CN101901806B - AC-DC conversion integration component and integrated circuit using the component - Google Patents
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Abstract
本发明提出一种交直流转换整合元件与使用该元件的集成电路。所述集成电路包含:一直流低压电路;以及与该直流低压电路耦接的交直流转换整合元件,该交直流转换整合元件包括四个二极管,其中第一二极管的阴极与第二二极管的阳极相接,此第一相接节点接收一交流电压的一输入,第三二极管的阴极与第四二极管的阳极相接,此第二相接节点接收该交流电压的另一输入,该第一二极管的阳极与第三二极管的阳极相接,此第三相接节点提供一直流电压的低准位,第二二极管的阴极与第四二极管的阴极相接,此第四相接节点提供一直流电压的高准位。
The present invention provides an AC/DC conversion integration element and an integrated circuit using the element. The integrated circuit includes: a DC low voltage circuit; and an AC/DC conversion integration element coupled to the DC low voltage circuit, the AC/DC conversion integration element includes four diodes, wherein the cathode of the first diode is connected to the anode of the second diode, the first connection node receives an input of an AC voltage, the cathode of the third diode is connected to the anode of the fourth diode, the second connection node receives another input of the AC voltage, the anode of the first diode is connected to the anode of the third diode, the third connection node provides a low level of the DC voltage, the cathode of the second diode is connected to the cathode of the fourth diode, the fourth connection node provides a high level of the DC voltage.
Description
技术领域 technical field
本发明涉及一种交直流转换整合元件与使用该元件的集成电路。The invention relates to an AC/DC conversion integration element and an integrated circuit using the element.
背景技术 Background technique
将交流电转换为直流电,供应给集成电路内部使用,是电子电路中经常使用到的电路结构。如图1所示,现有技术通常使用桥式整流电路10来达成交直流转换,此桥式整流电路10中包含电阻R1,R2以降压,并以四个二极管12,14,16,18达成整流。整流所产生的直流电压再经过电阻R的降压,并以齐纳二极管Z控制降压后的电压上限,之后供应给后级电路50使用。后级电路50可以为各种操作在直流低压下的电路(以下简称低压电路),例如光学传感器、LED控制电路等等。Converting alternating current to direct current and supplying it to the internal use of integrated circuits is a circuit structure often used in electronic circuits. As shown in FIG. 1 , in the prior art, a
现有技术中,桥式整流电路10必须以独立二极管元件来制作,无法与其它电路元件一同整合在集成电路之内,是一项有待改进之处。In the prior art, the
有鉴于此,本发明即提出一种能够与低压电路一同整合在集成电路的内的交直流转换整合元件,与使用该元件的集成电路。In view of this, the present invention proposes an integrated AC/DC conversion component that can be integrated into an integrated circuit together with a low-voltage circuit, and an integrated circuit using the component.
发明内容 Contents of the invention
本发明目的之一在于克服现有技术的不足与缺陷,提出一种能够与低压电路一同整合在集成电路之内的交直流转换整合元件。One of the objectives of the present invention is to overcome the deficiencies and defects of the prior art, and propose an integrated AC/DC conversion component that can be integrated into an integrated circuit together with a low-voltage circuit.
本发明的又一目的在于,提出一种使用交直流转换整合元件的集成电路。Another object of the present invention is to provide an integrated circuit using an AC-DC conversion integrated element.
