CN101866917B - Active element array substrate and repair method thereof - Google Patents

Abstract

The invention discloses an active element array substrate, which comprises a substrate, a plurality of pixels, a plurality of signal wires and a repair structure. The substrate is provided with a display area and a peripheral area. Pixel arrays are arranged on the display area of the substrate. The signal wires are electrically connected with the pixels, and the signal wires extend to the peripheral area from the display area respectively. The repair structure is collocated in the peripheral area, and the repair structure comprises a first repair wire, a second repair wire, an electrostatic release lead and an electrostatic protection element. The first repair wire is staggered with one end of the signal wire, and the first repair wire is electrically floated. The electrostatic protection element is connected between the second repair wire and the electrostatic release lead, and the electrostatic protection element is superposed and electrically insulated with the first repair wire.

Description

Active element array substrate and repair method thereof

technical field

The present invention relates to an array substrate and its repair method, and in particular to an active element array substrate and its repair method. the

Background technique

The operation mode of the flat panel display is to control each pixel (pixel) arranged in an array by two sets of signal lines perpendicular to each other, so as to achieve the purpose of displaying images. Among various display control modes, the design of scan lines and data lines is most commonly used, and these scan lines and data lines are perpendicular to each other and define a plurality of pixels. Each scanning line is sequentially turned on to turn on or turn off the corresponding switching element, so that the signal transmitted by each data line can be written into the pixel, thereby changing the state of the corresponding pixel, and achieving the purpose of controlling the display screen. the

Although the flat panel display technology has matured, the components of the display panel, such as the active device array substrate, inevitably have some defects during the manufacturing process. For example, the scanning lines and data lines on the active device array substrate are very long, so they are prone to disconnection. When the scan line and the data line are disconnected, some pixels will not be able to operate (line defect), so it is necessary to try to repair the disconnection. In addition, it is very difficult to achieve zero defect rate only by improving the process technology. Therefore, the repair structure and defect repair technology of the active device array substrate become very important. In the prior art, the defect repair of the active device array substrate is usually performed by means of laser welding and/or laser cutting. the

Generally speaking, in order to quickly repair broken wires, more than one repair line will be reserved on the active element array substrate. Under normal circumstances, the repair line will intersect with the signal line to have soldering points, and the repair line and the signal line Electrically insulated. When the signal line is broken due to an open defect, the two ends of the damaged signal line can be welded to the repair line through the welding point, so that the damaged signal line can maintain electrical continuity through the repair line , for the pixel to function properly. the

In other words, under normal circumstances, the repair line is electrically floating and electrically insulated from the signal line, and only when the signal line is disconnected, the repair line will be welded by laser welding or the like. The point is electrically connected with the signal line to maintain the electrical conduction of the signal line. However, it is worth noting that the signal line and the repair line are extremely susceptible to electrostatic discharge (ESD), resulting in a short circuit between the signal line and the repair line. In this way, the display quality of the active device array substrate will be affected, and even the active device array substrate must be scrapped. the

Contents of the invention

The invention provides an active element array substrate, which makes the signal line and the repair line not easily affected by the electrostatic discharge effect and has good element characteristics. the

The present invention further provides a repairing method suitable for the above-mentioned active device array substrate to repair the damaged signal lines so that the pixels can operate normally. the

The invention provides an active device array substrate, which includes a substrate, a plurality of pixels, a plurality of signal lines and a repair structure. The substrate has a display area and a peripheral area. The pixel array is arranged on the display area of the substrate. The signal lines are electrically connected to the pixels, and each signal line extends from the display area to the peripheral area. The repairing structure is arranged in the peripheral area, and the repairing structure includes a first repairing line, a second repairing line, an electrostatic discharge wire and an electrostatic protection element. The first repairing line intersects with one end of the signal line, and the first repairing line is electrically floating. The electrostatic protection element is connected between the second repairing wire and the electrostatic discharge wire, and the electrostatic protection element overlaps with the first repairing wire and is electrically insulated from each other. the

The present invention further proposes a repairing method, which is suitable for repairing the above-mentioned active device array substrate. When an open defect occurs in one of the signal lines, the repairing method includes the following steps. Solder the first repair wire to one end of the signal wire with the open defect. Where the electrostatic protection element overlaps with the first repair line, the electrostatic protection element is welded to the first repair line, wherein the second repair line is electrically connected to the signal line with an open defect through the electrostatic protection element and the first repair line. the

