CN101793361B - LED light source with Fresnel lens - Google Patents
LED light source with Fresnel lens Download PDFInfo
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- CN101793361B CN101793361B CN2010101289595A CN201010128959A CN101793361B CN 101793361 B CN101793361 B CN 101793361B CN 2010101289595 A CN2010101289595 A CN 2010101289595A CN 201010128959 A CN201010128959 A CN 201010128959A CN 101793361 B CN101793361 B CN 101793361B
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- fresnel lenses
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Abstract
The invention relates to an LED light source, comprising a substrate, a mounting frame, a reflecting cup, an LED chip array, a supporting bracket and a Fresnel lens, and is characterized in that the substrate comprises one or two substrate conductive inserting pin passages passing through in the thickness direction of the substrate; a mounting frame location device is installed at the bottom of the mounting frame; the substrate is located by embedding the location device on the substrate conductive inserting pin passages; the reflecting cup is embedded on the mounting frame location device through the reflecting cup aiming device at the bottom of the reflecting cup so as to locate the mounting frame through the reflecting cup; the supporting bracket is on the mounting frame; the Fresnel lens is on the supporting bracket; and the efficiency of the switching power supply of the light source is more than 80%.
Description
Technical field
The present invention relates to a kind of light source with led of Fresnel Lenses.Relate in particular to a kind of light source with high power led.
This light source adopts the led chip array as light emitting source, has characteristics such as the light that the led light source is penetrated is soft, even, brightness is high, light decay is little.And the installation process of this led light source is simple, can increase substantially production efficiency, and has the range of application that improves the led light source, and characteristics such as increase the service life also have waterproof and dustproof, explosion-proof three anti-functions simultaneously.
Background technology
In recent years, energy problem has become the most important problem of restriction countries in the world economic development, and along with energy starved progressively aggravates, the contradiction of this problem institute derivation also grows in intensity.This problem has only by increasing two approach of source and throttling and solves, increase the source and promptly seek the new energy, such as luminous energy, nuclear energy, water energy or the like, throttling is exactly the consumption that reduces the present energy, for example automobile with small output volumn, energy saving building or the like, and the led light source is exactly this wonderful work wherein undoubtedly.Outmoded lightings such as the incandescent lamp of now used high energy consumption, low luminous efficiency, fluorescent lamp can't adapt to the new demand of current society to lighting.Therefore the led light source that has characteristics such as energy consumption is low, the life-span is long progressively is subjected to the favor in market, become the most popular current lighting apparatus, under the support of current national relevant policies, the main flow that the led light source will become on the market is selected, and in the unique selection of high-end market.
But the structure that the led light source is traditional, because exist that reflecting rate is low, radiating effect is general, cost cost height, light decay is higher, light is inhomogeneous, brightness is not high, profile is not attractive in appearance, be unfavorable for shortcoming such as installation, seriously restrict the development of led light source, particularly be applicable to the high speed development of the high power led light source of city illumination, plaza lighting, battlefield illumination.Particularly at luminous power at 10W, room lighting more than the 40W, even at 100W, the stage more than the 1000W, the encapsulating structure of outdoor high power led light source, this problem is particularly outstanding.
The structure that the led light source is traditional, adopt is installed on the led chip in the reflector more, and then reflector is installed on the positioner, again by this positioner is installed on the alignment device, and then this alignment device is installed on the heat abstractor, also to carry out inner circuit and connect, adopt the resin-encapsulated moulding then.Owing to need special positioner and alignment device, and carry out many loaded down with trivial details circuit and be connected, increased production process, increased production cost.
And, traditional led light-source structure adopts resin-encapsulated more, resin-shaped becomes transparent panel, convex lens, concavees lens etc., so that the light that the led chip is produced directly penetrates, perhaps converge or disperse, be able at part generation highlight illumination through the light that converges, and outwards send with the form of directional light usually, in the hope of reaching farther illumination distances through the light of dispersing.But but exist light excessive problem of light decay the time by potting resin, and by this resin converge the back and produce hot spot excessive, brightness is low excessively, and is dispersed shortcomings such as the light spot shape that forms is uncontrollable, hot spot is too small, brightness irregularities by this resin.
