CN101784165B - Treatment method of corrosion-resistant weldable coating layer of printed circuit board - Google Patents
Treatment method of corrosion-resistant weldable coating layer of printed circuit board Download PDFInfo
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- CN101784165B CN101784165B CN201010127804.XA CN201010127804A CN101784165B CN 101784165 B CN101784165 B CN 101784165B CN 201010127804 A CN201010127804 A CN 201010127804A CN 101784165 B CN101784165 B CN 101784165B
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Abstract
The invention discloses a treatment method of a corrosion-resistant weldable coating layer of a printed circuit board, which comprises the following steps: carrying chemical tin plating treatment on the surface of a bare Cu foil of the printed circuit board PCB; and carrying out heat treatment on the PCB after the chemical tin plating treatment, wherein the temperature of the heat treatment is higher than or equal to 232 DEG C and is lower than or equal to 245 DEG C. Through the treatment method provided by the invention, the severe environment etching resistance capability and the weldability of PCB components are improved, in addition, the weldability can be maintained and can be protected from being influenced by operation environment in the warehouse storage and shop assembling process, the manufacture is simple and convenient, the acceptance rate of PCBA welding points is improved, the rosin joint is inhabited, and the reliability of the welding points is improved.
Description
Technical field
The present invention relates to semiconductor and electronics field, relate in particular to a kind for the treatment of method of corrosion-resistant weldable coating layer of printed circuit board.
Background technology
In electronic product pcb board protection used and solderability coating process (ENIG Ni/Au, Im-Sn, Im-Ag and OSP); chemical plating Sn (being called for short Im-Sn) technique more and more comes into one's own in leadless electronic assembling, for example, at the European Im-Sn first-selected coating process with pcb board as leadless electronic product.
Sn atom skin is 4 electronics, and therefore its chemical property is very stable, so it often keeps the glittering gloss of silver.But; plating Sn layer is spininess permeability; because the existence of pin hole makes to have produced passage between matrix Cu surface and air; oxygen in atmosphere is by this pin hole passage and underlying metal Cu Surface Contact; make underlying metal Cu oxidation and lose solderability; and because the standard electrode potential of Sn is more negative than Cu, when damp vapour just forms a micro cell during by the pin hole in plating Sn layer and underlying metal Cu Surface Contact, coated metal Sn is corroded and loses the protection to bottom Cu.So although the solderability of the new plate of existing this coating is good, after storage a period of time, the erosiveness of its solderability and resistance to environment declines fast, backend application manufacturability is poor.
Summary of the invention
The invention provides a kind for the treatment of method of corrosion-resistant weldable coating layer of printed circuit board, in order to solve in prior art, due to tin coating, to be that the copper facing pcb board that causes of spininess permeability coating erosiveness of solderability and resistance to environment after storage a period of time declines fast, the problem that backend application manufacturability is poor.
Concrete, a kind for the treatment of method of corrosion-resistant weldable coating layer of printed circuit board provided by the invention, comprising: on the naked Cu paper tinsel of printing board PCB surface, carry out chemical plating stannum processing, it is characterized in that, also comprise:
To chemical plating stannum, PCB after treatment heat-treats, and described heat treated temperature is 232 DEG C～245 DEG C.
Method provided by the invention further has following characteristics:
In the method for the invention, heat treatment time scope is 30s～60s.
The method of the invention connects stove by reflow welding carries out continuous flowing type to the PCB of chemical plating stannum and crosses furnace treatment reason process, and it is 232 DEG C～245 DEG C that described reflow welding connects Lu Zailiu district peak temperature.
Wherein, the PCB of described chemical plating stannum is positioned on the conveyer belt that described reflow welding connects stove and meets Lu Zailiu district through described reflow welding and carry out continuous flowing type and cross furnace treatment reason.
It should be noted that, in the time that the present invention adopts heat treatment time scope to be 30s～60s, the transfer rate that described reflow welding connects stove conveyer belt is to guarantee in a certain value that time of PCB product Zai Liu district experience is 30s～60s.