The present invention provides another active device array substrate, which includes a substrate, a plurality of pixels, a plurality of signal lines and a repair structure. The substrate has a display area and a peripheral area. The pixel array is arranged on the display area of the substrate. The signal lines are electrically connected to the pixels, and each signal line extends from the display area to the peripheral area, and one of the signal lines has an open defect. The repairing structure is arranged in the peripheral area, and the repairing structure includes a first repairing line, a second repairing line, an electrostatic discharge wire and an electrostatic protection element. The first repairing line intersects with one end of the signal line, and the first repairing line is electrically floating. The electrostatic protection element is electrically connected between the second repairing line and the electrostatic discharge wire, and the electrostatic protection element overlaps with the first repairing line and is electrically insulated from each other, wherein the first repairing line and one end of the signal line having an open defect have a There is at least one welding point, and there is at least one welding point at the overlap between the electrostatic protection component and the first repairing line, so that the second repairing line is electrically connected to the signal line having an open circuit defect through the electrostatic protection component and the first repairing line. the

The present invention proposes yet another active device array substrate, which includes a substrate, a plurality of pixels, a plurality of signal lines and a repair structure. The substrate has a display area and a peripheral area. The pixel array is arranged on the display area of the substrate. The signal lines are electrically connected to the pixels, and each signal line extends from the display area to the peripheral area, and one of the signal lines has an open defect. The repairing structure is arranged in the peripheral area, and the repairing structure includes a first repairing line, a second repairing line, an electrostatic discharge wire and an electrostatic protection element. The first repairing line intersects with one end of the signal line, and the first repairing line is electrically floating. The electrostatic protection element is electrically connected between the second repairing wire and the electrostatic discharge wire, wherein the electrostatic protection element includes a plurality of diodes connected in series, and each diode includes a first electrode, a second electrode, and an electrical connection between the second electrode and the second electrode. A control electrode and a semiconductor layer that are electrically connected, the semiconductor layer is located above the control electrode, and is connected between the first electrode and the second electrode, and one of the first electrodes that is not electrically connected to the second electrode is electrically connected to the static discharge wire One of the second electrodes that is not electrically connected to the first electrode is electrically connected to the second repair line, and the first repair line overlaps with one of the second electrodes. Where the first repair line intersects with one end of the signal line having an open defect, where the second electrode overlaps the first repair line, and where part of the control electrode overlaps part of the second electrode, there is at least one welding point, so that the second The repairing line is electrically connected to the signal line having an open defect through part of the control electrode, part of the second electrode and the first repairing line. the

Based on the above, the active device array substrate of the present invention has a repair structure, and the repair structure can protect the signal line and the repair line from being affected by the electrostatic discharge effect, so as to avoid short circuit between the signal line and the repair line. In this way, the active device array substrate can have better yield and display quality. the

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings. the

Description of drawings

FIG. 1A is a schematic top view of an active element array substrate according to an embodiment of the present invention;

Figure 1B is an enlarged schematic view of the repair structure of Figure 1A;

2A is a schematic top view of an active element array substrate according to an embodiment of the present invention;

Figure 2B is an enlarged schematic view of the repair structure of Figure 2A;

FIG. 3 is a repair method according to an embodiment of the present invention, which is suitable for repairing the active element array substrate of FIG. 1A;

4 is an enlarged schematic view of another repair structure of the active element array substrate of FIG. 1A;

5 is an enlarged schematic view of another repair structure of the active element array substrate of FIG. 2A;

FIG. 6 is a repair method according to an embodiment of the present invention, which is suitable for repairing the active device array substrate with the repair structure shown in FIG. 5 . the

【Description of main component symbols】

100, 100a: active element array substrate

102: Substrate

104: display area

106: Peripheral Area

110: Pixels

112: Active components

114: pixel electrode

116: Gate drive circuit

118: Source drive circuit

120: scan line

130, 130a: data line

131a, 131b: terminal

134: Flexible printed circuit board

136: Control element

138: Electrostatic protection components

140: Repairing Structures

142: First Repair Line

144: Second repair line

146: Electrostatic discharge wire

150: Electrostatic protection components

152, 152a, 152b: Diodes

154: first electrode

156: Second electrode

158: Control electrode

160: semiconductor layer

162: Conductive layer

180: welding point

D: open circuit defect

Detailed ways

FIG. 1A is a schematic top view of an active device array substrate according to an embodiment of the present invention, and FIG. 1B is an enlarged schematic view of the repair structure in FIG. 1A . Referring to FIG. 1A , the active device array substrate 100 includes a substrate 102 , a plurality of pixels 110 , a plurality of scan lines 120 , a plurality of data lines 130 and a repair structure 140 . The substrate 102 has a display area 104 and a peripheral area 106 . In this embodiment, the display area 104 is the inner area surrounded by the dotted line in FIG. 1A and the area from the dotted line to the edge of the substrate 102 is the peripheral area 106 . The pixels 110 are arranged in an array on the display area 104 of the substrate 102 . A gate driving circuit 116 and a source driving circuit 118 are disposed in the peripheral area 106 . The pixel 110 includes an active element 112 such as a transistor and a pixel electrode 114 electrically connected to the active element 112 . The scan lines 120 and the data lines 130 are arranged alternately on the substrate 102 and extend from the display area 104 to the peripheral area 106 respectively. The gate driving circuit 116 and the source driving circuit 118 are respectively connected to the active device 112 in the corresponding pixel 110 via the scan line 120 and the data line 130 to drive the pixel 110 . the

