CN101840285B - Touch control device, touch control display panel and repairing method thereof - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000008439 repair process Effects 0.000 claims abstract description 178
- 239000010410 layer Substances 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 43
- 239000011241 protective layer Substances 0.000 claims description 19
- 238000001182 laser chemical vapour deposition Methods 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 23
- 230000008569 process Effects 0.000 description 10
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- -1 IZO) Chemical compound 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- BEQNOZDXPONEMR-UHFFFAOYSA-N cadmium;oxotin Chemical compound [Cd].[Sn]=O BEQNOZDXPONEMR-UHFFFAOYSA-N 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 150000001925 cycloalkenes Chemical class 0.000 description 2
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001470 polyketone Polymers 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 108010023321 Factor VII Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- DUFGEJIQSSMEIU-UHFFFAOYSA-N [N].[Si]=O Chemical compound [N].[Si]=O DUFGEJIQSSMEIU-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- TYHJXGDMRRJCRY-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) tin(4+) Chemical compound [O-2].[Zn+2].[Sn+4].[In+3] TYHJXGDMRRJCRY-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Push-Button Switches (AREA)
Abstract
本发明公开一种触控装置与触控显示面板及其修补方式,该触控显示面板包含一显示面板与一触控感测阵列。触控感测阵列设置于显示面板上,并包含多条第一透明感测串列、多条第二透明感测串列、多个导电修补标记。第一透明感测串列沿一第一方向排列,且包含多个彼此电性连接的第一透明感测垫;第二透明感测串列沿一第二方向排列,且包含多个彼此电性连接的第二透明感测垫,且各第一透明感测垫与各第二透明感测垫彼此电性隔绝。导电修补标记对应于第一透明感测垫或第二透明感测垫设置。
The invention discloses a touch device, a touch display panel and a repair method thereof. The touch display panel includes a display panel and a touch sensing array. The touch sensing array is arranged on the display panel, and includes a plurality of first transparent sensing series, a plurality of second transparent sensing series, and a plurality of conductive repair marks. The first transparent sensing series is arranged along a first direction and includes a plurality of first transparent sensing pads electrically connected to each other; the second transparent sensing series is arranged along a second direction and includes a plurality of first transparent sensing pads electrically connected to each other. The second transparent sensing pads are electrically connected, and each first transparent sensing pad and each second transparent sensing pad are electrically isolated from each other. The conductive repair marks are disposed corresponding to the first transparent sensing pad or the second transparent sensing pad.
Description
技术领域 technical field
本发明涉及一种触控装置、触控显示面板以及一种修补触控装置的方法,特别是一种具有导电修补标记的触控装置、触控显示面板以及其修补方式。The invention relates to a touch device, a touch display panel and a method for repairing a touch device, in particular to a touch device with conductive repair marks, a touch display panel and a repair method thereof.
背景技术 Background technique
在现今各类型消费性电子产品中,平板电脑、个人数字助理(PDA)、移动电话(mobile phone)、卫星导航系统(GPS)与影音播放器等可携式电子产品已广泛地使用触控面板(touch panel),作为人机数据的沟通界面,借此节省电子产品的体积。In today's various types of consumer electronic products, portable electronic products such as tablet computers, personal digital assistants (PDAs), mobile phones (mobile phones), satellite navigation systems (GPS) and audio-visual players have widely used touch panels. (touch panel), as a communication interface for human-machine data, so as to save the volume of electronic products.
触控显示面板的触控功能主要来自于一触控感测阵列。此触控感测阵列具有多个水平方向的感测垫以及垂直方向的感测垫,借以分别感测输入位置的水平或垂直坐标轴度。但是公知的触控感测阵列常因静电或刮伤等问题而产生断路,且只要其中一条水平感测垫或其中一条垂直感测垫产生断线,此处的水平感测或垂直感测功能就会丧失,而造成整个触控感测阵列的报废,大大影响了触控显示面板的良率。因此近几年来,面板厂商提出了各种触控显示面板的修补方式,以对断线的触控感测阵列进行修补。The touch function of the touch display panel mainly comes from a touch sensing array. The touch sensing array has a plurality of horizontal sensing pads and vertical sensing pads for respectively sensing the horizontal or vertical coordinate axis of the input position. However, the known touch sensing arrays are often disconnected due to problems such as static electricity or scratches, and as long as one of the horizontal sensing pads or one of the vertical sensing pads is disconnected, the horizontal sensing or vertical sensing function here will be lost, resulting in the scrapping of the entire touch sensing array, greatly affecting the yield of the touch display panel. Therefore, in recent years, panel manufacturers have proposed various repair methods for touch display panels to repair disconnected touch sensing arrays.