Problem at above all many-sides, I search data, the also scientific experiment of process several years through many-side, expend a large amount of financial resources, material resources, study the led encapsulating structure that successfully originally has characteristics such as the light that the led light source is penetrated is soft, even, brightness is high, light decay is little finally.And use this encapsulating structure to reach to simplify the installation process of led light source, and increasing substantially production efficiency, and have the range of application that improves the led light source, characteristics such as increase the service life also have waterproof and dustproof, explosion-proof three anti-functions simultaneously.
Summary of the invention
The present invention relates to a kind of led light source with Fresnel Lenses, comprise substrate, installing frame, reflector, the led chip array, bracing frame and Fresnel Lenses, it is characterized in that: substrate, wherein having one or two substrate conductive pin passage runs through on the substrate thickness direction, substrate conductive pin passage exposes about 0.5-10mm on basement top, and has conductive pin in substrate conductive pin channel interior, installing frame, the intermediate portion has opening and directly exposes the top surface of substrate, in this opening, be used to place reflector, and has the installing frame positioner in the bottom of installing frame, by this positioner being nested in the location of realizing on the substrate conductive pin passage to substrate, and installing frame is installed in the substrate, and this positioner can hold the part that substrate conductive pin passage exposes base top surface, reflector, it is nested on the installing frame positioner by the reflector alignment device on the reflector bottom, realize the location of reflector to installing frame, and reflector is installed on the installing frame, the led chip array is positioned at the bottom of reflector, installing frame inside has conductive path, bracing frame, it is positioned on the installing frame, Fresnel Lenses is positioned on the support frame as described above, and the top surface of Fresnel Lenses and bracing frame is at same horizontal plane, the bottom surface of Fresnel Lenses is about 5-10mm apart from the distance of led chip array, one end of the described conductive path in the installing frame positioner is used for being electrically connected with conductive pin, the other end be used for the reflector alignment device in an end of connecting path be electrically connected, the other end of connecting path is used for being connected with the led chip array, the other end of conductive pin is used for being connected with the Switching Power Supply of led light source, and the efficient of this Switching Power Supply is about more than 80%.
Connect by the bonding mode of bonding agent between described substrate and the installing frame, perhaps connect by the trip buckle structure that is used to connect between substrate and installing frame.Described bonding agent is between substrate conductive pin passage and installing frame positioner, and perhaps described trip buckle structure is between substrate conductive pin passage and installing frame positioner.Connect by the bonding mode of bonding agent between described reflector and the installing frame, perhaps connect by the trip buckle structure that is used to connect between reflector and installing frame.Described bonding agent is between reflector alignment device and installing frame positioner, and perhaps described trip buckle structure is between reflector alignment device and installing frame positioner.
Has the groove that is used to hold the bracing frame bottom surface on the described installing frame, also have in this groove and be used to hold the unnecessary depression that is used for bracing frame and installing frame are carried out bonding bonding agent, perhaps this groove also has and is used for the trip buckle structure that is connected with bracing frame, perhaps do not have depression and trip buckle structure, directly make groove and bracing frame carry out bonding by bonding agent.Have on the described installing frame and be used for the projection that contacts with the bracing frame bottom surface, also have on this projection and be used to hold the unnecessary depression that is used for bracing frame and installing frame are carried out bonding bonding agent, perhaps should projection also have and be used for the trip buckle structure that is connected with bracing frame, perhaps do not have depression and trip buckle structure, directly make protruding and bracing frame carry out bonding by bonding agent.
Support frame as described above and Fresnel Lenses form by identical materials is integrated, and the material of bracing frame and Fresnel Lenses one of is selected from respectively in the group that is made of pc material, epoxide resin material and glass.This Fresnel Lenses has square, rectangle, circle, rhombus, regular pentagon, orthohexagonal shape, makes the light through Fresnel Lenses have the shape of any needs.The light decay of the luminous flux of the light by this Fresnel Lenses is about 5%-7%.
Description of drawings
Accompanying drawing 1: the top view of Fresnel Lenses of the present invention.
Accompanying drawing 2: the side view of Fresnel Lenses of the present invention.
