CN101872932A - Circuit element thermocompression bonding method and circuit element thermocompression bonding device - Google Patents

Abstract

A thermal compression bonding method for circuit elements and a thermal compression bonding device for circuit components. The thermal compression bonding method includes: using a compression fitting provided with an electromagnetic induction coil; The buffer pressing material of the magnetic material; and pressing by the pressing piece; the electromagnetic induction coil of the pressing piece is energized during pressing to heat the buffer pressing material in contact with the circuit element to be pressed. The invention overcomes the above-mentioned defects existing in the existing thermocompression method and thermocompression device, has a reasonable design, can effectively reduce thermocompression energy consumption, and improves thermal energy utilization efficiency, which can reduce ambient temperature and improve working conditions.

Description

Circuit element thermocompression bonding method and circuit element thermocompression bonding device

technical field

The invention belongs to the thermocompression bonding technology of circuit elements, and in particular relates to a thermocompression bonding method and a circuit element thermocompression bonding device used for bonding LCD circuit elements with anisotropic conductive glue.

Background technique

During the manufacturing process of the liquid crystal display panel, when the circuit elements are connected through the anisotropic conductive adhesive ACF, it needs to go through hot pressing. As shown in Figure 1 and Figure 2, in the prior art, a thermocompression bonding device is generally used to complete the process. The thermocompression bonding device includes a thermocompression bonding head 11, and an electric heating element is arranged inside the thermocompression bonding head 11. The thermocompression bonding head is kept at a constant high temperature by power supply, and the thermocompression bonding head is driven to move up and down to perform a pressing action to press and bond the circuit element to the thermobonding seat 12 . After the thermocompression bonding head is pressed down, pressure is applied to the circuit element 20 to be pressed and through heat conduction, the anisotropic conductive adhesive in the pressing area of the upper circuit element 21 and the lower circuit element 22 of the circuit element to be pressed can reach the required thermal bonding temperature. Then the thermocompression bonding head moves away, waiting for the next circuit component to be bonded to be in place. This thermocompression bonding method and thermocompression bonding device have the defect of high energy consumption, because the heat transferred to the lamination area can be effectively absorbed only during the short time when the thermocompression bonding head is in contact with the circuit components to be bonded. use, while most of the rest of the time the heat from the thermocompression bonding head is lost to the surrounding environment.

Contents of the invention

Aiming at the above-mentioned defects existing in the existing thermocompression methods and thermocompression devices, the present invention proposes a circuit element thermocompression bonding method and circuit with reasonable design, which can effectively reduce thermocompression energy consumption and improve thermal energy utilization efficiency. Component thermocompression bonding device, which can reduce the ambient temperature and improve working conditions.

The technical scheme adopted in the present invention is as follows:

A thermocompression bonding method for circuit elements, characterized in that the thermocompression bonding method includes: using a compression fitting provided with an electromagnetic induction coil, and setting a ferromagnetic material between the compression fitting and the circuit element to be pressed. The buffer pressing material is pressed; and the pressing part is pressed; the electromagnetic induction coil of the pressing part is energized during pressing to heat the buffer pressing material in contact with the circuit element to be pressed.

Specifically, the circuit element is an LCD circuit element bonded by an anisotropic conductive adhesive, and the thermocompression bonding connection method further includes: before the circuit element to be pressed is placed into the pressing piece, Anisotropic conductive glue is arranged between the circuit elements.

A circuit element thermocompression bonding method, characterized in that the thermocompression bonding method specifically includes:

An electromagnetic induction coil is arranged in the pressing head of a pressing piece, and an anisotropic conductive glue is arranged between the circuit elements to be pressed before placing the circuit elements to be pressed into the pressing piece;

A buffer pressing material with a ferromagnetic material is arranged between the pressing head and the circuit element to be pressed;

When the pressing head presses down the circuit components to be pressed, power is supplied to the electromagnetic induction coil, and the electromagnetic induction coil makes the buffer pressing material generate heat energy, which heats the anisotropic conductive adhesive and bonds the circuit components.

A thermocompression bonding method for circuit elements, characterized in that the thermocompression bonding method comprises:

An electromagnetic induction coil is arranged in the pressing head of a pressing piece, and an anisotropic conductive glue is arranged between the circuit elements to be pressed before placing the circuit elements to be pressed into the pressing piece;

The anisotropic conductive adhesive is doped with ferromagnetic substances;

When the pressing head presses down the circuit components to be pressed, power is supplied to the electromagnetic induction coil, and the electromagnetic induction coil heats the anisotropic conductive adhesive to heat the anisotropic conductive adhesive to bond the circuit elements.