公知修补触控感测阵列的方式在两断线的感测垫之间形成一修补线,使得感测信号能绕过断线之处而通过此修补线进行传送。但由于公知的感测垫通常为透明导电材质例如氧化铟锡(indium tin oxide,ITO),因此在形成修补线时,机器难以正确辨识透明感测垫的位置而产生对准(alignment)的困难。且修补线形成之前,还须将感测垫上方的保护层烧穿而形成接触洞,若下方的感测垫为透明材质时,激光的能量不容易集中而较难烧穿保护层,因此需要更高的能量才能形成接触洞,成为工艺中较不稳定的因素。上述的情况皆提高了触控面板在修补工艺上的难度,而成为亟欲解决的问题。In a known method of repairing a touch sensing array, a repair line is formed between two disconnected sensing pads, so that sensing signals can bypass the disconnection and be transmitted through the repair line. However, since the known sensing pads are usually made of transparent conductive materials such as indium tin oxide (ITO), it is difficult for the machine to correctly identify the position of the transparent sensing pads when forming the repair line, resulting in difficulties in alignment. . And before the repair line is formed, it is necessary to burn through the protective layer above the sensing pad to form a contact hole. If the sensing pad below is made of transparent material, the energy of the laser is not easy to concentrate and it is difficult to burn through the protective layer. Therefore, it is necessary to Higher energy can form contact holes, which becomes a less stable factor in the process. The above-mentioned situations all increase the difficulty in the repair process of the touch panel, and become a problem that needs to be solved urgently.
发明内容Contents of the invention
本发明于是提出一种触控装置与触控显示面板,以及修补触控装置的方法,以加强修补时的定位精准度,并使得修补时的接触洞更容易形成。Therefore, the present invention proposes a touch device, a touch display panel, and a method for repairing the touch device, so as to enhance the positioning accuracy during repair and make it easier to form contact holes during repair.
本发明的一较佳实施例提出一种触控显示面板,包含一显示面板与一触控感测阵列。触控感测阵列设置于显示面板上,并包含多条第一透明感测串列、多条第二透明感测串列以及多个导电修补标记。第一透明感测串列沿一第一方向排列,且包含多个彼此电性连接的第一透明感测垫;第二透明感测串列沿一第二方向排列,且包含多个彼此电性连接的第二透明感测垫,且各第一透明感测垫与各第二透明感测垫彼此电性隔绝。导电修补标记对应于第一透明感测垫或第二透明感测垫设置。保护层覆盖这些第一透明感测串列、这些第二透明感测串列。A preferred embodiment of the present invention provides a touch display panel, including a display panel and a touch sensing array. The touch sensing array is disposed on the display panel and includes a plurality of first transparent sensing series, a plurality of second transparent sensing series and a plurality of conductive repair marks. The first transparent sensing series is arranged along a first direction and includes a plurality of first transparent sensing pads electrically connected to each other; the second transparent sensing series is arranged along a second direction and includes a plurality of first transparent sensing pads electrically connected to each other. The second transparent sensing pads are electrically connected, and each first transparent sensing pad and each second transparent sensing pad are electrically isolated from each other. The conductive repair marks are disposed corresponding to the first transparent sensing pad or the second transparent sensing pad. The protective layer covers the first transparent sensing series and the second transparent sensing series.
本发明的另一较佳实施例另提出了一种触控面板,其包含一基板以及一触控感测阵列。触控感测阵列设置于基板上,并包含多条第一透明感测串列、多条第二透明感测串列以及多个导电修补标记。第一透明感测串列沿一第一方向排列,且包含多个彼此电性连接的第一透明感测垫;第二透明感测串列沿一第二方向排列,且包含多个彼此电性连接的第二透明感测垫,且各第一透明感测垫与各第二透明感测垫彼此电性隔绝。导电修补标记设置对应于第一透明感测垫或第二透明感测垫设置。保护层,覆盖这些第一透明感测串列、这些第二透明感测串列。Another preferred embodiment of the present invention further provides a touch panel, which includes a substrate and a touch sensing array. The touch sensing array is disposed on the substrate and includes a plurality of first transparent sensing series, a plurality of second transparent sensing series and a plurality of conductive repair marks. The first transparent sensing series is arranged along a first direction and includes a plurality of first transparent sensing pads electrically connected to each other; the second transparent sensing series is arranged along a second direction and includes a plurality of first transparent sensing pads electrically connected to each other. The second transparent sensing pads are electrically connected, and each first transparent sensing pad and each second transparent sensing pad are electrically isolated from each other. The conductive repair mark arrangement corresponds to the first transparent sensing pad or the second transparent sensing pad arrangement. The protective layer covers the first transparent sensing series and the second transparent sensing series.
