CN101873113A - Heat-insulating constant-temperature crystal device - Google Patents
Heat-insulating constant-temperature crystal device Download PDFInfo
- Publication number
- CN101873113A CN101873113A CN200910049669A CN200910049669A CN101873113A CN 101873113 A CN101873113 A CN 101873113A CN 200910049669 A CN200910049669 A CN 200910049669A CN 200910049669 A CN200910049669 A CN 200910049669A CN 101873113 A CN101873113 A CN 101873113A
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- China
- Prior art keywords
- circuit board
- printed circuit
- heat
- layer printed
- crystal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000013078 crystal Substances 0.000 title claims abstract description 53
- 238000007669 thermal treatment Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention discloses a heat-insulating constant-temperature type crystal device, comprising: upper level printed circuit board, lower floor printed circuit board, bottom plate, resonant crystal and casing. Wherein, surround the resonant crystal and be provided with at least one heat-insulating groove on lower floor's printed circuit board to be provided with first heat-conducting gasket between upper PCB and resonant crystal, be provided with the second heat-conducting gasket between lower floor's printed circuit board and resonant crystal. Compared with the prior art, the surrounding resonant crystal is provided with at least one heat insulation groove on the lower printed circuit board, so that the resonant crystal can be effectively prevented from carrying out heat transfer with the outside through the lower printed circuit board, and the working stability of the resonant crystal is improved.
Description
Technical field
The present invention relates to a kind of heat-insulating constant-temperature type crystal device.
Background technology
Constant-temperature crystal oscillator (Oven Controlled Crystal Oscillator) must be worked under constant high temperature.But the resonant crystal of more existing constant-temperature crystal oscillators or printed circuit board (PCB) and base plate or housing contacts, heat is transmitted to the outside by shell or base plate easily, perhaps Wai Bu heat is transmitted to resonant crystal or printed circuit board (PCB) by shell or base plate easily, the working temperature instability that causes resonant crystal causes the frequency stability of constant-temperature crystal oscillator low then.
Summary of the invention
Therefore, the objective of the invention is to overcome above-mentioned the deficiencies in the prior art part, the heat-insulating constant-temperature type crystal device that a kind of stability is high, working temperature is not subject to ectocine is provided.
To achieve these goals, technical scheme of the present invention provides a kind of heat-insulating constant-temperature type crystal device, comprising: upper printed circuit board; Following layer printed circuit board is electrically connected and supports by lead-in wire between described layer printed circuit board down and the upper printed circuit board; Base plate, described base plate and the described lead-in wire that passes through between the layer printed circuit board down are electrically connected and support; Resonant crystal, described resonant crystal are clamped between the thermal treatment zone of the thermal treatment zone of described upper printed circuit board and described down layer printed circuit board; And housing, described housing is used for holding hermetically upper printed circuit board, the following layer printed circuit board harmony crystal that shakes, wherein, be provided with at least one heat dam around the described layer printed circuit board down of resonant crystal, and between described upper printed circuit board and described resonant crystal, be provided with the first heat conduction pad, between described layer printed circuit board down and described resonant crystal, be provided with the second heat conduction pad.
Preferably, the first heat conduction pad and the second heat conduction pad are the elastic heat conducting sheet.
Preferably, be parallel to each other in twos between upper printed circuit board, following layer printed circuit board and the base plate.
Preferably, following layer printed circuit board is supported on the described base plate by lead-in wire with suspending.
Compared with prior art, the invention has the advantages that: owing to be provided with at least one heat dam around the following layer printed circuit board of resonant crystal, therefore, can prevent effectively that resonant crystal is by the layer printed circuit board and the external world carry out heat transmission down, thereby further improve thermal insulation, the assurance resonant crystal is worked under stable temperature.
Description of drawings
Fig. 1 is the perspective view of heat-insulating constant-temperature type crystal device of the present invention;
Fig. 2 is the longitudinal sectional view of heat-insulating constant-temperature type crystal device of the present invention; With
Fig. 3 is the longitudinal sectional view of the heat-insulating constant-temperature type crystal device of the present invention when installing shell.
Embodiment
Describe embodiments of the invention below in detail, the example of embodiment is shown in the drawings, and wherein same or analogous label is represented same or analogous element.The embodiment that describes below with reference to accompanying drawing is exemplary, is intended to explain the present invention, and can not be interpreted as limitation of the present invention.
Fig. 1 shows the perspective view of heat-insulating constant-temperature type crystal device of the present invention; Fig. 2 shows the longitudinal sectional view of heat-insulating constant-temperature type crystal device of the present invention; Longitudinal sectional view with the of the present invention heat-insulating constant-temperature type crystal device of Fig. 3 demonstration when installing shell.
As shown in Figure 1-Figure 3, heat-insulating constant-temperature type crystal device of the present invention comprises: upper printed circuit board 1; Following layer printed circuit board 2 is electrically connected and supports by lead-in wire 7 between following layer printed circuit board 2 and the upper printed circuit board 1; Base plate 3 is electrically connected and supports by lead-in wire 8 between base plate 3 and the following layer printed circuit board 2; Resonant crystal 4, resonant crystal 4 are clamped between the thermal treatment zone of the thermal treatment zone of upper printed circuit board 1 and following layer printed circuit board 2; With housing 9, housing 9 is used for holding hermetically upper printed circuit board 1, following layer printed circuit board 2 and resonance crystal 4.Wherein, be provided with four heat dams 10 around 4 times layer printed circuit boards 2 of resonant crystal.