A thermal pressing device for circuit elements, comprising a pressing head, characterized in that an electromagnetic induction coil is arranged inside the pressing head, and a pressing end surface of the pressing head is adjacent to a circuit element to be pressed. The contact buffer press material is provided with a ferromagnetic material. When the pressing head indirectly presses the circuit elements to be pressed through the buffer press material, the electromagnetic induction coil inside the buffer press material is heated.

In one embodiment, the pressing head includes a magnetically permeable insulating filler, and the magnetically permeable insulating filler is distributed with electromagnetic induction coils.

The electromagnetic induction coils are arranged and packaged in the magnetically permeable insulating filler, and a temperature control circuit is connected to the electromagnetic induction coils.

The pressing end surface of the pressing head is a magnetically permeable and heat-insulating partition, and the magnetically permeable and heat-insulating partition is bonded and fixed with the magnetically permeable insulating filler.

In one embodiment, the buffer pressing material is a sheet, and the buffer pressing material is dispersed and filled with ferromagnetic particles.

In another embodiment, the thermal pressing device further includes a pressing seat for placing circuit components to be pressed.

In order to further elaborate on the present invention, the following will be described in conjunction with the accompanying drawings and specific embodiments.

Description of drawings

Fig. 1 is the lamination schematic diagram of existing thermal lamination device of the present invention;

Fig. 2 is a schematic diagram of another state of the heat-compression bonding device in the prior art of the present invention.

Fig. 3 is a schematic diagram of an application structure of a circuit element thermocompression bonding device in a specific embodiment of the present invention.

Detailed ways

The circuit element heat-sealing connection method of the present invention is mainly suitable for circuit elements that require heat-sealing connection. For example, ACF is used in the liquid crystal panel manufacturing process to carry out the circuit board connection process, which can be completed by a heat-sealing device. An electromagnetic induction coil is arranged in the pressing part of the thermal pressing device, and the electromagnetic induction coil can generate electromagnetic waves when electrified. Firstly, anisotropic conductive glue is arranged between the circuit elements to be pressed, and two circuit elements to be pressed are stacked together. The anisotropic conductive glue is located in the pressing area of the circuit elements to be pressed. There is also a buffer pressing material between the pressing circuit elements, the buffer pressing material is a sheet with ferromagnetic material, the buffer pressing material generates heat energy under the action of the electromagnetic induction coil and conducts it to the anisotropic conductive adhesive. In this way, a thermal connection of the heterotropic conductive adhesive can be realized.

This heat-sealing connection method is to energize the electromagnetic induction coil only after the pressing part is pressed down, and the heat energy is generated by the buffer pressing material and conducted to the anisotropic conductive adhesive, which can effectively improve the conduction efficiency and reduce the energization of the electromagnetic induction coil time, reduce energy consumption, and improve thermal energy utilization efficiency.

Another circuit element heat-sealing connection method provided by the present invention is to implant an electromagnetic induction coil in the pressing head of the pressing piece, and use anisotropic conductive glue doped with ferromagnetic substances as the connection medium of the circuit element, and separate the different The directionally conductive adhesive is placed in the pressing area of the two circuit components to be pressed, and the pressing head of the pressing part is pressed down while the electromagnetic induction coil is energized. The ferromagnetic substance in the anisotropic conductive adhesive, such as ferromagnetic particles, will Heat is generated under the heat to make the anisotropic conductive adhesive heat up to the pressing temperature. In this way, high-efficiency thermal energy utilization can be realized, and factors of environmental temperature rise can be reduced.

As shown in Figure 3, the thermal pressing device for circuit components is mainly composed of a pressing head 30, a buffer pressing material 40 and a pressing seat 51. An electromagnetic coil 32 is arranged inside the pressing head 30, and the pressing end faces of the pressing head are aligned with each other. A buffer pressing material 40 which is in contact with the circuit element to be pressed is arranged adjacently. The buffer pressing material 40 is provided with a ferromagnetic material such as ferromagnetic particles. The pressing head 30 indirectly presses the circuit to be pressed through the buffer pressing material 40 When the element is used, the electromagnetic induction coil 32 in it heats the buffer pressing material 40, and then conducts it to the anisotropic conductive adhesive 23 to complete the thermocompression bonding connection.

