CN101807558A - Element sealing and jointing structure and its process - Google Patents

Abstract

The invention discloses an element sealing and connecting structure and a process thereof. The element sealing joint structure comprises a buffer bump layer, a plurality of conductive joints and a sealing joint. The buffer bump layer is arranged between the element and the substrate and comprises a plurality of first parts and second parts, and the second parts surround the peripheries of the first parts. Each conductive joint part comprises a first electrode covering each first part and a second electrode on the substrate, and each first electrode is electrically connected with each second electrode. The sealing joint part comprises a joint ring on the substrate, and the joint ring and the second part are mutually jointed to form a sealing space between the element and the substrate.

Description

Component sealing joint structure and its process

technical field

The present invention relates to a sealing joint structure, and in particular to a sealing joint structure and a technique thereof which simultaneously achieve element sealing and packaging effects.

Background technique

Looking at the development trend of medical electronic products, implantable micro-package components and biocompatibility technology play a very important role. If the requirements of biocompatibility and sealing cannot be met, the implantable micro-package components For humans or animals, the erosion and degradation of body fluids or the destruction of muscle tissue activities will cause toxic substances to invade the living body, which will be quite dangerous.

In biomedical electronic packaging components using a titanium can, the electrodes of the multilayer ceramic substrate are used to conduct signals to the outside. The production of this multilayer ceramic substrate is based on low-temperature co-fired ceramics (LTCC, Low-Temperature Cofired Ceramics) technology, using gold, silver, copper and other low-impedance metals as electrodes, and then using lithography to coat the circuit, and finally at 850 degrees Celsius The integrated ceramic element is formed by sintering at a temperature of 900°C, and the integrated ceramic element is placed in the air-tight airtight space of the titanium metal cover to complete the sealing process.

In recent years, in order to meet the requirements of miniaturization, various micro-package components can be produced by using semiconductor integrated circuit technology and packaging technology, which use silicon chips, glass or high molecular polymers as substrates, and combine micro-electromechanical components. Technology and biomedical technology, design and manufacture of biological and medical detection components with miniaturization, fast and parallel processing capabilities, such as gene chips, protein chips, specimen processing chips and biological sensing chips, etc., fully utilize molecular biology, Analyze the principles of chemistry and biochemical reactions, and quickly perform a large number of biochemical sensing or reactions on a small area.

In addition, for injection-type micro-packaged components such as pacemakers, neurostimulators, or blood glucose monitors, in order to prevent toxic substances from invading the living body, the reliability of the sealing material and packaging must be safe. plays a very important role.

Contents of the invention

The invention provides an element sealing joint structure for packaging an element on a substrate. The element sealing joint structure includes a buffer bump layer, a plurality of conductive joint parts, and a sealing joint part. The buffer bump layer is disposed between the element and the substrate, the buffer bump layer includes a plurality of first parts and a second part, and the second part surrounds the periphery of the first parts. A plurality of conductive junctions are electrically connected between the element and the substrate, wherein each conductive junction includes a first electrode covering each first portion and a second electrode on the substrate, and each first electrode is connected to each The second electrode is electrically connected. The sealing joint part surrounds the periphery of the conductive joint parts, and the sealing joint part includes a joint ring on the substrate, and the joint ring and the second part are mutually jointed, so that a sealed space is formed between the element and the substrate.

The invention proposes an element hermetic bonding process. First, provide a base material for forming an element; form a buffer layer on the element; pattern the buffer layer to form a buffer bump layer including a plurality of first portions and second portions, wherein the second portion surrounds the elements The periphery of the first part; forming first electrodes on each of the first parts; providing a substrate, the substrate is formed with a plurality of second electrodes and a joint ring, and the joint ring surrounds the periphery of the second electrodes. The element is arranged on the substrate, wherein each of the first electrodes corresponds to each of the second electrodes and is electrically connected to each of the second electrodes, and the bonding ring is correspondingly bonded to the second part, so that the element and A sealed space is formed between the substrates.

