CN101853914A - High-power LED white lighting source structure - Google Patents
High-power LED white lighting source structure Download PDFInfo
- Publication number
- CN101853914A CN101853914A CN201010168445A CN201010168445A CN101853914A CN 101853914 A CN101853914 A CN 101853914A CN 201010168445 A CN201010168445 A CN 201010168445A CN 201010168445 A CN201010168445 A CN 201010168445A CN 101853914 A CN101853914 A CN 101853914A
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- silica gel
- led chip
- lighting source
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- support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a high-power LED white lighting source structure which comprises a support and a heat dissipating copper pillar, wherein the heat dissipating copper pillar is arranged on the top of the support. The high-power LED white light source structure is characterized by comprising a PPA plastic reflecting cup body, a blue light LED chip, a golden thread and transparent silica gel. An outer ring of the support is provided with the PPA plastic reflecting cup body, and the PPA reflecting cup body is matched with the heat dissipating copper pillar to form a cup cavity. The blue light LED chip is die-bonded on the external surface of the heat dissipating copper pillar through silver gel, and the electrodes of the blue light LED chip are mutually connected with electrodes on the support through the golden thread. The transparent silica gel is packaged on the blue light LED chip, and the transparent silica gel fills the entire cup cavity. The invention solves the problems of high cost due to packaging twice by using silica gel, poor color temper coherence of the products and low light energy use efficiency of the lighting source in the prior art. The invention has the characteristics of reasonable structure, low cost, good heat dissipating effect, better color temper coherence and the like. The high-power LED white lighting source structure is an extremely simple and practical lighting source.
Description
Technical field
The present invention relates to a kind of lighting source, particularly relate to a kind of high-power LED white light source.
Background technology
High-pressure sodium lamp is mostly adopted in traditional illumination, but along with development of science and technology, the LED lamp relies on the luminous efficiency height, low power consumption, do not need high pressure, advantages such as fail safe height, be applied in various lighting fields widely, but when being some big area illuminations (such as headlight, street lamp, Tunnel Lamp, plaza lighting, industrial light, garden lamp etc.), at this moment the power of LED lamp is bigger, the life-span of led light source and the working temperature of node have closer getting in touch, at present the LED lamp has only 15%～25% electric energy to convert luminous energy in the course of the work, remaining electric energy nearly all changes into heat energy, the temperature of LED lamp is raise, and every increase by 10 its reliabilities of degree of temperature will reduce half.In great power LED, heat radiation is a big problem especially.Bad meeting directly causes the LED quick aging if dispel the heat, and stability reduces, bad can the generation life-span that serious light decay influences lamp of dispelling the heat simultaneously.
There is following defective in common high power white lighting source structure simultaneously: 1, owing to added the PC lens on light-source structure, so can not cross Reflow Soldering, can cause the damage of lens like this; When 2, white lighting source structure utilized silica gel to encapsulate, it was complicated to carry out twice packaging technology, uses the silica gel amount many, and cost is higher; 3, to encapsulate twice silica gel on the led chip, so the bad control of product colour temperature consistency; 4, the light energy of led chip is too many through medium, thereby has reduced the utilance of luminous energy, and the illumination light efficiency is not so good.
Summary of the invention
In order to solve the problems of the prior art, the invention provides a kind of rational in infrastructure, with low cost, good heat dissipation effect, the high-power white radiant that the consistency of light source color temperature is high.
The technical solution used in the present invention is:
A kind of high-power LED white lighting source structure, comprise support, heat radiation copper post, prop up top of the trellis and be provided with heat radiation copper post, it is characterized in that: also comprise PPA plastic reflective cup, blue-light LED chip, gold thread and transparent silica gel, described support is equipped with PPA plastic reflective cup outward, PPA reflection cup and heat radiation copper post cooperate formation cup chamber, described blue-light LED chip is solid brilliant in heat radiation copper post surface by elargol, on the support of blue-light LED chip both sides, be provided with electrode, the electrode of blue-light LED chip is connected with electrode on the support by gold thread, is packaged with transparent silica gel on blue-light LED chip, and transparent silica gel is full of whole cup chamber.
Aforesaid a kind of high-power LED white lighting source structure is characterized in that: described heat radiation copper post, support and PPA plastic reflective cup adopt the injection moulding process one-shot forming.
Aforesaid a kind of high-power LED white lighting source structure is characterized in that: be mixed with fluorescent material in the described transparent silica gel.
Aforesaid a kind of high-power LED white lighting source structure, it is characterized in that: described blue-light LED chip number is greater than one.
Aforesaid a kind of high-power LED white lighting source structure, it is characterized in that: the transparent silica gel that encapsulates on blue-light LED chip exceeds a glass chamber, and silica gel and the cup chamber form be shaped as the projection lenticular.
