CN101832797A - Wired compound sensor capable of being in direct sealed conductive connection - Google Patents
Wired compound sensor capable of being in direct sealed conductive connection Download PDFInfo
- Publication number
- CN101832797A CN101832797A CN 201010179267 CN201010179267A CN101832797A CN 101832797 A CN101832797 A CN 101832797A CN 201010179267 CN201010179267 CN 201010179267 CN 201010179267 A CN201010179267 A CN 201010179267A CN 101832797 A CN101832797 A CN 101832797A
- Authority
- CN
- China
- Prior art keywords
- seat
- stake
- compound
- sensor
- connect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000001875 compounds Chemical class 0.000 title claims abstract description 22
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 238000002955 isolation Methods 0.000 claims description 8
- 239000000565 sealant Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 3
- 206010025482 malaise Diseases 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002463 transducing effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004589 rubber sealant Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
Images
Landscapes
- Testing Or Calibration Of Command Recording Devices (AREA)
Abstract
The invention relates to a wired compound sensor capable of being in direct sealed conductive connection, which comprises an isolated conductive connection seat, a compound conductive connection core piece of the sensor and a core piece locking sheath. In the invention, one or more measurement sensing elements are simultaneously and organically combined with one signal conductive connection installing piece to form a whole to change the traditional installing and using mode that each measurement sensing element respectively corresponds to one signal conductive connection installing piece and one installing interface, thereby effectively solving the problems of multiple connection points, complex connection lines, complicated maintenance management, non-standard sealing method, high dielectric leakage rate and unsafe use in the installing and using processes of the traditional measurement sensor. The invention has the advantages of simple and standard structure and convenient installation and greatly improves the installing and using efficiency, the safety and the reliability of the measurement sensor.
Description
Technical field
The invention belongs to measurement mechanism, particularly relate to a kind of wired sense measuring device that is used in the airtight container.
Background technology
In many products or process units, one or more are installed is used to measure or the sensing device of control device duty, for example measure or control the sensor of temperature, pressure, humidity, liquid level or the like, and each sensor that is usually located in the vessel media all must be connected by the sealed conductive connection device transducing signal processing controller outer with being positioned at container that is installed on the container joint respectively, thereby tie point is many, connection line is numerous and diverse, the maintenance management trouble; In addition, existing packoff, the not enough standard of encapsulating method, dielectric leakage rate height uses and feels unwell entirely.
Summary of the invention
Purpose of the present invention provides a kind of simple in structure, standard, and is easy for installation, the safe and reliable directly wired compound sensor of sealed conductive connection.
Technical solution of the present invention is: comprise the isolation conduction seat, compound chipware and the chipware lock sheath of connecting of sensor, described isolation conduction seat leading section is provided with and can seals the syndeton that connects with container joint, isolate and to be provided with a dividing plate in the conduction seat and will to isolate the conduction seat inner chamber and be divided into ante-chamber and back cavity, dividing plate is provided with the center pit in chamber, conducting front and back, described sensor is compound to connect chipware and has and connect the stake seat, connect in the stake seat and some stakes that connect are arranged with the electric insulating sealant sealing, the two ends that respectively connect stake are worn respectively and are exposed to both ends of the surface that connect stake seat, wherein the compound circuit plate that is connected and installed with one or several sensors is held in the stake that connects on the end face, sensor is compound to connect chipware and connects the stake seat by it and be installed in the ante-chamber of isolating conduction seat, and make the free end face that connects the stake seat towards the dividing plate of isolating conduction seat, connect between the ante-chamber bottom surface of stake seat and isolation conduction seat and be provided with packing washer, described chipware lock sheath is a pipe box, be rotatably connected in the ante-chamber of isolating conduction seat by screw thread and compress, the compound seat that connects that connects chipware of locking sensor, pipe box is provided with the medium guide hole.
Described some stakes that connects, its stage casing is fixed on the collets, is mounted on by these collets to connect on the stake seat again.
Described chipware lock sheath is made up of metal adapter sleeve and nerd pack cover, and nerd pack puts and is provided with the medium guide hole.
The invention has the beneficial effects as follows: one or more measurement sensing elements are organically constituted one with a signal conduction connection part simultaneously, changed traditional each and measured the pattern of installing and using of a corresponding respectively signal conduction connection part of sensing element and a mounting interface, thus solved effectively traditional survey sensor install and use in existing tie point many, connection line is numerous and diverse, maintenance management trouble, the not enough standard of encapsulating method, dielectric leakage rate height, use are felt unwell full disadvantage.Simple in structure, the standard of the present invention, easy for installation, that has improved survey sensor greatly installs and uses efficient and safe reliability.