本发明的另一较佳实施例另提出了一种修补触控装置的方法,首先提供一触控装置。触控装置包含一基板以及一触控感测阵列。触控感测阵列设置于基板上,并包含多条第一透明感测串列、多条第二透明感测串列以及多个导电修补标记。第一透明感测串列沿一第一方向排列,且包含多个彼此电性连接的第一透明感测垫;第二透明感测串列沿一第二方向排列,且包含多个彼此电性连接的第二透明感测垫,且各第一透明感测垫与各第二透明感测垫彼此电性隔绝。导电修补标记对应于第一透明感测垫或第二透明感测垫设置。保护层覆盖这些第一透明感测串列、这些第二透明感测串列。接着,进行一修补工艺,以导电修补标记作为对准标记,并形成一修补线,与相邻的第一透明感测垫电性连接,或是与相邻的第二透明感测垫电性连接。Another preferred embodiment of the present invention further proposes a method for repairing a touch device. Firstly, a touch device is provided. The touch device includes a substrate and a touch sensing array. The touch sensing array is disposed on the substrate and includes a plurality of first transparent sensing series, a plurality of second transparent sensing series and a plurality of conductive repair marks. The first transparent sensing series is arranged along a first direction and includes a plurality of first transparent sensing pads electrically connected to each other; the second transparent sensing series is arranged along a second direction and includes a plurality of first transparent sensing pads electrically connected to each other. The second transparent sensing pads are electrically connected, and each first transparent sensing pad and each second transparent sensing pad are electrically isolated from each other. The conductive repair marks are disposed corresponding to the first transparent sensing pad or the second transparent sensing pad. The protective layer covers the first transparent sensing series and the second transparent sensing series. Next, a repair process is performed, using the conductive repair mark as an alignment mark, and forming a repair line, which is electrically connected to the adjacent first transparent sensing pad, or is electrically connected to the adjacent second transparent sensing pad connect.
本发明由于在透明感测垫上提供了非透明的导电修补标记,因此在后续的修补工艺中,机器得以辨识各透明感测垫的位置,可提升定位的精准度。另一方面,非透明的导电修补标记也可以在后续修补的工艺中,使得激光能量得反射而集中,因此更容易在保护层中形成接触洞,可大大提升了修补工艺的整体效率。Since the present invention provides non-transparent conductive repair marks on the transparent sensing pads, in the subsequent repairing process, the machine can identify the positions of each transparent sensing pads, which can improve the positioning accuracy. On the other hand, the non-transparent conductive repair marks can also reflect and concentrate the laser energy in the subsequent repair process, so it is easier to form contact holes in the protective layer, which can greatly improve the overall efficiency of the repair process.
附图说明 Description of drawings
为让本发明的上述和其他目的、特征、优点与实施例能更明显易懂,所附附图的说明如下:In order to make the above and other objects, features, advantages and embodiments of the present invention more comprehensible, the accompanying drawings are described as follows:
图1绘示了本发明第一实施例的触控装置的平面结构示意图;FIG. 1 shows a schematic plan view of a touch device according to a first embodiment of the present invention;
图2与图3绘示了本发明第一实施例的触控装置的结构示意图;2 and 3 are schematic structural diagrams of a touch device according to a first embodiment of the present invention;
图4与图5绘示了本发明第一实施例的触控装置在修补状况下的结构示意图;FIG. 4 and FIG. 5 are schematic diagrams of the structure of the touch device in the repair state according to the first embodiment of the present invention;
图6绘示了本发明第二实施例的触控装置结构示意图;FIG. 6 is a schematic structural diagram of a touch device according to a second embodiment of the present invention;
图7绘示了本发明第三实施例的触控装置结构示意图;FIG. 7 is a schematic structural diagram of a touch device according to a third embodiment of the present invention;
图8绘示了本发明第四实施例的触控装置结构示意图;FIG. 8 is a schematic structural diagram of a touch device according to a fourth embodiment of the present invention;
图9与图10绘示了本发明另一实施例的触控装置结构示意图;9 and 10 are schematic structural diagrams of a touch device according to another embodiment of the present invention;
图11绘示了本发明一实施例的触控装置在修补状况下的结构示意图;FIG. 11 shows a schematic structural diagram of a touch device in a repair state according to an embodiment of the present invention;
图12绘示了本发明另一实施例的触控装置结构示意图;FIG. 12 is a schematic structural diagram of a touch device according to another embodiment of the present invention;
图13与图14绘示了本发明另一实施例的触控装置结构示意图;13 and 14 are schematic structural diagrams of a touch device according to another embodiment of the present invention;
图15绘示了本发明又一实施例的触控装置结构示意图;FIG. 15 is a schematic structural diagram of a touch device according to another embodiment of the present invention;
图16至图18绘示了本发明另三较佳实施例的触控显示面板的示意图;16 to 18 are schematic diagrams of touch display panels according to another three preferred embodiments of the present invention;
图19为本发明的一实施例的修补触控装置方法流程图。FIG. 19 is a flowchart of a method for repairing a touch device according to an embodiment of the present invention.