The invention provides an element sealing joint structure for packaging an element on a substrate. The element sealing joint structure includes a buffer bump layer, a plurality of conductive joint parts, and a sealing joint part. The buffer bump layer is disposed between the element and the substrate, the element has a plurality of pads, and the buffer bump layer has a ring-shaped portion surrounding the periphery of the pads. A plurality of conductive joints are electrically connected between the element and the substrate, wherein each conductive joint includes a metal bump electrically connected to each pad on the element and a second electrode on the substrate, and each metal The bumps are electrically connected to each of the second electrodes. The sealing joint part surrounds the periphery of the conductive joint parts, and the sealing joint part includes a joint ring on the substrate, and the joint ring and the ring part are mutually jointed to form a sealed space between the element and the substrate.

The invention proposes an element hermetic bonding process. Firstly, provide a base material for forming an element, the element has a plurality of contact pads; form a buffer layer on the element; pattern the buffer layer to form a buffer bump layer with a ring portion, wherein the ring portion surrounds On the periphery of the pads; forming a plurality of metal bumps on the element, and each of the metal bumps is electrically connected to each of the pads; providing a substrate, the substrate is formed with a plurality of second electrodes and a bonding ring, The bonding ring surrounds the periphery of the second electrodes. The element is disposed on the substrate, wherein each of the metal bumps corresponds to each of the second electrodes and is electrically connected to each of the second electrodes, and the bonding ring is correspondingly bonded to the annular portion, so that the element and A sealed space is formed between the substrates.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

Description of drawings

FIG. 1A and FIG. 1B are cross-sectional schematic diagrams of an element sealing joint structure according to two embodiments of the present invention.

2A to 2E are schematic flowcharts of the manufacturing method of the element sealing joint structure in FIG. 1A .

3A and 3B are cross-sectional schematic diagrams of an element sealing joint structure according to another embodiment of the present invention.

4A and 4B are cross-sectional schematic diagrams of an element sealing joint structure according to another embodiment of the present invention.

5A and 5B are schematic cross-sectional views of an element sealing joint structure according to another second embodiment of the present invention.

FIG. 6A and FIG. 6B are cross-sectional schematic views of an element sealing joint structure according to another second embodiment of the present invention.

Explanation of reference signs

1001~1010: Component seal joint structure

100: components

100S: Active Surface

100P: protective layer

102: Pad

104: metal layer

104a: Under bump metallization layer

110': cushioning material

110: buffer bump layer

110a: Part I

110b: Part II

110c: Part Three

110d: annular part

120: Conductive junction

130: Seal joint

140: Substrate

W: Substrate

S1: first electrode

S2: second electrode

S3: Metal bump

H1: first adhesive metal layer

H2: second adhesive metal layer

H3: third adhesive metal layer

R1: adapter ring

C: sealed space

150: Substrate

152: via hole

S3: third electrode

S4: Nerve stimulation electrodes

160: Carrier

162: Pad

170: biocompatible coating

100a: first element

150a: first substrate

100b: second element

150b: second substrate

Detailed ways

FIG. 1A and FIG. 1B are cross-sectional schematic diagrams of an element sealing joint structure according to two embodiments of the present invention. 2A to 2E are schematic flowcharts of the manufacturing method of the element sealing joint structure in FIG. 1A .

Referring to FIG. 1A , the component sealing joint structure 1001 includes a buffer bump layer 110 , a plurality of conductive joints 120 , and a sealing joint 130 . Wherein, the buffer bump layer 110 forms a plurality of first portions 110 a and a second portion 110 b (annular portion) surrounding the periphery of these first portions 110 a by, for example, a patterning process. The material of the buffer bump layer 110 can be a polymer of high molecular material, such as epoxy resin or polyimide resin, etc., and the method is to coat the high molecular material on the substrate (such as silicon Wafer), and then perform exposure, development process or photoetching, dry etching and other processes, so that the polymer material forms a predetermined pattern (a plurality of first parts 110a and the second part 110b surrounding the periphery of these first parts 110a).

