CN101871614A - Illuminating lamp and manufacturing method thereof - Google Patents
Illuminating lamp and manufacturing method thereof Download PDFInfo
- Publication number
- CN101871614A CN101871614A CN201010186419A CN201010186419A CN101871614A CN 101871614 A CN101871614 A CN 101871614A CN 201010186419 A CN201010186419 A CN 201010186419A CN 201010186419 A CN201010186419 A CN 201010186419A CN 101871614 A CN101871614 A CN 101871614A
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- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- illuminating lamp
- chip
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 18
- 229920005992 thermoplastic resin Polymers 0.000 claims description 18
- 238000002347 injection Methods 0.000 claims description 17
- 239000007924 injection Substances 0.000 claims description 17
- 238000001746 injection moulding Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 10
- 238000012423 maintenance Methods 0.000 claims description 3
- 238000005265 energy consumption Methods 0.000 description 10
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005253 cladding Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
The lighting lamp comprises a printed circuit board, an LED lamp and a thermoplastic resin body, wherein the printed circuit board and the LED lamp are connected through a lead, the LED lamp is provided with a lead part electrically connected with the printed circuit board and a head part used for lighting, the thermoplastic resin body encapsulates the printed circuit board and the lead part of the LED lamp, a chip resistor and a diode are arranged on the printed circuit board, and at least one through hole is formed in the printed circuit board. The manufacturing method of the illuminating lamp comprises the following steps: (1) forming at least one through hole on the printed circuit board; (2) printing a chip circuit on the printed circuit board, and connecting the bulb and a power line; (3) packaging and injection molding are carried out on the printed circuit board, the injection molding temperature ranges from 140 ℃ to 170 ℃, and the injection molding pressure ranges from 36 Kg/cm to 90Kg/cm2. The manufacturing method of the illuminating lamp and the illuminating lamp solve the problem of uneven pressure of components during injection molding by arranging the through holes, can perform injection molding in a high-pressure and low-temperature range, and have low requirements on materials, low manufacturing cost and low energy consumption.
Description
[technical field]
The present invention relates to a kind of lighting apparatus, refer in particular to the illuminating lamp that is applied in car lighting.
[background technology]
Be installed in the interior lighting equipment of lighting equipment for vehicle such as window control switch, the interior lighting equipment of ashtray, the lighting apparatus on the Electronic equipment panel etc., the illuminating lamp that comprises light emitting diode or miniature bulb, the expose portion of these light emitting diodes or miniature bulb is to be made by glass or synthetic resin, under exposed state, be very easy to damage, if adopt traditional housing method for packing, fixing point between housing and illuminating lamp is easy to generate the gap, can cause dust to enter or becomes flexible.For addressing these problems, Chinese patent 02105702.8 adopts the molded illuminating lamp of thermoplastic resin, the characteristics of this method of moulding be lower pressure (3～35Kg/cm2) and higher temperature under (180～230 ℃) just can finish corresponding manufacturing engineering.This method of moulding is very high to the requirement of resin material, and its manufacturing cost is also higher relatively, and the illuminating lamp component parts is damaged; Simultaneously, low-pressure injection molding needs special equipment, and this also can cause manufacturing cost to rise.
Therefore, be to solve the problem that prior art exists, a kind of low to material requirements, that manufacturing cost is lower, can be in low temperature range molded manufacture method need be provided.
[summary of the invention]
The object of the present invention is to provide a kind of low cost of manufacture, good, low illuminating lamp and the manufacture method thereof of manufacturing energy consumption of workmanship.
For realizing the object of the invention, provide following technical scheme:
Illuminating lamp of the present invention comprises printed circuit board (PCB), LED lamp and thermoplastic resin body, described printed circuit board (PCB) is provided with Chip-R and diode, described LED light fixture has conductor part that is electrically connected with described printed circuit board (PCB) and the head that is used to throw light on, described thermoplastic resin body encapsulates the conductor part of described printed circuit board (PCB) and described LED lamp, offer at least one perforation on the described printed circuit board (PCB), the influence of the pressure inequality that when this perforation can improve injection moulding printed circuit board (PCB) and each element is caused.
Preferable, a below that is arranged on described Chip-R in this at least one perforation.Especially, owing to have the gap between Chip-R and the printed circuit board (PCB), injected plastics material can inject the gap and expanded by high temperature when molded, cause Chip-R pressure inequality up and down, Chip-R is damaged, therefore the printed circuit board (PCB) below Chip-R is provided with perforation, and Chip-R is communicated with the injected plastics material of printed circuit board (PCB) another side with gap between the printed circuit board (PCB), makes pressure equilibrium about the Chip-R.
Further, adopt this kind structure to carry out injection moulding, the pressure limit that can bear is higher, therefore can adopt lower injection temperature scope, requirement to technology, material reduces greatly, use common thermoplastic resin material such as PVC/TPR and can realize that the modified PVC material is generally adopted in the corresponding reduction of cost.Simultaneously and since temperature to the influence of equipment energy consumption significantly greater than the influence of pressure to equipment energy consumption, therefore adopt the high-pressure injection moulding of the lower temperature that this kind structure can carry out, can reduce the energy consumption in the production process greatly, energy-saving and emission-reduction.
