CN101916894A - Method for welding inner conductor of filter and PCB and cavity filter - Google Patents
Method for welding inner conductor of filter and PCB and cavity filter Download PDFInfo
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- CN101916894A CN101916894A CN2010101747663A CN201010174766A CN101916894A CN 101916894 A CN101916894 A CN 101916894A CN 2010101747663 A CN2010101747663 A CN 2010101747663A CN 201010174766 A CN201010174766 A CN 201010174766A CN 101916894 A CN101916894 A CN 101916894A
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Abstract
The invention discloses a method for welding an inner conductor of a filter and a PCB and a cavity filter. By adjusting the position of the inner conductor first, a distance between the top surface of the inner conductor and the lower surface of the PCB meets the requirement; and the influence of the processing and manufacturing error between the inner conductor and the PCB, the PCB board assembly error and the like on the product required height can be avoided by welding the inner conductor on the PCB. Therefore, that the distance from the top surface of the inner conductor to a reference plane of the filter meets the product requirements is effectively guaranteed.
Description
Technical field
The present invention relates to the radio-frequency devices technical field, be specifically related to the welding method of a kind of inner conductor of filter and pcb board, and a kind of cavity body filter.
Background technology
Filter is widely used in the communications field as a kind of frequency selection device, especially field of radio frequency communication.In the base station, filter is used to select signal of communication, clutter or interference signal that the filtering communication signal frequency is outer.
At present, generally adopt cavity body filter in the base station system, cavity body filter comprises assemblies such as cavity, cover plate, inner wire, pcb board, the inner wire that has directly is welded on the pcb board, filter usually require with the end face of inner wire to the filter datum level be controlled at a very narrow scope apart from tolerance, for example+/-0.15mm.
In the prior art, adopt following method that inner conductor of filter is welded on the pcb board: as shown in Figure 1, on inner wire 101, process a step, the via hole 102 that adapts with the inner wire shape is set on pcb board 103,, as spacing inner wire is fitted on the pcb board 103 with the step on the inner wire, then from the lower surface of pcb board, inner wire and pcb board are welded together, form weld part 104.
In research and practice process to prior art, the present inventor finds, in the prior art, because be as spacing with the step that processes on the inner wire, be fitted on the pcb board and weld, this just needs strict control pcb board thickness deviation, the making tolerance of inner wire, the build-up tolerance when being assemblied in inner wire on the pcb board, owing to want the tolerance index of strict control more and be distributed in different process procedures, be difficult to reach the requirement height of product, especially in batch process, product fraction defective height.
Summary of the invention
The invention provides the welding method of a kind of inner conductor of filter and pcb board, can eliminate the influence of the processing and fabricating error, pcb board rigging error etc. of inner wire and pcb board to the product requirement height, guarantee that effectively the inner wire end face meets product requirement to the distance of filter datum level, reduce the product fraction defective, enhance productivity, reduce production costs.
The inner conductor of filter that the embodiment of the invention provides and the welding method of pcb board, described pcb board is provided with the connecting hole that adapts with described inner wire, comprising: inner wire is inserted connecting hole on the pcb board; Regulate the position of inner wire, the inner wire end face is met the demands to the distance between the pcb board lower surface; Inner wire is welded on the pcb board.
A kind of inner conductor of filter that the embodiment of the invention provides and the welding method of pcb board, adopt the position of regulating inner wire earlier, the inner wire end face is met the demands to the distance between the pcb board lower surface, and then inner wire is welded on the pcb board, so just can avoid only utilizing in the prior art step spacing, the position of inner wire is determined according to the position of step, weld then, and the inner wire that causes is highly unstable after being welded on the pcb board, the problem that change in size is bigger, eliminated the pcb board thickness deviation, the manufacturing deviation of inner wire and assembling deviation are to the influence of inner wire end face to filter datum level distance, guarantee that effectively the inner wire end face meets product requirement to the distance of filter datum level, reduce the product fraction defective, enhance productivity, reduce production costs.
The present invention also provides a kind of cavity body filter, comprises cavity, cover plate, inner wire, pcb board, is useful on the connecting hole that inserts described inner wire on the described pcb board, and the position of described inner wire is determined to the distance between the pcb board lower surface according to the inner wire end face.
