CN101890575A - Femtosecond laser parallel micromachining device based on Damman grating with real-time monitoring - Google Patents
Femtosecond laser parallel micromachining device based on Damman grating with real-time monitoring Download PDFInfo
- Publication number
- CN101890575A CN101890575A CN 201010227030 CN201010227030A CN101890575A CN 101890575 A CN101890575 A CN 101890575A CN 201010227030 CN201010227030 CN 201010227030 CN 201010227030 A CN201010227030 A CN 201010227030A CN 101890575 A CN101890575 A CN 101890575A
- Authority
- CN
- China
- Prior art keywords
- femtosecond laser
- mirror
- filter
- sample
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005459 micromachining Methods 0.000 title claims abstract description 23
- 238000012544 monitoring process Methods 0.000 title claims abstract description 19
- 230000003287 optical effect Effects 0.000 claims description 16
- 238000012545 processing Methods 0.000 claims description 16
- 239000013078 crystal Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 230000006378 damage Effects 0.000 claims description 3
- 238000001228 spectrum Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000003595 spectral effect Effects 0.000 claims 1
- 238000003754 machining Methods 0.000 abstract description 7
- 230000004313 glare Effects 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 238000001914 filtration Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000009514 concussion Effects 0.000 description 2
- 239000010437 gem Substances 0.000 description 2
- 229910001751 gemstone Inorganic materials 0.000 description 2
- 238000003913 materials processing Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000009022 nonlinear effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000004038 photonic crystal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
Images
Landscapes
- Laser Beam Processing (AREA)
Abstract
A femtosecond laser parallel micromachining device based on Dammann grating with real-time monitoring is characterized in that femtosecond laser parallel micromachining is carried out based on the beam splitting characteristic of Dammann grating, the femtosecond laser machining efficiency can be greatly improved, and meanwhile, a CCD detector is utilized to observe and monitor the machining process in real time. The invention has good application prospect in the aspect of femtosecond laser micromachining.
Description
Technical field
The present invention relates to the little processing of femtosecond pulse, particularly a kind of femtosecond pulse parallel micromachining device with real-time monitoring.
Background technology
Femtosecond pulse has the pulse duration of femtosecond magnitude, high peak power and power density, thereby it is extremely short to have action time in the little processing of material, and can bring out special advantages such as various nonlinear effects.Since femtosecond laser is used for materials processing since nineteen ninety-five, because its unique processed edge obtains people very soon and pays close attention to widely.All materials such as femtosecond laser almost can processing metal, semiconductor and dielectric, the characteristic of the ultrashort pulse of femtosecond laser, high-peak power and the minimum fuel factor zone of action, make the indirect damage on materials processing surface little, the machining accuracy height can be used for processing and fabricating metal mask plate etc.In addition, the multiphoton-effect that utilizes femtosecond laser to induce in transparent material inside such as various glass (mixing silex glass, pure silicate glass, boron glass of germanium etc.) and optical fiber, the refractive index of irradiated area material is changed, fiber waveguide, various coupler, grating and carry out optical storage etc. can write direct in various transparent materials, what produce during the femtosecond laser microburst in addition ablates and the optical breakdown of transparent material inside etc. such as induced with laser fusing, material surface, can also be used for making as diffraction optical element, photonic crystal and grating etc.
At present, common femtosecond laser parallel micromachining generally all is to utilize single beam laser through focusing on, and carries out single channel scanning then, and process velocity is slow, inefficiency.In order to raise the efficiency the mode of the parallel processing of general employing, a kind of parallel processing method is to realize by the beam splitter that plated film obtains, but beam splitter generally can only be realized 1 * 2 beam splitting, realize the multichannel beam splitting, just require to carry out cascade, so just brought the complexity of light path; Another kind of parallel processing method is for realizing the little processing that walks abreast of multi beam focused beam by microlens array, but utilize microlens array also to have certain weak point, as manufacturing cost than higher, for the uniformity requirement of light source than higher, otherwise each focus light intensity is inhomogeneous in the microlens array, causes bigger machining accuracy error; The light source dot matrix of microlens array is fixed, and can't adjust, and the gap of microlens array can produce unnecessary veiling glare.
