CN101795532A - Single-layer flexible printed circuit and realization method thereof - Google Patents
Single-layer flexible printed circuit and realization method thereof Download PDFInfo
- Publication number
- CN101795532A CN101795532A CN 201010138770 CN201010138770A CN101795532A CN 101795532 A CN101795532 A CN 101795532A CN 201010138770 CN201010138770 CN 201010138770 CN 201010138770 A CN201010138770 A CN 201010138770A CN 101795532 A CN101795532 A CN 101795532A
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- Prior art keywords
- fpc
- conductive region
- layer
- layer fpc
- printed circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002356 single layer Substances 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000010410 layer Substances 0.000 claims description 69
- 238000005452 bending Methods 0.000 claims description 10
- 230000002787 reinforcement Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000008520 organization Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The embodiment of the invention provides a single-layer flexible printed circuit and a realization method thereof. The realization method concretely comprises the following steps of: extending to manufacture a conductive region on an original single-layer FPC (Flexible Printed Circuit) and realizing the grounded shield of the original single-layer FPC through the grounding of the conductive region, thus, the grounded shield effect of the single-layer FPC can be enhanced, and meanwhile, the manufacturing time and the manufacturing cost are saved, and the reliability of the FPC is improved.
Description
Technical field
The present invention relates to the wiring board field, relate in particular to a kind of single-layer flexible printed circuit and its implementation.
Background technology
At present, at the wiring board design field, the form of Flexible Printed Circuit (FPC, Flexible Printed Circuit) is more and more, comprises slip FPC, keyboard FPC, side switch FPC, renovates FPC and all kinds of switching FPC etc.For example, for the slip FPC of needs enhancing shielding and good earth, design commonly used is to realize by adding independent screen or slip FPC being designed to bilayer.
Specifically, when realizing the earth shield of slip FPC, a kind of mode is by pasting independent screen, and the silver foil that for example conducts electricity is realized shielding; Another kind is made the conduction form with connector reinforcement place at slip FPC two ends exactly, by reinforcement place and up and down between the slip lid well ground connection reach good shield effectiveness, and so also need make double-deck good earth that could realize reinforcement place to FPC at the connector end at FPC two ends.
From the scheme of above prior art as can be known, realize the earth shield effect of FPC, need to increase independent screen or FPC is made as double-deck FPC, so not only increase the cost of manufacture of FPC, and the reliability of FPC is also had certain influence.
Summary of the invention
The embodiment of the invention provides a kind of single-layer flexible printed circuit and its implementation, can strengthen the earth shield effect of individual layer FPC, saves Production Time and cost simultaneously, and improves the reliability of FPC.
The embodiment of the invention provides a kind of implementation method of single-layer flexible printed circuit, and described method comprises:
On former single-layer flexible printed circuit FPC, extend and produce a conductive region;
Realize the earth shield of described former individual layer FPC by described conductive region ground connection.
The embodiment of the invention also provides a kind of implementation method of single-layer flexible printed circuit, and described method comprises:
When needs are made multi-layer FPC, on former individual layer FPC, extend each layer FPC that produces the needs making successively according to symmetrical manner;
Along symmetry axis double flat successively, each layer FPC after the bending is superimposed each layer FPC.
The embodiment of the invention also provides a kind of single-layer flexible printed circuit, comprises former single-layer flexible printed circuit FPC and conductive region, wherein:
Described conductive region extension is made on the described former FPC, and realizes the earth shield of described former individual layer FPC by described conductive region ground connection.
By the above-mentioned technical scheme that provides as can be seen, on former single-layer flexible printed circuit FPC, extend and produce a conductive region, and realize the earth shield of described former individual layer FPC by this conductive region ground connection, the screen that so just can avoid the switching of prior art multilayer to realize, and only need just can be grounded shielding, thereby strengthened the earth shield effect of individual layer FPC by conductive region with one deck; The technical scheme of fitting and designing compared to existing technology can also be saved corresponding material cost simultaneously; On making, can also reduce activity times such as boring, copper facing, single-sided lamination; And, do not have rubberizing or mechanical connection because present embodiment only need just can be grounded shielding on individual layer, so also can improve the Mechanical Reliability of FPC.
