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CN101834053A - A ferromagnetic/antiferromagnetic multilayer film pinning material and its preparation method - Google Patents

A ferromagnetic/antiferromagnetic multilayer film pinning material and its preparation method Download PDF

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CN101834053A
CN101834053A CN 201010177285 CN201010177285A CN101834053A CN 101834053 A CN101834053 A CN 101834053A CN 201010177285 CN201010177285 CN 201010177285 CN 201010177285 A CN201010177285 A CN 201010177285A CN 101834053 A CN101834053 A CN 101834053A
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ferromagnetic
layer
antiferromagnetic
multilayer film
ferromagnetic layer
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CN101834053B (en
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代波
蒋庆林
邢永燕
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Southwest University of Science and Technology
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Abstract

The invention discloses a ferromagnetic/anti-ferromagnetic multilayer film pinning material and a preparation method thereof. The multilayer film pinning material comprises a substrate and a buffer layer, a ferromagnetic layer I, an anti-ferromagnetic layer and a ferromagnetic layer II arranged on the substrate, and a protective layer arranged on the ferromagnetic layer II. The preparation method comprises that the layers are deposited on the substrate in turn by adopting magnetron sputtering to obtain the multilayer film material. The multilayer film pinning material prepared by the method of the invention not only successfully realizes ferromagnetic/anti-ferromagnetic exchange bias, but also enhances the pinning performance of an anti-ferromagnetic material by using exchange coupling effect so that a ferromagnetic/anti-ferromagnetic exchange bias system is more stable and is more suitable for the application of a magneto-electronic device; and the preparation process is simple and the performance of the material is stable.

Description

A kind of ferromagnetic/antiferromagnetic multilayer film pinning material and preparation method thereof
Technical field
The invention belongs to multi-layered magnetic film and preparation method thereof of spin exchange coupling, relate to a kind of ferromagnetic/antiferromagnetic multilayer film pinning material and preparation method thereof.This pinning material is suitable for the element do in the magnetoelectronic devices, can directly applies to Spin Valve and MTJ.
Background technology
Antiferromagnet is in the components and parts of magneto-electronics or spintronics, mainly be used as pinning layer, its the most basic requirement is that big exchange anisotropy and high thermal stability are arranged, so that this system has high Blocking temperature and big pinning field, but antiferromagnetic pinning material of the prior art often can not satisfy this two primary conditions simultaneously better.
As the antiferromagnetic thermal stability that can strengthen ferromagnetic particle to ferromagnetic exchange biased effect, antiferromagnetic and ferromagnetic exchange-coupling interaction also can strengthen the thermal stability of antiferromagnetic particle.R.Mattheis and K.Steenbeck once were coupled the IrMn in CoFe/Ru/CoFe artificial antiferromagnetic and the exchange biased system of NiFe/IrMn, utilize the uniaxial anisotropy of CoFe/Ru/CoFe to improve the thermal stability of IrMn, exchange biased Blocking temperature had been increased to 360K from 110K when they found that IrMn is 1.2nm.But this work does not illustrate the enhancing of IrMn thermal stability and the relation of artificial antiferromagnetic coupling intensity and artificial antiferromagnetic middle ferromagnetic layer.In addition, when the present inventor finds that in research work suitable Mn is incorporated into the interface of CrPt pinning system, can make thermal stability obtain large increase, we think that this is owing to formed antiferromagnetic (Cr1-δ Mn δ) Pt with the CrPt structural similarity at the interface, these two kinds similar antiferromagnetic generation exchange couplings, thereby in whole exchange biased system, combine very strong exchange anisotropy and the extraordinary thermal stability of CrPt of (Cr1-δ Mn δ) Pt, realized the ideal pinning effect: Blocking temperature T b~600 ℃ and exchange anisotropy energy Jex~0.48erg/cm 2Similarly, two or more antiferromagnetic pinning materials commonly used, by suitable collocation, being coupled together with different ferromagnetic materials also may have more superior performance as a kind of pinning system.