The cavity body filter that the embodiment of the invention provides, determine the position of described inner wire to the distance between the pcb board lower surface according to the inner wire end face, it is highly unstable after the inner wire that can avoid utilizing spacing welding of step in the prior art and cause is welded on the pcb board, the problem that change in size is bigger, eliminated the pcb board thickness deviation, the manufacturing deviation of inner wire and assembling deviation are to the influence of inner wire end face to filter datum level distance, guarantee that effectively the inner wire end face meets product requirement to the distance of filter datum level, thereby guarantee that Filter Design meets product requirement, reduce the product fraction defective, enhance productivity, reduce production costs.
Description of drawings
In order to be illustrated more clearly in the technical scheme in the embodiment of the invention, the accompanying drawing of required use is done to introduce simply in will describing embodiment below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the partial schematic sectional view of a kind of cavity body filter of the prior art;
Fig. 2 (a) is the schematic diagram of a kind of inner wire in the embodiment of the invention one;
Fig. 2 (b) is the schematic diagram of a kind of pcb board in the embodiment of the invention one;
Fig. 2 (c) is the schematic diagram after the inner wire in the embodiment of the invention one inserts pcb board;
Fig. 2 (d) is the cross-sectional schematic of Fig. 2 (c);
Fig. 2 (e) is the partial schematic sectional view that adopts a kind of cavity body filter in the embodiment of the invention one;
Fig. 3 is the local enlarged diagram of Fig. 2 (e);
Fig. 4 (a) is the schematic diagram of a kind of inner wire in the embodiment of the invention two;
Fig. 4 (b) is the schematic diagram of a kind of pcb board in the embodiment of the invention two;
Fig. 4 (c) is the schematic diagram after the inner wire in the embodiment of the invention two inserts pcb board;
Fig. 4 (d) is the cross-sectional schematic of Fig. 4 (c);
Fig. 4 (e) is the partial schematic sectional view that adopts a kind of cavity body filter in the invention process two;
Fig. 5 (a) is the local enlarged diagram of five kinds of weld parts in the embodiment of the invention two to Fig. 5 (d);
Fig. 5 (e) is the schematic diagram of the pcb board that adapts with the inner wire shape shown in Fig. 5 (d);
Fig. 6 (a) is the schematic diagram that has three kinds of pcb boards of fixing hole in the embodiment of the invention two to Fig. 6 (c);
Fig. 7 is the partial schematic sectional view of a kind of cavity body filter in the embodiment of the invention three.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
The welding method of embodiment one, a kind of inner conductor of filter and pcb board, with reference to figure 2 (a), Fig. 2 (b), described pcb board 203 is provided with the connecting hole 202 that adapts with described inner wire 201, comprising in the lump:
A1 is with the connecting hole 202 on the inner wire 201 insertion pcb boards 203;
In the present embodiment, a kind of inner wire is provided, shown in Fig. 2 (a), screwed hole is not set on the inner wire 201, certainly, screwed hole or other locking mechanisms also can be set on the inner wire, and the concrete structure of inner wire structure can be according to Filter Design needs generation various deformation, and its specific implementation is not construed as limiting the invention; Provide a kind of pcb board that has connecting hole, shown in Fig. 2 (b); Connecting hole 202 with inner wire 201 inserts on the pcb board 203 shown in Fig. 2 (c) and Fig. 2 (d), can adopt the anchor clamps, other instruments or artificial realization that design.The size of the size of connecting hole 202 and described inner wire 201 adapts on the pcb board.
A2 shown in Fig. 2 (d), regulates the position of inner wire, and inner wire end face 212 is met the demands to the distance between the pcb board lower surface 213;
In the present embodiment, can adopt anchor clamps or other instruments control inner wire, regulate the position of inner wire end face 212.
A3 is welded on inner wire 201 on the pcb board 203.