为达上述目的,就其中一个观点而言,本发明提供了一种交直流转换整合元件,包含:(1)第一传导型态的基板;以及(2)位于基板内的第二传导型态的至少四个井区,每个第二传导型态的井区内包括:(a)位于第二传导型态井区内的第一传导型态的高浓度掺杂区;及(b)位于第二传导型态井区内的第二传导型态的高浓度掺杂区;其中,每个井区与其内的第一与第二传导型态的高浓度掺杂区构成二极管,四个井区构成四个二极管,其中第一二极管的阴极与第二二极管的阳极相接,此第一相接节点接收一交流电压的一输入,第三二极管的阴极与第四二极管的阳极相接,此第二相接节点接收该交流电压的另一输入,该第一二极管的阳极与第三二极管的阳极相接,此第三相接节点提供一直流电压的低准位,第二二极管的阴极与第四二极管的阴极相接,此第四相接节点提供一直流电压的高准位;且其中,此交直流转换整合元件与一直流低压电路制作于同一集成电路中,该第一二极管和第二二极管位于该基板上的一区间,该第三二极管和第四二极管位于该基板上的另一区间,且所述的交直流转换整合元件还包含:设置于上述两区间之间的至少一个MOS晶体管,其栅极接收该交流电压的一输入。In order to achieve the above purpose, from one viewpoint, the present invention provides an AC/DC conversion integrated component, comprising: (1) a substrate of a first conductivity type; and (2) a second conductivity type located in the substrate At least four well regions of the second conductivity type, each well region of the second conductivity type includes: (a) a high-concentration doped region of the first conductivity type located in the well region of the second conductivity type; and (b) located in the well region of the second conductivity type; The high-concentration doped region of the second conductivity type in the well region of the second conductivity type; wherein, each well region and the high-concentration doped regions of the first and second conductivity types in the well region constitute a diode, and the four wells The region constitutes four diodes, wherein the cathode of the first diode is connected to the anode of the second diode, and the first connection node receives an input of an AC voltage, and the cathode of the third diode is connected to the anode of the fourth and second diodes. The anodes of the diodes are connected, the second connection node receives another input of the AC voltage, the anode of the first diode is connected to the anode of the third diode, and the third connection node provides a DC The low level of the voltage, the cathode of the second diode is connected to the cathode of the fourth diode, and the fourth connection node provides a high level of DC voltage; and wherein, the AC-DC conversion integration element and the constant The current and low-voltage circuits are fabricated in the same integrated circuit, the first diode and the second diode are located in one area on the substrate, and the third diode and the fourth diode are located in another area on the substrate , and the AC-DC conversion integration element further includes: at least one MOS transistor disposed between the above two intervals, the gate of which receives an input of the AC voltage.
在其中一种较佳实施形式中,该交直流转换整合元件的各二极管中更包括:位于第二传导型态井区内的第一传导型态的浅掺杂区,且第一传导型态的高浓度掺杂区设置于此浅掺杂区内。在此较佳实施形式中,第二与第四二极管中的第二传导型态的高浓度掺杂区设置于该浅掺杂区内。In one of the preferred implementation forms, each diode of the integrated AC-DC conversion element further includes: a lightly doped region of the first conductivity type located in the well region of the second conductivity type, and the first conductivity type The high-concentration doped region is set in the lightly doped region. In this preferred implementation form, the high-concentration doped regions of the second conduction type in the second and fourth diodes are disposed in the lightly doped regions.
在其中一种较佳实施形式中,该第一二极管和第二二极管位于一区间,该第三二极管和第四二极管位于另一区间,且所述的交直流转换整合元件更包括:设置于上述两区间之间的两个MOS晶体管,其栅极分别与该交流电压的两输入耦接。In one of the preferred implementation forms, the first diode and the second diode are located in one interval, the third diode and the fourth diode are located in another interval, and the AC-DC conversion The integration device further includes: two MOS transistors disposed between the above two intervals, the gates of which are respectively coupled to the two inputs of the AC voltage.
为达上述目的,就另一个观点言,本发明提供了一种集成电路,包含:一直流低压电路;以及与该直流低压电路耦接的交直流转换整合元件,该交直流转换整合元件包括四个二极管,其中第一二极管的阴极与第二二极管的阳极相接,此第一相接节点接收一交流电压的一输入,第三二极管的阴极与第四二极管的阳极相接,此第二相接节点接收该交流电压的另一输入,该第一二极管的阳极与第三二极管的阳极相接,此第三相接节点提供一直流电压的低准位,第二二极管的阴极与第四二极管的阴极相接,此第四相接节点提供一直流电压的高准位,该交直流转换整合元件中,该第一二极管和第二二极管位于一区间,该第三二极管和第四二极管位于另一区间,且所述的交直流转换整合元件还包括:设置于上述两区间之间的至少一个MOS晶体管,其栅极接收该交流电压。In order to achieve the above purpose, from another point of view, the present invention provides an integrated circuit, comprising: a DC low-voltage circuit; a diode, wherein the cathode of the first diode is connected to the anode of the second diode, the first connection node receives an input of an AC voltage, the cathode of the third diode is connected to the anode of the fourth diode The anodes are connected, the second connection node receives another input of the AC voltage, the anode of the first diode is connected to the anode of the third diode, and the third connection node provides a low voltage of the DC voltage level, the cathode of the second diode is connected to the cathode of the fourth diode, and the fourth connection node provides a high level of DC voltage. In the AC-DC conversion integration element, the first diode and the second diode are located in one interval, the third diode and the fourth diode are located in another interval, and the AC-DC conversion integration element further includes: at least one MOS disposed between the above two intervals A transistor whose gate receives this AC voltage.