Summary of the invention
Purpose of the present invention is intended to overcome deficiency of the prior art, provide a kind of ferromagnetic/antiferromagnetic multilayer film pinning material and preparation method thereof.Thereby realize that ferromagnetic and antiferromagnet (such as FeMn, NiO, IrMn, NiMn, PtMn or PdMn etc.) make its thermal stability and corresponding pinning performance more superior by the interface coupling.
Content of the present invention is: a kind of ferromagnetic/antiferromagnetic multilayer film pinning material, it is characterized in that comprising:
One substrate (substrate material be selected from silicon or the glass a kind of) and on substrate, setting gradually
One resilient coating is used to induce the inverse ferric magnetosphere of texture;
One ferromagnetic layer (I) is arranged on the resilient coating;
One inverse ferric magnetosphere is arranged on the ferromagnetic layer (I);
One ferromagnetic layer (II) is arranged on the inverse ferric magnetosphere; And
One be arranged on the ferromagnetic layer (II) protective layer (being used to prevent that magnetic material is oxidized).
In the content of the present invention: described inverse ferric magnetosphere is that manganese is a kind of among antiferromagnet FeMn, NiMn, PtMn, PdMn or the IrMn etc.
In the content of the present invention: described ferromagnetic layer (I) is a kind of among hard magnetic material SmCo, the FePt etc.; Described ferromagnetic layer (II) is a kind of among soft magnetic material NiFe, Co or the CoFe etc.
In the content of the present invention: described ferromagnetic/preparation method of antiferromagnetic multilayer film pinning material, it is characterized in that may further comprise the steps:
A, employing vacuum deposition method plate resilient coating, ferromagnetic layer (I), inverse ferric magnetosphere, ferromagnetic layer (II) and protective layer successively on substrate, promptly make the semi-finished product of pinning material;
B, with the semi-finished product of this pinning material, be parallel under the externally-applied magnetic field of general magnetic field intensity of sample easy axis direction one and carry out vacuum annealing, promptly obtain finished product after the annealing.
Described ferromagnetic/preparation method of antiferromagnetic multilayer film pinning material in:
When the vacuum deposition method of described step a plated (film) layer, base vacuum air pressure was better than 10 -4Pa, and the deposition operating air pressure under the inert atmosphere is 0.1~0.8Pa;
The annealing temperature of the annealing process among the described step b is that 350~650 ℃, annealing time are that 0.5~5.0 hour, base vacuum are better than 10 -3Pa.
Another content of the present invention is: a kind of ferromagnetic/antiferromagnetic multilayer film pinning material, it is characterized in that comprising:
Substrate (substrate material be selected from silicon or the glass a kind of) and on substrate, setting gradually
Resilient coating is used to induce the inverse ferric magnetosphere of texture;
First ferromagnetic layer is arranged on the resilient coating;
First inverse ferric magnetosphere is arranged on first ferromagnetic layer;
Second ferromagnetic layer is arranged on first inverse ferric magnetosphere;
Second inverse ferric magnetosphere is arranged on second ferromagnetic layer; And
Be arranged at the protective layer (being used to prevent that second inverse ferric magnetosphere is oxidized) on second inverse ferric magnetosphere.
In another content of the present invention: described first inverse ferric magnetosphere is that NiO or manganese are a kind of among antiferromagnet FeMn or the IrMn etc.; Described second inverse ferric magnetosphere is that manganese is a kind of among antiferromagnet FeMn, NiMn, PtMn, PdMn or the IrMn etc., or artificial antiferromagnet Co/Ru
Figure GSA00000107808200031
/ Co, CoFe/Ru
Figure GSA00000107808200032
/ CoFe, NiFe/Ru A kind of among/NiFe or the Co/Cu/Co etc.