Summary of the invention
The technical problem to be solved in the present invention is to overcome above-mentioned the deficiencies in the prior art, a kind of femtosecond laser parallel micromachining device based on Darman raster with real-time monitoring is provided, this device can be realized the synchronous little processing of multichannel light beam, and can monitor process in real time.
Basic design of the present invention is:
Beam splitting based on Darman raster is carried out the little processing of femtosecond laser parallel to sample, to improve working (machining) efficiency, utilizes the ccd detector Real Time Observation to monitor little process simultaneously.Darman raster is a kind of beam splitting device that relies on the phase place turning point of optimizing in the one-period to realize high diffraction efficiency.Select the big substrate of laser broken ring threshold value, just can realize easily that very big anti-light laser damages the beam splitting device of ability, and Darman raster can be divided into the multichannel light beam of the N * N of 1 * N of one dimension or bidimensional as required.
Technical solution of the present invention is as follows:
A kind of femtosecond laser parallel micromachining device based on Darman raster with real-time monitoring, its characteristics are that this device comprises LASER Light Source, first semi-transparent semi-reflecting lens, first pinhole filter, first collimation lens, Darman raster, collector lens, dichroscope, mobile platform, bbo crystal, completely reflecting mirror, second pinhole filter, second collimation lens, dichroscope, optical filter and photodetector, and sample to be processed places on the described mobile platform, the position of above-mentioned parts relation is as follows:
Femtosecond laser from described LASER Light Source outgoing, be divided into transmitted light beam and folded light beam through described first semi-transparent semi-reflecting lens, described transmitted light beam expands the spherical wave of bundle for dispersing through the described first pinhole filter filtering, through the described first collimation lens complanation glistening light of waves bundle, this plane wave light beam is through forming a plurality of plane wave light beams of different diffraction direction behind the described Darman raster, with after described collector lens becomes the multi beam convergent beam, this multi beam convergent beam is through forming the converging light dot matrix that spacing equates after the described dichroic mirror reflects, focus on and carry out multiple beam processing on the sample surfaces that places on the mobile platform, described folded light beam is after the bbo crystal frequency multiplication, enter the second pinhole filter filtering through the completely reflecting mirror reflection and expand the spherical wave of bundle for dispersing, expand Shu Houjing second collimation lens and be transformed into collimation plane glistening light of waves bundle, this plane wave light beam is after the second semi-transparent semi-reflecting mirroring, be radiated at the surface of described sample through dichroscope, after the sample surfaces reflection, form the object beam that carries sample message, through dichroscope, second semi-transparent semi-reflecting lens and optical filter enter described photodetector, are used for monitoring in real time the processed process of sample.
In described first semi-transparent semi-reflecting lens and second semi-transparent semi-reflecting lens is a wide spectrum plating deielectric-coating semi-transparent semi-reflecting lens, and described dichroscope is the light total reflection to the 800nm wavelength, to the anti-reflection eyeglass of the light of 400nm wavelength.
Described first pinhole filter and second pinhole filter are the pinhole filters of removing veiling glare.
Described first collimation lens, second collimation lens and collector lens all are the achromatism biconvex lens.
Described Darman raster is the Darman raster of the N * N beam splitting of a high laser-damaged threshold value, and wherein N is the positive integer greater than 1.
Described mobile platform is a three-dimensional precise mobile platform.
Described optical filter is an optical filter that only allows to see through the 400nm wavelength light.
Described photodetector is a ccd detector that 400nm is had the sensitive spectroscopy response.
Said LASER Light Source is a femto-second laser, and pulsewidth is 90fs, and power output is greater than 250mW, and bandwidth is greater than 50nm, and radiation wavelength is 780nm-840nm, and centre wavelength is 800nm, and repetition rate is the titanium precious stone laser concussion system of 76MHz.
Said optical filter is an optical filter that only sees through the 400nm wavelength light.This filter plate can effectively be removed the veiling glare that produces after the sample reflection.
Technique effect of the present invention:
1, because the present invention adopts the N * N Darman raster of high laser-damaged threshold value to make beam splitter, become multiple beam by single beam and carry out little processing, the spacing between the multiple beam is easy to adjust, and cost is low, has improved working (machining) efficiency greatly;
2,, can ensure the crudy of sample preferably by the processing situation and the location situation of ccd detector real time monitoring processed sample.
