermosetting resin, 65-70% flaky metal powder, the spherical metal-powder of 1-5% and the 0.5-1% coupling agent raw material thorough mixing of mass percent, use three-roll grinder to disperse 5 to 8 times then, make it to form uniform mixed phase according to one kilogram of every grinding all over 3-15 minute;
Preparation B component: with the 2-5% solidifying agent and the 0.1-0.5% dispersion agent of mass percent, use stirrer to disperse, make it to form uniform mixed phase;
A component and B component are mixed under normal temperature or low temperature, promptly get electrically conductive ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010293059 CN101935483A (en) | 2010-09-27 | 2010-09-27 | Low-temperature conductive ink and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010293059 CN101935483A (en) | 2010-09-27 | 2010-09-27 | Low-temperature conductive ink and preparation method thereof |
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| CN101935483A true CN101935483A (en) | 2011-01-05 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102190980A (en) * | 2011-03-28 | 2011-09-21 | 彩虹集团公司 | Low-temperature conductive adhesive and preparation method thereof |
| CN103059767A (en) * | 2013-01-15 | 2013-04-24 | 宁波晶鑫电子材料有限公司 | Conductive silver paste with high-temperature resistance and low sheet resistance and preparation method of conductive silver paste |
| US9416290B2 (en) | 2012-12-28 | 2016-08-16 | Nthdegree Technologies Worldwide Inc. | Nickel inks and oxidation resistant and conductive coatings |
| CN107325627A (en) * | 2017-08-28 | 2017-11-07 | 厦门大学 | Electrically conductive ink low-temperature setting composition and preparation method thereof |
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| CN1354208A (en) * | 2000-11-16 | 2002-06-19 | 国家淀粉及化学投资控股公司 | Conductive ink composition |
| CN101314680A (en) * | 2007-05-30 | 2008-12-03 | 比亚迪股份有限公司 | Electrically-conducting paint, preparation method and uses thereof |
| CN101567228A (en) * | 2008-04-23 | 2009-10-28 | 松下电器产业株式会社 | Conductive paste and mounting structure using the same |
| CN101717557A (en) * | 2008-10-09 | 2010-06-02 | 北京印刷学院 | Hot curing conductive silver slurry for manufacturing radio frequency identification (RFID) tag antenna |
| CN101864211A (en) * | 2010-06-22 | 2010-10-20 | 彩虹集团公司 | Low-temperature conductive ink and preparation method thereof |
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2010
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1354208A (en) * | 2000-11-16 | 2002-06-19 | 国家淀粉及化学投资控股公司 | Conductive ink composition |
| CN101314680A (en) * | 2007-05-30 | 2008-12-03 | 比亚迪股份有限公司 | Electrically-conducting paint, preparation method and uses thereof |
| CN101567228A (en) * | 2008-04-23 | 2009-10-28 | 松下电器产业株式会社 | Conductive paste and mounting structure using the same |
| CN101717557A (en) * | 2008-10-09 | 2010-06-02 | 北京印刷学院 | Hot curing conductive silver slurry for manufacturing radio frequency identification (RFID) tag antenna |
| CN101864211A (en) * | 2010-06-22 | 2010-10-20 | 彩虹集团公司 | Low-temperature conductive ink and preparation method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102190980A (en) * | 2011-03-28 | 2011-09-21 | 彩虹集团公司 | Low-temperature conductive adhesive and preparation method thereof |
| US9416290B2 (en) | 2012-12-28 | 2016-08-16 | Nthdegree Technologies Worldwide Inc. | Nickel inks and oxidation resistant and conductive coatings |
| US9815998B2 (en) | 2012-12-28 | 2017-11-14 | Printed Energy Pty Ltd | Nickel inks and oxidation resistant and conductive coatings |
| US10329444B2 (en) | 2012-12-28 | 2019-06-25 | Printed Energy Pty Ltd | Nickel inks and oxidation resistant and conductive coatings |
| US10961408B2 (en) | 2012-12-28 | 2021-03-30 | Printed Energy Pty Ltd | Nickel inks and oxidation resistant and conductive coatings |
| CN103059767A (en) * | 2013-01-15 | 2013-04-24 | 宁波晶鑫电子材料有限公司 | Conductive silver paste with high-temperature resistance and low sheet resistance and preparation method of conductive silver paste |
| CN103059767B (en) * | 2013-01-15 | 2015-06-17 | 宁波晶鑫电子材料有限公司 | Conductive silver paste with high-temperature resistance and low sheet resistance and preparation method of conductive silver paste |
| CN107325627A (en) * | 2017-08-28 | 2017-11-07 | 厦门大学 | Electrically conductive ink low-temperature setting composition and preparation method thereof |
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Open date: 20110105 |