In the present embodiment, described pcb board comprises pcb board upper surface 220 and pcb board lower surface 213, described inner wire inserts connecting hole 202 from described pcb board upper surface 220, pass from described pcb board lower surface 213, described welding comprises that one side welds together inner wire and pcb board at least from pcb board upper surface 220 and pcb board lower surface 213.That is to say that inner wire is welded on can following three kinds of implementations on the pcb board:
Mode one, inner wire and pcb board are welded together from the upper surface of pcb board.
Mode two, inner wire and pcb board are welded together from the lower surface of pcb board.
Mode three, inner wire and pcb board are welded together, and inner wire and pcb board are welded together from the lower surface of pcb board from the upper surface of pcb board.
Be appreciated that, if after inner wire is inserted connecting hole, in the connecting hole position, between inner wire and the pcb board slit is arranged, so when first face from pcb board welds, because the flowability of scolding tin, scolding tin just can be by above-mentioned slit second from first surface current of pcb board to pcb board, thereby form the weldering bag on second of pcb board.If after first welding of pcb board, also formed good weldering bag on second of pcb board, weld from second face of pcb board with regard to not needing again so.Choosing of concrete implementation can require to select according to actual conditions and product design, is not construed as limiting the invention.
Choosing of concrete implementation can require to select according to actual conditions and product design, is not construed as limiting the invention.
In the present embodiment, in order to guarantee after the pcb board that will be welded with inner wire is assemblied on the cavity, the inner wire end face satisfies the requirement for height of product to the distance of filter datum level, shown in Fig. 2 (e), before being welded to inner wire on the pcb board, can regulate the position of inner wire, inner wire end face 212 is satisfied to the distance H between the PCB lower surface 213 2:
H2=H+H1;
Wherein, the H representative products requires height, and promptly inner wire end face 212 is to the distance of filter datum level 211, and H1 represents the distance of filter datum level 211 to pcb board installed surface 214.
Be appreciated that, fixing for the ease of welding, the connecting hole on the pcb board can be arranged to adapt with the shape of inner wire, the shape of the shape of connecting hole and inner wire has various deformation on the pcb board, accordingly, inner wire is welded on different implementations is arranged on the pcb board.
In the present embodiment, inner wire can be column, as shown in Figure 3, connecting hole on the PCB is the through hole that adapts with the inner wire shape, at this moment, from the upper surface of pcb board inner wire and pcb board are welded together, form weld part 301, lower surface from pcb board welds together inner wire and pcb board again, form weld part 302, make the part of pcb board upper surface, all be full of scolding tin near the part between part, inner wire outer wall and the connecting hole inwall of inner wire, the close inner wire of pcb board lower surface.
In the embodiment of the invention, inner wire also can not be column, referring to embodiment two.
The welding method of embodiment two, a kind of inner conductor of filter and pcb board, with reference to figure 4 (a), Fig. 4 (b), described pcb board 403 is provided with the connecting hole 402 that adapts with described inner wire 401, comprising in the lump:
A1 is with the connecting hole 402 on the inner wire 401 insertion pcb boards 403;
In the present embodiment, provide a kind of inner wire 401, comprise inner wire main body 441 and inner wire link 442, shown in Fig. 4 (a); Provide a kind of pcb board 403 that has connecting hole 402, shown in Fig. 4 (b); With the connecting hole 402 of inner wire 401 insertion pcb boards 403, shown in Fig. 4 (c) and Fig. 4 (d), can adopt the anchor clamps, other instruments or artificial realization that design.The size of the size of connecting hole 402 and described inner wire 401 adapts on the pcb board.
A2 with reference to figure 4 (e), regulates the position of inner wire 401, makes inner wire end face 412 satisfy necessary requirement to the distance between the pcb board lower surface 413;
Be appreciated that identical with embodiment one, in the present embodiment, can adopt anchor clamps to regulate the position of described inner wire 401, also can adopt other instrument control inner wires, thereby regulate the position of inner wire, inner wire end face 412 is met the demands to the distance between the pcb board lower surface 413.