In another content of the present invention: described first ferromagnetic layer and second ferromagnetic layer are a kind of among soft magnetic material NiFe, Co or the CoFe etc.
In another content of the present invention: described ferromagnetic/preparation method of antiferromagnetic multilayer film pinning material, it is characterized in that may further comprise the steps:
A, employing vacuum deposition method, [under the externally-applied magnetic field of a general magnetic field intensity (102Oe)] plates resilient coating, first ferromagnetic layer, first inverse ferric magnetosphere, second ferromagnetic layer, second inverse ferric magnetosphere and protective layer successively on substrate.
Another content of the present invention described ferromagnetic/preparation method of antiferromagnetic multilayer film pinning material in, when adopting described vacuum deposition method plating (film) layer, the base vacuum atmospheric pressure is better than 10 -4Pa, and the deposition operating air pressure under the inert atmosphere is 0.1~0.8Pa.
Compared with prior art, the present invention has following characteristics and beneficial effect:
(1) the present invention ferromagnetic/antiferromagnetic multilayer film pinning material, by selecting hard magnetic material for example SmCo, FePt etc. for use, be coupled, thereby improve the thermal stability of exchange biased system with antiferromagnetic pinning material, finally make the pinning performance of system also obtain to improve; Realized that promptly ferromagnetic and antiferromagnet (such as FeMn, NiO, IrMn, NiMn, PtMn or PdMn etc.) make its thermal stability and corresponding pinning performance more superior by the interface coupling;
(2) adopt the ferromagnetic/antiferromagnetic exchange that not only successfully realized of the ferromagnetic/antiferromagnetic multilayer film pinning material (or claiming magnetoresistance effect material, magnetoresistance effect system) of the inventive method preparation to setover, and utilize exchange-coupling interaction, strengthened the pinning performance of antiferromagnet, make that ferromagnetic/antiferromagnetic exchange biasing system is more stable, be more suitable for application in magnetoelectronic devices;
(3) the present invention by several commonly used ferromagnetic/antiferromagnetic exchange biasing systems, by being coupled together as a kind of pinning system, improved antiferromagnetic thermal stability with suitable ferromagnetic or ferromagnetic material, the pinning performance of simultaneity factor also obtains raising; This system can directly apply to Spin Valve and MTJ;
(4) thus preparation method of the present invention ties up on the substrate and to adopt magnetron sputtering to deposit each layer successively to obtain multi-layer film material, preparation technology is simple, material property is stable, and is practical.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention 1,2;
Fig. 2 is the structural representation of the embodiment of the invention 3,4;
Fig. 3 is that the vibrating specimen magnetometer (VSM) of the embodiment of the invention 3 ferromagnetic/antiferromagnetic multilayer film pinning materials is measured curve.
Among Fig. 1: 1-substrate, 2-resilient coating, 3-ferromagnetic layer I, 4-inverse ferric magnetosphere, 5-ferromagnetic layer II, 6-protective layer;
Among Fig. 2: 1-substrate, 2-resilient coating, 3-first ferromagnetic layer, 4-first inverse ferric magnetosphere, 5-second ferromagnetic layer, 6-second inverse ferric magnetosphere, 7-protective layer.
Embodiment
Embodiment given below intends so that the invention will be further described; but can not be interpreted as it is limiting the scope of the invention; the person skilled in art to some nonessential improvement and adjustment that the present invention makes, still belongs to protection scope of the present invention according to the content of the invention described above.
Embodiment 1: referring to accompanying drawing 1.
