CN101783362B - Upper cover structure, packaging structure of light-emitting element, and packaging method of light-emitting element - Google Patents

Abstract

A package structure of a light emitting device includes a device substrate, at least one light emitting device, and a cover structure. The upper cover structure comprises an upper cover substrate, a blocking dam body, frame glue and sealing glue. The blocking dam is disposed in the peripheral region of the upper cover substrate and faces the device substrate, wherein the blocking dam substantially surrounds the active region. The frame glue is arranged in the peripheral area of the upper cover substrate and faces the element substrate, wherein the frame glue substantially surrounds the blocking dam body, and the upper cover substrate is jointed with the element substrate through the frame glue. The sealant is substantially located in the active region of the upper cover substrate under the blocking of the blocking dam, and the sealant covers at least part of the light emitting element.

Description

Upper cover structure, packaging structure of light-emitting element, and packaging method of light-emitting element

technical field

The present invention relates to an upper cover structure, a packaging structure of a light-emitting element, and a packaging method for a light-emitting element, in particular to a packaging structure and a packaging method for a light-emitting element with a blocking dam that can avoid sealing glue overflow and can be used as a spacer .

Background technique

In recent years, electroluminescent display panels, such as organic light emitting diode display panels, have been gradually and widely used in various flat display products due to their advantages such as self-illumination, wide viewing angle, fast response time and high luminous efficiency.

Since moisture and oxygen will affect the luminous efficiency and lifespan of the electroluminescent elements of the electroluminescent display panel, such as organic light-emitting diode elements, how to ensure the airtightness of the packaging structure of the light-emitting elements to avoid the intrusion of water vapor and oxygen to the light-emitting elements It has adverse effects and becomes an important issue in the development of electroluminescent display panels.

Contents of the invention

One of the objectives of the present invention is to provide an upper cover structure, a packaging structure of a light-emitting element, and a packaging method of a light-emitting element, so as to increase the airtightness and packaging strength of the packaging structure of the light-emitting element.

A preferred embodiment of the present invention provides an upper cover structure for sealing an element substrate provided with at least one light emitting element. The upper cover structure includes a upper cover substrate, a blocking dam, a sealant and an encapsulation glue. An active area is defined on the upper cover substrate, and a peripheral area surrounds the active area. The blocking dam is disposed in the peripheral area of the upper cover substrate, wherein the blocking dam has a height, and the blocking dam substantially surrounds the active area. The frame glue is disposed in the peripheral area of the upper cover substrate, wherein the frame glue has a height, the height of the frame glue is greater than the height of the barrier dam, and the frame glue generally surrounds the barrier dam. The encapsulant is blocked by the blocking dam and substantially located in the active area of the upper cover substrate.

Another preferred embodiment of the present invention provides a packaging structure of a light-emitting element, which includes an element substrate, at least one light-emitting element, and an upper cover structure. An active area is defined on the component substrate, and a peripheral area surrounds the active area. The light emitting element is arranged in the active area of the element substrate. The upper cover structure includes a upper cover base plate, a blocking dam body, a frame glue and a sealing glue. An active area is defined on the upper cover substrate, and a peripheral area surrounds the active area, wherein the active area of the upper cover substrate corresponds to the active area of the device substrate, and the peripheral area of the upper cover substrate corresponds to the peripheral area of the device substrate. The blocking dam is disposed in the peripheral area of the upper cover substrate and faces the element substrate, wherein the blocking dam substantially surrounds the active area. The sealant is disposed in the peripheral area of the upper cover substrate and faces the component substrate, wherein the sealant substantially surrounds the barrier dam, and the upper cover substrate and the component substrate are bonded by the sealant. The encapsulant is blocked by the blocking dam and substantially located in the active area of the upper cover substrate, and the encapsulant covers at least part of the light-emitting element.