Description of drawings
Fig. 1 provides the schematic flow sheet of single-layer flexible printed circuit implementation method for the embodiment of the invention;
Fig. 2 is the project organization schematic diagram of instantiation that the present invention lifts;
Fig. 3 lifts the project organization schematic diagram after the doubling in the instantiation for the present invention;
The making schematic diagram that Fig. 4 enumerates for the embodiment of the invention when being applied to double-deck FPC.
Embodiment
The embodiment of the invention provides a kind of single-layer flexible printed circuit and its implementation, on former single-layer flexible printed circuit FPC, extend and produce a conductive region, and realize the earth shield of described former individual layer FPC by this conductive region ground connection, so just can strengthen the earth shield effect of individual layer FPC, save Production Time and cost simultaneously, and improve the reliability of FPC.
For better describing the embodiment of the invention, now in conjunction with the accompanying drawings specific embodiments of the invention are described, be illustrated in figure 1 as the schematic flow sheet that the embodiment of the invention provides the single-layer flexible printed circuit implementation method, described method comprises:
Step 11: on former single-layer flexible printed circuit FPC, extend and produce a conductive region.
In this step 11, can design a conductive region, then this conductive region increase is set on the former single-layer flexible printed circuit FPC, specifically can on former single-layer flexible printed circuit FPC, extend making.In the specific implementation process, this conductive region can adopt various electric conducting materials to make, for example copper, silver foil etc.
The length of this conductive region can be set according to user demand, just can meet the demands as long as extend a conductive region on the basis of former FPC.
Step 12: realize the earth shield of former individual layer FPC by this conductive region ground connection.
Specifically, on former FPC, extend after the conductive region, just can realize the earth shield of former individual layer FPC by the ground connection of this conductive region.
In the specific implementation process, can be with the direct ground connection of this conductive region; Or, realize the earth shield of former individual layer FPC again by the conductive region ground connection after the bending with extended conductive region bending.
Above-mentioned can be with extended conductive region double flat with extended conductive region bending, is close to the back side of this former individual layer FPC then, again with this conductive region ground connection.Whether this conductive region bends or is not close to the back side of former individual layer FPC, need decide according to applied environment and the operating position of former individual layer FPC.
In the specific implementation process, conductive region is close to the back side of former individual layer FPC, can be reinforcement place of this conductive region being close to former individual layer FPC connector end.
For instance, the example that is designed to slip FPC, be illustrated in figure 2 as the project organization schematic diagram of instantiation that the present invention lifts, among Fig. 2: extend on former slip FPC2 and design a dew copper zone 1, this dew copper zone 1 is exactly the conductive region described in the foregoing description; In this example, this extended dew copper zone 1 can double flat, is close to reinforcement place of former individual layer FPC2 connector end 3 after the doubling, as shown in Figure 3; Like this, after doubling, the connector end 3 of this FPC just can be realized the effect of similar double-deck FPC, make that the connector end 3 of this FPC can be fine and other partial earthings, strengthen the earth shield effect of individual layer FPC, saved Production Time and cost simultaneously, and improved the reliability of FPC.
The embodiment of the invention also provides the implementation method of another kind of single-layer flexible printed circuit, specifically:
When needs are made multi-layer FPC, can also on former individual layer FPC, extend each layer FPC that produces the needs making successively according to symmetrical manner; Then with each layer FPC along symmetry axis double flat successively, each layer FPC after the bending is superimposed.
In addition, when making multi-layer FPC, can also on this former individual layer FPC, extend a conductive region of producing again according to the mode of the foregoing description, and realize the earth shield of described multi-layer FPC by this conductive region ground connection.