A kind of ferromagnetic/antiferromagnetic multilayer film pinning material (magnetoresistance effect system), form by substrate 1, resilient coating 2, ferromagnetic layer I 3, inverse ferric magnetosphere 4, ferromagnetic layer II 5 and protective layer 6 in turn;
Layers of material and parameter are: 1-substrate Si, 2-resilient coating Ta (thickness is 10nm), 3-ferromagnetic layer I SmCo (thickness is 50nm), 4-inverse ferric magnetosphere FeMn or IrMn (thickness is 10nm), 5-ferromagnetic layer II NiFe (thickness is 15nm), and 6-protective layer Ta (thickness is 5nm); When each layer thickness or composition are the vacuum moulding machine sample or annealing before value; Vacuum annealing temperature is 550 ℃, is incubated 0.5 hour, and vacuum degree is better than 10 -4Pa.
Embodiment 2: referring to accompanying drawing 1.
A kind of ferromagnetic/antiferromagnetic multilayer film pinning material (magnetoresistance effect system), by substrate 1, on substrate 1, plate resilient coating 2, ferromagnetic layer I 3, inverse ferric magnetosphere 4, ferromagnetic layer II 5 and protective layer 6 successively and form;
Layers of material and parameter are: 1-substrate Si, 2-resilient coating Ta (thickness is 10nm), 3-ferromagnetic layer I FePt (thickness is 50nm), 4-inverse ferric magnetosphere FeMn or IrMn (thickness is 10nm), 5-ferromagnetic layer II NiFe (thickness is 15nm), and 6-protective layer Ta (thickness is 5nm); When above-mentioned each layer thickness or composition are the vacuum moulding machine sample or annealing before value; Vacuum annealing temperature is 600 ℃, is incubated 1 hour, and vacuum degree is better than 10 -4Pa.
Embodiment 3: referring to accompanying drawing 2.
A kind of ferromagnetic/antiferromagnetic multilayer film pinning material (magnetoresistance effect system), by substrate 1, on substrate 1, plate resilient coating 2, first ferromagnetic layer 3, first inverse ferric magnetosphere 4, second ferromagnetic layer 5, second inverse ferric magnetosphere 6 and protective layer 7 successively and form.
Layers of material and parameter are: 1-substrate Si, 2-resilient coating Ta (thickness is 5nm), the 3-first ferromagnetic layer NiFe (thickness is 15nm), the 4-first inverse ferric magnetosphere FeMn (thickness is 2.5nm), the 5-second ferromagnetic layer NiFe (thickness is 10nm), 6-second inverse ferric magnetosphere FeMn (thickness is 10nm) and 7-protective layer Ta (thickness is 5nm); Value when above-mentioned each layer thickness or composition are the vacuum moulding machine sample; The magnetic hysteresis loop that accompanying drawing 3 is measured with vibrating specimen magnetometer for the finished product of present embodiment 3; The pinning field of its 2.5nmFeMn pinning 15nm NiFe is 4.8 * 10 3A/m, coercive force are 0.75 * 10 3A/m.
Embodiment 4: referring to accompanying drawing 2.
A kind of ferromagnetic/antiferromagnetic multilayer film pinning material (magnetoresistance effect system), by substrate 1, on substrate 1, plate resilient coating 2, first ferromagnetic layer 3, first inverse ferric magnetosphere 4, second ferromagnetic layer 5, second inverse ferric magnetosphere 6 and protective layer 7 successively and form.
Layers of material and parameter are: 1-substrate Si; 2-resilient coating Ta (thickness is 5nm); the 3-first ferromagnetic layer NiFe (thickness is 15nm); the 4-first inverse ferric magnetosphere NiO (thickness is 10nm); the 5-second ferromagnetic layer NiFe (thickness is 10nm), the 6-second inverse ferric magnetosphere FeMn (thickness is 15nm) and 7-protective layer Ta (thickness is 5nm).Value when above-mentioned each layer thickness or composition are the vacuum moulding machine sample.