其中,附图标记Among them, reference signs
10 显示面板 118 桥接导线10
100 触控装置 120 图案化绝缘层100
101 基板 120a 岛状绝缘结构101
102 基板 120b 绝缘层102
102a 辅助基板 122a,122b 导电修补标记102a
103 液晶层 124 保护层103
104 触控感测阵列 126 接触洞104
106 第一方向 128 修补线106
108 第一透明感测串列 130 接触洞口108 first
110 第二方向 136 外表面110 Second direction 136 External surface
112 第二透明感测串列 138 内表面112 second
113 连接线 140 步骤
114 第一透明感测垫 142 步骤114 first
115 接触垫 144 步骤
116 第二透明感测垫 146 步骤116 second
具体实施方式 Detailed ways
为使熟习本发明的所属技术领域的普通技术人员能更进一步了解本发明,下文特列举本发明的数个较佳实施例,并配合所附附图,详细说明本发明的构成内容及所欲达成的功效。In order to enable those of ordinary skill in the technical field who are familiar with the present invention to further understand the present invention, several preferred embodiments of the present invention are enumerated below, and together with the accompanying drawings, the constitutional content and intended purpose of the present invention are described in detail. achieved effect.
请参考图1,其绘示为本发明第一实施例的触控装置的平面结构示意图。如图1所示,本发明的触控装置100包含一基板102以及设置于基板102上的触控感测阵列104。基板102可以是各种透明的软质基板,也可以是硬质基板例如玻璃基板、塑胶基板或石英基板等。本实施例的触控感测阵列104包含多条平行于一第一方向106(例如图1的水平方向)的第一透明感测串列108,以及多条平行于一第二方向110(例如图1所示的垂直方向)的第二透明感测串列112,其中第一方向106与第二方向110大致上垂直。每条第一透明感测串列108包含多个彼此电性连接的第一透明感测垫114,每条第二透明感测串列112包含多个第二透明感测垫116以及多条桥接导线118。如图1所示,图案化绝缘层120例如是岛状绝缘结构120a会设置在位于同一条第二透明感测串列112中两相邻的第二透明感测垫116上,而各桥接导线118则对应设置在各岛状绝缘结构120a上,以电性相连两相邻的第二透明感测垫116。如此一来,第一透明感测串列108和第二透明感测串列112得以彼此绝缘,且能够分别感测基板102上第一方向106以及第二方向110上两轴度的触控位置。第一透明感测串列108和第二透明感测串列112分别经连接线113连接周边的接触垫115。接触垫115可供外部驱动整合电路(IC)电性连接,用以驱动第一透明感测串列108和第二透明感测串列112,达到感测的目的,详细的驱动方法为本领域技术人员所熟知,因此不再赘述。此外需注意的是,若将基板102沿逆时针或顺时针旋转90度,例如使各第一透明感测串列108平行于第二方向110,而各第二透明感测串列112平行于第一方向106,其排列方式仍为本发明的均等变化与修饰,皆应属本发明的涵盖范围。Please refer to FIG. 1 , which is a schematic plan view of a touch device according to a first embodiment of the present invention. As shown in FIG. 1 , the
本实施例中的第一透明感测垫114与第二透明感测垫116由同一层的透明导电层所构成,透明导电层的材质例如是氧化铟锡(indium tin oxide,ITO)、氧化铟锌(indium zinc oxide,IZO)、氧化镉锡(cadmium tin oxide,CTO)、氧化铝锌(aluminum zinc oxide,AZO)以及氧化铟锌锡(indium tin zinc oxide,ITZO)等,但不以此为限。图案化绝缘层120(如岛状绝缘结构120a)包含各种绝缘材质,例如是有机材质或是无机材质,有机材质例如是苯并环丁烯(enzocyclobutane,BCB)、环烯类、聚酰亚胺类、聚酰胺类、聚酯类、聚醇类、聚环氧乙烷类、聚苯类、树脂类、聚醚类、聚酮类等树脂,无机材质例如氧化硅、氮化硅、氮氧化硅、碳化硅、氧化铝等,或上述的组合,但不以此为限,而桥接导线118则包含各种金属导电材质,例如铝、铜、银、金、钛、钼、钨等,但不以此为限。In this embodiment, the first