Description of drawings
Fig. 1 is an one-piece construction synoptic diagram of the present invention.
Fig. 2 is an assembly decomposing state structural representation of the present invention.
Embodiment
The invention will be further described with embodiment below in conjunction with accompanying drawing.
Isolating conduction seat 1 be the rank pipe joint, is provided with a dividing plate 11 in this tubular isolation conduction seat and will isolates the conduction seat inner chamber and be divided into ante-chamber 12 and back cavity 13, and dividing plate 11 is provided with the center pit 111 in chamber, conducting front and back; Isolating conduction seat 1 leading section is provided with and can seals the syndeton 14 that connects with container joint, rearward end can be provided with syndeton 14 too, described syndeton 14 can be flange or screw thread etc., present embodiment adopts helicitic texture, and is provided with seal groove 15 between anterior male ends of pedestal and the protruding joint of pedestal.Sensor is compound connect that chipware 2 has that engineering plastics make connect stake seat 21, connect in the stake seat 21 with what electric insulating sealant 24 sealing had a number of metal material and connect stake 23; Connect stake 23 fixing standard, reliable and stable more in connecting stake seat 21 in order to make, present embodiment is fixed in some stage casings that connect stake 23 on one collets 22, is mounted on by these collets 22 to connect on the stake seat 21 again; The electric insulating sealant 24 of present embodiment adopts silicon rubber sealant; Respectively connect stake 23 two ends and pass both ends of the surface that connect stake seat 21 respectively, wherein connect the compound circuit plate 25 that stake 23 is connected and installed with temperature sensor A, pressure transducer B and humidity sensor C on the end face; The compound stake seat 21 that connects that connects chipware 2 of sensor is installed in the ante-chamber 12 of conduction seat, and make freely the connecting stake 23 on its other end penetrate the center pits 111 of isolating on the conduction seat dividing plate or isolate in the conduction seat back cavity 13, connect mutually with the outer transducing signal processing controller of airtight container being convenient to; The ante-chamber bottom surface that connects stake seat 21 and isolation conduction seat is to be provided with packing washer 16 between the periphery of dividing plate center pit 111 leading flanks.Chipware lock sheath 3 is pipe boxes, be rotatably connected in the ante-chamber of isolating conduction seat 1 by screw thread compress, locking sensor compound connect chipware 2 connect stake seat 21, pipe box is provided with medium guide hole 33, the chipware lock sheath 3 of present embodiment adopts metal adapter sleeve 31 and nerd pack cover 32 to form, and nerd pack cover 32 is provided with medium guide hole 33.
Claims (3)
1. direct wired compound sensor of sealed conductive connection, it is characterized in that comprising isolation conduction seat (1), compound chipware (2) and the chipware lock sheath (3) of connecting of sensor, described isolation conduction seat (1) leading section is provided with and can seals the syndeton (14) that connects with container joint, isolate and to be provided with dividing plate (11) in the conduction seat (1) and will to isolate the conduction seat inner chamber and be divided into ante-chamber (12) and back cavity (13), dividing plate (11) is provided with the center pit (111) in chamber, conducting front and back, the compound chipware (2) that connects of described sensor has stake of connecting (21), connect in the stake seat (21) and some stakes (23) that connect are arranged with electric insulating sealant (24) sealing, the two ends that respectively connect stake (23) are worn respectively and are exposed to both ends of the surface that connect stake seat (21), wherein the compound circuit plate (25) that is connected and installed with one or several sensors is held in the stake that connects on the end face, sensor is compound to connect chipware (2) and connects stake seat (21) by it and be installed in the ante-chamber (12) of isolating conduction seat, and make the free end face that connects stake seat (21) towards the dividing plate of isolating conduction seat, connect between ante-chamber (12) bottom surface of stake seat (21) and isolation conduction seat and be provided with packing washer (16), described chipware lock sheath (3) is a pipe box, be rotatably connected in the ante-chamber of isolating conduction seat by screw thread and compress, the compound seat (21) that connects that connects chipware of locking sensor, pipe box is provided with medium guide hole (33).
2. by the described directly wired compound sensor of sealed conductive connection of claim 1, it is characterized in that described some stakes (23) that connects, its stage casing is fixed on the collets (22), is mounted on by these collets (22) to connect on the stake seat (21) again.