Embodiment 5:
A kind of ferromagnetic/preparation method of antiferromagnetic multilayer film pinning material (magnetoresistance effect system), with embodiment 3 examples, the preparation Ni-Fe ferromagnetic/the antiferromagnetic multilayer film pinning of Fe-Mn system, its step is as follows: at first adopt vacuum deposition method, as magnetically controlled sputter method, the base vacuum degree is better than 10 -5Pa; and the deposition operating air pressure under the inert atmosphere is 0.3Pa; on the 1-Si substrate, plate 2-resilient coating Ta (thickness is 5nm), the 3-first ferromagnetic layer Ni80Fe20 (thickness is 15nm), the 4-first inverse ferric magnetosphere FeMn (thickness is 2.5nm), the 5-second ferromagnetic layer Ni80Fe20 (thickness is 10nm), the 6-second inverse ferric magnetosphere FeMn (thickness is 10nm) and 7-protective layer Ta (thickness is 5nm) successively
To the measurement of its magnetic hysteresis loop with to the measurement of its temperature thermal stability, prove that this material has very strong thermal stability, and anisotropy is superior through vibrating specimen magnetometer.
Embodiment 6-11: referring to accompanying drawing 1.
A kind of ferromagnetic/antiferromagnetic multilayer film pinning material (magnetoresistance effect system), by substrate 1, on substrate 1, plate resilient coating 2, ferromagnetic layer I 3, inverse ferric magnetosphere 4, ferromagnetic layer II 5 and protective layer 6 successively and form; Layers of material sees the following form:
Embodiment numbers material component ??6 ??7 ??8 ??9 ??10 ??11
Substrate Silicon Silicon Silicon Glass Glass Glass
Resilient coating ??Ta ??Ta ??Ta ??Ta ??Ta ??Ta
Ferromagnetic layer I ??SmCo ??SmCo ??FePt ??SmCo ??FePt ??FePt
Inverse ferric magnetosphere ??FeMn ??NiMn ??PtMn ??PdMn ??IrMn ??IrMn
Ferromagnetic layer II ??NiFe ??Co ??CoFe ??NiFe ??Co ??CoFe
Protective layer ??Ta ??Ta ??Ta ??Ta ??Ta ??Ta
Embodiment 12:
A kind of ferromagnetic/preparation method of antiferromagnetic multilayer film pinning material, may further comprise the steps:
A, employing vacuum deposition method plate resilient coating, ferromagnetic layer I, inverse ferric magnetosphere, ferromagnetic layer II and protective layer successively on substrate, promptly make the semi-finished product of pinning material;
B, with the semi-finished product of this pinning material, be parallel under the externally-applied magnetic field of general magnetic field intensity of sample easy axis direction one and carry out vacuum annealing, promptly obtain finished product after the annealing;
During the vacuum deposition method coating of described step a, base vacuum air pressure is better than 10 -4Pa, and the deposition operating air pressure under the inert atmosphere is 0.1Pa;
The annealing temperature of the annealing process among the described step b is that 350 ℃, annealing time are that 0.5 hour, base vacuum are better than 10 -3Pa.
Other is with arbitrary among embodiment 1,2 or the embodiment 6-11, slightly.
Embodiment 13:
A kind of ferromagnetic/preparation method of antiferromagnetic multilayer film pinning material, may further comprise the steps:
A, employing vacuum deposition method plate resilient coating, ferromagnetic layer I, inverse ferric magnetosphere, ferromagnetic layer II and protective layer successively on substrate, promptly make the semi-finished product of pinning material;
B, with the semi-finished product of this pinning material, be parallel under the externally-applied magnetic field of general magnetic field intensity of sample easy axis direction one and carry out vacuum annealing, promptly obtain finished product after the annealing;
During the vacuum deposition method coating of described step a, base vacuum air pressure is better than 10 -4Pa, and the deposition operating air pressure under the inert atmosphere is 0.4Pa;
The annealing temperature of the annealing process among the described step b is that 350 ℃, annealing time are that 5.0 hours, base vacuum are better than 10 -3Pa.
Other is with arbitrary among embodiment 1,2 or the embodiment 6-11, slightly.