In the present embodiment, identical with embodiment one, in order to guarantee after the pcb board that will be welded with inner wire is assemblied on the cavity, the inner wire end face satisfies the requirement for height of product to the distance of filter datum level, shown in Fig. 4 (e), before being welded to inner wire 401 on the pcb board 403, can regulate the position of inner wire 401, inner wire end face 412 is satisfied to the distance H between the PCB lower surface 413 2:
H2=H+H1;
Wherein, the H representative products requires height, and promptly inner wire end face 412 is to the distance of filter datum level 411, and H1 represents the distance of filter datum level 411 to pcb board installed surface 414.
A3 is welded on inner wire 401 on the pcb board 403.
In the present embodiment, shown in Fig. 4 (a) and Fig. 4 (d), inner wire 401 comprises inner wire main body 441 and inner wire link 442, and inner wire link 442 is welded on the pcb board 403, and the cross-sectional area of inner wire link 442 is less than the cross-sectional area of inner wire main body 441.
In the present embodiment, on the inner wire screwed hole can be set, also screwed hole can be set, also other locking mechanisms can be set, according to the Filter Design needs, the structure of inner wire can have various deformation, and its specific implementation is not construed as limiting the invention.
The structure of inner wire main body and inner wire link can have multiple implementation; concrete the present invention can take following dual mode; be appreciated that; following dual mode only is an implementation preferably of the present invention; those skilled in the art do not pay other conventional distortion that creative work obtains on the basis of following dual mode, all belong to protection scope of the present invention.
Mode one, inner wire link are coniform or hemispherical, its profile is shown in Fig. 5 (a), Fig. 5 (b), the cross section of inner wire link is circular, the cross section of inner wire main body also is circular, and the two is compared, the radius of the cross section circle of inner wire main body link is less than the radius of the cross section circle of described inner wire main body, and promptly the cross-sectional area of inner wire link is less than the cross-sectional area of described inner wire main body.After inner wire and the pcb board welding, form weld part 501.
Mode two, inner wire link and inner wire main body are notch cuttype, its profile is shown in Fig. 5 (c), the cross-sectional area of inner wire link is less than the cross-sectional area of inner wire main body, form step surface 510 at inner wire link and inner wire main body joining part, when regulating the position of inner wire, can between pcb board upper surface and inner wire step surface, reserve a gap, such as 0.25mm, when welding, form weld part 501, scolding tin can be full of described gap, the position of inner wire is to be determined by the product requirement height like this, and do not have positive connection, thereby eliminated the pcb board thickness deviation with the position of step, the manufacturing deviation of inner wire and assembling deviation are to the influence of inner wire end face to filter datum level distance.At this moment, the pcb board that adapts with described inner wire shape is shown in Fig. 4 (b).
Be appreciated that, inner wire link and inner wire main body can be one-body molded through cutting or other processing technologys, at this moment, the inner wire link is the part of cylinder, described notch cuttype can also have the various deformation mode, for example, its generalized section can be shown in Fig. 5 (d), and corresponding pcb board is shown in Fig. 5 (e).
Be appreciated that choosing of concrete implementation can require to select according to actual conditions and product design, is not construed as limiting the invention.
As further improvement, can also around the described connecting hole on the described pcb board, be provided for reinforcing the fixing hole of weld part to the embodiment of the invention.Fixing hole can not be communicated with connecting hole, and shown in Fig. 6 (a), fixing hole also can be communicated with connecting hole, shown in 6 (b) and Fig. 6 (c).It is one or more to be appreciated that described fixing hole can have, and concrete number is not construed as limiting the invention.Weld from the one side of pcb board, because the flowability of scolding tin also can form the weldering bag usually on the another side of pcb board.By fixing hole is set around the connecting hole on pcb board, scolding tin just can be by fixing hole second from first surface current of pcb board to pcb board.If after first welding of pcb board, also formed good weldering bag on second of pcb board, weld from second face of pcb board with regard to not needing again so, so just can simplify the technological process of production, enhance productivity, reduce production costs.
As the further improvement to the embodiment of the invention, the length L of described inner wire main body satisfies:
L<H+H1-H5;
Wherein, the H representative products requires height, and promptly the inner wire end face is to the distance of filter datum level, and H1 represents the distance of filter datum level to the pcb board installed surface, and H5 represents the thickness of pcb board.