For the patterning process and detailed structure of the buffer bump layer 110 , please refer to FIGS. 2A-2D . First, a substrate W, such as a semiconductor substrate, is provided to form one or more integrated circuit elements 100 (only one is shown), the element 100 has an active surface 100S and a protective layer 100P, and the pads 102 ( Only one of them is shown) is disposed on the active surface 100S, and the protection layer 100P covers the active surface 100S and exposes the pads 102 . Next, referring to FIG. 2B and FIG. 2C , a metal layer 104 is formed on the protective layer 100P and the pad 102 by sputtering or vapor deposition, and a buffer material 110 ′ (polymer material or photosensitive polymer material is formed. ) on the component 100. Next, please refer to FIG. 2D , patterning the buffer material 110', for example, performing an exposure, development process or photoetching, dry etching process, to form a plurality of first parts 110a (only one of them is shown) and a second part 110b The buffer bump layer 110, wherein the second part 110b surrounds the periphery of these first parts 110a, therefore, the second part 110b is also a ring-shaped protrusion structure that completely covers the first parts 110a, and has both buffering and sealing effect. Afterwards, referring to FIG. 2E , a first electrode S1 (material such as copper, aluminum or gold) is formed on each first portion 110a (for example, covering the sidewall and upper surface of the first portion 110a) by sputtering or evaporation. , and the metal layer 104 becomes the under-bump metal layer 104a after being etched, and is electrically connected to the first electrode S1 covering each first portion 110a.

In this embodiment, the first part 110a and the second part 110b are completed together in the same patterning process, so as to reduce the steps of the process and enable the subsequent sealing process and component packaging steps to be performed simultaneously. In addition, a space is formed between the first portion 110a and the second portion 110b, for example, by etching, so that the two are structurally separated from each other. However, in another embodiment, the first part 110 a and the second part 110 b are structurally connected to each other, which also has the function of cushioning and sealing.

In another embodiment as shown in FIG. 1B , the device sealing joint structure 1002 includes a buffer bump layer 110 , a plurality of conductive joints 120 , and a sealing joint 130 . Wherein, the buffer bump layer 110 forms a plurality of first portions 110 a and a second portion 110 b surrounding the periphery of the first portions 110 a by, for example, a patterning process. For the manufacturing method of the buffer bump layer 110 , please refer to the steps in FIG. 2A to FIG. 2D , which will not be described in detail here. The difference between this embodiment and the element sealing combination structure in FIG. 1A and the process in FIGS. 2A to 2D is that there is a third part (connection part) 110c between the first part 110a and the second part 11b, and they are structurally connected to each other. Integral (same material), no spacing is formed by etching, so the bonding strength of the seal can be enhanced, and the effect of component sealing and packaging can be achieved at the same time.

Next, please refer to FIG. 1A and FIG. 1B , the conductive joint 120 is electrically connected between the element 100 and the substrate 140 (such as a printed circuit board), and is used for inputting electrical signals to the element 100 through the substrate 140 or outputting through the substrate 140. to the outside, and each conductive joint 120 includes a first electrode S1 covering each first part 110a and a second electrode S2 on the substrate 140, and each first electrode S1 and each second electrode S2 are, for example, passed through a first adhesive metal layer H1 (nickel-gold alloy or titanium-tungsten alloy) is electrically connected. In addition, the sealing joint part 130 surrounds the periphery of these conductive joint parts 120 . The sealing joint 130 includes a joint ring R1 (the material of which is copper, aluminum or gold, for example) on the substrate 140, surrounding the periphery of the second electrodes S2, and the joint ring R1 and the second part 110b are connected to the second part 110b through a second adhesive metal, for example. The layer H2 (nickel-gold alloy or titanium-tungsten alloy) and the third adhesive metal layer H3 (nickel-gold alloy or titanium-tungsten alloy) are joined together to form an airtight sealing structure, so that a sealed space C is formed between the device 100 and the substrate 140 .

In the above two embodiments, the first adhesive metal layer H1 is formed on each first electrode S1 (see FIG. 2E ), for example by sputtering or vapor deposition, and the second adhesive metal layer H2 (which can be S1 is formed in the same step) and the third adhesive metal layer H3 are, for example, formed on the second part 100b and the bonding ring R1 respectively, and when the element 100 is disposed on the substrate 140, a thermocompression step can also be performed, so that each first An adhesive metal layer H1 is electrically bonded between each first electrode S1 and each second electrode S2, and the second adhesive metal layer H2 and the third adhesive metal layer H3 are tightly bonded (eutectic bonding) between the bonding ring R1 and the third electrode S2. between the second parts 110b to enhance the joint strength of the seal. However, the first adhesive metal layer H1 , the second adhesive metal layer H2 and the third adhesive metal layer H3 are only examples of the present invention, and are not intended to limit the present invention.