Preferable, below described Chip-R and electric capacity or diode, respectively be provided with a perforation respectively, so that the pressure equilibrium when injection moulding of Chip-R, electric capacity or diode.
The present invention also provides a kind of manufacture method of illuminating lamp, and it comprises the steps:
(1) on printed circuit board (PCB), offers at least one perforation;
(2) Chip-R and diode are set on described printed circuit board (PCB), connect LED lamp and described printed circuit board (PCB);
(3) with thermoplastic resin material described LED lamp conductor part and printed circuit board (PCB) are encapsulated injection mo(u)lding, simultaneously, prevent the head that thermoplastic resin covering LED is used to throw light on so that the head that LED is used to throw light on maintenance can be seemed is exposed to outside the injection molding thermoplastic resin, wherein, the injection temperature scope is at 140～170 ℃, and the injection pressure scope is at 36～90Kg/cm
2
Preferable, one of them of this at least one perforation is arranged on the below of Chip-R.
The contrast prior art, the present invention has the following advantages:
The manufacture method of illuminating lamp of the present invention and this illuminating lamp, by the influence of the pressure inequality that perforation causes printed circuit board (PCB) and each element when improving injection moulding is set, printed circuit board (PCB) below element is provided with perforation, element is communicated with the injected plastics material of printed circuit board (PCB) another side with gap between the printed circuit board (PCB), make up and down pressure equilibrium of element, avoid damaging element.
In addition, adopt illuminating lamp manufacture method provided by the invention to carry out injection moulding, the pressure limit that can bear is higher, therefore can adopt lower injection temperature scope, requirement to technology, material reduces greatly, uses common thermoplastic resin material such as PVC/TPR and can realize, the corresponding reduction of cost.Simultaneously and since temperature to the influence of equipment energy consumption significantly greater than the influence of pressure to equipment energy consumption, therefore adopt the high-pressure injection moulding of the lower temperature that this kind structure can carry out, can reduce the energy consumption in the production process greatly, energy-saving and emission-reduction.
[description of drawings]
Fig. 1 is the structural representation of illuminating lamp of the present invention;
Fig. 2 is the perspective view of illuminating lamp of the present invention;
Fig. 3 is that the a-a of Fig. 2 is to cutaway view;
Fig. 4 is the temperature and pressure scope schematic diagram of illuminating lamp manufacture method of the present invention;
Fig. 5 is the temperature and pressure scope schematic diagram of prior art manufacture method.
[specific embodiment]
See also Fig. 1～Fig. 3, illuminating lamp of the present invention comprises printed circuit board (PCB) 13, LED lamp and thermoplastic resin body 11, this printed circuit board (PCB) 13 is provided with Chip-R R and diode D, described LED lamp 12 has conductor part 15 that is electrically connected with described printed circuit board (PCB) 13 and the head 12 that is used to throw light on, described thermoplastic resin body encapsulates the conductor part 15 of described printed circuit board (PCB) 13 and described LED lamp, the lower position of corresponding described Chip-R R offers perforation 14 on this printed circuit board (PCB) 13, the influence of the pressure inequality that when this perforation can improve injection moulding printed circuit board (PCB) and element is caused, especially, owing to have the gap between Chip-R R and the printed circuit board (PCB) 13, injected plastics material can inject the gap and expanded by high temperature when molded, cause Chip-R pressure inequality up and down, Chip-R is damaged, therefore the printed circuit board (PCB) below Chip-R is provided with perforation, Chip-R is communicated with the injected plastics material of printed circuit board (PCB) another side with gap between the printed circuit board (PCB), make Chip-R pressure equilibrium up and down.
Equally, can also perforation be set, further alleviate injection pressure influence that printed circuit board (PCB) and each element caused in relevant position and other positions of printed circuit board (PCB) of diode D.
See also Fig. 2 and Fig. 3, in the injection moulding process, pressure flows out from the perforation 14 of printed circuit board (PCB) 13, can not accumulate in printed circuit board (PCB) 13 and Chip-R R, or between printed circuit board (PCB) 13 and the diode D, causes the fracture of Chip-R or diode, lost efficacy.Perforation 14 shape can be circle, also can be square, triangle, ellipse or other geometries, can reach the problem of alleviation injection pressure inequality equally.
Therefore further, adopt this kind structure to carry out injection moulding, the pressure limit that can bear is higher, can adopt lower injection temperature scope, and the requirement of technology, material is reduced greatly, uses common resin material such as PVC/TPR and can realize, the corresponding reduction of cost.