Please refer to FIG. 1A and FIG. 1B at the same time. The repair structure 140 is disposed in the peripheral area 106 . The repair structure 140 includes a first repair line 142 , a second repair line 144 , an ESD wire 146 and an ESD protection element 150 . The first repairing line 142 overlaps with one end 131 a of the data line 130 alternately. The first repairing line 142 is electrically floating, and the first repairing line 142 and the data line 130 are electrically insulated from each other. The ESD protection element 150 is connected between the second repairing wire 144 and the ESD discharge wire 146 (please refer to FIG. 1B ), and the ESD protection element 150 overlaps with the first repairing wire 142 and is electrically insulated from each other. In this embodiment, the ESD protection element 150 includes at least one diode 152 , and the diode 152 includes a first electrode 154 , a second electrode 156 , a control electrode 158 and a semiconductor layer 160 . Wherein, the control electrode 158 is electrically connected to the second electrode 156 through the conductive layer 162 , for example. Wherein, the material of the conductive layer 162 can be a transparent material (for example: indium tin oxide, aluminum tin oxide, indium zinc oxide, aluminum zinc oxide, ardium oxide, or other suitable materials, or a combination of the above), reflective materials (for example: gold, silver, copper, tin, aluminum, molybdenum, titanium, tantalum, or other suitable materials, or alloys of the above materials, or nitrides of the above materials, or oxides of the above materials, or nitrogen oxides, or a combination of the above), or a combination of the above. The material of the conductive layer 162 in the embodiment of the present invention is exemplified by a transparent material, therefore, it can also be called the transparent conductive layer 162, but is not limited thereto. The semiconductor layer 160 is located above a portion of the control electrode 158 and connected between the first electrode 154 and the second electrode 156 . The first electrode 154 is, for example, electrically connected to the ESD wire 146 through the transparent conductive layer 162 , and the ESD wire 146 is, for example, electrically connected to a common voltage terminal or grounded. The second electrode 156 is, for example, electrically connected to the second repairing line 144 . The second repair line 144 is, for example, connected to a control element 136 via the source drive circuit 118 and the flexible circuit board 134, and the control element 136 is, for example, a circuit control board; or the second repair line 144 is, for example, via the source drive circuit 118 is connected to the flexible circuit board 134 . the

In this embodiment, the active device array substrate 100 further includes, for example, an ESD protection component 138 connected to each data line 130 and adjacent to the intersection of the first repair line 142 and each data line 130 . The ESD protection element 138 is, for example, a diode. Furthermore, it is worth mentioning that the first repair line 142 overlaps with one end 131a of the data line 130, the second repair line 144 overlaps with the other end 131b of the data line 130, and the first repair line 144 of the ESD protection element 150 The two electrodes 156 overlap with the first repairing line 142 and are electrically insulated from each other. the

Generally speaking, in the process of manufacturing the active device array substrate or when the active device array substrate is used, electrostatic discharge effects are likely to be induced, thereby affecting the device characteristics or display quality of the active device array substrate. In particular, the electrostatic discharge effect may cause a short circuit between the signal line and the repair line. Therefore, in this embodiment, the active device array substrate 100 is provided with an ESD protection element 150 to protect the signal lines (such as the data lines 130 ) and the repair lines 142 from being affected by the ESD effect. In detail, when improper electrostatic charge accumulation or electrostatic discharge occurs in the peripheral area 106 of the active device array substrate 100, since the electrostatic protection element 150 is arranged between the second repair line 144 and the electrostatic discharge line 146, Therefore, static electricity can be derived along the path of the second repairing wire 144 , the second electrode 156 of the ESD protection component 150 , the first electrode 154 and the ESD discharge wire 146 . In this way, the signal line (such as the data line 130 ) and the repair line 142 can be prevented from being short-circuited due to static electricity, so that the active device array substrate 100 can have better yield and display quality. the