The inner conductor of filter that the embodiment of the invention provides and the welding method of pcb board, adopt the position of regulating inner wire earlier, the inner wire end face is met the demands to the distance between the pcb board lower surface, and then inner wire is welded on the pcb board, so just can avoid only utilizing in the prior art step spacing, the position of inner wire is determined according to the position of step, weld then, and the inner wire that causes is highly unstable after being welded on the pcb board, the problem that change in size is bigger, eliminated the pcb board thickness deviation, the manufacturing deviation of inner wire and assembling deviation are to the influence of inner wire end face to filter datum level distance, guarantee that effectively the inner wire end face meets product requirement to the distance of filter datum level, reduce the product fraction defective, enhance productivity, reduce production costs.
One of ordinary skill in the art will appreciate that: all or part of step that realizes said method embodiment can be finished by the relevant hardware of program command, aforesaid program can be stored in the computer read/write memory medium, this program is carried out the step that comprises said method embodiment when carrying out; And aforesaid storage medium comprises: read-only memory (Read-Only Memory, ROM), random access device (RandomAccess Memory, RAM), various media that can be program code stored such as magnetic disc or CD.
Embodiment three, a kind of cavity body filter, comprise cavity, cover plate, inner wire 701, pcb board 703, be useful on the connecting hole that inserts described inner wire on the described pcb board, the position of described inner wire 701 is determined to the distance between the pcb board lower surface 713 according to inner wire end face 712.
Described pcb board comprises pcb board upper surface 720 and pcb board lower surface 713, described inner wire 701 inserts connecting hole from described pcb board upper surface 720, pass from described pcb board lower surface 713, in described connecting hole position, at least one side and the welding of described inner wire in described pcb board upper surface, the described pcb board lower surface, formation weld part 731 and/or weld part 732.Be appreciated that, if after inner wire is inserted connecting hole, in the connecting hole position, between inner wire and the pcb board slit is arranged, so when first face from pcb board welds, because the flowability of scolding tin, scolding tin just can be by above-mentioned slit second from first surface current of pcb board to pcb board, thereby form the weldering bag on second of pcb board.If after first welding of pcb board, also formed good weldering bag on second of pcb board, weld from second face of pcb board with regard to not needing again so.Choosing of concrete implementation can require to select according to actual conditions and product design, is not construed as limiting the invention.
In the present embodiment, can adopt anchor clamps or other instruments control inner wire, regulate the position of inner wire 701, inner wire end face 712 is met the demands to the distance between the pcb board lower surface 713.
Be appreciated that, fixing for the ease of welding, the connecting hole on the pcb board can be arranged to adapt with the shape of inner wire, the shape of the shape of connecting hole and inner wire has various deformation on the pcb board, accordingly, inner wire is welded on different implementations is arranged on the pcb board.
As a kind of preferred implementation of the present invention, in the present embodiment, inner wire comprises inner wire main body and inner wire link, described inner wire link is welded on the pcb board, the cross-sectional area of described inner wire link is less than the cross-sectional area of described inner wire main body, the inner wire main body is cylindric, it is cylindric that the inner wire link also is, and the latter's cross-sectional area is less than the former cross-sectional area, described inner wire link and described inner wire main body are notch cuttype, be appreciated that described inner wire link also can be coniform or hemispherical.
As further improvement to the embodiment of the invention, identical with embodiment two, can also around the described connecting hole on the described pcb board, be provided for reinforcing the fixing hole of weld part.Fixing hole can not be communicated with connecting hole, can be communicated with connecting hole yet.It is one or more to be appreciated that described fixing hole can have, and concrete number is not construed as limiting the invention.Weld from the one side of pcb board, because the flowability of scolding tin also can form the weldering bag usually on the another side of pcb board.By fixing hole is set around the connecting hole on pcb board, scolding tin just can be by fixing hole second from first surface current of pcb board to pcb board.If after first welding of pcb board, also formed good weldering bag on second of pcb board, weld from second face of pcb board with regard to not needing again so, so just can simplify the technological process of production, enhance productivity, reduce production costs.