为了解决公知的第一透明感测垫114或第二透明感测垫116因为其透明材质,而在后续修补工艺中会有对准不易的问题,本发明的触控感测阵列104还包含多个非透明的导电修补标记122,其对应设置于第一透明感测串列108上。这些导电修补标记122的排列方向大致上和第一透明感测串列108平行,也就是会平行于第一方向106,但也可以是其他排列方式。关于导电修补标记122的详细位置,请参考图2与图3,其绘示为本发明第一实施例的触控装置的结构示意图,其中图2为图1中区域A的放大示意图,而图3为图2中沿着BB’切线的剖面图。如图2与图3所示,导电修补标记122设置于第一透明感测垫114上,在本发明较佳实施例中,导电修补标记122会设置于第一透明感测垫114靠近岛状绝缘结构120a之处。也就是说,在岛状绝缘结构120a靠近第一透明感测垫114的左右两侧皆对应设置有一组的导电修补标记122。导电修补标记122的材质包含各种非透明的导电材质,例如金属,其可为铝、铜、银、金、钛、钼、钨等,但不以此为限,并与其下的第一透明感测垫114电性相连。导电修补标记122的宽度大致上介于1微米与25微米之间,并可以有各种形状,例如图2所示的圆形,或是方形、三角形、多边形,但并不以此为限。此外,本实施例的触控装置100还包含一保护层124,设置于触控感测阵列104的上方,其材质包含各种有机或无机的保护材料,有机材料例如是苯并环丁烯(enzocyclobutane,BCB)、环烯类、聚酰亚胺类、聚酰胺类、聚酯类、聚醇类、聚环氧乙烷类、聚苯类、树脂类、聚醚类、聚酮类等树脂(resin),无机材料例如是氧化硅、氮化硅、氮氧化硅、碳化硅、氧化铝等,或上述的组合,但并不以此为限。In order to solve the known problem that the first
制作本实施例触控装置100的步骤,例如先在基板102上全面形成一透明导电层,接着图案化透明导电层以形成第一透明感测垫114以及第二透明感测垫116。接着形成岛状绝缘结构120a,并于岛状绝缘结构120a上对应形成桥接导线118,在第一透明感测垫114上对应形成导电修补标记122,最后再形成保护层124。在本发明较佳实施例中,导电修补标记122可以跟桥接导线118在同一工艺中制作,例如是光刻与蚀刻步骤或是网版印刷工艺,以简化工艺降低制作成本。The steps of manufacturing the
本发明的导电修补标记122可在形成触控感测阵列104的后续修补工艺中作为一对准标记(alignment mark)。进行一修补工艺时,例如是使用激光化学气相沉积工艺(Laser CVD),可通过非透明材质的导电修补标记122快速进行对准,并协助机器定位于第一透明感测串列108与第二透明感测串列112的交叉处(即岛状绝缘结构120a之处),以利后续修补工艺在此交叉处可顺利形成修补线。下文就导电修补标记与修补线的相对位置以及其连接方式进一步说明。请参考图4与图5,其绘示为本发明第一实施例的触控装置在修补状况下的结构示意图,其中图5为图4中沿CC’切线绘示的剖面示意图。请同时参考图4与图5,若两相邻的第一透明感测垫114之间因区域D的缺陷而造成断线,则此第一透明感测串列108则会丧失感测功能而必须进行修补。如图4与图5所示,本实施例的触控装置100经过修补工艺后,除了上述元件外还包含一修补线128以及多个接触洞126。接触洞126设置在保护层124中,并分别对应位于岛状绝缘结构120a两侧的导电修补标记122。修补线128选自导电材质,例如是金属,其可为钨、钼、银、金、铝、铜等,或其它金属材质。修补线128设置在保护层124上并对应设置在接触洞126中。通过各接触洞126的连结,修补线128得以电性连接位于岛状绝缘结构120a两侧的导电修补标记122,也同时电性连接两相邻的第一透明感测垫114,使得第一透明感测串列108不因区域D的缺陷而造成断路,而可通过修补线128而再度串连。The
本发明的导电修补标记122除了上述作为对准标记的功用外,另一方面,由于接触洞126对应形成于导电修补标记122的上方,因此在保护层124中形成接触洞126所使用的激光工艺,可因下方非透明的导电修补标记122容易反射而集中能量,使得接触洞126较容易产生。且通过导电修补标记122的导电材质,将使得修补线128更容易与需修补的透明感测垫电性连接,而增加了修补的成功率。In addition to the above-mentioned function of the
请参考图6,其绘示为本发明第二实施例的触控装置结构示意图。本发明的导电修补标记122除了设置在第一透明感测垫114上,还可以设置在第二透明感测垫116上。如图6所示,导电修补标记122可包含导电修补标记122a与导电修补标记122b。导电修补标记122a设置在第一透明感测垫114上,作为第一方向106上的修补对准标记(即前述实施方式);导电修补标记122b则设置在第二透明感测垫116上,作为第二方向110上的修补对准标记。若第二透明感测垫116因区域D的缺陷而需进行修补,则可通过导电修补标记122b来设置修补线128。导电修补标记122b的实施方式、材质以及后续修补工艺中形成修补线128的方式与前述实施例的导电修补标记122a大致相同,在此不多做赘述。值得一提的是,为了增加导电修补标记122a与导电修补标记122b之间的辨别程度,导电修补标记122a与导电修补标记122b可以具有不同的形状,例如导电修补标记122a为圆形,而导电修补标记122b为矩形,但并不以此为限。此外,在本发明另一实施例中,也可以仅设置第二方向110上的导电修补标记122b,而没有设置第一方向106上的导电修补标记122a,其可以依据产品的情况而做适当的调整。另一方面,本发明修补线128的平面布局可以如图4所示,为直线形的连结,或者如图6所示,考虑到可能因缺陷产生不平而妨碍连接线128的形成,在本发明另一实施例中,连接线128则绕过区域D处,而呈现具有至少一转折的弯曲形连结。Please refer to FIG. 6 , which is a schematic structural diagram of a touch device according to a second embodiment of the present invention. In addition to being disposed on the first