Accompanying drawing 3: the side view of underlying structure of the present invention.
Accompanying drawing 4: the side view of installing frame structure of the present invention.
Accompanying drawing 5: the top view of reflector structure of the present invention.
Accompanying drawing 6: the side view of led light source of the present invention.
1: Fresnel Lenses 2: bracing frame 3: substrate 4: substrate conductive pin passage 5: installing frame 6: installing frame positioner 7: reflector 8: reflector alignment device 9:Led chip array
The specific embodiment
Led light source of the present invention comprises substrate, installing frame, reflector, led chip array, bracing frame and Fresnel Lenses.
Accompanying drawing 3 is side views of underlying structure of the present invention.Substrate 3 comprises one or two substrate conductive pin passage 4, and this substrate conductive pin passage 4 runs through the thickness direction of this substrate 3, and exposes certain height from the upper surface of substrate 3, and this is 0.5-10mm highly, is preferably 1-5mm, more preferably 2-4mm.It can make two conductive pin (not shown) pass from substrate conductive pin passage 4, both can in same substrate conductive pin passage 4, pass, also can in two different substrate conductive pin passages 4, pass respectively, an end that passes two conductive pin of substrate conductive pin passage 4 from the end face of substrate 3 be respectively applied for installing frame 5 on two installing frame positioners 6 in the conductive path (not shown) be electrically connected.The number of conductive pin is two, and the two ends of two conductive pin exposing from the substrate conductive pin passage 4 of substrate 3 bottom surfaces are electrically connected with the positive and negative electrode of power supply respectively,
Substrate conductive pin passage 4 can be made multiple geometry shapes such as square, cylinder, triangular prism.This substrate 3 can by copper, aluminium, etc. metal constitute; also can by or the iron that is coated with the corrosion protection layer constitute; perhaps can adopt other any material to make, can play the effect of radiator, for example can make by special cermacis etc. with excellent heat conductivity performance.Various heat abstractors also can optionally be installed in the bottom surface of substrate 3, can fan, fin or water-cooling heat radiating device, the perhaps heat abstractor that exists in other the prior art, or the combination of above-mentioned heat abstractor be installed in its bottom surface.
Accompanying drawing 4 is side views of installing frame structure of the present invention.The mid portion of installing frame 5 has opening, directly exposes substrate 3, is used to place reflector 7 in this opening.Has installing frame positioner 6 in the bottom of installing frame 5, the number of this installing frame positioner 6 is identical with the number of substrate conductive pin passage 4, installing frame positioner 6 directly is nested on the substrate conductive pin passage 4, can hold the height that end face exposed of substrate conductive pin passage 4 from substrate 3, has the conductive path (not shown) in installing frame positioner 6 inside, be electrically connected in order to the conductive pin with substrate conductive pin passage 4 inside, promptly the installing frame positioner 6 on the installing frame 5 can be finished electrical connection when finishing location and installation.The other end of this conductive path is used for being electrically connected with the connecting path (not shown) of reflector alignment device 8 inside of reflector 7.
Wherein, location between installing frame 5 and the substrate 3 is located by the identification between installing frame positioner 6 and the substrate conductive pin passage 4 and is realized, by installing frame positioner 6 is nested on the substrate conductive pin passage 4, realize identification location between the two; Can apply bonding agent then between the two carries out bonding, realize the installation between installing frame 5 and the substrate 3, perhaps can between installing frame positioner 6 and substrate conductive pin passage 4, apply the trip buckle structure that connects and realize installation between installing frame 5 and the substrate 3.Perhaps trip buckle structure that also can other position applies bonding agent or connects between installing frame 5 and substrate 3 is realized the installation between installing frame 5 and the substrate 3.
Installing frame by can resistant to elevated temperatures pottery or resin make, it can even be 200 ℃ at least at 100 ℃ at least, preferably be under 300 ℃ the environment temperature at least, remain unchanged shape and have the good insulation performance performance can be made this installing frame with resistant to elevated temperatures materials such as epoxy resin, polyvinyl chloride, polypropylene, polyphenyl third ethene.Also can wait and make this installing frame by the metal that has insulating element.