In the method for the invention, described tin coating thickness is 1～1.5 micron.
Method provided by the present invention is also carried out Vacuum Package processing to described PCB after chemical plating stannum PCB after treatment is heat-treated.
Compared with prior art, the present invention has following beneficial effect:
Treatment method of corrosion-resistant weldable coating layer provided by the invention, the PCB of chemical plating stannum is heat-treated, because heat treated temperature has exceeded the fusing point of tin, so there is remelting in tin coating in heat treatment process, making former Im-Sn surface texture is thick crystalloid by amorphous upgrading, and ageing resistance strengthens; And after remelting, it is fine and close that former Im-Sn surface microstructure becomes, and pin hole is sealed entirely, thereby has effectively protected underlying metal Cu not oxidized, and solderability improves a lot; Moreover, between Im-Sn layer after remelting and underlying metal Cu, under the effect of temperature, there is metallurgical reaction, generated the thin intermetallic compound (Cu6Sn5) of one deck, this intermetallic compound has strengthened the adhesion between plating Sn layer and underlying metal Cu.So, method provided by the invention has improved anti-adverse environment erosiveness and the solderability of PCB matrix, and have and in stock and shop assembled process, keep solderability not affected by operating environment, manufacture easy new PCB process for surface coating method, improve greatly the acceptance rate of PCBA solder joint, suppress rosin joint, improve the reliability of solder joint.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is a kind for the treatment of method of corrosion-resistant weldable coating layer of printed circuit board flow chart provided by the invention;
A kind for the treatment of method of corrosion-resistant weldable coating layer of printed circuit board flow chart that Fig. 2 provides for the embodiment of the present invention;
Fig. 3 is the Im-Sn coating surface before heat treatment and after heat treatment in the present invention, amplifies micro-comparison diagram of organizing of 200 times;
Fig. 4 is the Im-Sn coating cross sectional slice before heat treatment and after heat treatment in the present invention, amplifies the metallographic micro-structural comparison diagram of 250 times;
Fig. 5 is Im-Sn coating cross sectional slice electron-microscope scanning micro-structural comparison diagram before heat treatment and after heat treatment in the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
In order to have solved, in prior art, PCB face coat is after storage a period of time, and under severe environmental conditions, poor corrosion resistance, the bad problem of solderability, the invention provides a kind for the treatment of method of corrosion-resistant weldable coating layer of printed circuit board.By the method PCB after treatment, there is anti-adverse environment erosiveness, extend the workshop life-span, keep the advantage of solderability and reduction weld defect (as false, cold welding).
Concrete, treatment method of corrosion-resistant weldable coating layer of printed circuit board provided by the invention, as shown in Figure 1, comprises the following steps:
Step S101, on the naked Cu paper tinsel of printing board PCB surface, carry out chemical plating stannum processing.
In this step, on the naked Cu paper tinsel of pcb board surface, carry out chemical plating Sn process, can adopt the general technological process of current each PCB producer, this flow process is for passing through successively following handling procedure: the naked Cu paper tinsel of pcb board is carried out acid deoiling processing, microetch processing, preplating processing, soaks Sn processing, hot water cleaning and neutralisation treatment.
Step S102, chemical plating stannum PCB after treatment is heat-treated, this heat treated temperature range is less than or equal to 245 DEG C for being more than or equal to 232 DEG C.
The time range of wherein, PCB being heat-treated is preferably 30s～60s.
And heat treatment process preferably connects stove realization by reflow welding in this step, certainly, this mode is preferably mode of one, and the mode that can heat-treat PCB for other is all in protection scope of the present invention.
As illustrating, example the specific implementation process of method provided by the invention as shown in Figure 2, comprises the following steps to connect stove by reflow welding below:
Step S201, on the naked Cu paper tinsel of pcb board surface, carry out chemical plating Sn processing, its thickness is preferably 1～1.5 μ m.