Description of drawings
Fig. 1 is the structural representation based on the femtosecond laser parallel micromachining device of Darman raster that the present invention has real-time monitoring.
Its light path according to numbering is successively: the 1-LASER Light Source; 2-first semi-transparent semi-reflecting lens; 3-first pinhole filter; 4-first collimation lens; The 5-Darman raster; The 6-collector lens; The 7-dichroscope; The 8-sample; The 9-mobile platform; The 10-BBO crystal; The 11-completely reflecting mirror; 12-second pinhole filter; 13-second collimation lens; The 14-dichroscope; The 15-optical filter; The 16-photodetector.
The specific embodiment
The invention will be further described below in conjunction with embodiment and accompanying drawing, but should not limit protection scope of the present invention with this.
Of the present invention have real-time monitoring based on the structure of the femtosecond laser parallel micromachining device of Darman raster as shown in Figure 1, Fig. 1 is the structural representation based on the femtosecond laser parallel micromachining device embodiment of Darman raster that the present invention has real-time monitoring.
As seen from the figure, the present invention has the femtosecond laser parallel micromachining device based on Darman raster of real-time monitoring, comprise LASER Light Source 1, first semi-transparent semi-reflecting lens 2, first pinhole filter 3, first collimation lens 4, Darman raster 5, collector lens 6, dichroscope 7, sample 8, mobile platform 9, bbo crystal 10, completely reflecting mirror 11, second pinhole filter 12, second collimation lens 13, dichroscope 14, optical filter 15 and photodetector 16, the position relation of above-mentioned parts is as follows:
Femtosecond laser from described LASER Light Source 1 outgoing, be divided into transmitted light beam and folded light beam through described first semi-transparent semi-reflecting lens 2, described transmitted light beam expands the spherical wave of bundle for dispersing through described first pinhole filter, 3 filtering, through described first collimation lens, 4 complanation glistening light of waves bundles, this plane wave light beam forms a plurality of plane wave light beams of different diffraction direction through described Darman raster 5 backs, with after described collector lens 6 becomes the multi beam convergent beam, this multi beam convergent beam forms the converging light dot matrix that spacing equates through described dichroscope 7 reflection backs, focus on and carry out multiple beam processing on sample 8 surfaces that place on the mobile platform 9, described folded light beam is after bbo crystal 10 frequencys multiplication, enter 12 filtering of second pinhole filter through completely reflecting mirror 11 reflections and expand the spherical wave of bundle for dispersing, expand Shu Houjing second collimation lens 13 and be transformed into collimation plane glistening light of waves bundle, this plane wave light beam is after 14 reflections of second semi-transparent semi-reflecting lens, be radiated at the surface of described sample 8 through dichroscope 7, after the sample surfaces reflection, form the object beam that carries sample message, through dichroscope 7, second semi-transparent semi-reflecting lens 14 and optical filter 15 enter described photodetector 16, are used for monitoring in real time the processed process of sample.
In the present embodiment:
Said LASER Light Source 1 is a femto-second laser, and pulsewidth is 90fs, and power output is greater than 250mW, and bandwidth is greater than 50nm, and radiation wavelength is 780nm-840nm, and centre wavelength is 800nm, and repetition rate is the titanium precious stone laser concussion system of 76MHz.
Said first semi-transparent semi-reflecting lens 2 and second semi-transparent semi-reflecting lens 14 are wide spectrum plating deielectric-coating semi-transparent semi-reflecting lens, and it is divided into transmission and each two-beam of 50% of reflection with light beam.Described first semi-transparent semi-reflecting lens 2 is used for light beam is divided into two-beam: a branch ofly be used for parallel processing, a branch ofly be used for real-time monitoring.
Described dichroscope 7 is the light reflections to the 800nm wavelength, to the light transmissive eyeglass of 400nm wavelength.Dichroscope 7 is used for the reflect focalization light beam, makes to focus on the dot matrix vertical focusing on the surface of sample 8, and makes detecting light beam after the sample reflection, can see through and enter described photodetector 16.
Said first pinhole filter 3 and second pinhole filter 12 are the pinhole filter that can effectively remove veiling glare.