For example, when the multi-layer FPC that is applied to other non-screens is made, the making schematic diagram that the embodiment of the invention is enumerated as shown in Figure 4 when being applied to double-deck FPC, among Fig. 4: former FPC comprises two-layer, promptly L1 among the figure and L2 are two-layer, if according to the scheme of prior art, need to make two-layer FPC, then stack; According to the described method of the embodiment of the invention, only need on former individual layer FPC, extend another layer FPC that produces the needs making successively according to symmetrical manner; Then from the centre along the symmetry axis double flat, the two-layer FPC after the bending is superimposed.Same, for other multi-layer FPC, also can realize by the mode of the foregoing description, multi-layer FPC is produced on the individual layer FPC according to symmetrical manner, then successively along the symmetry axis bending, thereby reduced time and cost that multi-layer FPC is made.
The embodiment of the invention also provides a kind of single-layer flexible printed circuit, specifically comprise former single-layer flexible printed circuit FPC and conductive region, wherein, described conductive region extension is made on the described former FPC, and realizes the earth shield of described former individual layer FPC by described conductive region ground connection.
In addition, when needs are made multi-layer FPC, on described former individual layer FPC, extend each layer FPC that produces the needs making successively according to symmetrical manner; Described each layer FPC is superimposed behind symmetry axis double flat successively, forms new multi-layer FPC.
The process of the above single-layer flexible printed circuit specific implementation can be referring to described in the said method embodiment.
In sum, the screen that the embodiment of the invention can avoid the switching of prior art multilayer to realize, and only need just can be grounded shielding by the conductive region with one deck, thereby strengthened the earth shield effect of individual layer FPC; The technical scheme of fitting and designing compared to existing technology can also be saved corresponding material cost simultaneously; On making, can also reduce activity times such as boring, copper facing, single-sided lamination; And, do not have rubberizing or mechanical connection because present embodiment only need just can be grounded shielding on individual layer, so also can improve the Mechanical Reliability of FPC.
The above; only be the preferable embodiment of the present invention; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the embodiment of the invention discloses; the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of claim.
Claims (9)
1. the implementation method of a single-layer flexible printed circuit is characterized in that, described method comprises:
On former single-layer flexible printed circuit FPC, extend and produce a conductive region;
Realize the earth shield of described former individual layer FPC by described conductive region ground connection.
2. the method for claim 1 is characterized in that, describedly realizes specifically comprising the earth shield of described former individual layer FPC by described conductive region ground connection:
Extended conductive region is bent, and realize the earth shield of described former individual layer FPC by the conductive region ground connection after the bending.
3. method as claimed in claim 2 is characterized in that, and is described with extended conductive region bending, specifically comprises:
With extended conductive region double flat, be close to the back side of described former individual layer FPC.
4. method as claimed in claim 3 is characterized in that, the described back side of being close to described former individual layer FPC specifically comprises:
Be close to reinforcement place of described former individual layer FPC connector end.
5. the method for claim 1 is characterized in that, the length of described conductive region is set according to user demand.
6. the implementation method of a single-layer flexible printed circuit is characterized in that, described method comprises:
When needs are made multi-layer FPC, on former individual layer FPC, extend each layer FPC that produces the needs making successively according to symmetrical manner;
Along symmetry axis double flat successively, each layer FPC after the bending is superimposed each layer FPC.
7. implementation method as claimed in claim 6 is characterized in that, also comprises on described former individual layer FPC:
Extend a conductive region of producing, realize the earth shield of described multi-layer FPC by described conductive region ground connection.
8. a single-layer flexible printed circuit is characterized in that, comprises former single-layer flexible printed circuit FPC and conductive region, wherein:
Described conductive region extension is made on the described former FPC, and realizes the earth shield of described former individual layer FPC by described conductive region ground connection.