Step S202, connection reflow welding connect stove power supply and carry out stove intensification.
Step S203, adjusting furnace temperature curve, requiring Zai Liu district peak temperature is between 232 DEG C～245 DEG C.
Step S204, adjusting reflow furnace line speed, in a certain value that the time of guaranteeing PCB product Zai Liu district experience is 30s～60s.
Step S205, the pcb board of chemical plating Sn is placed on the conveyer belt that rear class reflow welding connects furnace apparatus, connects stove by reflow welding and the pcb board of chemical plating Sn is carried out to continuous flowing type cross furnace treatment reason.
In this step, if the pcb board of chemical plating Sn is multiple, its mode being placed on conveyer belt can be according to the requirement of production capacity, and one adjacent one can be also that interblock leaves gap, can grasp flexibly as required.
Step S206, by the PCB product connecing through reflow welding after furnace treatment reason, pack processing by the general technology of the package that vacuumizes at present.
Compared with method provided by the invention is only carried out chemical plating Sn with existing PCB, there is following advantage:
One, easy and simple to handle, only need be at the end of current existing pcb board chemical plating Sn production line, increase a reflow welding and connect stove, carry out flow-type heat treatment step one time;
Two, original improvement of manufacturing line cost is low, and reflow welding connects stove can adopt 5 inexpensive in the market warm area reflow furnaces;
Three, improved structure of plating layer: because heat-treatment temperature range has exceeded the fusing point (232 DEG C) of Sn, remelting has occurred plating Sn layer in heat treatment process.Making former Im-Sn surface texture is thick crystalloid by amorphous upgrading, thereby ageing resistance strengthens;
Four, improved the solderability of coating: because former Im-Sn coating is more loose, pin hole is many, easily causes underlying metal Cu to be oxidized.After remelting, it is fine and close that structure becomes, and pin hole is sealed entirely, thereby has effectively protected underlying metal Cu not oxidized, and solderability improves a lot;
Five, former Im-Sn coating is that atom is combined with parent metal Cu surface, and between Im-Sn layer and underlying metal Cu, under the effect of temperature, there is metallurgical reaction after remelting, generated the thin intermetallic compound (Cu6Sn5) of one deck, this intermetallic compound has strengthened the adhesion between plating Sn layer and underlying metal Cu.
The technique effect bringing in order more clearly to explain the present invention, illustrates that below by Fig. 3 to Fig. 5 the concrete pattern of the pcb board of heat-treating and the situation of not heat-treating compare, and then the beneficial effect that the present invention brings is described.
As shown in Figure 3, for the coating surface of Im-Sn coating before heat treatment and after heat treatment, amplify micro-tissue of 200 times.Wherein, Fig. 3 (a) is without heat treated Im-Sn coating surface outward appearance, can be seen that coating is loose and is lead by this figure; And the Im-Sn coating surface outward appearance light after heat treatment shown in Fig. 3 (b) is fine and closely woven, surface texture is thick crystalloid by amorphous upgrading.
As shown in Figure 4, be Im-Sn coating coating section before heat treatment and after heat treatment, the micro-structural after amplifying 250 times.Fig. 4 (a) is without heat treated Im-Sn coating cross sectional slice micro-structural, can see that by this figure coating is loose, spininess hole; And the coating densification in heat treated Im-Sn coating cross sectional slice micro-structural shown in Fig. 4 (b), gap, pin hole disappear, thin thickness and continuously.
As shown in Figure 5, be Im-Sn coating micro-structural of coating cross sectional slice electron-microscope scanning (SEM) before heat treatment and after heat treatment.Fig. 5 (a) is without heat treated Im-Sn coating cross sectional slice electron-microscope scanning (SEM), by this figure can see coating coarse grains, granular size inequality, loose, brilliant gap is many; And shown in Fig. 5 (b) through the grain refinement of heat treated Im-Sn coating cross sectional slice electron-microscope scanning (SEM) coating, uniform particles densification, thickness of coating is evenly continuous.