Said bbo crystal 10 is that a thickness is 100um, and length and width all are the bbo crystal of 5mm.Be that to be used for centre wavelength be that the pulsed light frequency multiplication of 800nm is the pulsed light of 400nm.
Said completely reflecting mirror 11 is silver-plated completely reflecting mirrors.
Said optical filter 15 is optical filters that only see through the 400nm wavelength light, and this filter plate can effectively be removed the veiling glare that produces after the sample reflection.
Operation principle of the present invention and basic process are:
Centre wavelength is that the femtosecond laser of 800nm is after LASER Light Source 1 outgoing, be divided into two-beam through first semi-transparent semi-reflecting lens 2, be A light beam and B light beam, the A light beam is used for parallel little processing of femtosecond laser, the B light beam is used for the real-time monitoring of process after BBO frequency-doubling crystal frequency multiplication becomes the pulse laser of 400nm wavelength.Wherein the A light beam is divergent spherical wave through first pinhole filter, 3 expansion bundles, be transformed into the plane wave light beam through first collimation lens 4, this plane wave light beam forms a plurality of plane wave light beams of different diffraction direction through Darman raster 5 backs, with after second collector lens 6 is transformed into the multi beam convergent beam, form the converging light dot matrix that spacing equates through dichroscope 7 reflection backs, focus on sample 8 surfaces, wherein, sample 8 places on the mobile platform 9, can move in different directions; The B light beam is after bbo crystal 10 frequencys multiplication form the 400nm light beam, after completely reflecting mirror 11 reflections, enter second pinhole filter 12, expand Shu Houjing second collimation lens 13 and be transformed into the plane wave light beam, this plane wave light beam is after 14 reflections of the 3rd semi-transparent semi-reflecting lens, be radiated at sample 8 surfaces, after sample 8 surface reflections, form the object beam that carries sample message, through dichroscope 7, second semi-transparent semi-reflecting lens 14 and optical filter 15 (only seeing through 400nm light) enter ccd detector 16, processing situation and location situation by ccd detector 16 real time monitoring processed samples help ensureing the sample crudy.
Experiment shows, the femtosecond laser parallel micromachining device with real-time monitoring of the present invention based on Darman raster, and simple in structure, the working (machining) efficiency height has good application prospects.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010227030 CN101890575A (en) | 2010-07-14 | 2010-07-14 | Femtosecond laser parallel micromachining device based on Damman grating with real-time monitoring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010227030 CN101890575A (en) | 2010-07-14 | 2010-07-14 | Femtosecond laser parallel micromachining device based on Damman grating with real-time monitoring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101890575A true CN101890575A (en) | 2010-11-24 |
Family
ID=43100005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010227030 Pending CN101890575A (en) | 2010-07-14 | 2010-07-14 | Femtosecond laser parallel micromachining device based on Damman grating with real-time monitoring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101890575A (en) |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102253605A (en) * | 2011-07-07 | 2011-11-23 | 中国科学院上海光学精密机械研究所 | Multiple parallel laser beam grating direct writing device and grating direct writing method |
| CN102837125A (en) * | 2011-11-11 | 2012-12-26 | 中国科学院光电研究院 | Laser processing device |
| CN103071930A (en) * | 2013-01-09 | 2013-05-01 | 南开大学 | System and method for preparing micro-pore array through femtosecond laser direct writing |