请参考图7,其绘示为本发明第三实施例的触控装置结构示意图。本实施例的触控装置位于岛状绝缘结构120a两侧可设置有不只一组的导电修补标记122,例如同时具有两组或两组以上的导电修补标记122。如图7所示,岛状绝缘结构120a左右两侧第一透明感测垫114上设置有2组(即4个)的导电修补标记122a;而在岛状绝缘结构120a上下两侧的第二透明感测垫116也设置有2组(即4个)的导电修补标记122b。本实施例的其中一个优点在于:后续于形成修补线128时,可在两相邻的透明导电垫同时形成两条或两条以上的修补线128,因此可有效降低修补后此第一透明感测串列106(或第二透明感测串列112)上的阻抗。请参考图8,其绘示为本发明第四实施例的触控装置结构示意图。如图8所示,也可以将修补线128同时形成于两组以上的接触洞126,并同时电性连接两组以上的导电修补标记122,也可有效达成降低阻抗的功效。Please refer to FIG. 7 , which is a schematic structural diagram of a touch device according to a third embodiment of the present invention. The touch device of this embodiment may be provided with more than one set of conductive repair marks 122 on both sides of the island-shaped insulating
本发明的导电修补标记122除了应用于上述于图1至图8所述的触控感测阵列104的结构外,也可以应用于其他态样的触控感测阵列104。请参考图9与图10所示,其绘示为本发明另一实施例的触控装置结构示意图,其中图10为图9中沿EE’切线的剖面图。如图9所示,本实施例的触控感测阵列104包含第一透明感测垫114、第二透明感测垫116、桥接导线118、岛状绝缘结构120a以及导电修补标记122a,122b。本实施例的触控感测阵列104的结构大致上与图2的实施方式相同,其中的一差别在于桥接导线118、岛状绝缘结构120a与第一透明感测垫114上下的顺序不同。举例来说,在制造本实施例的触控装置100的步骤,首先在基板102上形成桥接导线118以及导电修补标记122a,122b,接着形成岛状绝缘结构120a对应设置于桥接导线118上,最后再以同一层的透明导电层同时形成第一透明感测垫114以及第二透明感测垫116。在本实施例中,两相邻的第二透明感测垫116可通过岛状绝缘结构120a下方的桥接导线118彼此连接,而第一透明感测垫114与第二透明感测垫116之间也可通过岛状绝缘结构120a而电性绝缘。在本实施例中,桥接导线118和导电修补标记122a,122b可以在同一步骤中一起形成,以节省工艺的时间,但并不以此为限。本实施例的结构可以搭配前述图2至图8导电修补标记122a,122b与修补线128的实施方式。举例来说,请参考图11,所绘示为本发明一实施例的触控装置在修补状况下的结构示意图。如图11所示,通过导电修补标记122a提供的对准标记功能,使得修补线128会形成在保护层124上,并对应设置于接触洞126中,以电性连接两相邻的第一透明感测垫114,借此修补区域D所造成的断路。In addition to being applied to the structure of the
请参考图12,所绘示为本发明另一实施例的触控装置结构示意图。如图12所示,第一透明感测垫114由一透明导电层所构成,而第二透明感测串列112(包含第二透明感测垫116以及桥接导线118)则由另一层的透明导电层所构成,而岛状绝缘结构120a则设置于两不同的透明导电层之间,且分别对应于各第一感测串列108以及第二感测串列112的交界处。在本实施例中,导电修补标记122同样设置于第一透明感测垫114或第二透明感测垫116上,其实施方式可参考前文图2至图8与其说明,在此不多加赘述。Please refer to FIG. 12 , which is a schematic structural diagram of a touch device according to another embodiment of the present invention. As shown in FIG. 12 , the first
请参考图13与图14,其绘示为本发明另一实施例的触控装置结构示意图,其中图13为图14中沿FF’切线的剖面示意图。本实施例中,第一透明感测垫114与第二透明感测垫116皆由同一层的透明导电层所构成。而在第一透明感测垫114与第二透明感测串列112上则设置有一绝缘层120b(图13中未示)、多个接触开口130、一桥接导线118以及一保护层124。接触开口130位于绝缘层120b中,并对应设置于两相邻的第一透明感测垫114之间,且桥接导线118分别通过这些接触开口132与两相邻的第一透明感垫114电性连接。本实施例的触控装置的形成方式例如先在基板102上形成第一透明感测垫114与第二透明感测垫116后,再形成导电修补标记122b,接着形成绝缘层120b覆盖于第一透明感测垫114与第二透明感测垫116以及导电修补标记122b上。接着在绝缘层120b中形成接触开口130,并在绝缘层120b上以及接触开孔130中形成桥接导线118,使得相邻的两个第二透明感测垫116得以电性相连。