3. by the described directly wired compound sensor of sealed conductive connection of claim 1, it is characterized in that described chipware lock sheath (3) is made up of metal adapter sleeve (31) and nerd pack cover (32), nerd pack cover (32) is provided with medium guide hole (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010179267 CN101832797A (en) | 2010-05-21 | 2010-05-21 | Wired compound sensor capable of being in direct sealed conductive connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010179267 CN101832797A (en) | 2010-05-21 | 2010-05-21 | Wired compound sensor capable of being in direct sealed conductive connection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101832797A true CN101832797A (en) | 2010-09-15 |
Family
ID=42716949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010179267 Pending CN101832797A (en) | 2010-05-21 | 2010-05-21 | Wired compound sensor capable of being in direct sealed conductive connection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101832797A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103364020A (en) * | 2013-07-19 | 2013-10-23 | 哈尔滨工业大学深圳研究生院 | Sealing device for sensor with multi-strand pipelines and large inner diameter and assembly method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2063633U (en) * | 1989-11-06 | 1990-10-10 | 王声操 | Compound protective pipe |
| CN1419649A (en) * | 2000-03-25 | 2003-05-21 | 罗伯特-博希股份公司 | Sensor assembly |
| US20060037394A1 (en) * | 2004-08-20 | 2006-02-23 | Honeywell International, Inc. | High temperature sensor sleeve |
| CN101608935A (en) * | 2009-07-18 | 2009-12-23 | 湖州爱迪电气有限公司 | Sealing conduction seat of wired sensor |
| CN201731896U (en) * | 2010-05-21 | 2011-02-02 | 湖州爱迪电气有限公司 | Wired compound sensor capable of directly sealing and conducting |
-
2010
- 2010-05-21 CN CN 201010179267 patent/CN101832797A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2063633U (en) * | 1989-11-06 | 1990-10-10 | 王声操 | Compound protective pipe |
| CN1419649A (en) * | 2000-03-25 | 2003-05-21 | 罗伯特-博希股份公司 | Sensor assembly |
| US20060037394A1 (en) * | 2004-08-20 | 2006-02-23 | Honeywell International, Inc. | High temperature sensor sleeve |
| CN101608935A (en) * | 2009-07-18 | 2009-12-23 | 湖州爱迪电气有限公司 | Sealing conduction seat of wired sensor |
| CN201731896U (en) * | 2010-05-21 | 2011-02-02 | 湖州爱迪电气有限公司 | Wired compound sensor capable of directly sealing and conducting |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103364020A (en) * | 2013-07-19 | 2013-10-23 | 哈尔滨工业大学深圳研究生院 | Sealing device for sensor with multi-strand pipelines and large inner diameter and assembly method thereof |
| CN103364020B (en) * | 2013-07-19 | 2016-01-06 | 哈尔滨工业大学深圳研究生院 | The assemble method of the sensor seal of multiply pipeline large diameter |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104122029A (en) | New-structured air pressure differential sensor assembly | |
| CN109001421A (en) | A kind of soil pressure and monitoring pore water pressure device | |
| CN205225245U (en) | Under high temperature and high pressure environment along with boring temperature measurement nipple joint | |
| CN202614327U (en) | Mining water level sensor | |
| CN201731896U (en) | Wired compound sensor capable of directly sealing and conducting | |
| CN203037284U (en) | Integrated SF6 gas density, micro water, temperature transmitter | |
| CN102607661A (en) | Electronic direct-reading counter for wet type water meter | |
| CN209820525U (en) | Sulfur hexafluoride micro-water and density on-line monitoring device | |
| CN101832797A (en) | Wired compound sensor capable of being in direct sealed conductive connection | |
| CN203365000U (en) | Overhead type sensor | |
| CN204831471U (en) | Novel magnetism floater liquid level changer | |
| CN203192204U (en) | Underground data acquisition and transmission device | |
| CN108109878B (en) | Coaxial double-point liquid level switch | |
| CN205049288U (en) | Intelligence digital display pressure transmitter | |
| CN213022107U (en) | Waterproof and anti-corrosion meteorological air pressure sensing device | |
| CN103236144A (en) | Apparatus used for underground data acquisition and wireless transmission | |
| CN115219099A (en) | Intelligent pressure transmitter | |
| CN210014821U (en) | A Synchronous Sampling Thermal Conductivity Liquid Level Sensor | |
| CN202501890U (en) | Electronic direct reading counter for wet type water meter | |
| CN203310474U (en) | Locomotive fuel amount sensing node device | |
| CN201741965U (en) | Signal wire sealing-splicing chipware | |
| CN222166210U (en) | Electromagnetic water meter | |
| CN103353371B (en) | Solid particle level measurement pressure transmitter | |
| CN105865546B (en) | Solid flow meter mounting structure | |
| CN216483683U (en) | Direct-reading pressure gauge |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100915 |