FIG. 2A is a schematic top view of an active device array substrate according to an embodiment of the present invention, and FIG. 2B is an enlarged schematic view of the repair structure in FIG. 2A . FIG. 3 is a repair method according to an embodiment of the present invention, which is suitable for repairing the active device array substrate shown in FIG. 1A . It should be noted that the components of the active device array substrate 100a shown in FIG. 2A are substantially the same as the components of the active device array substrate 100 shown in FIG. 1A, but in the active device array substrate 100a shown in FIG. 2A, one of The signal line (such as the data line 130a) has an open defect D, so it needs to be repaired by the repair structure 140 and the repair method shown in FIG. 3 . the

Please refer to FIG. 2A , FIG. 2B and FIG. 3 at the same time. First, step S310 is performed to solder the first repair line 142 to one end 131a of the signal line (such as the data line 130a ) having the open defect D. In this embodiment, one of the data lines 130a of the active device array substrate 100a has an open defect D, for example, the first repair line 142 overlaps with one end 131a of the data line 130a having the open defect D, and the second repair line 144 overlaps with the end 131a of the data line 130a having the open defect D. The other end 131b of the data line 130a having the open defect D overlaps. Therefore, in this embodiment, for example, laser welding is used to weld the overlapping portion of the first repair line 142 and the end 131a of the data line 130a to form a welding point 180 . In this way, the data line 130 a with the open defect D is electrically connected to the first repair line 142 through the welding point 180 . Moreover, in this embodiment, the repairing method further includes welding the overlapped portion of the second repairing line 144 and the other end 131b of the data line 130a to form a welding point 180 . the

Next, proceed to step S320, where the ESD protection element 150 overlaps with the first repair line 142, weld the ESD protection element 150 to the first repair line 142, wherein the second repair line 144 passes through the ESD protection element 150 and the first repair line 142 It is electrically connected to a signal line having an open defect D (such as the data line 130 a ). Specifically, in this embodiment, the electrostatic protection element 150 includes at least one diode 152, for example, and the diode 152 includes a first electrode 154, a second electrode 156, a control electrode 158 and a semiconductor layer 160, the semiconductor layer 160 It is disposed above the control electrode 158 and connected between the first electrode 154 and the second electrode 156 . The place where the electrostatic protection component 150 overlaps with the first repair line 142 is, for example, the place where the second electrode 156 overlaps with the first repair line 142. Therefore, the place where the electrostatic protection component 150 overlaps with the first repair line 142 is, for example, welding the second electrode 156 and the first repair line 142. Where the first repair line 142 overlaps, a welding point 180 is formed where the second electrode 156 overlaps with the first repair line 142 . the

Please refer to FIG. 2A and FIG. 2B , in this embodiment, the second electrode 156 is, for example, electrically connected to the second repairing line 144 . Therefore, after soldering the overlapping portion of the first repairing line 142 and the data line 130a, the overlapping portion of the second repairing line 144 and the data line 130a, and the overlapping portion of the second electrode 156 and the first repairing line 142, the signal can pass through the second repairing line 144. , the second electrode 156 of the electrostatic protection element 150, the welding point 180 (located at the overlap of the first repair line 142 and the second electrode 156), the first repair line 142, the welding point 180 (located at the data line 130a and the first repair line 142 overlap) and transmitted to one end 131a of the data line 130a, and since the second repair line 144 and the other end 131b of the data line 130a have been welded by the welding point 180, the signal can be transmitted by the data with the open defect D through the above-mentioned path One end 131a of the wire 130a is passed to the other end 131b. In this way, the data line 130a with the open-circuit defect D can maintain the state of electrical conduction through the repair structure 140, so that the pixel 110 can operate normally. the

In addition, in other embodiments, the second electrode 156 may also be connected to the ESD wire 146 as described in FIG. 4 of the following embodiments. In the embodiment of the present invention, the second electrode 156 is not connected to the ESD wire 146 as described in FIG. 4 of the following embodiment as an example, but it is not limited thereto. the

It can be known from the above embodiments that the repair structure 140 of the active device array substrates 100 and 100a can protect the data lines 130 and the repair lines 142 from being affected by the ESD effect, and can repair the data lines 130a with the open defect D. In other words, as shown in FIG. 1A and FIG. 1B, when the signal line (such as the data line 130) is normal, since the repair structure 140 can effectively conduct static electricity, it can avoid the signal line (such as the data line 130) There is a short circuit with the repair line 142 due to the electrostatic discharge effect. In this way, the yield rate of the active device array substrate 100 can be improved, thereby enabling the display panel to have good display quality. In addition, as shown in FIG. 2A and FIG. 2B, when the signal line (such as the data line 130a) has an open defect D, the repair structure 140 can be used to repair the signal line (such as the data line 130a), so that the signal line with the open defect remains. The electrical conduction state enables the pixel 110 to operate normally. In other words, the design of the repair structure 140 enables the active device array substrates 100 and 100 a to have good device characteristics and better display quality. the