本实施例导电修补标记122b与第一透明感测垫114和第二透明感测垫116的形成顺序可以颠倒,例如先形成导电修补标记122b后,再形成第一透明感测垫114与第二透明感测垫116。在前述实施例中,导电修补标记122b跟第一透明感测垫114与第二透明感测垫116电性接触,不仅有良好的修补效果,而且还可以降低第一透明感测垫114与第二透明感测垫116的片电阻,增进感测灵敏度。Please refer to FIG. 13 and FIG. 14 , which are schematic diagrams illustrating the structure of a touch device according to another embodiment of the present invention, wherein FIG. 13 is a schematic cross-sectional view along the tangent line FF' in FIG. 14 . In this embodiment, the first
或者,在本发明另一实施例中,亦可先形成桥接导线118后,再形成绝缘层120b,再形成第一透明感测垫114与第二透明感测垫116。请参考图15,其绘示为本发明又一实施例的触控装置结构示意图。如图15所示,先在基板102上形成桥接导线118以及导电修补标记122b。在本发明较佳实施例中,桥接导线118以及导电修补标记122b可以同时形成,但并不以此为限。接着,形成绝缘层120b覆盖在桥接导线118以及导电修补标记122b上,并在绝缘层120b中形成接触开口130。最后,在绝缘层120b上以及接触开孔130中形成桥接导线118,使得相邻的两个第二透明感测垫116透过桥接导线118而电性相连。图13至图15所述实施例的结构可与前述图2至图7任一实施方式的导电修补标记122与修补线128做搭配,在此不一一赘述。在前述实施例中,导电修补标记122b虽然未跟第一透明感测垫114与第二透明感测垫116电性接触,不过仍然有良好的修补效果。Alternatively, in another embodiment of the present invention, the
本发明的触控装置100,其可以单独作为一具有触控功能的触控面板,也可以和一显示面板10结合而成为一触控显示面板。请参考图16至图18,其绘示为本发明另三个较佳实施例的触控显示面板的示意图。如图16所示,本实施例的触控装置100的基板102同时也作为一显示面板10的其中一基板。举例而言,若显示面板10为一液晶显示面板,其包含两基板101、102,以及一液晶层103设置于基板101、102之间。基板102可为液晶显示面板的彩色滤光玻璃基板,其中触控感测阵列104会设置在显示面板10的基板102的一外表面136上,如图16所示。而在本发明另一实施例中,触控显示阵列104也可以设置在显示面板10的基板102面对液晶层103的一内表面138上,如图17所示。在本发明另一实施例中,请参考图18,基板102上可增加一辅助基板102a,辅助基板102a设置于触控感测阵列104与显示面板10之间。例如先在辅助基板102a的一面设置有触控感测阵列104,而另一面则贴附于显示面板10中的基板102上。在上述的实施方式中,显示面板10可以是一液晶显示面板、一有机发光显示面板、一电泳显示面板或一等离子体显示面板,但并不以此为限。当触控感测阵列104设置在显示面板10上时,触控感测阵列104中的导电修补标记122较佳是对准设置在显示区内的遮光区域上,例如是黑色矩阵(BM)上,或是不透光的电容区域上,避免目视可见。导电修补标记122的宽度可介于0.1至100微米,较佳是介于0.5至50微米,更佳是介于1至25微米,但是并不以此为限,其尺寸设计可以实际需求调整。The
本发明另外提供了一种修补触控装置的方法,请参考图19,并请一并参考图1至图18。图19为本发明的一实施例的修补触控装置方法流程图。如图19所示,本发明的方法包含下列步骤:The present invention further provides a method for repairing a touch device, please refer to FIG. 19 , and please refer to FIGS. 1 to 18 together. FIG. 19 is a flowchart of a method for repairing a touch device according to an embodiment of the present invention. As shown in Figure 19, the method of the present invention comprises the following steps:
步骤140:开始;Step 140: start;