| CN103317228A (en) * | 2013-07-09 | 2013-09-25 | 北京工业大学 | Simultaneous monitoring device for femtosecond laser micromachining |
| CN103542803A (en) * | 2013-09-30 | 2014-01-29 | 中国科学院上海光学精密机械研究所 | Dammann grating based synchronous phase shift interference device |
| CN103692083A (en) * | 2013-11-21 | 2014-04-02 | 西安交通大学 | System for adjusting shape and appearance of micro deep hole based on laser dual-wave combined machining |
| CN103831536A (en) * | 2014-03-05 | 2014-06-04 | 北京工业大学 | Method and device for manufacturing three-dimensional micro-channel in PMMA (polymethyl methacrylate) by using femtosecond laser |
| CN104959730A (en) * | 2015-06-26 | 2015-10-07 | 吉林大学 | Rotating table type femtosecond laser direct writing method and device |
| CN105772947A (en) * | 2016-03-23 | 2016-07-20 | 中国科学院上海光学精密机械研究所 | Dual light source combined laser beam polishing device |
| CN106624354A (en) * | 2017-02-21 | 2017-05-10 | 长春理工大学 | Multi-beam laser interference micro-nano processing device and method based on Dammann grating and reflectors |
| CN106735868A (en) * | 2017-02-21 | 2017-05-31 | 长春理工大学 | Laser interference micro-nano technology device and method based on reflective dammann grating beam splitting |
| CN108568602A (en) * | 2018-04-11 | 2018-09-25 | 安徽凯贝耐特钣金科技有限公司 | A kind of double radium-shine lock-out pulse panel beating laser cutting machines |
| CN108971747A (en) * | 2018-08-29 | 2018-12-11 | 华中科技大学 | A kind of ultrafast laser micro-nano technology device having on-line monitoring function |
| CN111112835A (en) * | 2018-10-31 | 2020-05-08 | 东莞新科技术研究开发有限公司 | Laser beam splitting device and laser welding method |
| CN111604607A (en) * | 2020-06-19 | 2020-09-01 | 郝强 | Laser scribing on-line monitoring device adopting all-optical mode |
| CN112296512A (en) * | 2020-11-26 | 2021-02-02 | 德清恒凌五金有限公司 | Laser processing equipment for producing mechanical parts |
| CN112448259A (en) * | 2019-09-05 | 2021-03-05 | 深圳市联赢激光股份有限公司 | Dual-wavelength laser device |
| CN112605526A (en) * | 2020-12-21 | 2021-04-06 | 鲁东大学 | Parallel marking machine of multifocal |
| CN113118652A (en) * | 2019-12-30 | 2021-07-16 | 中国科学院上海光学精密机械研究所 | Multi-focus parallel laser scribing equipment compatible with large focal depth and high resolution |
| CN113820870A (en) * | 2020-06-19 | 2021-12-21 | 三赢科技（深圳）有限公司 | Projection module, imaging module and electronic device |
| CN114643420A (en) * | 2022-04-27 | 2022-06-21 | 天津大学 | Gradient processing system and method for atomic-scale surface and structure |
| CN115113409A (en) * | 2022-08-26 | 2022-09-27 | 成都莱普科技股份有限公司 | Linear flat-top light spot generation system, method and equipment based on Dammann grating |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19719344A1 (en) * | 1997-05-07 | 1998-11-12 | Univ Schiller Jena | Arrangement for optical micromanipulation, analysis and processing of objects |
| CN101028671A (en) * | 2007-04-09 | 2007-09-05 | 中国科学院西安光学精密机械研究所 | Ultrashort pulse laser parallel micromachining method and equipment |
| CN101028670A (en) * | 2007-04-09 | 2007-09-05 | 中国科学院西安光学精密机械研究所 | Method and equipment for manufacturing optical fiber F-P sensor by ultra-short pulse laser micromachining |
| CN101055332A (en) * | 2006-04-14 | 2007-10-17 | 北京大学 | Method for preparing waveguide grating in transparent dielectric material |
| CN101187709A (en) * | 2007-11-30 | 2008-05-28 | 中国科学院上海光学精密机械研究所 | Equal Intensity Beam-Splitting Grating Eliminating Zero-Order Diffraction Spectrum Points |
| CN101315957A (en) * | 2008-04-21 | 2008-12-03 | 上海大学 | Method and device for forming PN junction on P-type mercury cadmium telluride material by laser processing |
| CN101323053A (en) * | 2008-07-16 | 2008-12-17 | 上海大学 | Femtosecond laser microsphere drilling method and device |
| CN101363798A (en) * | 2008-07-25 | 2009-02-11 | 中国科学院上海光学精密机械研究所 | Laser femtosecond probe device |
-
2010