In particular, although in the above-mentioned embodiment, the repair structure 140 is configured at one end 131a of the data line 130a as an example, the repair structure 140 can also be configured at the other end 131b of the data line 130a or at the same time. The two ends 131a, 131b of the line 130a. In addition, although the above-mentioned embodiment uses the repair structure 140 as an example to repair the data line 130, those skilled in the art should understand that the repair structure of the active device array substrate of the present invention can also be configured to be compatible with scanning The lines are interleaved to repair the scan lines with open defects, which will not be repeated here. Furthermore, in the above-mentioned embodiment, the ESD protection component 150 includes a diode 152 as an example, but the ESD protection component 150 may also include multiple diodes or diodes with other configurations. the

FIG. 4 is an enlarged schematic view of another repair structure 140 of the active device array substrate in FIG. 1A . Referring to FIG. 4 , in this embodiment, the repair structure 140 includes a first repair line 142 , a second repair line 144 , an ESD wire 146 and an ESD protection element 150 . The first repairing line 142 intersects with one end 131 a of the data line 130 to have an overlap. The first repairing line 142 is electrically floating, and the first repairing line 142 and the data line 130 are electrically insulated from each other. The ESD protection element 150 is connected between the second repairing wire 144 and the ESD discharge wire 146 , and the ESD protection element 150 overlaps with the first repairing wire 142 and is electrically insulated from each other. the

Please refer to FIG. 4 , in this embodiment, the electrostatic protection element 150 includes, for example, a plurality of diodes 152a, 152b connected in series, and each diode 152a, 152b includes a first electrode 154, a second electrode 156, and a control electrode. 158 and a semiconductor layer 160 . Wherein, the control electrode 158 is electrically connected to the second electrode 156 through the conductive layer 162 , for example. Wherein, the material of the conductive layer 162 can be a transparent material (for example: indium tin oxide, aluminum tin oxide, indium zinc oxide, aluminum zinc oxide, ardium oxide, or other suitable materials, or a combination of the above), reflective materials (for example: gold, silver, copper, tin, aluminum, molybdenum, titanium, tantalum, or other suitable materials, or alloys of the above materials, or nitrides of the above materials, or oxides of the above materials, or nitrogen oxides, or a combination of the above), or a combination of the above. The material of the conductive layer 162 in the embodiment of the present invention is exemplified by a transparent material, so it can also be called the transparent conductive layer 162 , but is not limited thereto. The semiconductor layer 160 is located above a portion of the control electrode 158 and connected between the first electrode 154 and the second electrode 156 . The first electrode 154 of the diode 152a is connected to the second electrode 156 of the diode 152b to connect the diode 152a and the diode 152b in series. Furthermore, one of the first electrodes 154 (that is, the first electrode 154 of the diode 152 b ) that is not electrically connected to the second electrode 156 is electrically connected to the electrostatic discharge wire 146 through the transparent conductive layer 162 , and the electrostatic discharge wire 146 For example, it is electrically connected to a common voltage terminal or grounded. One of the second electrodes 156 not electrically connected to the first electrode 154 (that is, the second electrode 156 of the diode 152a) is, for example, electrically connected to the second repair line 144, and the second repair line 144 is, for example, connected to a control element. 136. The control component 136 is, for example, a circuit control board or a flexible circuit board. the

In this embodiment, the first repair line 142 overlaps with one end 131a of the data line 130, the second repair line 144 overlaps with the other end 131b of the data line 130, and the second electrode 156 (that is, the second electrode of the diode 152b Electrode 156 ) overlaps first repair line 142 , and control electrode 158 (ie, control electrode 158 of diode 152 a ) overlaps second electrode 156 (ie, second electrode 156 of diode 152 b ). the

Please refer to FIG. 1A and FIG. 4 at the same time. When improper electrostatic charge accumulation or electrostatic discharge occurs in the peripheral area 106 of the active device array substrate 100, since the second repair line 144 and the electrostatic discharge wire 146 are disposed between ESD protection element 150, so static electricity can pass along the second repair line 144, the second electrode 156 of the diode 152a of the ESD protection element 150, the first electrode 154 of the diode 152a, the second electrode 156 of the diode 152b, and the first electrode 156 of the diode 152b. The electrode 154 and the path of the electrostatic discharge wire 146 are derived. In this way, the signal line (such as the data line 130 ) and the repair line 142 can be prevented from being short-circuited due to static electricity, so that the active device array substrate 100 can have better yield and display quality. the

FIG. 5 is an enlarged schematic view of another repair structure 140 of the active device array substrate in FIG. 2A . FIG. 6 is a repair method according to an embodiment of the present invention, which is suitable for repairing the active device array substrate 100 a having the repair structure 140 shown in FIG. 5 . Please refer to FIG. 2A and FIG. 5 at the same time. In this embodiment, one of the signal lines (such as the data line 130a) of the active device array substrate 100a has an open circuit defect D, so it needs to be repaired by the repair structure 140 in FIG. The repair method shown to repair. the