Accompanying drawing 5: the top view of reflector structure of the present invention.The shape that is shaped as inverted section cone or inverted truncation polygonal pyramid body of this reflector 7, its bottom surface is little, end face is big.The bottom surface of reflector 7 directly contacts with the end face of the substrate that opening exposed 3 by installing frame 5, and this reflector is contained in this installing frame.The bottom of this reflector 7 has reflector alignment device 8, by this reflector alignment device 8 is nested on the installing frame positioner 6, realize the location and installation of reflector, has connecting path in the reflector alignment device 8, one end is electrically connected with conductive path in the installing frame positioner 6, and the other end is electrically connected with led chip array 9.
The cone of this reflector 7 has the angle of 30-60 degree, preferably has the angle of 45 degree.The material of this reflector 7 is the materials with high reflective, and its light reflectivity is more than 80%, or even more than 90%, or 95% above, preferably more than 98% or 100%.The thickness of this reflector 7 is between the 0.1mm-10mm, and preferably 0.2mm-5mm is more preferably 0.1mm-1mm.Reflector 7 also should have good thermal conductivity when having high reflector efficiency, the substrate 3 below the thermal energy conduction that led chip array 9 can be produced in luminescence process arrives.Therefore the material of reflector 7 can be aluminium sheet, the silver plate of high reflecting rate, or the surface is coated with the plate of high reflexed light film, such as various plates such as the metallic plate of silver coated, aluminium lamination, gold layer, plastic plate, resin plates.
This is directly exposed the end face of substrate 3, be used for directly contacting with the bottom surface of reflector 7, can be undertaken bonding by bonding agent, this bonding agent can be resistant to elevated temperatures insulation, heat conduction viscose glue (not shown), the heat that led chip array 9 in the reflector 7 is produced, pass to substrate 3 by the reflector bottom surface, again heat is delivered to the external world.This resistant to elevated temperatures insulation, heat conduction viscose glue can be epoxy resin, silver-colored slurry, heat conductive silica gel or ab glue, perhaps also can be other any glue with above-mentioned functions.
Wherein, location between installing frame 5 and the reflector 7 is located by the identification between installing frame positioner 6 and the reflector alignment device 8 and is realized, by reflector alignment device 8 is nested on the basic installing frame positioner 6, realize identification location between the two; Can apply bonding agent then between the two carries out bonding, realize the installation between installing frame 5 and the reflector 7, perhaps can realize installation between installing frame 5 and the reflector 7 applying the trip buckle structure that connects between installing frame positioner 6 and the reflector alignment device 8.Perhaps trip buckle structure that also can other position applies bonding agent or connects between installing frame 5 and reflector 7 is realized the installation between installing frame 5 and the reflector 7.
Led chip array 9 is installed on reflector 7 bottom surfaces, the quantity of the led chip that is comprised in this led chip array 9 can for 2,3,50,100 or hundreds of, several thousand, its number can be natural number arbitrarily.The power of this led chip array 9 can be more than the 10w, more than the 20w, more than the 40w, more than the 80w, more than the 100w, more than the 200w, more than the 500w or the high power of 1000w.This led chip can by have heat conduction, insulation, at high temperature indeformable viscose glue directly directly is bonded in led chip array 9 on the reflector bottom surface 31, for example epoxy resin, silver-colored slurry, heat conductive silica gel, heat conductive silica gel or ab glue perhaps also can be other any glue with above-mentioned functions.Also can install by installation trip and buckle on led chip and reflector bottom surface 31.Led lead 33 is welded on the conductive pin, adopt and directly do not contact soldered object, and the method that directly heat energy is provided on Led lead 33 and the conductive pin is finished welding, can be by the method for contactless welding such as supersonic welding, Reflow Soldering, avoided in the traditional welding the damage of internal fine device, also avoided gathering of electric charge and make the led chip puncture damage.