- 2010-07-14 CN CN 201010227030 patent/CN101890575A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19719344A1 (en) * | 1997-05-07 | 1998-11-12 | Univ Schiller Jena | Arrangement for optical micromanipulation, analysis and processing of objects |
| CN101055332A (en) * | 2006-04-14 | 2007-10-17 | 北京大学 | Method for preparing waveguide grating in transparent dielectric material |
| CN101028671A (en) * | 2007-04-09 | 2007-09-05 | 中国科学院西安光学精密机械研究所 | Ultrashort pulse laser parallel micromachining method and equipment |
| CN101028670A (en) * | 2007-04-09 | 2007-09-05 | 中国科学院西安光学精密机械研究所 | Method and equipment for manufacturing optical fiber F-P sensor by ultra-short pulse laser micromachining |
| CN101187709A (en) * | 2007-11-30 | 2008-05-28 | 中国科学院上海光学精密机械研究所 | Equal Intensity Beam-Splitting Grating Eliminating Zero-Order Diffraction Spectrum Points |
| CN101315957A (en) * | 2008-04-21 | 2008-12-03 | 上海大学 | Method and device for forming PN junction on P-type mercury cadmium telluride material by laser processing |
| CN101323053A (en) * | 2008-07-16 | 2008-12-17 | 上海大学 | Femtosecond laser microsphere drilling method and device |
| CN101363798A (en) * | 2008-07-25 | 2009-02-11 | 中国科学院上海光学精密机械研究所 | Laser femtosecond probe device |
Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102253605A (en) * | 2011-07-07 | 2011-11-23 | 中国科学院上海光学精密机械研究所 | Multiple parallel laser beam grating direct writing device and grating direct writing method |
| CN102837125A (en) * | 2011-11-11 | 2012-12-26 | 中国科学院光电研究院 | Laser processing device |
| CN103071930B (en) * | 2013-01-09 | 2014-12-03 | 南开大学 | System and method for preparing micro-pore array through femtosecond laser direct writing |
| CN103071930A (en) * | 2013-01-09 | 2013-05-01 | 南开大学 | System and method for preparing micro-pore array through femtosecond laser direct writing |
| CN103317228A (en) * | 2013-07-09 | 2013-09-25 | 北京工业大学 | Simultaneous monitoring device for femtosecond laser micromachining |
| CN103542803B (en) * | 2013-09-30 | 2016-05-11 | 中国科学院上海光学精密机械研究所 | Based on the synchronous phase shift interference device of Darman raster |
| CN103542803A (en) * | 2013-09-30 | 2014-01-29 | 中国科学院上海光学精密机械研究所 | Dammann grating based synchronous phase shift interference device |
| CN103692083A (en) * | 2013-11-21 | 2014-04-02 | 西安交通大学 | System for adjusting shape and appearance of micro deep hole based on laser dual-wave combined machining |
| CN103831536A (en) * | 2014-03-05 | 2014-06-04 | 北京工业大学 | Method and device for manufacturing three-dimensional micro-channel in PMMA (polymethyl methacrylate) by using femtosecond laser |
| CN104959730A (en) * | 2015-06-26 | 2015-10-07 | 吉林大学 | Rotating table type femtosecond laser direct writing method and device |
| CN104959730B (en) * | 2015-06-26 | 2016-08-17 | 吉林大学 | Rotary table femtosecond laser direct-write methods and device |
| CN105772947A (en) * | 2016-03-23 | 2016-07-20 | 中国科学院上海光学精密机械研究所 | Dual light source combined laser beam polishing device |
| CN106735868B (en) * | 2017-02-21 | 2018-10-23 | 长春理工大学 | Laser interference micro-nano technology device and method based on reflective dammann grating beam splitting |
| CN106624354A (en) * | 2017-02-21 | 2017-05-10 | 长春理工大学 | Multi-beam laser interference micro-nano processing device and method based on Dammann grating and reflectors |
| CN106735868A (en) * | 2017-02-21 | 2017-05-31 | 长春理工大学 | Laser interference micro-nano technology device and method based on reflective dammann grating beam splitting |
| CN108568602A (en) * | 2018-04-11 | 2018-09-25 | 安徽凯贝耐特钣金科技有限公司 | A kind of double radium-shine lock-out pulse panel beating laser cutting machines |
| CN108971747B (en) * | 2018-08-29 | 2020-07-28 | 华中科技大学 | Ultrafast laser micro-nano machining device with online monitoring function |
| CN108971747A (en) * | 2018-08-29 | 2018-12-11 | 华中科技大学 | A kind of ultrafast laser micro-nano technology device having on-line monitoring function |