Multinomial reliability test through various adverse circumstances proves, the printing board PCB that adopts " printing board PCB corrosion-resistant weldable coating layer treatment process " of the present invention to produce, erosiveness and the solderability of opposing adverse circumstances, compared with prior art Im-Sn and ENIG Ni/Au, Im-Ag, OSP etc., all show very significantly advantage: can effectively suppress rosin joint, cold welding, improve quality of welding spot, promote electronic product functional reliability; Reduce the requirement to assembling environment in PCB storage and assembling process, extend the workshop life-span; Reduce production cost and the use cost of electronic product.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention the present invention.Like this, if these amendments of the present invention and within modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these changes and modification interior.
Claims (5)
1. a treatment method of corrosion-resistant weldable coating layer of printed circuit board, comprising: on the naked Cu paper tinsel of printing board PCB surface, carry out chemical plating stannum processing, it is characterized in that, described tin coating thickness is 1～1.5 micron, and described method also comprises:
To chemical plating stannum, PCB after treatment heat-treats, and described heat treated temperature is 232 DEG C～245 DEG C, and described heat treatment time scope is 30s～60s.
2. treatment method of corrosion-resistant weldable coating layer of printed circuit board as claimed in claim 1, it is characterized in that, connect stove by reflow welding and the PCB of chemical plating stannum is carried out to continuous flowing type cross furnace treatment reason, it is 232 DEG C～245 DEG C that described reflow welding connects Lu Zailiu district peak temperature.
3. treatment method of corrosion-resistant weldable coating layer of printed circuit board as claimed in claim 2, it is characterized in that, the PCB of described chemical plating stannum is positioned on the conveyer belt that described reflow welding connects stove and meets Lu Zailiu district through described reflow welding and carry out continuous flowing type and cross furnace treatment reason.
4. treatment method of corrosion-resistant weldable coating layer of printed circuit board as claimed in claim 2, it is characterized in that, the PCB of described chemical plating stannum is positioned on the conveyer belt that described reflow welding connects stove and meets Lu Zailiu district through described reflow welding and carry out continuous flowing type and cross furnace treatment reason, wherein, to connect the transfer rate of stove conveyer belt be to guarantee in a certain value that time of PCB product Zai Liu district experience is 30s～60s to reflow welding.
5. the treatment method of corrosion-resistant weldable coating layer of printed circuit board as described in claim 1 to 4 any one, is characterized in that, also comprises: the PCB after heat treatment is carried out to Vacuum Package processing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010127804.XA CN101784165B (en) | 2010-03-19 | 2010-03-19 | Treatment method of corrosion-resistant weldable coating layer of printed circuit board |
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| CN201010127804.XA CN101784165B (en) | 2010-03-19 | 2010-03-19 | Treatment method of corrosion-resistant weldable coating layer of printed circuit board |
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| CN101784165B true CN101784165B (en) | 2014-11-05 |
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| CN102065633A (en) * | 2011-01-05 | 2011-05-18 | 倪新军 | Microwave high-frequency ultralong circuit board |
| CN103052270A (en) * | 2012-12-10 | 2013-04-17 | 四川海英电子科技有限公司 | Method for plating copper and tin on metal circuit board through pattern plating |
| CN103345539B (en) * | 2013-05-28 | 2016-04-27 | 中国电子科技集团公司第十研究所 | The method to set up of reflow welding loading curve parameter |
| CN108601231A (en) * | 2018-04-09 | 2018-09-28 | 常州海弘电子有限公司 | A kind of production technology and test method of printed wiring board |
| CN113487092B (en) * | 2021-07-08 | 2022-12-27 | 吉安满坤科技股份有限公司 | Production management system of MiniLED high dynamic printed circuit board |
| CN115961284A (en) * | 2022-08-05 | 2023-04-14 | 深圳市博士达焊锡制品有限公司 | Bonding pad plating layer structure and preparation method |
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