Accompanying drawing the 1, the 2nd, the structure chart of Fresnel Lenses of the present invention.Fresnel Lenses 1 and bracing frame 2 thereof are placed on the installing frame 5, this Fresnel Lenses is made up of one or more Fresnel Lenses, below Fei Nier lens 1, has a bracing frame 2, the size of bracing frame 2 formed frameworks, just in time can put into this Fresnel Lenses 1, the upper surface of the upper surface of Fresnel Lenses 1 and bracing frame 2 is positioned at same horizontal plane, the lower surface of the lower surface of Fresnel Lenses 1 and bracing frame 2 has certain distance, regulates the feasible focal length that equals Fresnel Lenses 1 from the lower surface of Fresnel Lenses 1 to the distance of led chip array 9 of this distance.
Can be formed with on the installing frame 5 and bracing frame 2 corresponding grooves, the bottom surface that is used to hold bracing frame 2.Can also can also have a depression in certain in the outside of this groove, when bracing frame 2 is connected with the groove of installing frame 5 by the bonding mode of bonding agent, unnecessary bonding agent can flow in this depression and go, and avoids unnecessary bonding agent to cause led light source and external pollution; Can also in groove, have the trip buckle structure that is connected usefulness with bracing frame 2; Can also in groove, directly be undertaken bonding by bonding agent and bracing frame 2.
Can be formed with on the installing frame 5 and bracing frame 2 corresponding projectioies, be used for being connected with bracing frame 2.Can also can also have a depression in certain in the outside of this projection, when bracing frame 2 is connected with the projection of installing frame 5 by the bonding mode of bonding agent, unnecessary bonding agent can flow in this depression and go, and avoids unnecessary bonding agent to cause led light source and external pollution; Can also on projection, have the trip buckle structure that is connected usefulness with bracing frame 2; Can also on projection, directly be undertaken bonding by bonding agent and bracing frame 2.
Can certainly in the trip buckle structure, use a spot of bonding agent, to strengthen the compactness of combination.Certainly installing frame 5 also can not have any trip buckle structure that is connected with bracing frame 2 and groove, depression, projection of being used for, and directly bracing frame 2 and installing frame 5 is linked together by bonding agent.Depression perhaps only being set on installing frame 5 being used for installing frame 5 and being connected, and holding unnecessary bonding agent by depression with bracing frame 2 usefulness bonding agents.This groove and projection also can be positioned on this reflector 7 or the inside of this reflector 7, also can be positioned at installing frame 5 and go out other place beyond the installing frame positioner 6.
Bonding agent used herein can be any bonding agent, and heat cured bonding agent, the bonding agent of light solidity etc. may be used to that this is bonding.This bonding agent can be epoxy resin or pc material.
Regulate this distance and make the focal length that equals Fresnel Lenses 1 from the lower surface of Fresnel Lenses 1 to the distance of led chip array 9, can reach best this moment and converge or disperse effect.This effective depth is the distance of the lower surface of Fresnel Lenses apart from the led chip.When adopting the bonding mode of direct adhesive, this effective depth may be the same with the actual height of bracing frame 2; This effective depth may be less than the actual height of bracing frame 2 when adopting the mode of groove, depression; This effective depth may be greater than the actual height of bracing frame 2 when adopting projection.In order to satisfy some specific needs, this effective depth also can be not equal to the focal length of Fresnel Lenses, can be more bigger or smaller than this focal length.
The material of bracing frame 2 can be resin material arbitrarily, for example PC material, epoxide resin material, the also material that can play a supporting role arbitrarily for glass, metal etc.The material of this bracing frame 2 can be consistent with the material of Fresnel Lenses, and integrated formation, can save Fresnel Lenses like this and be fixed on this operation on the bracing frame 2, carries having changed production efficiency, having improved airtight performance.
The shape of bracing frame 2 can be consistent with the shape of Fresnel Lenses, also can be inconsistent, and only need this bracing frame 2 Fresnel Lenses can be supported on the led chip, and the height that needing to keep both can.This bracing frame 2 can be square, circle, rectangle, triangle, pentagon, rhombus, regular polygon, the perhaps arbitrary shape of non-regular polygon.