In the present embodiment, in order to guarantee after the pcb board that will be welded with inner wire is assemblied on the cavity, the inner wire end face satisfies the requirement for height of product to the distance of filter datum level, as shown in Figure 7, before being welded to inner wire on the pcb board, can regulate the position of inner wire, inner wire end face 712 is satisfied to the distance H between the PCB lower surface 713 2:
H2=H+H1;
Wherein, the H representative products requires height, and promptly inner wire end face 712 is to the distance of filter datum level 711, and H1 represents the distance of filter datum level 711 to pcb board installed surface 714.
The cavity body filter that the embodiment of the invention provides, determine the position of described inner wire to the distance between the pcb board lower surface according to the inner wire end face, it is highly unstable after the inner wire that can avoid utilizing spacing welding of step in the prior art and cause is welded on the pcb board, the problem that change in size is bigger, eliminated the pcb board thickness deviation, the manufacturing deviation of inner wire and assembling deviation are to the influence of inner wire end face to filter datum level distance, guarantee that effectively the inner wire end face meets product requirement to the distance of filter datum level, thereby guarantee that Filter Design meets product requirement, reduce the product fraction defective, enhance productivity, reduce production costs.
More than a kind of inner conductor of filter that the embodiment of the invention provided and welding method and a kind of cavity body filter of pcb board are described in detail, used specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment just is used for helping to understand core concept of the present invention; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (15)
1. the welding method of inner conductor of filter and pcb board, described pcb board is provided with the connecting hole that adapts with described inner wire, comprising:
Inner wire is inserted connecting hole on the pcb board;
Regulate the position of inner wire, the inner wire end face is met the demands to the distance between the pcb board lower surface;
Inner wire is welded on the pcb board.
2. the welding method of inner conductor of filter as claimed in claim 1 and pcb board is characterized in that,
Described pcb board comprises pcb board upper surface and pcb board lower surface, described inner wire inserts connecting hole from described pcb board upper surface, pass from described pcb board lower surface, described welding comprises that one side welds together inner wire and pcb board at least from pcb board upper surface and pcb board lower surface.
3. the welding method of inner conductor of filter as claimed in claim 1 and pcb board is characterized in that, adopts anchor clamps to regulate the position of described inner wire.
4. the welding method of inner conductor of filter as claimed in claim 1 and pcb board is characterized in that,
Described inner wire comprises inner wire main body and inner wire link, and described inner wire link is welded on the pcb board, and the cross-sectional area of described inner wire link is less than the cross-sectional area of described inner wire main body.
5. the welding method of inner conductor of filter as claimed in claim 4 and pcb board is characterized in that,
Described inner wire link and described inner wire main body are notch cuttype.
6. as the welding method of any described inner conductor of filter of claim 1 to 5 and pcb board, it is characterized in that, around the described connecting hole on the described pcb board, have the fixing hole that is used to reinforce weld part.
7. as the welding method of any described inner conductor of filter of claim 1 to 5 and pcb board, it is characterized in that,
Described inner wire end face satisfies to the distance H between the pcb board lower surface 2:
H2=H+H1;
Wherein, the H representative products requires height, and promptly the inner wire end face is to the distance of filter datum level, and H1 represents the distance of filter datum level to the pcb board installed surface.
8. as the welding method of claim 4 or 5 described inner conductor of filter and pcb board, it is characterized in that the length L of described inner wire main body satisfies:
L<H+H1-H5;
Wherein, the H representative products requires height, and promptly the inner wire end face is to the distance of filter datum level, and H1 represents the distance of filter datum level to the pcb board installed surface, and H5 represents the thickness of pcb board.
9. a cavity body filter comprises cavity, cover plate, inner wire, pcb board, is useful on the connecting hole that inserts described inner wire on the described pcb board, it is characterized in that, the position of described inner wire is determined to the distance between the pcb board lower surface according to the inner wire end face.
10. cavity body filter as claimed in claim 9, it is characterized in that, described pcb board comprises pcb board upper surface and pcb board lower surface, described inner wire inserts connecting hole from described pcb board upper surface, pass from described pcb board lower surface, in described connecting hole position, one side and the welding of described inner wire at least in described pcb board upper surface, the described pcb board lower surface.
11. cavity body filter as claimed in claim 9 is characterized in that, adopts anchor clamps to regulate the position of described inner wire.