The manufacture method of this illuminating lamp, it comprises the steps:
(1) on printed circuit board (PCB), offers at least one perforation;
(2) Chip-R and diode are set on described printed circuit board (PCB), connect LED lamp and described printed circuit board (PCB);
(3) with thermoplastic resin material described LED lamp conductor part and printed circuit board (PCB) are encapsulated injection mo(u)lding, simultaneously, prevent the head that thermoplastic resin covering LED is used to throw light on so that the head that LED is used to throw light on maintenance can be seemed is exposed to outside the injection molding thermoplastic resin, wherein, the injection temperature scope is at 140～170 ℃, and the injection pressure scope is at 36～90Kg/cm
2
As shown in Figure 3, injection temperature scope of the present invention is 140 ℃～170 ℃, and the injection pressure scope is at 36～90Kg/cm
2Adopt the conductor part and the printed circuit board (PCB) of ordinary resin material injection molding package illumination lamp, the head that LED is used to throw light on during moulding keeps being exposed to visibly outside the injection heat cladding resin.
Because temperature significantly greater than the influence of pressure to equipment energy consumption, therefore adopts this kind structure of the lighting lamp and manufacture method to the influence of equipment energy consumption, can reduce the energy consumption in the production process greatly, energy-saving and emission-reduction.
The above is preferred embodiment of the present invention only, and protection scope of the present invention is not limited thereto, and anyly all belongs within the protection domain of the present invention based on the equivalent transformation on the technical solution of the present invention.
Claims (5)
1. illuminating lamp, comprise printed circuit board (PCB), LED lamp and thermoplastic resin body, described printed circuit board (PCB) is provided with Chip-R and diode, described LED light fixture has conductor part that is electrically connected with described printed circuit board (PCB) and the head that is used to throw light on, described thermoplastic resin body encapsulates the conductor part of described printed circuit board (PCB) and described LED lamp, it is characterized in that, offers at least one perforation on the described printed circuit board (PCB).
2. illuminating lamp as claimed in claim 1 is characterized in that, a below that is arranged on described Chip-R in this at least one perforation.
3. illuminating lamp as claimed in claim 1 is characterized in that, respectively is provided with a perforation below described Chip-R and electric capacity respectively.
4. the manufacture method as any described illuminating lamp of claim 1～3 is characterized in that it comprises the steps:
(1) on printed circuit board (PCB), offers at least one perforation;
(2) Chip-R and diode are set on described printed circuit board (PCB), connect LED lamp and described printed circuit board (PCB);
(3) with thermoplastic resin material described LED lamp conductor part and printed circuit board (PCB) are encapsulated injection mo(u)lding, simultaneously, prevent the head that thermoplastic resin covering LED is used to throw light on so that the head that LED is used to throw light on maintenance can be seemed is exposed to outside the injection molding thermoplastic resin, wherein, the injection temperature scope is at 140～170 ℃, and the injection pressure scope is at 36～90Kg/cm
2
5. illuminating lamp as claimed in claim 7 is characterized in that one of them of this at least one perforation is arranged on the below of Chip-R.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010186419A CN101871614A (en) | 2010-05-21 | 2010-05-21 | Illuminating lamp and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010186419A CN101871614A (en) | 2010-05-21 | 2010-05-21 | Illuminating lamp and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101871614A true CN101871614A (en) | 2010-10-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010186419A Pending CN101871614A (en) | 2010-05-21 | 2010-05-21 | Illuminating lamp and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101871614A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102352978A (en) * | 2011-07-20 | 2012-02-15 | 青岛海诺特电器有限公司 | Indicating lamp and injection-molding process thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1381692A (en) * | 2001-04-13 | 2002-11-27 | 株式会社T-T | Lighting device |
| US20040171189A1 (en) * | 1997-12-10 | 2004-09-02 | Morio Gaku | Semiconductor plastic package and process for the production thereof |
| CN101384140A (en) * | 2007-09-03 | 2009-03-11 | 三星电子株式会社 | Electronic appliance and method for manufacturing the same |
| CN101430052A (en) * | 2008-12-15 | 2009-05-13 | 伟志光电（深圳）有限公司 | PCB rubber shell integrated packaging LED illumination light source and its production technique |
-
2010
- 2010-05-21 CN CN201010186419A patent/CN101871614A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040171189A1 (en) * | 1997-12-10 | 2004-09-02 | Morio Gaku | Semiconductor plastic package and process for the production thereof |
| CN1381692A (en) * | 2001-04-13 | 2002-11-27 | 株式会社T-T | Lighting device |
| CN101384140A (en) * | 2007-09-03 | 2009-03-11 | 三星电子株式会社 | Electronic appliance and method for manufacturing the same |
| CN101430052A (en) * | 2008-12-15 | 2009-05-13 | 伟志光电（深圳）有限公司 | PCB rubber shell integrated packaging LED illumination light source and its production technique |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102352978A (en) * | 2011-07-20 | 2012-02-15 | 青岛海诺特电器有限公司 | Indicating lamp and injection-molding process thereof |
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Application publication date: 20101027 |