3A and 3B are cross-sectional schematic diagrams of an element sealing joint structure according to another embodiment of the present invention. Please refer to FIG. 3A and FIG. 3B, the component sealing joint structures 1003, 1004 are used to package the component 100 on the substrate 150 (such as a flexible circuit board), and the first surface of the substrate 150 has a plurality of second electrodes In addition to S2 and the bonding ring R1, the second surface of the substrate 150 further includes a plurality of third electrodes S3. The third electrodes S3 are respectively electrically connected to the second electrodes S2 through the via holes 152 of the substrate 150 . In addition, each third electrode S3 also includes a nerve stimulation electrode S4 (or a conductive patch), which can be used in a Transcutaneous Electro Nerve Stimulator (TENS, Transcutaneous Electro Nerve Stimulator). Each nerve stimulating electrode S4 can discharge through its tip to provide stimulating current required for electrical therapy or muscle rehabilitation.

In addition, FIG. 4A and FIG. 4B are schematic cross-sectional views of an element sealing joint structure according to another two embodiments of the present invention, wherein FIG. 4A is a schematic cross-sectional view of an element sealing joint structure 1005 with a biocompatible coating 170, and FIG. 4B is a stack A schematic cross-sectional view of an element sealing joint structure 1006 of a type package. Please refer to FIG. 4A first, taking injectable biomedical components such as a pacemaker, a nerve stimulator, or a blood glucose monitor as an example, the component sealing and bonding structure 1005 is used to package the component 100 (such as a single-chip component) on the substrate 150, The substrate 150 can be electrically connected to the pad 162 of the carrier 160 through a plurality of conductors S5 (such as solder balls) to transmit the signal to the outside of the living body, and the substrate 150 also includes a biocompatible coating 170 ( For example, non-toxic high molecular polymer such as silica gel), which covers the periphery of the element 100, not only enhances the coverage and sealing performance of the element 100, but also does not cause harm to living tissues.

Next, please refer to FIG. 4B , the element sealing bonding structure 1006 of the stacked package is used to package each element 100 (such as an injectable biomedical element or a single-chip element for other purposes) on each substrate 150 to form a stacked multi-chip Packaging components, wherein the first electrode S1 of the first component 100a is electrically connected to the second electrode S2 of the first substrate 150a, and then the third electrode S3 of the first substrate 150a is passed through a plurality of conductors S5 (such as solder balls) and through The plurality of conductive vias S6 of the second element 100b are electrically connected to the metal pads 102 of the second element 100b, and then the first electrode S1 of the second element 100b is electrically connected to the second electrode S2 of the second substrate 150b, and then The third electrodes S3 of the second substrate 150 b are electrically connected to the pads 162 of the carrier 160 through a plurality of conductors S5 (such as solder balls), so as to transmit signals to the outside. As shown in FIG. 4A , each substrate 150 also includes a biocompatible coating 170 (such as a non-toxic polymer such as silica gel), which covers the surroundings of each element 100, in addition to enhancing the coverage of each element 100 and Sealing, and will not cause harm to living tissues. Of course, the biocompatible coating 170 can also be replaced by other polymer coatings (such as epoxy resin), which is not intended to limit the present invention.