步骤142:提供一触控装置,此触控装置包含一基板以及一触控感测阵列。触控感测阵列设置于基板上,并包含多个第一透明感测串列、多个第二透明感测串列以及多个导电修补标记。各第一透明感测串列沿第一方向排列,且包含多个彼此电性连接的第一透明感测垫;各第二透明感测串列沿第二方向排列,并包含多个彼此电性连接的第二透明感测垫,且各第一透明感测垫与各第二透明感测垫彼此电性隔绝。导电修补标记会对应于第一透明感测垫或第二透明感测垫设置。Step 142: Provide a touch device, the touch device includes a substrate and a touch sensing array. The touch sensing array is disposed on the substrate and includes a plurality of first transparent sensing series, a plurality of second transparent sensing series and a plurality of conductive repair marks. Each first transparent sensing series is arranged along a first direction and includes a plurality of first transparent sensing pads electrically connected to each other; each second transparent sensing series is arranged along a second direction and includes a plurality of mutually electrically connected pads. The second transparent sensing pads are electrically connected, and each first transparent sensing pad and each second transparent sensing pad are electrically isolated from each other. The conductive repair marks are disposed corresponding to the first transparent sensing pad or the second transparent sensing pad.
步骤144:进行一修补工艺,以导电修补标记作为对准标记,并形成一修补线,与相邻的两个第一透明感测垫电性连接,或是与相邻的两个第二透明感测垫电性连接。Step 144: Perform a repair process, use the conductive repair mark as an alignment mark, and form a repair line, electrically connected with two adjacent first transparent sensing pads, or with two adjacent second transparent sensing pads The sensing pads are electrically connected.
步骤146:结束。Step 146: end.
在步骤142中,关于导电修补标记122的各种实施方式,可参考图2至图8,而关于触控感测阵列104的各种实施方式,也请参考图9至图15。可以了解的是,各种导电修补标记122的实施方式可以和各种触控感测阵列104的实施方式相互配合,在此并不一一列举其实施组合。In
此外,在步骤144中以导电修补标记122作为对准标记,并形成与部分导电修补标记122电性连接的修补线128。举例来说,可使用激光工艺先于保护层126中形成多个对应于导电修补标记122的接触洞126。接着,利用一沉积工艺,例如一激光化学气相沉积工艺(laser CVD)以直接定位形成修补线128。形成修补线128的平面布局如前文所述,可以如图4所示的直线形导电修补标记128,或者如图6是弯曲形导电修补标记128。In addition, in
综上而言,本发明由于在透明感测垫上提供了非透明材质的导电修补标记,因此在后续的修补工艺中,不仅可作为机器之对准标记,也使得其上的接触洞更容易形成,进而提升了修补工艺的整体效率。此外,本发明也提出了若干修补线与导电修补标记的实施态样,能有效降低触控感测阵列于修补后的阻抗,而能提升整体产品的信赖度。To sum up, since the present invention provides a non-transparent conductive repair mark on the transparent sensing pad, it can not only be used as an alignment mark for the machine in the subsequent repair process, but also make it easier to form contact holes on it. , thereby improving the overall efficiency of the repair process. In addition, the present invention also proposes the implementation of several repair lines and conductive repair marks, which can effectively reduce the impedance of the touch sensing array after repair, and improve the reliability of the overall product.
当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.
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