Fresnel Lenses 1 is made up of one or more Fresnel Lenses.The shape of Fresnel Lenses can form square, circle, rectangle, triangle, pentagon, rhombus, regular polygon, perhaps the arbitrary shape of non-regular polygon; The shape of the Fresnel Lenses of being made up of a plurality of Fresnel Lenses can be square, circle, rectangle, triangle, pentagon, rhombus, regular polygon, the perhaps arbitrary shape of non-regular polygon, also can make any regular or irregular flat shape or three-dimensional shape.Can be by selection to Fresnel Lenses 1 shape, limit the illumination zone of the final light of led light source, make it remain on shape any regular or irregular, it can be square, circle, rectangle, triangle, pentagon, rhombus, regular polygon, the perhaps arbitrary shape of non-regular polygon, can make through Fresnel Lenses 1 light have the shape of any needs.
The material of Fresnel Lenses is the pc material, or other has the material of good light permeability arbitrarily, also can be glass, epoxy resin, if do not consider cost, also can adopt sapphire, ruby etc.Fresnel Lenses has only the thickness of 1-20mm usually, and preferably the thickness of 3-10mm is more preferably the thickness about 5mm.
Has the position relation that is positioned at same plane or same sphere between a plurality of Fresnel Lenses that had in the Fresnel Lenses 1.The optical surface of Fresnel Lenses toward the outer side, i.e. the side that penetrates of light, the opposite side of Fresnel Lenses enters to allow light towards led chip array 9, and finishes in Fresnel Lenses inside and to converge or disperse.And the vertical range between the led chip array 9 corresponding with it of the bottom surface of Fresnel Lenses equals the focal length of this Fresnel Lenses, certainly for some specific needs, also can be slightly less than or be slightly larger than the focal length of this corresponding Fresnel Lenses.
When the lighting apparatus with this Fresnel encapsulating structure is used for street lamp, city illumination or plaza lighting, when its light source throws light on downwards from the distance of the distance of the distance of distance ground 10-200m, 20-100m or 35-40m, the scope of illumination can be controlled in the zone that needs illumination, the scope on square for example, road surface scope between two street lamps, or even form specific literal, pattern, can take into account propaganda and illumination purposes simultaneously.
Adopted the lighting apparatus of this Fresnel encapsulating structure, its brightness of illumination can be under the situation with constant power, and more traditional encapsulation can improve 15%-25%, and the light decay of luminous flux is reduced to 5%-7% by traditional 20%-30%.Unit illumination can improve 2-9 doubly, and mean flow rate can improve 15%-25%.In this case, the territory lighting brightness of street lamp can be brought up to more than 40 luxs by the 25-30 lux.
Connection between installing frame 5 and the reflector 7, connection between installing frame positioner 6 and the reflector alignment device 8, connection between substrate 3 and the installing frame 5, connection between substrate conductive pin passage 4 and the installing frame positioner 6, connection between bracing frame 2 and the installing frame 5, or the connection between Fresnel Lenses 1 and the bracing frame 2, can connect by the trip buckle structure, also can be by recessed, male structure connects, can also by any have symmetrical, complementary shape connects, the heat radiation oil that can also have excellent heat dispersion performance by increase, the material of heat-conducting silicone grease and so on increases thermal diffusivity, can also increase both connection stability by the viscose glue that increase has viscosity.
The power supply that conductive pin connected be power-efficient in the Switching Power Supply more than 80%, be preferably the Switching Power Supply more than 95%.The kind of power supply is preferably constant-current source, but not only be confined to the crossing current source, any power supply of electric energy that can provide may be used to be connected with conductive pin, for example constant pressure source, civil power, high-tension electricity can provide the device of electric power and circuit and in the future variously can all can provide the device and the circuit of electric power through now all various of the power supply of transformation, battery, device of solar generating, wind power generation plant or the like.
Embodiments of the invention have been described above.But the present invention is not limited to the foregoing description, and the various changes that those skilled in the art are carried out in the scope of technical solution of the present invention are all within protection scope of the present invention.