Furthermore, FIG. 5A and FIG. 5B are cross-sectional schematic diagrams of an element sealing joint structure according to another second embodiment of the present invention. Please refer to FIG. 5A and FIG. 5B, the component sealing bonding structures 1007, 1008 are used to package the component 100 on the substrate 140, 150, and the first surface of the substrate 140, 150 has a plurality of second electrodes S1 and bonding ring R1 . In addition, the second surface of the substrate 150 further includes a plurality of third electrodes S3. Each third electrode S3 is electrically connected to each second electrode S2 through the via hole 152 of the substrate 150 . In addition, in FIG. 5B , each third electrode S3 also includes nerve stimulation electrodes S4 (or conductive patches), which can be used in a transcutaneous electrical nerve stimulator (TENS). Each nerve stimulating electrode S4 can discharge through its tip to provide stimulating current required for electrical therapy or muscle rehabilitation. However, the embodiment of FIG. 5A and FIG. 5B is different from the above two embodiments (see FIG. 1A, 3A) in that the first portion 110a of the buffer bump layer 110 is not formed on the pad 102 via the UBM layer 104a. , but formed on the protective layer near the pads 102, and then form the first electrode S1 between each pad 102 and each first part 110a by sputtering or evaporation (for example, covering each pad 102 and each The sidewall and the upper surface of the first part 110a), so that each pad 102 is electrically connected to each second electrode S2 through each first electrode S1.

The process of the buffer bump layer 110 in FIG. 5A and FIG. 5B is similar to the process of the buffer bump layer 110 in FIG. 2D and FIG. 2E described above, except that the process of the UBM layer 104 in FIG. 2B is omitted, and After the buffer bump layer 110 is patterned, the first electrode S1 is formed by sputtering or evaporation to electrically connect each pad 102 . Therefore, the position of the first portion 110 a of the buffer bump layer 110 is not limited to be located above the pad 102 , and can also extend inward through the redistributed first electrode S1 , so as to meet different contact design requirements.

Next, FIG. 6A and FIG. 6B are cross-sectional schematic diagrams of an element sealing joint structure according to another embodiment of the present invention. Please refer to FIG. 6A and FIG. 6B , the component sealing joint structures 1009 , 1010 include a buffer bump layer 110 , a plurality of conductive joints 120 , and a sealing joint 130 . Among them, the buffer bump layer 110 is made of a polymer material with a ring-shaped part 110d (in FIG. 6B ), and a plurality of metal bumps S3 (replacing the original first part 110a) are made of a conductive material, and the metal The bump S3 can be electrically connected to each pad 102 through the under-bump metal layer 104a, so that the first electrode S1, the metal bump S3 and the second electrode S2 form a conductive joint 120 with an electrical connection function, and surround The annular portion 110 d around the metal bumps S3 is bonded to the sealing joint portion 130 , and has the functions of sealing and cushioning, so that a sealed space C is formed between the device 100 and the substrate 140 .

The process of the metal bump S3 in FIG. 6A and FIG. 6B is similar to the process of the buffer bump layer 110 in FIG. 2D and FIG. 2E described above, except that the metal bump S3 is formed on the pad 102 by electroplating, and After the metal bumps S3 are formed, the first electrode S1 is formed by sputtering or vapor deposition to cover each metal bump S3.

In this embodiment, if the material of the above-mentioned metal bump S3 is gold, it can be directly electrically connected to the second electrode S2 through the first adhesive metal layer H1, without first forming the first electrode S1 on the metal bump. on S3. In addition, if the material of the metal bump S3 is copper or copper alloy, the first electrode S1 on the metal bump S3 can be used as an anti-oxidation layer (eg nickel/gold layer) to avoid oxidation of the copper surface.

In summary, the present invention proposes a variety of component sealing and bonding structures and processes thereof, which can be applied to various micro-packaged components, such as gene chips, protein chips, specimen processing chips, and bio-sensing chips, etc., or Injectable biomedical components. In addition to strengthening the bonding strength of the seal through the buffer bump layer, it can also achieve the effect of component sealing and packaging at the same time, preventing toxic substances from invading the living body. In addition, the buffer bump layer is completed in the same patterning process, which does not require additional fabrication of multiple photomasks and multiple photomask processes, so as to reduce process steps and enable subsequent sealing processes and component packaging steps to be performed simultaneously , thereby simplifying the component sealing and packaging process and reducing the production cost.

Although the present invention has been disclosed above with embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the claims.