Please refer to FIG. 2A , FIG. 5 and FIG. 6 at the same time. Firstly, step S610 is performed to solder the first repair line 142 to one end 131a of the signal line (such as the data line 130a ) having the open defect D. In this embodiment, one of the data lines 130a of the active device array substrate 100a has an open defect D, for example, the first repair line 142 overlaps with one end 131a of the data line 130a having the open defect D, and the second repair line 144 overlaps with the end 131a of the data line 130a having the open defect D. The other end 131b of the data line 130a having the open defect D overlaps. Therefore, in this embodiment, for example, laser welding is used to weld the overlapping portion of the first repair line 142 and the end 131a of the data line 130a to form a welding point 180 . In this way, the data line 130 a with the open defect D is electrically connected to the first repair line 142 through the welding point 180 . Moreover, in this embodiment, the repairing method further includes welding the overlapped portion of the second repairing line 144 and the other end 131b of the data line 130a to form a welding point 180 . the

Next, step S620 is performed, where the second electrode 156 and the first repairing line 142 overlap, the second electrode 156 is welded to the first repairing line 142 . In this embodiment, the second electrode 156 of the diode 152 b overlaps with the first repairing line 142 , for example. Therefore, in this step, for example, laser welding is used to weld the second electrode 156 of the diode 152b and the first repair line 142 to form a welding point 180 . the

Then, proceed to step S630, welding part of the control electrode 158 and part of the second electrode 156, so that the second repair line 144 passes through the part of the control electrode 158, part of the second electrode 156 and the first repair line 142 and the signal with the open defect D Wires (such as the data wire 130a) are electrically connected. In this embodiment, the electrostatic protection element 150 includes, for example, a plurality of diodes 152a, 152b connected in series, and each diode 152a, 152b includes a first electrode 154, a second electrode 156, a control electrode 158 and a semiconductor layer 160. Wherein, the control electrode 158 of the diode 152a overlaps with the second electrode 156 of the diode 152a. Therefore, in this step, welding a portion of the control electrode 158 and a portion of the second electrode 156 is, for example, welding the control electrode 158 of the diode 152 a and the second electrode 156 of the diode 152 a to form a welding point 180 . Wherein, since the control electrode 158 of the diode 152a is, for example, electrically connected to the second electrode 156 of the diode 152b, the second electrode 156 of the diode 152a can be electrically connected to the control electrode 158 of the diode 152a through the welding point 180, and then connected to the diode 152a. The second electrode 156 of 152b is electrically connected. the

Please refer to FIG. 2A and FIG. 5 , in this embodiment, the second electrode 156 of the diode 152 a is electrically connected to the second repair line 144 , for example. Therefore, after welding the first repair line 142 overlapping with the data line 130a, the second electrode 156 of the diode 152b overlapping with the first repair line 142, and the control electrode 158 of the diode 152a and the second electrode 156 of the diode 152a, the signal can Through the second repair line 144, the second electrode 156 of the diode 152a of the electrostatic protection element 150, the welding point 180 (at the overlapping place where the control electrode 158 of the diode 152a overlaps with the second electrode 156 of the diode 152a), the diode 152a of the electrostatic protection element 150 The control electrode 158 of the ESD protection element 150, the second electrode 156 of the diode 152b, the welding point 180 (located at the overlap of the first repair line 142 and the second electrode 156 of the diode 152b), the first repair line 142, the signal welding point 180 (located at the overlap of the data line 130a and the first repair line 142) and transmitted to one end 131a of the data line 130a, and because the second repair line 144 and the other end 131b of the data line 130a have been welded by the welding point 180, the signal can be It is transmitted from one end 131a of the data line 130a having the open defect D to the other end 131b through the above path. In this way, the data line 130 a with the open defect D can be maintained in an electrically conductive state by the repair structure 140 , so that the pixel 110 can operate normally. the

In addition, in other embodiments, the second electrode 156 of the diode 152b can also be designed as described in FIG. 2 of the above embodiment without being connected to the ESD wire 146 . In the embodiment of the present invention, the second electrode 156 of the diode 152b is connected to the ESD wire 146 as an example, but it is not limited thereto. the