Embodiment 14:
A kind of ferromagnetic/preparation method of antiferromagnetic multilayer film pinning material, may further comprise the steps:
A, employing vacuum deposition method plate resilient coating, ferromagnetic layer I, inverse ferric magnetosphere, ferromagnetic layer II and protective layer successively on substrate, promptly make the semi-finished product of pinning material;
B, with the semi-finished product of this pinning material, be parallel under the externally-applied magnetic field of general magnetic field intensity of sample easy axis direction one and carry out vacuum annealing, promptly obtain finished product after the annealing;
During the vacuum deposition method coating of described step a, base vacuum air pressure is better than 10 -4Pa, and the deposition operating air pressure under the inert atmosphere is 0.8Pa;
The annealing temperature of the annealing process among the described step b is that 500 ℃, annealing time are that 3.0 hours, base vacuum are better than 10 -3Pa.
Other is with arbitrary among embodiment 1,2 or the embodiment 6-11, slightly.
Embodiment 15-20: referring to accompanying drawing 1.
A kind of ferromagnetic/antiferromagnetic multilayer film pinning material (magnetoresistance effect system), by substrate 1, on substrate 1, plate resilient coating 2, first ferromagnetic layer 3, first inverse ferric magnetosphere 4, second ferromagnetic layer 5, second inverse ferric magnetosphere 6 and protective layer 7 successively and form; Layers of material sees the following form:
Figure GSA00000107808200091
Embodiment 21:
A kind of ferromagnetic/preparation method of antiferromagnetic multilayer film pinning material, may further comprise the steps:
Adopt vacuum deposition method, on substrate 1, plate resilient coating 2, first ferromagnetic layer 3, first inverse ferric magnetosphere 4, second ferromagnetic layer 5, second inverse ferric magnetosphere 6 and protective layer 7 successively;
When adopting described vacuum deposition method coating, the base vacuum atmospheric pressure is better than 10 -4Pa, and the deposition operating air pressure under the inert atmosphere is 0.8Pa.
Other is with arbitrary among embodiment 3,4 or the embodiment 15-20, slightly.
Embodiment 22:
A kind of ferromagnetic/preparation method of antiferromagnetic multilayer film pinning material, may further comprise the steps:
Adopt vacuum deposition method, on substrate 1, plate resilient coating 2, first ferromagnetic layer 3, first inverse ferric magnetosphere 4, second ferromagnetic layer 5, second inverse ferric magnetosphere 6 and protective layer 7 successively;
When adopting described vacuum deposition method coating, the base vacuum atmospheric pressure is better than 10 -4Pa, and the deposition operating air pressure under the inert atmosphere is 0.1Pa.
Other is with arbitrary among embodiment 3,4 or the embodiment 15-20, slightly.
The invention is not restricted to the foregoing description, content of the present invention is described all can implement and have described good result.