Claims (35)

1. A component sealing joint structure for packaging components on a substrate, the component sealing joint structure comprising: a buffer bump layer disposed between the element and the substrate, the buffer bump layer includes a plurality of first parts and a second part, and the second part surrounds the periphery of the first part; A plurality of conductive joints are electrically connected between the element and the substrate, wherein each conductive joint includes a first electrode covering each of the first parts and a second electrode on the substrate, and each of the first electrodes is connected to the substrate. each of the second electrodes is electrically connected; and a sealing joint part surrounding the periphery of the plurality of conductive joint parts, the sealing joint part includes a joint ring on the substrate, and the joint ring and the second part are mutually jointed to form a seal between the element and the substrate space. 2. The element sealing joint structure as claimed in claim 1, wherein a gap is formed between the plurality of first portions and the second portion, and are structurally separated from each other. 3. The component sealing joint structure as claimed in claim 1, wherein a third portion is located between the plurality of first portions and the second portion, and is structurally connected to each other. 4. The device sealing joint structure as claimed in claim 1, wherein a material of the buffer bump layer comprises a polymer material. 5. The element sealing joint structure as claimed in claim 1, wherein a first adhesive metal layer is further included between each of the first electrodes and each of the second electrodes. 6 . The component sealing joint structure as claimed in claim 1 , further comprising a second adhesive metal layer and a third adhesive metal layer between the joint ring and the second part. 7. The element sealing joint structure as claimed in claim 1, wherein the substrate further comprises a plurality of third electrodes, and the plurality of third electrodes are respectively electrically connected to the plurality of second electrodes through the substrate. 8. The device sealing joint structure as claimed in claim 7, wherein each of the third electrodes further comprises a nerve stimulation electrode. 9. The device sealing joint structure as claimed in claim 1, wherein the substrate further comprises a biocompatible coating covering the periphery of the device. 10. The component sealing engagement of claim 9, wherein the component is an injectable biomedical component. 11. The device sealing joint structure as claimed in claim 1, wherein the device has a plurality of pads, and each of the first portions is disposed on each of the pads via an under-bump metallization layer, and the under-bump metallization layer is covered with The first electrodes of each of the first parts are electrically connected. 12. The element sealing joint structure as claimed in claim 1, wherein the element has a plurality of pads, and the first electrode is formed between each of the pads and each of the first parts, and each of the pads passes through each of the The first electrodes are electrically connected to each of the second electrodes. 13. The component hermetic joint structure as claimed in claim 1, wherein the component comprises a single-chip component or a stacked multi-chip package component. 14. A component sealing bonding process, comprising: providing the substrate from which the element is intended to be formed; forming a buffer layer on the element; patterning the buffer layer to form a buffer bump layer including a plurality of first portions and a second portion, wherein the second portion surrounds the periphery of the plurality of first portions; forming a first electrode on each of the first portions; providing a substrate formed with a plurality of second electrodes and a bonding ring surrounding a periphery of the plurality of second electrodes; and The element is arranged on the substrate, wherein each of the first electrodes corresponds to each of the second electrodes and is electrically connected to each of the second electrodes, and the bonding ring is correspondingly bonded to the second part, so that the element and A sealed space is formed between the substrates. 15 . The device sealing bonding process as claimed in claim 14 , wherein in the step of patterning the buffer layer, the plurality of first portions and the second portions are etched to form gaps and are structurally separated from each other. 16 . The element sealing bonding process as claimed in claim 14 , wherein in the step of patterning the buffer layer, third portions are respectively formed between the plurality of first portions and the second portions, and are structurally connected to each other. 17. The element sealing bonding process as claimed in claim 14, wherein after forming the first electrodes after each of the first parts, further comprising: forming a first adhesive metal layer on each of the first electrodes; forming a second adhesive metal layer on the second portion; forming a third adhesive metal layer on the bonding ring; and When disposing the element on the substrate, a thermocompression bonding step is also performed, so that each of the first adhesive metal layers is electrically bonded between each of the first electrodes and each of the second electrodes, and the second adhesive metal layer The third adhesive metal layer is bonded between the bonding ring and the second portion. 