Claims (10)
1. the led light source with Fresnel Lenses comprises substrate, installing frame, reflector, led chip array, bracing frame and Fresnel Lenses, it is characterized in that:
Substrate wherein has one or two substrate conductive pin passage and runs through on the substrate thickness direction, and substrate conductive pin passage exposes 0.5-10mm on basement top, and has conductive pin in substrate conductive pin channel interior,
Installing frame, the intermediate portion has opening and directly exposes the top surface of substrate, in this opening, be used to place reflector, and has the installing frame positioner in the bottom of installing frame, by this positioner being nested in the location of realizing on the substrate conductive pin passage to substrate, and installing frame is installed in the substrate, and this positioner can hold the part that substrate conductive pin passage exposes base top surface
Reflector, it is nested on the installing frame positioner by the reflector alignment device on the reflector bottom, realizes the location of reflector to installing frame, and reflector is installed on the installing frame, the led chip array is positioned at the bottom of reflector, and installing frame inside has conductive path
Bracing frame, it is positioned on the installing frame, and Fresnel Lenses is positioned on the support frame as described above, and the top surface of Fresnel Lenses and bracing frame is at same horizontal plane, and the bottom surface of Fresnel Lenses is 5-10mm apart from the distance of led chip array,
One end of the described conductive path in the installing frame positioner is used for being electrically connected with conductive pin, the other end be used for the reflector alignment device in an end of connecting path be electrically connected, the other end of connecting path is used for being connected with the led chip array, the other end of conductive pin is used for being connected with the Switching Power Supply of led light source, and the efficient of this Switching Power Supply is more than 80%.
2. led light source according to claim 1 is characterized in that: connect by the bonding mode of bonding agent between described substrate and the installing frame, perhaps connect by the trip buckle structure that is used to connect between substrate and installing frame.
3. led light source according to claim 2 is characterized in that: described bonding agent is between substrate conductive pin passage and installing frame positioner, and perhaps described trip buckle structure is between substrate conductive pin passage and installing frame positioner.
4. led light source according to claim 1 is characterized in that: connect by the bonding mode of bonding agent between described reflector and the installing frame, perhaps connect by the trip buckle structure that is used to connect between reflector and installing frame.
5. led light source according to claim 4 is characterized in that: described bonding agent is between reflector alignment device and installing frame positioner, and perhaps described trip buckle structure structure is between reflector alignment device and installing frame positioner.
6. led light source according to claim 1, it is characterized in that: have the groove that is used to hold the bracing frame bottom surface on the described installing frame, also have in this groove and be used to hold the unnecessary depression that is used for bracing frame and installing frame are carried out bonding bonding agent, perhaps this groove also has and is used for the trip buckle structure that is connected with bracing frame, perhaps do not have depression and trip buckle structure, directly make groove and bracing frame carry out bonding by bonding agent.
7. led light source according to claim 1, it is characterized in that: have on the described installing frame and be used for the projection that contacts with the bracing frame bottom surface, also have on this projection and be used to hold the unnecessary depression that is used for bracing frame and installing frame are carried out bonding bonding agent, perhaps should projection also have and be used for the trip buckle structure that is connected with bracing frame, perhaps do not have depression and trip buckle structure, directly make protruding and bracing frame carry out bonding by bonding agent.
8. led light source according to claim 1, it is characterized in that: support frame as described above and Fresnel Lenses form by identical materials is integrated, and the material of bracing frame and Fresnel Lenses one of is selected from respectively in the group that is made of pc material, epoxide resin material and glass.
9. led light source according to claim 1 is characterized in that: this Fresnel Lenses has square, rectangle, circle, rhombus, regular pentagon, orthohexagonal shape, makes the light through Fresnel Lenses have the shape of any needs.
10. led light source according to claim 1 is characterized in that: the light decay of the luminous flux of the light by this Fresnel Lenses is 5%-7%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101289595A CN101793361B (en) | 2010-03-22 | 2010-03-22 | LED light source with Fresnel lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101289595A CN101793361B (en) | 2010-03-22 | 2010-03-22 | LED light source with Fresnel lens |
Publications (2)
| Publication Number | Publication Date |
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| CN101793361A CN101793361A (en) | 2010-08-04 |
| CN101793361B true CN101793361B (en) | 2011-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010101289595A Expired - Fee Related CN101793361B (en) | 2010-03-22 | 2010-03-22 | LED light source with Fresnel lens |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104676470A (en) * | 2013-11-29 | 2015-06-03 | 深圳市海洋王照明工程有限公司 | Lens and LED (light emitting diode) lamp with lens |
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| CN101793361A (en) | 2010-08-04 |
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