以上集成电路中,可更包含:耦接于该交直流转换整合元件与该直流低压电路之间的电阻,以及与该直流低压电路耦接的拑位电路。该拑位电路例如为齐纳二极管。The above integrated circuit may further include: a resistor coupled between the AC-DC conversion integration element and the DC low voltage circuit, and a clamping circuit coupled to the DC low voltage circuit. The clamping circuit is, for example, a Zener diode.
在其中一种较佳实施形式中,该第一二极管和第二二极管位于一区间,该第三二极管和第四二极管位于另一区间,且所述的交直流转换整合元件更包括:设置于上述两区间之间的两个MOS晶体管,其栅极分别与该交流电压的两输入耦接。In one of the preferred implementation forms, the first diode and the second diode are located in one interval, the third diode and the fourth diode are located in another interval, and the AC-DC conversion The integration device further includes: two MOS transistors disposed between the above two intervals, the gates of which are respectively coupled to the two inputs of the AC voltage.
下面通过具体实施例详加说明,当更容易了解本发明的目的、技术内容、特点及其所达成的功效。The following will be described in detail through specific embodiments, so that it is easier to understand the purpose, technical content, characteristics and effects of the present invention.
附图说明 Description of drawings
图1说明现有技术的电路结构;Fig. 1 illustrates the circuit structure of prior art;
图2举例说明如何制作可与其它电路整合的二极管;Figure 2 illustrates how to make a diode that can be integrated with other circuits;
图3与图4分别表示本发明的两个实施例。3 and 4 respectively show two embodiments of the present invention.
图中符号说明Explanation of symbols in the figure
10 桥式整流电路10 bridge rectifier circuit
12,14,16,18 二极管12, 14, 16, 18 diodes
13,17 MOS晶体管13, 17 MOS transistors
13G,17G 栅极13G, 17G Gate
20 基板20 Substrate
22 N型井区22 N-type well area
30 基板30 Substrate
32,34,36,38 N型井区32, 34, 36, 38 N-type well area
50 后级电路(低压电路)50 Post-stage circuit (low voltage circuit)
221 P+高浓度掺杂区221 P+ high concentration doped region
222 N+高浓度掺杂区222 N+ high-concentration doped region
301,302,321,323,341,343,361,363,381,383P+高浓度掺杂区301, 302, 321, 323, 341, 343, 361, 363, 381, 383P+ high-concentration doped regions
322,342,362,382 N+高浓度掺杂区322, 342, 362, 382 N+ high-concentration doped regions
R,R1,R2 电阻R, R1, R2 resistors
Z 齐纳二极管Z Zener diode
具体实施方式 Detailed ways
请参考图2,其中举例显示如何制作可与其它电路整合的二极管。如图所示,本发明在P型基板20内设置N型井区22,并在N型井区22内设置P+高浓度掺杂区221与N+高浓度掺杂区222,分别构成二极管的阳极端与阴极端。N型井区22一方面与P+掺杂区221构成PN接面,另一方面也使阳极端222不会与P型基板20或不适当的节点(例如其它二极管的阳极端)短路相接。以上二极管的半导体结构可以有各种变形,例如P+或N+高浓度掺杂区221或222可不只设置一个,以便利整体电路的布局安排或微调电路参数(如导通电阻等)。Please refer to Figure 2, which shows an example of how to make a diode that can be integrated with other circuits. As shown in the figure, the present invention sets an N-
图3显示本发明的一个实施例。如图所示,本实施例先以外挂电阻R1,R2对所接收的交流电(例如但不限于政府供应的市电110V)进行降压,至晶圆内元件所能承受的范围,再通过整合成为集成电路一部份的交直流转换整合元件予以整流,再经过电阻R降压产生低压电路(后级电路)50所需的直流工作电压的高低准位VDD与VSS,并以齐纳二极管Z所构成的拑位电路控制工作电压VDD与VSS的压差上限。拑位电路可不限于为齐纳二极管,而可为其它类型的拑位电路。本发明的特点是交直流转换整合元件可以与低压电路50整合在同一颗集成电路之中(电阻R与齐纳二极管Z亦可一并整合在内)。Figure 3 shows an embodiment of the present invention. As shown in the figure, in this embodiment, the external resistors R1 and R2 are used to step down the received AC power (such as but not limited to the 110V commercial power supplied by the government) to the range that the components in the wafer can withstand, and then through the integration It is rectified by the AC-DC conversion integration element that becomes a part of the integrated circuit, and then the high and low levels VDD and VSS of the DC operating voltage required by the low-voltage circuit (post-stage circuit) 50 are generated through the resistor R step-down, and the Zener diode Z The formed clamping circuit controls the upper limit of the voltage difference between the working voltage VDD and VSS. The clamping circuit is not limited to be a Zener diode, but can be other types of clamping circuits. The feature of the present invention is that the integrated AC-DC conversion element can be integrated with the low-