9. single-layer flexible printed circuit as claimed in claim 8 is characterized in that, when needs are made multi-layer FPC,
On described former individual layer FPC, extend each layer FPC that produces the needs making successively according to symmetrical manner;
Described each layer FPC is superimposed behind symmetry axis double flat successively, forms new multi-layer FPC.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010138770 CN101795532A (en) | 2010-03-31 | 2010-03-31 | Single-layer flexible printed circuit and realization method thereof |
| PCT/CN2011/072111 WO2011120397A1 (en) | 2010-03-31 | 2011-03-24 | Monolayer flexible printed circuit board and method for realizing it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010138770 CN101795532A (en) | 2010-03-31 | 2010-03-31 | Single-layer flexible printed circuit and realization method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101795532A true CN101795532A (en) | 2010-08-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010138770 Pending CN101795532A (en) | 2010-03-31 | 2010-03-31 | Single-layer flexible printed circuit and realization method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101795532A (en) |
| WO (1) | WO2011120397A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011120397A1 (en) * | 2010-03-31 | 2011-10-06 | 华为终端有限公司 | Monolayer flexible printed circuit board and method for realizing it |
| CN109581074A (en) * | 2018-12-05 | 2019-04-05 | 上海龙旗科技股份有限公司 | The transmission path structure and its setting method of SAR SENSOR control unit |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5031027A (en) * | 1990-07-13 | 1991-07-09 | Motorola, Inc. | Shielded electrical circuit |
| EP0443717A2 (en) * | 1990-01-21 | 1991-08-28 | Sony Corporation | Component mounting circuit board |
| US5181065A (en) * | 1990-09-04 | 1993-01-19 | Nikon Corporation | Flexible printed board for use in cameras |
| CN1582085A (en) * | 2003-08-14 | 2005-02-16 | 友达光电股份有限公司 | Positioning reinforcement board, flexible circuit film with positioning reinforcement board and connector module thereof |
| JP2007036086A (en) * | 2005-07-29 | 2007-02-08 | Seiko Epson Corp | Semiconductor device and liquid crystal module |
| JP2007281145A (en) * | 2006-04-05 | 2007-10-25 | Kenwood Corp | Flexible wiring member |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4567281B2 (en) * | 2002-09-24 | 2010-10-20 | パナソニック株式会社 | Flexible circuit board with electromagnetic shield |
| CN101346047B (en) * | 2007-07-13 | 2010-06-02 | 富葵精密组件(深圳)有限公司 | Manufacturing method of multilayer circuit board and inner substrate for manufacturing multilayer circuit board |
| CN101795532A (en) * | 2010-03-31 | 2010-08-04 | 华为终端有限公司 | Single-layer flexible printed circuit and realization method thereof |
-
2010
- 2010-03-31 CN CN 201010138770 patent/CN101795532A/en active Pending
-
2011
- 2011-03-24 WO PCT/CN2011/072111 patent/WO2011120397A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0443717A2 (en) * | 1990-01-21 | 1991-08-28 | Sony Corporation | Component mounting circuit board |
| US5031027A (en) * | 1990-07-13 | 1991-07-09 | Motorola, Inc. | Shielded electrical circuit |
| US5181065A (en) * | 1990-09-04 | 1993-01-19 | Nikon Corporation | Flexible printed board for use in cameras |
| CN1582085A (en) * | 2003-08-14 | 2005-02-16 | 友达光电股份有限公司 | Positioning reinforcement board, flexible circuit film with positioning reinforcement board and connector module thereof |
| JP2007036086A (en) * | 2005-07-29 | 2007-02-08 | Seiko Epson Corp | Semiconductor device and liquid crystal module |
| JP2007281145A (en) * | 2006-04-05 | 2007-10-25 | Kenwood Corp | Flexible wiring member |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011120397A1 (en) * | 2010-03-31 | 2011-10-06 | 华为终端有限公司 | Monolayer flexible printed circuit board and method for realizing it |
| CN109581074A (en) * | 2018-12-05 | 2019-04-05 | 上海龙旗科技股份有限公司 | The transmission path structure and its setting method of SAR SENSOR control unit |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011120397A1 (en) | 2011-10-06 |
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Application publication date: 20100804 |