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CN101801155A - 柔性印刷电路板及安装有柔性印刷电路板的电连接器 - Google Patents

柔性印刷电路板及安装有柔性印刷电路板的电连接器 Download PDF

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Publication number
CN101801155A
CN101801155A CN200910300370A CN200910300370A CN101801155A CN 101801155 A CN101801155 A CN 101801155A CN 200910300370 A CN200910300370 A CN 200910300370A CN 200910300370 A CN200910300370 A CN 200910300370A CN 101801155 A CN101801155 A CN 101801155A
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circuit board
printed circuit
flexible printed
bonding pad
electric connector
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Inventor
胡楠
张汉明
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200910300370A priority Critical patent/CN101801155A/zh
Priority to US12/576,252 priority patent/US20100203747A1/en
Publication of CN101801155A publication Critical patent/CN101801155A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/771—Details
    • H01R12/772—Strain relieving means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

本发明公开一种安装有柔性印刷电路板的电连接器，用以连接模块，该电连接器包括座体单元及柔性印刷电路板，该座体单元形成有收容柔性印刷电路板的收容空间，柔性印刷电路板具有收容于收容空间内的连接区及自该连接区延伸出收容空间的延伸区，且连接区设有数个接触部；所述连接区的接触部凸伸有与模块相接触的弧形表面，从而有利于柔性印刷电路板与模块实现可靠接触。

Description

柔性印刷电路板及安装有柔性印刷电路板的电连接器
【技术领域】
本发明涉及一种柔性印刷电路板及安装有柔性印刷电路板的电连接器，尤其涉及用以连接模块的柔性印刷电路板及安装有柔性印刷电路板的电连接器。
【背景技术】
请参阅中国实用新型专利公告第201112952号，其公开了一种用于连接模块的现有电连接器，该电连接器包括有框形的外壳、收容于并焊接于该外壳内的端子及与该端子相抵接的柔性印刷电路板。所述端子具有焊接于该外壳上的基部及自基部延伸的数个弹性接触臂，柔性印刷电路板的上下两侧分别具有与模块及所述端子的弹性接触臂接触的导电片。
当模块被组装入该电连接器内后，该接触臂受到压力而向下变形扩张，同时该接触臂抵压于柔性印刷电路板下侧的导电片上，并使该柔性印刷电路板上侧的导电片与模块相抵接。然而，导电片与模块之间为平面与平面相接触，由于面与面接触的精度要求可能较高，如果柔性印刷电路板的导电片出现毛刺或凹凸等不平整的状况时，可能使柔性印刷电路板与模块之间的接触不太可靠。
因此，确有必要设计一种电连接器以克服现有技术中存在的上述问题。
【发明内容】
本发明所要解决的技术问题在于提供了一种能够与模块实现可靠电性接触的柔性印刷电路板及安装有柔性印刷电路板的电连接器。
为解决上述问题，本发明柔性印刷电路板采用如下技术方案：一种柔性印刷电路板，用以连接模块，该柔性印刷电路板具有与模块相互面对的连接区及自该连接区延伸的延伸区，该连接区设有数个接触部；所述连接区的接触部凸伸有与模块相接触的弧形表面。
本发明柔性印刷电路板具有如下有益效果：通过接触部的弧形表面与模块相接触，有利于柔性印刷电路板与模块实现可靠接触。
为解决上述问题，本发明电连接器采用如下技术方案：一种安装有柔性印刷电路板的电连接器，用以连接模块，该电连接器包括座体单元及柔性印刷电路板，该座体单元形成有收容柔性印刷电路板的收容空间，柔性印刷电路板具有收容于收容空间内的连接区及自该连接区延伸出收容空间的延伸区，且连接区设有数个接触部；所述连接区的接触部凸伸有与模块相接触的弧形表面。
本发明电连接器具有如下有益效果：通过柔性印刷电路板连接区的接触部的弧形表面与模块相接触，有利于柔性印刷电路板与模块实现可靠接触。
【附图说明】
图1为本发明电连接器及模块的组合图。
图2为本发明电连接器的立体组合图。
图3为图2所示本发明电连接器的立体分解图。
图4为图2所示本发明电连接器另一角度的立体分解图。
图5为图1所示本发明电连接器及模块沿A-A线的剖视图，其中模块仅展示了示意图。
【具体实施方式】
请参阅图1及图2所示，本发明电连接器100用以电性连接一模块200，该电连接器包括座体单元10及收容于该座体单元内并与座体单元相抵接的柔性印刷电路板20。所述电连接器100通过柔性印刷电路板电性连接模块200，本实施方式中，该模块是用于拍照装置中的相机模块。
请参阅图3及图4所示，座体单元10形成有收容柔性印刷电路板的收容空间101，该座体单元10包括有壳体11及收容于该壳体内的金属件12，该金属件被夹持于壳体11与柔性印刷电路板20之间以连接该两个元件。柔性印刷电路板20具有收容于收容空间内的连接区21及自该连接区延伸出收容空间的延伸区22，该连接区21包括有数个与模块电性连接的导电部211，金属件12具有焊接于壳体上的基部121及自基部延伸的数个弹性臂122，该弹性臂通过其自由末端的抵接部123抵接于柔性印刷电路板上的导电部211的下侧，该导电部下侧具有抵接部123相对应的数个第一接触部212；数个导电部211上侧具有第二接触部213以与模块相接触。所述抵接部123朝向柔性印刷电路板下侧凸起设置，有利于加强该抵接部与柔性印刷电路板的稳定接触。
请再参阅图5所示，模块收容于电连接器100的收容空间101(请参阅图2所示)，当模块200组装入该收容空间时，该模块挤压柔性印刷电路板20并使金属件的弹性臂122发生弹性变形，该弹性臂122通过反弹力顶推柔性印刷电路板20，使第二接触部213抵接于模块的底面上，第二接触部213凸伸有与模块的底面相接触的弧形表面，该弧形表面可始终与模块之间稳定接触，可避免第二接触部为直平面时与模块的底面相接触而可能产生的接触不良，从而有利于柔性印刷电路板与模块实现可靠接触。壳体11还具有与抵接部123相对应的通孔111，当弹性臂122受压而带动接触部运动后，该通孔可提供容纳空间，防止抵接部123碰到壳体11，且有利于电连接器的低构型发展。
请参阅图1所示，所述壳体11具有卡持于模块200上的锁扣臂112及扣持部113以防止模块脱离，且该锁扣臂及扣持部一体弯折有导引模块插入的倾斜部1121、1131，同时也可简化电连接器的结构。扣持部113冲压弯折有接地弹片1132，该接地弹片与模块相接触，并与金属件12及柔性印刷电路板下侧的第一接触部212形成接地路径，以释放模块200所携带的静电(请参阅图5所示)。
上述实施方式为本发明柔性印刷电路板及具有该柔性印刷电路板的电连接器的较佳实施方式，当然，本发明电连接器及其连接的柔性印刷电路板也可采用其它实施方式，此处不再一一赘述。