It can be seen from the above-mentioned embodiments that the repair structure 140 of the active device array substrates 100 and 100a can protect the data lines 130 and the repair lines 142 from being affected by the ESD effect, and can repair the data lines 130a with open defects. In other words, as shown in FIG. 1A and FIG. 4, when the signal line (such as the data line 130) is normal, since the repair structure 140 can effectively conduct static electricity, it can avoid the signal line (such as the data line 130) There is a short circuit with the repair line 142 due to the electrostatic discharge effect. In this way, the yield rate of the active device array substrate 100 can be improved, thereby enabling the display panel to have good display quality. In addition, as shown in FIG. 2A and FIG. 5, when the signal line (such as the data line 130a) has an open defect D, the repair structure 140 can be used to repair the signal line (such as the data line 130a), so that the signal line with the open defect remains. The electrical conduction state enables the pixel 110 to operate normally. In other words, the design of the repair structure 140 enables the active device array substrates 100 and 100 a to have good device characteristics and better display quality. the

It is particularly noted that although in the above-mentioned embodiment, the repair structure 140 is configured at one end 131a of the data line 130a as an example, the repair structure 140 may also be configured at the other end 131b of the data line 130a or both ends 131a, 131b. In addition, although in the above-mentioned embodiment only the repair structure 140 is used to repair the data line 130 as an example, those skilled in the art should understand that the repair structure of the active device array substrate of the present invention can also be configured to be compatible with scanning Line interleaving is used to repair scan lines with open defects. Furthermore, in the above-mentioned embodiment, the ESD protection element 150 includes two diodes 152 as an example, but the ESD protection element 150 may also include more than two diodes connected in series or diodes with other configurations. the

To sum up, the active device array substrate of the present invention has a repair structure, and the repair structure can effectively discharge static electricity. Therefore, when improper electrostatic charge accumulation or electrostatic discharge occurs in the peripheral area of the active device array substrate, the repair structure can protect the signal line and the repair line from being easily affected by the electrostatic discharge effect, thereby preventing the signal line and the repair line from being affected by the electrostatic discharge effect. A short circuit has occurred. That is, the active device array substrate of the present invention is not easily damaged by electrostatic discharge and has good quality. Therefore, when the display panel has the above-mentioned active element array substrate, the display panel also has good display quality and is not easily damaged by electrostatic discharge. the

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Those skilled in the art can make various corresponding modifications according to the present invention without departing from the spirit and essence of the present invention. Changes and deformations, but these corresponding changes and deformations should fall within the scope of protection of the appended claims of the present invention. the

Claims (18)

1. active component array base board comprises:

One substrate has a viewing area and an external zones;

A plurality of pixels, arrayed is on this viewing area of this substrate;

Many signal line electrically connect with those pixels, and respectively this holding wire extend to this external zones from this viewing area respectively; And

One preparing structure is disposed at this external zones, and this preparing structure comprises:

One first patch cord, staggered with a wherein end of those holding wires, and this first patch cord is for electrically floating;

One second patch cord;

One static discharges lead; And

One electrostatic protection element is connected in this second patch cord and this static and discharges between the lead, and this electrostatic protection element and this first patch cord are overlapping and be electrically insulated each other.

2. active component array base board as claimed in claim 1 is characterized in that, those holding wires comprise multi-strip scanning line and many data wires, and those scan lines and those data wires are staggered.

3. active component array base board as claimed in claim 1 is characterized in that, this static discharges lead and is electrically connected at a common voltage end.

4. active component array base board as claimed in claim 1 is characterized in that, this static discharges lead ground connection.

5. active component array base board as claimed in claim 1 is characterized in that this electrostatic protection element comprises at least one diode, and this diode comprises:

One first electrode;

One second electrode;

One control electrode electrically connects with this second electrode; And

Semi-conductor layer is positioned at this control electrode top, and is connected between this first electrode and this second electrode.

6. active component array base board as claimed in claim 5; It is characterized in that; This first electrode and this static discharge lead and electrically connect, this second electrode and the electric connection of this second patch cord, and wherein this second electrode and this first patch cord are overlapping and be electrically insulated each other.

7. active component array base board as claimed in claim 1; It is characterized in that; This electrostatic protection element comprises a plurality of diodes of serial connection each other; Respectively this diode comprises one first electrode, one second electrode, one and this second electrode control electrode and the semi-conductor layer that electrically connect, and this semiconductor layer is positioned at this control electrode top, and is connected between this first electrode and this second electrode.

8. active component array base board as claimed in claim 7; It is characterized in that; One of them first electrode and this static with this second electrode electric connection does not discharge the lead electric connection; And one of them second electrode and the electric connection of this second patch cord of not electrically connecting with this first electrode, and this first patch cord and one of them second electrode are overlapping.

9. active component array base board as claimed in claim 1 is characterized in that, this second patch cord is connected to a control element.

10. active component array base board as claimed in claim 1 is characterized in that, further comprises another electrostatic protection element, connects respectively this holding wire, and is adjacent to this first patch cord and this holding wire staggered place respectively.