But, need to prove that the present invention is not limited to this, also can descend layer printed circuit board 2 to be provided with one, two or three heat dams 10.
In the present invention, between upper printed circuit board 1 and resonance crystal 4, be provided with the first heat conduction pad 5, be provided with the second heat conduction pad 6 between layer printed circuit board 2 and the resonance crystal 4 down.
In the present invention, the first heat conduction pad 5 and the second heat conduction pad 6 are the elastic heat conducting sheet.But the present invention is not limited to this, the pad that the first heat conduction pad 5 and the second heat conduction pad 6 also can adopt other to be made by big thermal capacitance material.
In the present invention, following layer printed circuit board 2 is supported on the base plate 3 by 8 quilts that go between with suspending, thereby forms insulating air layer, thereby prevents external environment influence resonant crystal 4.
In the present invention, be parallel to each other in twos between upper printed circuit board 1, following layer printed circuit board 2 and the base plate 3.But, need to prove that the present invention is not limited to this, can not be parallel to each other in twos between upper printed circuit board 1, following layer printed circuit board 2 and the base plate 3 yet.
Although illustrated and described embodiments of the invention, for the ordinary skill in the art, be appreciated that without departing from the principles and spirit of the present invention and can change that scope of the present invention is limited by claims and equivalent thereof to these embodiment.
Claims (4)
1. heat-insulating constant-temperature type crystal device comprises:
Upper printed circuit board (1);
Following layer printed circuit board (2) is electrically connected and supports by lead-in wire (7) between described layer printed circuit board (2) down and the upper printed circuit board (1);
Base plate (3), described base plate (3) and the described lead-in wire (8) that passes through between the layer printed circuit board (2) down are electrically connected and support;
Resonant crystal (4), described resonant crystal (4) are clamped between the thermal treatment zone of the thermal treatment zone of described upper printed circuit board (1) and described down layer printed circuit board (2); With
Housing (9), described housing (9) are used for holding hermetically upper printed circuit board (1), following layer printed circuit board (2) and resonant crystal (4), it is characterized in that:
Be provided with at least one heat dam (10) around the described layer printed circuit board (2) down of resonant crystal (4), and
Between described upper printed circuit board (1) and described resonant crystal (4), be provided with the first heat conduction pad (5), between described layer printed circuit board (2) down and described resonant crystal (4), be provided with the second heat conduction pad (6).
2. heat-insulating constant-temperature type crystal device according to claim 1 is characterized in that: described first heat conduction pad (5) and the described second heat conduction pad (6) are the elastic heat conducting sheet.
3. heat-insulating constant-temperature type crystal device according to claim 1 is characterized in that: described layer printed circuit board (2) down is supported on the described base plate (3) by lead-in wire (8) with suspending.
4. heat-insulating constant-temperature type crystal device according to claim 1 is characterized in that: be parallel to each other in twos between described upper printed circuit board (1), following layer printed circuit board (2) and the base plate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910049669A CN101873113A (en) | 2009-04-21 | 2009-04-21 | Heat-insulating constant-temperature crystal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910049669A CN101873113A (en) | 2009-04-21 | 2009-04-21 | Heat-insulating constant-temperature crystal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101873113A true CN101873113A (en) | 2010-10-27 |
Family
ID=42997811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910049669A Pending CN101873113A (en) | 2009-04-21 | 2009-04-21 | Heat-insulating constant-temperature crystal device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101873113A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103563501A (en) * | 2011-06-01 | 2014-02-05 | 丰田自动车株式会社 | Radiator structure |
| CN104734637A (en) * | 2014-12-30 | 2015-06-24 | 广东大普通信技术有限公司 | Temperature control method of a crystal oscillator, crystal oscillator and manufacturing method thereof |
| CN107509331A (en) * | 2017-08-11 | 2017-12-22 | 中国电子科技集团公司第三十八研究所 | A kind of Low phase noise missile-borne antivibration frequency source and cushion blocking |
-
2009
- 2009-04-21 CN CN200910049669A patent/CN101873113A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103563501A (en) * | 2011-06-01 | 2014-02-05 | 丰田自动车株式会社 | Radiator structure |
| CN104734637A (en) * | 2014-12-30 | 2015-06-24 | 广东大普通信技术有限公司 | Temperature control method of a crystal oscillator, crystal oscillator and manufacturing method thereof |
| CN107509331A (en) * | 2017-08-11 | 2017-12-22 | 中国电子科技集团公司第三十八研究所 | A kind of Low phase noise missile-borne antivibration frequency source and cushion blocking |
| CN107509331B (en) * | 2017-08-11 | 2023-07-04 | 中国电子科技集团公司第三十八研究所 | Low-phase-noise missile-borne vibration-resistant frequency source and vibration-damping pad |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20101027 |