Claims (10)

1.一种柔性印刷电路板，用以连接模块，该柔性印刷电路板具有与模块相互面对的连接区及自该连接区延伸的延伸区，该连接区设有数个接触部；
其特征在于：所述连接区的接触部凸伸有与模块相接触的弧形表面。
2.如权利要求1所述的柔性印刷电路板，其特征在于：所述柔性印刷电路板的接触部分布于连接区的两侧。
3.如权利要求2所述的柔性印刷电路板，其特征在于：所述柔性印刷电路板的连接区设有与模块相面对的顶面，上述接触部的弧形表面凸伸出该连接区的顶面。
4.一种安装有柔性印刷电路板的电连接器，用以连接模块，该电连接器包括座体单元及柔性印刷电路板，该座体单元形成有收容柔性印刷电路板的收容空间，柔性印刷电路板具有收容于收容空间内的连接区及自该连接区延伸出收容空间的延伸区，且连接区设有数个接触部；
其特征在于：所述连接区的接触部凸伸有与模块相接触的弧形表面。
5.如权利要求4所述的电连接器，其特征在于：所述座体单元包括有壳体及连接于该壳体与柔性印刷电路板之间的金属件，该金属件具有与柔性印刷电路板的一侧相抵接的弹性臂。
6.如权利要求5所述的电连接器，其特征在于：所述弹性臂的自由末端具有抵接于柔性印刷电路板表面的接触部，该接触部是向柔性印刷电路板下侧凸起设置，所述壳体具有与该接触部相对应的通孔。
7.如权利要求5所述的电连接器，其特征在于：所述壳体具有卡持于模块上的锁扣臂及扣持部。
8.如权利要求5或7所述的电连接器，其特征在于：所述壳体具有导引模块插入的倾斜部。
9.如权利要求4所述的电连接器，其特征在于：所述柔性印刷电路板的另一侧具有与座体单元相对应并抵接的另一连接部。
10.如权利要求4或5所述的电连接器，其特征在于：所述电连接器连接的模块为相机模块。
CN200910300370A 2009-02-09 2009-02-09 柔性印刷电路板及安装有柔性印刷电路板的电连接器 Pending CN101801155A (zh)

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Application Number Priority Date Filing Date Title
CN200910300370A CN101801155A (zh) 2009-02-09 2009-02-09 柔性印刷电路板及安装有柔性印刷电路板的电连接器
US12/576,252 US20100203747A1 (en) 2009-02-09 2009-10-09 Flexible printed circuit board having embossed contact engaging portion

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Application Number Priority Date Filing Date Title
CN200910300370A CN101801155A (zh) 2009-02-09 2009-02-09 柔性印刷电路板及安装有柔性印刷电路板的电连接器

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TWM354795U (en) * 2008-08-07 2009-04-11 Wistron Corp Keyboard connecting mechanism capable of assembling a keyboard conveniently and related portable computer
US8027167B2 (en) * 2009-03-03 2011-09-27 Antec, Inc. Case cable management
US10587074B2 (en) * 2017-09-29 2020-03-10 Appple Inc. Hybrid electrical connector
US11399124B2 (en) * 2018-06-07 2022-07-26 Huawei Technologies Co., Ltd. Positioning apparatus, camera module, and mobile terminal
DE102022202928A1 (de) * 2022-03-24 2023-09-28 Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg Elektronikeinheit für einen elektromotorischen Kältemittelverdichter

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US4925522A (en) * 1989-08-21 1990-05-15 Gte Products Corporation Printed circuit assembly with contact dot
US5343616B1 (en) * 1992-02-14 1998-12-29 Rock Ltd Method of making high density self-aligning conductive networks and contact clusters
US6515233B1 (en) * 2000-06-30 2003-02-04 Daniel P. Labzentis Method of producing flex circuit with selectively plated gold
FI20020992L (fi) * 2002-05-27 2003-11-28 Nokia Corp Komponentin kiinnitysrakenne
US7114961B2 (en) * 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
CN2757364Y (zh) * 2004-11-18 2006-02-08 富士康(昆山)电脑接插件有限公司 电连接器
KR100650767B1 (ko) * 2005-11-10 2006-11-27 주식회사 하이닉스반도체 패드 재배열 칩과, 그 제조방법 및 패드 재배열 칩을이용한 적층형 패키지

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Application publication date: 20100811