本实施例中,交直流转换整合元件包含P型基板30,其内设置N型井区32,34,36,38,并在N型井区32内设置P+高浓度掺杂区321,323与N+高浓度掺杂区322,对应于图1的二极管12;N型井区34内设置P+高浓度掺杂区341,343与N+高浓度掺杂区342,对应于图1的二极管14;N型井区36内设置P+高浓度掺杂区361,363与N+高浓度掺杂区362,对应于图1的二极管16;N型井区38内设置P+高浓度掺杂区381,383与N+高浓度掺杂区382,对应于图1的二极管18。本实施例中每个二极管具有两个P+高浓度掺杂区(作为阳极端)与一个N+高浓度掺杂区(作为阴极端)。基板30以P+高浓度掺杂区301和302作为接点,对应于图1中的节点A,而N+高浓度掺杂区342与382所连接的节点(电阻R左方的节点)则对应于图1中的节点B。In this embodiment, the AC/DC conversion integrated component includes a P-
图3上方部分的基板30与其中的离子植入区构成图1桥式整流电路10的上半部两个二极管12,14,而下方部分的基板30与其中的离子植入区构成图1桥式整流电路10的下半部两个二极管16,18。此两部份间的连接宜经过适当安排,以避免在N型井区、P型基板、N型井区间构成寄生NPN双载子晶体管。若构成寄生双载子晶体管,则可能会使所能的到的直流电压或电流受限于寄生双载子晶体管的导通而无法太高。The
对此,图4标出本发明的另一个实施例,以解决上述问题。如图所示,根据本发明,可于基板30上,在对应于桥式整流电路10的上半部两个二极管12,14,和对应于桥式整流电路10的下半部两个二极管16,18之间,设置一或数颗MOS晶体管,以解决寄生双载子晶体管的问题。本实施例设置两颗NMOS晶体管13,17,其栅极分别与经过电阻R1,R2降压后的电压连接,换言之这两颗晶体管将轮流导通,而使基板本体的地电位更接近零电压。举例而言,当左端AC输入为高电压时,MOS晶体管17将导通,使基板本体通过电阻R2连接于右端AC输入,因此更接近零电压。如此可消除寄生双载子晶体管的效应,使得整流电路所产生的直流电源(VDD与VSS)更稳定。In this regard, FIG. 4 shows another embodiment of the present invention to solve the above-mentioned problems. As shown in the figure, according to the present invention, on the
如前所述,二极管的半导体结构可以有各种变形,本实施例中,在二极管的N型井区中再设置P型浅掺杂区(PDD),将阳极端设置于PDD中。在二极管12,16中,在N型井区中设置两个N型高浓度掺杂区作为阴极端。在二极管14,18中,则另在PDD中设置N型高浓度掺杂区作为阴极端,而将N型井区与经过电阻R1,R2降压后的电压连接。As mentioned above, the semiconductor structure of the diode can be modified in various ways. In this embodiment, a P-type lightly doped region (PDD) is provided in the N-type well region of the diode, and the anode terminal is disposed in the PDD. In the
与现有技术相较,本发明可以将整流电路中的大部分元件与集成电路内部的低压电路整合,仅需外挂电阻,显然较优。Compared with the prior art, the present invention can integrate most of the components in the rectifier circuit with the low-voltage circuit inside the integrated circuit, and only needs external resistors, which is obviously better.
以上已针对较佳实施例来说明本发明,只是以上所述,仅为使本领域技术人员易于了解本发明的内容,并非用来限定本发明的权利范围。在本发明的相同精神下,本领域技术人员可以思及各种等效变化。例如,各实施例中的交直流转换整合元件以桥式整流电路为例,但本发明亦可应用于其它类型、使用到二极管的交直流转换电路中。因此,以上种种,及其它各种等效变化,均应包含在本发明的范围之内。The present invention has been described above with reference to preferred embodiments, but the above description is only for those skilled in the art to easily understand the content of the present invention, and is not intended to limit the scope of rights of the present invention. Under the same spirit of the present invention, various equivalent changes can be conceived by those skilled in the art. For example, the AC-DC conversion integration element in each embodiment is a bridge rectifier circuit as an example, but the present invention can also be applied to other types of AC-DC conversion circuits using diodes. Therefore, all the above and other equivalent changes should be included within the scope of the present invention.
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