Claims (10)

1.一种铁磁/反铁磁多层膜钉扎材料,其特征是包括:1. A ferromagnetic/antiferromagnetic multilayer film pinning material is characterized in that it comprises: 一基片,和在基片上依次设置的a substrate, and sequentially arranged on the substrate 一缓冲层,用于诱导织构的反铁磁层;a buffer layer for inducing a textured antiferromagnetic layer; 一铁磁层(I),设置于缓冲层上;a ferromagnetic layer (I), disposed on the buffer layer; 一反铁磁层,设置于铁磁层(I)上;an antiferromagnetic layer, disposed on the ferromagnetic layer (I); 一铁磁层(II),设置于反铁磁层上;以及a ferromagnetic layer (II) disposed on the antiferromagnetic layer; and 一设置于铁磁层(II)上的的保护层。A protective layer disposed on the ferromagnetic layer (II). 2.按权利要求1所述的铁磁/反铁磁多层膜钉扎材料,其特征是:所述反铁磁层为锰系反铁磁材料FeMn、NiMn、PtMn、PdMn或IrMn中的一种。2. ferromagnetic/antiferromagnetic multilayer film pinning material according to claim 1, characterized in that: said antiferromagnetic layer is manganese antiferromagnetic material FeMn, NiMn, PtMn, PdMn or IrMn A sort of. 3.按权利要求1所述的铁磁/反铁磁多层膜钉扎材料,其特征是:3. ferromagnetic/antiferromagnetic multilayer film pinning material according to claim 1, characterized in that: 所述铁磁层(I)为硬磁材料SmCo、FePt中的一种;The ferromagnetic layer (I) is a kind of hard magnetic material SmCo, FePt; 所述的铁磁层(II)为软磁材料NiFe、Co或CoFe中的一种。The ferromagnetic layer (II) is one of soft magnetic materials NiFe, Co or CoFe. 4.按权利要求1所述的铁磁/反铁磁多层膜钉扎材料的制备方法,其特征是包括以下步骤:4. by the preparation method of ferromagnetic/antiferromagnetic multilayer film pinning material according to claim 1, it is characterized in that comprising the following steps: a、采用真空沉积法,在基片上依次镀上缓冲层、铁磁层(I)、反铁磁层、铁磁层(II)和保护层,即制得钉扎材料的半成品;a, adopting the vacuum deposition method, plate a buffer layer, a ferromagnetic layer (I), an antiferromagnetic layer, a ferromagnetic layer (II) and a protective layer on the substrate in sequence, to obtain a semi-finished product of the pinning material; b、将该钉扎材料的半成品,在一平行于样品易轴方向的普通磁场强度的外加磁场下进行真空退火,退火后即获得成品。b. The semi-finished product of the pinning material is subjected to vacuum annealing under an external magnetic field with a common magnetic field strength parallel to the direction of the easy axis of the sample, and the finished product is obtained after annealing. 5.按权利要求4所述的铁磁/反铁磁多层膜钉扎材料的制备方法,其特征是:5. by the preparation method of ferromagnetic/antiferromagnetic multilayer film pinning material according to claim 4, it is characterized in that: 所述步骤a的真空沉积法镀层时,本底真空气压优于10-4Pa,且惰性气氛下的沉积工作气压为0.1~0.8Pa;During the vacuum deposition method coating in the step a, the background vacuum pressure is better than 10 -4 Pa, and the deposition working pressure under an inert atmosphere is 0.1-0.8 Pa; 所述步骤b中的退火工艺的退火温度为350~650℃、退火时间为0.5~5.0小时、本底真空优于10-3Pa。The annealing temperature in the annealing process in the step b is 350-650° C., the annealing time is 0.5-5.0 hours, and the background vacuum is better than 10 −3 Pa. 6.一种铁磁/反铁磁多层膜钉扎材料,其特征是包括:6. A ferromagnetic/antiferromagnetic multilayer film pinning material, characterized in that it comprises: 基片,和在基片上依次设置的substrate, and sequentially arranged on the substrate 缓冲层,用于诱导织构的反铁磁层;Buffer layer, antiferromagnetic layer for inducing texture; 第一铁磁层,设置于缓冲层上;the first ferromagnetic layer is disposed on the buffer layer; 第一反铁磁层,设置于第一铁磁层上;The first antiferromagnetic layer is disposed on the first ferromagnetic layer; 第二铁磁层,设置于第一反铁磁层上;a second ferromagnetic layer disposed on the first antiferromagnetic layer; 第二反铁磁层,设置于第二铁磁层上;以及a second antiferromagnetic layer disposed on the second ferromagnetic layer; and 设置于第二反铁磁层上的保护层。The protective layer is arranged on the second antiferromagnetic layer. 7.按权利要求6所述的铁磁/反铁磁多层膜钉扎材料,其特征是:7. ferromagnetic/antiferromagnetic multilayer film pinning material according to claim 6, characterized in that: 所述第一反铁磁层为NiO或锰系反铁磁材料FeMn或IrMn中的一种;The first antiferromagnetic layer is one of NiO or manganese-based antiferromagnetic materials FeMn or IrMn; 所述第二反铁磁层为锰系反铁磁材料FeMn、NiMn、PtMn、PdMn或IrMn中的一种,或人工反铁磁材料Co/Ru(t
Figure FSA00000107808100021
)/Co、CoFe/Ru(t
Figure FSA00000107808100022
)/CoFe、NiFe/Ru(t)/NiFe、或Co/Cu/Co中的一种。
The second antiferromagnetic layer is one of manganese-based antiferromagnetic materials FeMn, NiMn, PtMn, PdMn or IrMn, or an artificial antiferromagnetic material Co/Ru(t
Figure FSA00000107808100021
)/Co、CoFe/Ru(t
Figure FSA00000107808100022
)/CoFe, NiFe/Ru(t )/NiFe, or one of Co/Cu/Co.