The invention has the beneficial effects as follows:
1, the present invention is configured to a cup with PPA, and constitutes a cup chamber with heat radiation copper post.In heat radiation copper post surface, fluorescent powder silica gel is directly splashed in this glass chamber and is cured blue-light LED chip by solid brilliant.Thereby save the use of PC lens cover, so the user can cross Reflow Soldering in use.
2, the present invention only need get final product by silica gel of encapsulation on blue-light LED chip, has saved the use amount of silica gel, has reduced cost, adopts once to encapsulate simultaneously can not make a big impact to colour temperature, has improved the consistency of light source color temperature.
3, the present invention need not add the PC lens, and the blue-light LED chip light energy is only passed through the silica gel medium, has significantly reduced the loss of luminous energy, and the illumination light efficiency is higher.
4, the present invention is provided with heat radiation copper post, can well dispel the heat, and has prolonged useful life, has reduced the loss of energy.
Description of drawings
Fig. 1 is a perspective view of the present invention;
Fig. 2 is a Facad structure schematic diagram of the present invention.
Embodiment
The present invention will be further described below in conjunction with accompanying drawing,
As depicted in figs. 1 and 2, a kind of high-power LED white lighting source structure, comprise support 1, heat radiation copper post 2, support 1 top is provided with heat radiation copper post 2, it is characterized in that: also comprise PPA plastic reflective cup, blue-light LED chip 3, gold thread 5 and transparent silica gel 6, described heat radiation copper post 2, support 1 and PPA plastic reflective cup adopt the injection moulding process one-shot forming, the support 1 outer PPA plastic reflective cup that is equipped with, PPA reflection cup and 2 cooperations of heat radiation copper post constitute the cup chamber, and described blue-light LED chip 3 is solid brilliant in copper post 2 surfaces of dispelling the heat by elargol, blue-light LED chip 3 numbers can be set to a plurality of, just can increase light efficiency when throwing light on like this.Be provided with electrode 4 on the support 1 of blue-light LED chip 3 both sides, the electrode of blue-light LED chip 3 is connected with electrode 4 on the support 1 by gold thread 5, is packaged with transparent silica gel 6 on blue-light LED chip 3, and transparent silica gel 6 is full of whole cup chamber.Be mixed with fluorescent material in the described transparent silica gel, blue light that blue-light LED chip sent and fluorescent material institute excited fluorescent are mixed the back and are formed the sensible white light of human eye.The transparent silica gel that fluorescent material is mixed in coating on blue-light LED chip, and make transparent silica gel be higher than the top in glass chamber, transparent silica gel and cup top of chamber edge can form surface tension, surface tension makes transparent silica gel raise into lenticular, thereby saved the use of PC lens cover, the lentiform transparent silica gel of solidifying the back reservation is in order to increase white light efficient.
More than show and described basic principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that describes in the foregoing description and the specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (5)
1. high-power LED white lighting source structure, comprise support, heat radiation copper post, prop up top of the trellis and be provided with heat radiation copper post, it is characterized in that: also comprise PPA plastic reflective cup, blue-light LED chip, gold thread and transparent silica gel, described support is equipped with PPA plastic reflective cup outward, PPA reflection cup and heat radiation copper post cooperate formation cup chamber, described blue-light LED chip is solid brilliant in heat radiation copper post surface by elargol, on the support of blue-light LED chip both sides, be provided with electrode, the electrode of blue-light LED chip is connected with electrode on the support by gold thread, is packaged with transparent silica gel on blue-light LED chip, and transparent silica gel is full of whole cup chamber.
2. a kind of high-power LED white lighting source structure according to claim 1 is characterized in that: described heat radiation copper post, support and PPA plastic reflective cup adopt the injection moulding process one-shot forming.
3. a kind of high-power LED white lighting source structure according to claim 2 is characterized in that: be mixed with fluorescent material in the described transparent silica gel.
4. a kind of high-power LED white lighting source structure according to claim 3, it is characterized in that: described blue-light LED chip number is greater than one.