| CN111112835A (en) * | 2018-10-31 | 2020-05-08 | 东莞新科技术研究开发有限公司 | Laser beam splitting device and laser welding method |
| CN112448259A (en) * | 2019-09-05 | 2021-03-05 | 深圳市联赢激光股份有限公司 | Dual-wavelength laser device |
| CN113118652A (en) * | 2019-12-30 | 2021-07-16 | 中国科学院上海光学精密机械研究所 | Multi-focus parallel laser scribing equipment compatible with large focal depth and high resolution |
| CN113820870B (en) * | 2020-06-19 | 2024-03-29 | 三赢科技（深圳）有限公司 | Projection module, imaging module and electronic device |
| CN111604607A (en) * | 2020-06-19 | 2020-09-01 | 郝强 | Laser scribing on-line monitoring device adopting all-optical mode |
| CN113820870A (en) * | 2020-06-19 | 2021-12-21 | 三赢科技（深圳）有限公司 | Projection module, imaging module and electronic device |
| CN112296512A (en) * | 2020-11-26 | 2021-02-02 | 德清恒凌五金有限公司 | Laser processing equipment for producing mechanical parts |
| CN112605526A (en) * | 2020-12-21 | 2021-04-06 | 鲁东大学 | Parallel marking machine of multifocal |
| CN114643420B (en) * | 2022-04-27 | 2023-10-13 | 天津大学 | Atomic-level surface and structure gradient processing systems and methods |
| CN114643420A (en) * | 2022-04-27 | 2022-06-21 | 天津大学 | Gradient processing system and method for atomic-scale surface and structure |
| CN115113409A (en) * | 2022-08-26 | 2022-09-27 | 成都莱普科技股份有限公司 | Linear flat-top light spot generation system, method and equipment based on Dammann grating |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101890575A (en) | Femtosecond laser parallel micromachining device based on Damman grating with real-time monitoring | |
| CN109803786B (en) | Apparatus and method for laser processing of transparent workpieces using non-axisymmetric beam spots | |
| US20210325581A1 (en) | Method and apparatus for preparing femtosecond optical filament interference direct writing volume grating/chirped volume grating | |
| JP7045372B2 (en) | Laser device for cutting brittle materials using aspherical focusing means and beam magnifier | |
| CN102773612B (en) | Vibrating mirror type ultraviolet laser cutting wafer chip device and method thereof | |
| CN101862899A (en) | Femtosecond laser processing device | |
| CN114393313A (en) | Laser scanning intelligent processing device and method based on coaxial detection | |
| WO2011127400A2 (en) | Laser beam analysis apparatus | |
| CN103071930A (en) | System and method for preparing micro-pore array through femtosecond laser direct writing | |
| CN108723012A (en) | A kind of integrated laser cleaning electro-optical system | |
| CN105750729A (en) | Laser processing device with linear array optical lens assembly with micro cylindrical lenses in cylindrical distribution | |
| CN109366015A (en) | With the interior cutter device coaxially positioned | |
| CN102837125A (en) | Laser processing device | |
| CN103934577B (en) | Stray-light-free laser processing system with adjustable cutting width | |
| CN108563034A (en) | Reflective spatial filter debugging apparatus and method | |
| CN105203222A (en) | Device for measuring temperature of flame through one-dimensional scanning on basis of Fresnel lens and CARS | |
| CN101692520A (en) | Laser resonant cavity with Gauss beam reshaping function | |
| CN101303447A (en) | Laser converging device with variable incident angle | |
| CN202388123U (en) | Laser machining device | |
| CN202667933U (en) | Galvanometer type ultraviolet laser cutting device for wafer chips | |
| CN104526160B (en) | A kind of laser processing and laser-processing system | |
| CN104785923A (en) | Multi-point focusing laser processing device | |
| CN1584647A (en) | Hollow circular truncated cone laser optical fibre coupler | |
| KR20130076444A (en) | Laser machining apparatus and method thereof | |
| CN111338152B (en) | A device for homogenizing frequency-doubling light field distribution |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20101124 |