Specifically, the pressing head 30 has a magnetically permeable insulating filler 31 and a magnetically permeable heat insulating partition 33, and the magnetically permeable insulating filling body 31 and the magnetically permeable heat insulating partition 33 are fitted and fixed to form the bonding head. For the pressing assembly, the magnetically permeable and heat-insulating partition 33 is located on the pressing end surface of the pressing head. The electromagnetic induction coils 32 are independent conductive coils arranged and packaged in the magnetically permeable insulating filler 31 , and each electromagnetic induction coil is connected to a temperature control circuit 52 . The temperature control circuit 52 can independently control each electromagnetic induction coil.

The buffer pressing material 40 is a sheet, which is dispersed and filled with ferromagnetic particles, and can be prepared by doping ferromagnetic particles.

When using a circuit element thermocompression device for lamination, the lamination areas of the circuit elements 21 and 22 to be laminated are first disposed of in the anisotropic conductive adhesive 23, and then the circuit elements to be laden are placed on the lamination seat so that The pressing area is located at the pressing place of the pressing head, and a buffer pressing material is placed between the pressing head and the circuit element to be pressed. When the pressing head performs pressing, the temperature control circuit 52 can firstly provide an adaptive current to the electromagnetic induction coil, so that the buffer pressing material generates heat under the action of electromagnetic waves and the temperature rises. The buffer pressing material conducts heat energy to the anisotropic conductive adhesive, so that the anisotropic conductive adhesive is at the required heat sealing temperature to realize heat sealing connection.

Claims (10)

1. circuit element hot pressing method of attachment is characterized in that this hot pressing method of attachment comprises: employing one is provided with the pressing part of electromagnetic induction coil, a buffering with ferromagnetic material is set between this pressing part and circuit element to be laminated presses material; And carry out pressing by the pressing part; The electromagnetic induction coil of described pressing part is switched on when pressing and is made the buffering that contacts with circuit element to be laminated press the material heating.

2. circuit element hot pressing according to claim 1 method of attachment, it is characterized in that described circuit element is the LCD circuit element by the Anisotropically conductive glue bond, described hot pressing method of attachment further comprises: before circuit element to be laminated is placed into described pressing part, Anisotropically conductive glue is set between circuit element to be laminated.

3. circuit element hot pressing method of attachment is characterized in that this hot pressing method of attachment specifically comprises:

In the pressing head of a pressing part, electromagnetic induction coil is set, in circuit element to be laminated is placed into the pressing part before, Anisotropically conductive glue is set between circuit element to be laminated;

One buffering with ferromagnetic material is set between pressing head and circuit element to be laminated presses material;

When the pressing head presses down circuit element to be laminated, to the electromagnetic induction coil power supply, electromagnetic induction coil makes buffering press material to produce heat energy, makes the thermalization of Anisotropically conductive glue and circuit element is bondd.

4. circuit element hot pressing method of attachment is characterized in that this hot pressing method of attachment comprises:

In the pressing head of a pressing part, electromagnetic induction coil is set, in circuit element to be laminated is placed into the pressing part before, Anisotropically conductive glue is set between circuit element to be laminated;

Be mixed with ferromagnetic substance in this Anisotropically conductive glue;

When the pressing head presses down circuit element to be laminated, to the electromagnetic induction coil power supply, electromagnetic induction coil heats Anisotropically conductive glue, makes the thermalization of Anisotropically conductive glue and circuit element is bondd.

5. circuit element hot pressing device, comprise a pressing head, it is characterized in that being provided with electromagnetic induction coil in the described pressing head, the pressing end face of described pressing head is adjacent to be provided with one and to press material with the contacted buffering of circuit element to be laminated, this buffering is pressed in the material and is provided with ferromagnetic material, when described pressing head was pressed the indirect pressing of material circuit element to be laminated by buffering, the electromagnetic induction coil in it made buffering press material to be heated.

6. circuit element hot pressing device according to claim 5 is characterized in that described pressing head comprises a saturating magnetic insulation obturator, and this saturating magnetic insulation obturator distributes and is provided with electromagnetic induction coil.

7. circuit element hot pressing device according to claim 6 is characterized in that described electromagnetic induction coil array packages in described magnetic insulation obturator, and described electromagnetic induction coil connection is provided with a temperature control circuit.

8. circuit element hot pressing device according to claim 6, the pressing end face that it is characterized in that described pressing head are a saturating magnetic thermal baffle, and described magnetic thermal baffle is fitted fixing with saturating magnetic insulation obturator.

9. circuit element hot pressing device according to claim 5 is characterized in that it is a sheet material that described buffering is pressed material, and this buffering is pressed and disperseed to be filled with ferromagnetic particle in the material.

10. circuit element hot pressing device according to claim 5 is characterized in that described hot pressing device comprises that further one is used to place the pressing base of circuit element to be laminated.

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