8.按权利要求6所述的铁磁/反铁磁多层膜钉扎材料,其特征是:所述的第一铁磁层和第二铁磁层均为软磁材料NiFe、Co或CoFe中的一种。8. The ferromagnetic/antiferromagnetic multilayer film pinning material according to claim 6, characterized in that: the first ferromagnetic layer and the second ferromagnetic layer are soft magnetic materials NiFe, Co or CoFe One of. 9.按权利要求6所述的铁磁/反铁磁多层膜钉扎材料的制备方法,其特征是包括以下步骤:9. By the preparation method of ferromagnetic/antiferromagnetic multilayer film pinning material according to claim 6, it is characterized in that comprising the following steps: a、采用真空沉积法,在基片上依次镀上缓冲层、第一铁磁层、第一反铁磁层、第二铁磁层、第二反铁磁层和保护层。a. Using a vacuum deposition method, a buffer layer, a first ferromagnetic layer, a first antiferromagnetic layer, a second ferromagnetic layer, a second antiferromagnetic layer and a protective layer are sequentially plated on the substrate. 10.按权利要求9所述的铁磁/反铁磁多层膜钉扎材料的制备方法,其特征是:采用所述的真空沉积法镀层时,本底真空气压压力优于10-4Pa,且惰性气氛下的沉积工作气压为0.1~0.8Pa。10. The preparation method of the ferromagnetic/antiferromagnetic multilayer film pinning material according to claim 9, characterized in that: when using the vacuum deposition method for coating, the background vacuum pressure is better than 10 -4 Pa , and the deposition working pressure under an inert atmosphere is 0.1-0.8Pa.
CN2010101772858A 2010-05-19 2010-05-19 Ferromagnetic/anti-ferromagnetic multilayer film pinning material and preparation method thereof Expired - Fee Related CN101834053B (en)

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CN109166690A (en) * 2018-08-27 2019-01-08 电子科技大学 A kind of anisotropic magnetoresistance based on Multilayer Switching bias structure
CN110808331A (en) * 2019-11-19 2020-02-18 郑州工程技术学院 Giant magnetoresistance film and preparation method thereof
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CN104851975A (en) * 2015-01-07 2015-08-19 内蒙古大学 Anisotropic magnetic resistance material with NiFe alloy magnetic layer and preparation method of anisotropic magnetic resistance material
CN109166690A (en) * 2018-08-27 2019-01-08 电子科技大学 A kind of anisotropic magnetoresistance based on Multilayer Switching bias structure
CN109166690B (en) * 2018-08-27 2021-05-04 电子科技大学 Anisotropic magneto-resistance based on multilayer exchange bias structure
CN110808331A (en) * 2019-11-19 2020-02-18 郑州工程技术学院 Giant magnetoresistance film and preparation method thereof
CN115148896A (en) * 2022-06-10 2022-10-04 珠海多创科技有限公司 Magnetic sensor, preparation method thereof and electronic equipment

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