Another preferred embodiment of the present invention provides a method for packaging a light-emitting element, including the following steps. An upper cover substrate is provided, wherein an active area is defined on the upper cover substrate, and a peripheral area surrounds the active area. A blocking dam is formed in the peripheral area of the upper cover substrate, wherein the blocking dam has a first height, and the blocking dam substantially surrounds the active area. A first hardening process is performed on the blocking dam body to harden the blocking dam body, and the blocking dam body has a second height after hardening. A frame glue is formed in the peripheral area of the upper cover substrate, wherein the frame glue substantially surrounds the blocking dam body, the frame glue has a third height, and the third height is greater than the second height. A sealant is injected into the active area of the upper cover substrate, wherein the sealant is substantially located in the active area of the upper cover substrate by being blocked by the blocking dam. An element substrate is provided, wherein an active area is defined on the element substrate, and a peripheral area surrounds the active area, and at least one light-emitting element is arranged in the active area of the element substrate. Make the active area and the peripheral area of the component substrate roughly correspond to the active area and the peripheral area of the upper cover substrate respectively, and perform a lamination process on the component substrate and the upper cover substrate, and make the sealant on the upper cover substrate and the component The substrate is in contact. A second hardening process is performed on the frame glue to harden the frame glue, so that the upper cover substrate and the element substrate are bonded through the frame glue.

The present invention utilizes the hardened barrier dam to limit the sealant of the light-emitting element in the space formed by the barrier dam, so that the barrier dam will not be squeezed during the lamination process of the element substrate and the upper cover substrate. Pressed and collapsed to make the sealant overflow. In this way, the encapsulant can effectively cover the light-emitting element to prevent moisture and oxygen from affecting the light-emitting efficiency and life of the light-emitting element. In addition, in the lamination process, the barrier dam can also function as a spacer to maintain a fixed gap between the element substrate and the upper cover substrate.

Description of drawings

1 to 9 are schematic diagrams illustrating a packaging method of a light emitting element according to a preferred embodiment of the present invention.

The reference numerals in the above-mentioned accompanying drawings are explained as follows:

10 upper cover substrate 10A active area

10P peripheral area 12 blocking dam body

14 frame glue 16 buffer space

18 sealant 20 element substrate

20P peripheral area 20A active area

22 light-emitting elements h1 first height

h2 second height h3 third height

Detailed ways

In order to enable those skilled in the art of the present invention to further understand the present invention, the preferred embodiments of the present invention are enumerated below, together with the accompanying drawings, to describe in detail the composition and intended effects of the present invention.

Please refer to Figure 1 to Figure 9. Fig. 1 to Fig. 9 are schematic diagrams showing a packaging method of a light-emitting element according to a preferred embodiment of the present invention, wherein in order to highlight the features of the present invention, Fig. 1, Fig. 4 and Fig. 6 are schematic appearance diagrams, and Fig. 2. Fig. 3, Fig. 5, Fig. 7 to Fig. 9 are shown in the form of cross-sectional schematic diagrams. As shown in FIG. 1 and FIG. 2 , firstly, a cover substrate 10 is provided. The upper cover substrate 10 is used to seal an element substrate provided with at least one light-emitting device, wherein at least one active region 10A is defined on the upper cover substrate 10 , and at least one peripheral region 10P surrounds the active region 10A. In this embodiment, the upper cover substrate 10 can be a light-transmitting substrate, such as a glass substrate, a plastic substrate or other various forms of light-transmitting substrates, but not limited thereto. Next, a blocking dam 12 is formed in the peripheral region 10P of the upper cover substrate 10 , wherein the blocking dam 12 substantially surrounds the active region 10A. In this embodiment, the barrier dam 12 preferably has a closed pattern, and the barrier dam 12 has a first height h1, wherein the first height h1 is generally between 6 microns and 20 microns, but not greater than This is the limit. In addition, the blocking dam 12 can be, for example, a light-sensitive material that can be hardened by a light process, or a heat-sensitive material that can be hardened by a heat process, or other types of hardenable materials.

As shown in FIG. 3 , a first hardening process is performed on the blocking dam body 12 to harden the blocking dam body 12 (shown by arrows in the figure), but not limited thereto. As mentioned above, if the blocking dam body 12 is made of photosensitive material, the first hardening process can be a light-emitting process, which utilizes, for example, ultraviolet light or light in other wavelength ranges to harden the blocking dam body 12; if the blocking dam body 12 If heat-sensitive materials are selected, the first hardening process can be a thermal process, which heats the blocking dam body 12 to an appropriate temperature to harden the blocking dam body 12 . Depending on the materials used for the barrier dam body 12 , the first hardening process can also be other various hardening processes and is not limited to the illumination process or thermal process. In this embodiment, the shrinkage rate of the height of the blocking dam body 12 after hardening is about 4%, so the second height h2 after hardening is slightly smaller than the first height h1 before hardening. For example, in this embodiment, the second height h2 is generally between 5 microns and 20 microns, but not limited thereto.