5. a kind of high-power LED white lighting source structure according to claim 4, it is characterized in that: the transparent silica gel that encapsulates on blue-light LED chip exceeds a glass chamber, and silica gel and the cup chamber form be shaped as the projection lenticular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010168445A CN101853914A (en) | 2010-05-11 | 2010-05-11 | High-power LED white lighting source structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010168445A CN101853914A (en) | 2010-05-11 | 2010-05-11 | High-power LED white lighting source structure |
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| Publication Number | Publication Date |
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| CN101853914A true CN101853914A (en) | 2010-10-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010168445A Pending CN101853914A (en) | 2010-05-11 | 2010-05-11 | High-power LED white lighting source structure |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102364710A (en) * | 2011-11-04 | 2012-02-29 | 苏州晶雷光电照明科技有限公司 | Light emitting diode (LED) white light source device |
| CN102456806A (en) * | 2010-10-26 | 2012-05-16 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure |
| CN102931178A (en) * | 2012-07-30 | 2013-02-13 | 易美芯光（北京）科技有限公司 | Novel light emitting diode (LED) integrated optical source packaging structure |
| CN103227277A (en) * | 2013-03-27 | 2013-07-31 | 王定锋 | Welding-wire-free LED packaging method and LED packaging structure |
| CN103531671A (en) * | 2012-07-08 | 2014-01-22 | 深圳市蓝科电子有限公司 | Production process of light-emitting diode and light-emitting diode |
| CN103560131A (en) * | 2013-11-14 | 2014-02-05 | 深圳市丽晶光电科技股份有限公司 | LED display device and manufacturing method thereof |
| CN106098902A (en) * | 2016-08-03 | 2016-11-09 | 江西亚中电子科技有限公司 | A kind of high-brightness LED patch support |
| CN106287339A (en) * | 2015-06-10 | 2017-01-04 | 嘉兴山蒲照明电器有限公司 | LEDbulb lamp |
| US9882094B2 (en) | 2011-03-14 | 2018-01-30 | Intellectual Discovery Co., Ltd. | Light source with inner and outer bodies comprising three different encapsulants |
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| JP2007123390A (en) * | 2005-10-26 | 2007-05-17 | Kyocera Corp | Light emitting device |
| CN2903664Y (en) * | 2006-05-19 | 2007-05-23 | 孙平如 | A LED lighting module |
| CN101090144A (en) * | 2006-06-14 | 2007-12-19 | 宏齐科技股份有限公司 | Technology and Structure of High Power Light-emitting Component Encapsulation |
| US7326583B2 (en) * | 2004-03-31 | 2008-02-05 | Cree, Inc. | Methods for packaging of a semiconductor light emitting device |
| CN101834263A (en) * | 2010-04-27 | 2010-09-15 | 南京吉山光电科技有限公司 | Integrated light source structure with wide-angle transmission |
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2010
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| US7326583B2 (en) * | 2004-03-31 | 2008-02-05 | Cree, Inc. | Methods for packaging of a semiconductor light emitting device |
| CN2770097Y (en) * | 2004-11-16 | 2006-04-05 | 东贝光电科技股份有限公司 | Solid state semiconductor light emitting element |
| JP2007123390A (en) * | 2005-10-26 | 2007-05-17 | Kyocera Corp | Light emitting device |
| CN2903664Y (en) * | 2006-05-19 | 2007-05-23 | 孙平如 | A LED lighting module |
| CN101090144A (en) * | 2006-06-14 | 2007-12-19 | 宏齐科技股份有限公司 | Technology and Structure of High Power Light-emitting Component Encapsulation |
| CN101834263A (en) * | 2010-04-27 | 2010-09-15 | 南京吉山光电科技有限公司 | Integrated light source structure with wide-angle transmission |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102456806A (en) * | 2010-10-26 | 2012-05-16 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure |
| US9882094B2 (en) | 2011-03-14 | 2018-01-30 | Intellectual Discovery Co., Ltd. | Light source with inner and outer bodies comprising three different encapsulants |
| CN102364710A (en) * | 2011-11-04 | 2012-02-29 | 苏州晶雷光电照明科技有限公司 | Light emitting diode (LED) white light source device |
| CN103531671A (en) * | 2012-07-08 | 2014-01-22 | 深圳市蓝科电子有限公司 | Production process of light-emitting diode and light-emitting diode |
| CN102931178A (en) * | 2012-07-30 | 2013-02-13 | 易美芯光（北京）科技有限公司 | Novel light emitting diode (LED) integrated optical source packaging structure |
| CN103227277A (en) * | 2013-03-27 | 2013-07-31 | 王定锋 | Welding-wire-free LED packaging method and LED packaging structure |
| CN103560131A (en) * | 2013-11-14 | 2014-02-05 | 深圳市丽晶光电科技股份有限公司 | LED display device and manufacturing method thereof |
| CN103560131B (en) * | 2013-11-14 | 2016-06-01 | 深圳市丽晶光电科技股份有限公司 | A kind of LED display and manufacture method thereof |
| CN106287339A (en) * | 2015-06-10 | 2017-01-04 | 嘉兴山蒲照明电器有限公司 | LEDbulb lamp |
| CN106287339B (en) * | 2015-06-10 | 2020-10-02 | 嘉兴山蒲照明电器有限公司 | LED filament |
| CN106098902A (en) * | 2016-08-03 | 2016-11-09 | 江西亚中电子科技有限公司 | A kind of high-brightness LED patch support |
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