18. The element sealing bonding process according to claim 14, wherein in the step of providing the substrate, the substrate further includes a plurality of third electrodes, and the plurality of third electrodes are respectively electrically connected to the plurality of second electrodes through the substrate. sexual connection. 19. The element sealing bonding process as claimed in claim 18, wherein the step of providing the substrate further comprises forming nerve stimulating electrodes on each of the third electrodes. 20. The device sealing bonding process as claimed in claim 14, wherein when disposing the device on the substrate, further comprising forming a biocompatible coating to cover the periphery of the device. 21. A component sealing joint structure for packaging components on a substrate, the component sealing joint structure comprising: a buffer bump layer configured between the element and the substrate, the element has a plurality of pads, and the buffer bump layer has a ring portion surrounding the periphery of the plurality of pads; A plurality of conductive joints are electrically connected between the element and the substrate, wherein each conductive joint includes a metal bump electrically connected to each pad on the element and a second electrode on the substrate, and each of the metal bumps are electrically connected to each of the second electrodes; and A sealing joint part, surrounding the periphery of the plurality of conductive joint parts, the sealing joint part includes a joint ring on the substrate, and the joint ring and the annular part are mutually engaged to form a seal between the element and the substrate space. 22. The device sealing joint structure as claimed in claim 21, wherein a material of the buffer bump layer comprises a polymer material. 23. The element sealing joint structure as claimed in claim 21, wherein a first adhesive metal layer is further included between each of the metal bumps and each of the second electrodes. 24. The component sealing joint structure as claimed in claim 21, further comprising a second adhesive metal layer and a third adhesive metal layer between the joint ring and the annular portion. 25. The device sealing joint structure as claimed in claim 21, wherein the substrate further comprises a plurality of third electrodes, and the plurality of third electrodes are respectively electrically connected to the plurality of second electrodes through the substrate. 26. The device sealing joint structure as claimed in claim 25, wherein each of the third electrodes further comprises a nerve stimulation electrode. 27. The device sealing joint structure as claimed in claim 21, wherein the substrate further comprises a biocompatible coating covering the periphery of the device. 28. The component sealing engagement of claim 27, wherein the component is an injectable biomedical component. 29. The element sealing joint structure as claimed in claim 21, wherein each of the metal bumps is disposed on each of the pads via an under-bump metal layer, and the under-bump metal layer and the first metal bump covering each of the metal bumps One electrode is electrically connected. 30. The device sealing joint structure as claimed in claim 21, wherein the device comprises a single-chip device or a stacked multi-chip package device. 31. A component sealing bonding process comprising: providing a substrate intended to form a component having a plurality of pads; forming a buffer layer on the element; patterning the buffer layer to form a buffer bump layer having a ring portion, wherein the ring portion surrounds the plurality of pads; forming a plurality of metal bumps on the element, and each of the metal bumps is electrically connected to each of the pads; providing a substrate formed with a plurality of second electrodes and a bonding ring surrounding a periphery of the plurality of second electrodes; and The element is disposed on the substrate, wherein each of the metal bumps corresponds to each of the second electrodes and is electrically connected to each of the second electrodes, and the bonding ring is correspondingly bonded to the annular portion, so that the element and A sealed space is formed between the substrates. 32. The device sealing bonding process as claimed in claim 31, wherein after forming a plurality of metal bumps on the device, further comprising: forming a first adhesive metal layer on each of the metal bumps; forming a second adhesive metal layer on the annular portion; forming a third adhesive metal layer on the bonding ring; and When disposing the element on the substrate, a thermocompression bonding step is also performed, so that each of the first adhesive metal layers is electrically bonded between each of the metal bumps and each of the second electrodes, and the second adhesive metal layer The third adhesive metal layer is bonded between the bonding ring and the annular portion. 33. The element sealing bonding process according to claim 31, wherein in the step of providing the substrate, the substrate further includes a plurality of third electrodes, and the plurality of third electrodes are respectively electrically connected to the plurality of second electrodes through the substrate. sexual connection. 34. The element sealing bonding process as claimed in claim 33, wherein the step of providing the substrate further comprises forming a nerve stimulating electrode on each of the third electrodes. 35. The element sealing bonding process as claimed in claim 31, wherein when disposing the element on the substrate, further comprising forming a biocompatible coating to cover the periphery of the element.

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