12. cavity body filter as claimed in claim 9, it is characterized in that, described inner wire comprises inner wire main body and inner wire link, and described inner wire link is welded on the pcb board, and the cross-sectional area of described inner wire link is less than the cross-sectional area of described inner wire main body.
13. cavity body filter as claimed in claim 9 is characterized in that, described inner wire link and described inner wire main body are notch cuttype.
14. as any described cavity body filter of claim of claim 9 to 13, it is characterized in that, around the described connecting hole on the described pcb board, have the fixing hole that is used to reinforce weld part.
15., it is characterized in that described inner wire end face satisfies to the distance H between the pcb board lower surface 2 as any described cavity body filter of claim of claim 9 to 13:
H2=H+H1;
Wherein, the H representative products requires height, and promptly the inner wire end face is to the distance of filter datum level, and H1 represents the distance of filter datum level to the pcb board installed surface.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102074774A (en) * | 2010-12-22 | 2011-05-25 | 深圳市大富科技股份有限公司 | Radio frequency communication equipment |
WO2015035553A1 (en) * | 2013-09-10 | 2015-03-19 | 深圳市大富科技股份有限公司 | Remote radio head unit, cavity filter, coaxial connector assembly, and electrical connector |
CN107994341A (en) * | 2017-11-08 | 2018-05-04 | 湖北三江航天险峰电子信息有限公司 | A kind of antenna feed structure |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4906955A (en) * | 1987-12-10 | 1990-03-06 | Murata Manufacturing Co., Ltd. | Dielectric filter |
JPH08181513A (en) * | 1994-12-26 | 1996-07-12 | Murata Mfg Co Ltd | Dielectric resonator device |
JP2000114810A (en) * | 1998-10-08 | 2000-04-21 | Nippon Antenna Co Ltd | Dielectric filter |
US6559740B1 (en) * | 2001-12-18 | 2003-05-06 | Delta Microwave, Inc. | Tunable, cross-coupled, bandpass filter |
CN101471477A (en) * | 2007-12-27 | 2009-07-01 | 奥雷通光通讯设备(上海)有限公司 | Coupler for passive cavity filter |
CN101517823A (en) * | 2006-09-20 | 2009-08-26 | 朗讯科技公司 | Resonant cavities and method of manufacturing such cavities |
-
2010
- 2010-05-11 CN CN2010101747663A patent/CN101916894A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4906955A (en) * | 1987-12-10 | 1990-03-06 | Murata Manufacturing Co., Ltd. | Dielectric filter |
JPH08181513A (en) * | 1994-12-26 | 1996-07-12 | Murata Mfg Co Ltd | Dielectric resonator device |
JP2000114810A (en) * | 1998-10-08 | 2000-04-21 | Nippon Antenna Co Ltd | Dielectric filter |
US6559740B1 (en) * | 2001-12-18 | 2003-05-06 | Delta Microwave, Inc. | Tunable, cross-coupled, bandpass filter |
CN101517823A (en) * | 2006-09-20 | 2009-08-26 | 朗讯科技公司 | Resonant cavities and method of manufacturing such cavities |
CN101471477A (en) * | 2007-12-27 | 2009-07-01 | 奥雷通光通讯设备(上海)有限公司 | Coupler for passive cavity filter |
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CN102074774A (en) * | 2010-12-22 | 2011-05-25 | 深圳市大富科技股份有限公司 | Radio frequency communication equipment |
CN102074774B (en) * | 2010-12-22 | 2015-05-20 | 深圳市大富科技股份有限公司 | Radio frequency communication equipment |
WO2015035553A1 (en) * | 2013-09-10 | 2015-03-19 | 深圳市大富科技股份有限公司 | Remote radio head unit, cavity filter, coaxial connector assembly, and electrical connector |
CN107994341A (en) * | 2017-11-08 | 2018-05-04 | 湖北三江航天险峰电子信息有限公司 | A kind of antenna feed structure |
CN107994341B (en) * | 2017-11-08 | 2021-08-13 | 湖北三江航天险峰电子信息有限公司 | Antenna feed structure |
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