11. a method for repairing and mending is suitable for repairing the described active component array base board of claim 1, when wherein open circuit flaw (open defect) took place a signal line, this method for repairing and mending comprised:

With of the wherein end welding of this first patch cord with holding wire with this open circuit flaw; And

At this electrostatic protection element and this first patch cord overlapping, with this electrostatic protection element and the welding of this first patch cord, wherein this second patch cord electrically connects with the holding wire with this open circuit flaw through this electrostatic protection element and this first patch cord.

12. method for repairing and mending as claimed in claim 11; It is characterized in that; This electrostatic protection element comprises at least one diode; This diode comprises a control electrode, one first electrode, one second electrode and semi-conductor layer, and this semiconductor layer is arranged at this control electrode top and is connected between this first electrode and this second electrode, and wherein this electrostatic protection element and this first patch cord overlapping are this second electrode and this first patch cord overlapping.

13. a method for repairing and mending is suitable for repairing the described active component array base board of claim 8, when wherein open circuit flaw (open defect) took place a signal line, this method for repairing and mending comprised:

With of the wherein end welding of this first patch cord with holding wire with this open circuit flaw;

At this second electrode and this first patch cord overlapping, with this second electrode and the welding of this first patch cord; And

With part control electrode and the welding of part second electrode, so that this second patch cord electrically connects through part control electrode, part second electrode and this first patch cord and the holding wire with this open circuit flaw.

14. an active component array base board is characterized in that, comprising:

One substrate has a viewing area and an external zones;

A plurality of pixels, arrayed is on this viewing area of this substrate;

Many signal line electrically connect with those pixels, and respectively this holding wire extend to this external zones from this viewing area respectively, and wherein a signal line has open circuit flaw (open defect); And

One preparing structure is disposed at this external zones, and this preparing structure comprises:

One first patch cord, staggered with a wherein end of those holding wires, and this first patch cord is for electrically floating;

One second patch cord;

One static discharges lead;

One electrostatic protection element; Being electrically connected at this second patch cord and this static discharges between the lead; This electrostatic protection element and this first patch cord are overlapping and be electrically insulated each other; Wherein this first patch cord has at least one pad with the wherein end with holding wire of this open circuit flaw; The overlapping of this electrostatic protection element and this first patch cord has at least one pad, so that this second patch cord electrically connects with the holding wire with this open circuit flaw through this electrostatic protection element and this first patch cord.

15. active component array base board as claimed in claim 14; It is characterized in that; This electrostatic protection element comprises at least one diode, and this diode comprises a control electrode, one first electrode, one second electrode and semi-conductor layer, and this semiconductor layer is arranged at this control electrode top and is connected between this first electrode and this second electrode; Wherein this electrostatic protection element and this first patch cord overlapping are this second electrode and this first patch cord overlapping, and this overlapping has this pad.

16. active component array base board as claimed in claim 14 is characterized in that, further comprises another electrostatic protection element, connects respectively this holding wire, and is adjacent to this first patch cord and this holding wire staggered place respectively.

17. an active component array base board is characterized in that, comprising:

One substrate has a viewing area and an external zones;

A plurality of pixels, arrayed is on this viewing area of this substrate;

Many signal line electrically connect with those pixels, and respectively this holding wire extend to this external zones from this viewing area respectively, and wherein a signal line has open circuit flaw (open defect); And

One preparing structure is disposed at this external zones, and this preparing structure comprises:

One first patch cord, staggered with a wherein end of those holding wires, and this first patch cord is for electrically floating;

One second patch cord;

One static discharges lead; And

One electrostatic protection element; Being electrically connected at this second patch cord and this static discharges between the lead; Wherein this electrostatic protection element comprises a plurality of diodes of serial connection each other; Respectively this diode comprises one first electrode, one second electrode, one and this second electrode control electrode and the semi-conductor layer that electrically connect; This semiconductor layer is positioned at this control electrode top, and is connected between this first electrode and this second electrode, and one of them first electrode and this static with this second electrode electric connection does not discharge the lead electric connection; And one of them second electrode and the electric connection of this second patch cord of not electrically connecting with this first electrode, and this first patch cord and one of them second electrode are overlapping;

Wherein this first patch cord and the holding wire with this open circuit flaw wherein an end staggered place, this second electrode and this first patch cord overlapping and part control electrode and the part second electrode overlapping all have at least one pad so that this second patch cord is through part control electrode, part second electrode and this first patch cord and have the holding wire electric connection of this open circuit flaw.

18. active component array base board as claimed in claim 17 is characterized in that, further comprises another electrostatic protection element, connects respectively this holding wire, and is adjacent to this first patch cord and this holding wire staggered place respectively.

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