As shown in FIG. 4 and FIG. 5 , a sealant 14 is subsequently formed in the peripheral area 10P of the upper cover substrate 10 , wherein the sealant 14 substantially surrounds the barrier dam 12 , and the sealant 14 has a third height h3 , and the third height h3 is greater than the second height h2 of the blocking dam body 12 after hardening. In this embodiment, the third height h3 of the sealant 14 is generally between 10 microns and 25 microns, but not limited thereto, and the sealant 14 preferably has a closed pattern, but it is not limited thereto. limit. In addition, a buffer space 16 is formed between the blocking dam body 12 and the sealant 14 to accommodate possible overflow of the sealant (not shown).

As shown in FIGS. 6 and 7 , encapsulation glue 18 is then injected into the active region 10P of the upper cover substrate 10 to form the upper cover structure of this embodiment. Since the blocking dams 12 have a closed pattern, the encapsulant 18 is blocked by the blocking dams 12 and substantially located in the active region 10P of the upper cover substrate 10 through the arrangement of the blocking dams 12 .

As shown in FIG. 8 , an element substrate 20 is provided, wherein at least one active region 20A is defined on the element substrate 20 , and at least one peripheral region 20P surrounds the active region 20A. The element substrate 20 further includes at least one light emitting element 22 disposed in the active region 20A, and other necessary elements such as switching elements (not shown). In this embodiment, the element substrate 20 can be an element substrate of an electroluminescent display panel, so the light emitting element 22 can include a plurality of electroluminescent elements, such as organic light emitting diode elements, polymer light emitting diode elements, or other types. of light-emitting elements.

As shown in FIG. 9 , the active region 20A and the peripheral region 20P of the element substrate 20 are roughly corresponding to the active region 10A and the peripheral region 10P of the upper cover substrate 10 respectively, and a process is carried out on the element substrate 20 and the upper cover substrate 10. The pressing process is to make the sealant 14 on the upper cover substrate 10 contact with the peripheral area 20P of the element substrate 20 . In the pressing process, the frame glue 14 will be squeezed by the element substrate 20 so that the frame glue 14 is in close contact with the element substrate 20, and the hardened blocking dam body 12 has the function of a spacer (spacer), so the frame glue After 14 is squeezed, the frame rubber 14 and the blocking dam body 12 will generally have the same height, that is, the height of the frame rubber 14 will be reduced from the third height h3 to the second height h2. In addition, during the lamination process, the sealant 18 located in the space formed by the barrier dam 12 will partially or completely cover the light-emitting element 22 of the element substrate 20 , so as to achieve the effect of isolating moisture and oxygen. It is worth noting that since the blocking dam body 12 has sufficient hardness after hardening, the blocking dam body 12 will not collapse due to being pressed by the element substrate 20 during the lamination process, and will not cause a large amount of sealant 18 overflow, so that the encapsulant 18 can effectively cover the light-emitting element 22 . In addition, if the injection amount of the sealant 18 is too much due to process variation or other factors, the sealant 18 located in the space formed by the barrier dam 12 may have a small amount of overflow during the pressing process. 12 and the sealant 14 , and between the upper cover substrate 10 and the component substrate 20 jointly form a buffer space 16 , so a small amount of overflowing sealant 18 will flow into the buffer space 16 . Subsequently, a second hardening process is performed on the frame glue 14 to harden the frame glue 14 (as shown by the arrow in the figure), so that the upper cover substrate 10 and the component substrate 20 are tightly bonded through the frame glue 14 to form the present embodiment. The package structure of the light-emitting element of the example. In this embodiment, the material of the frame glue 14 can be a light-sensitive adhesive material, which can be hardened by a light-emitting process and exert adhesiveness, or a heat-sensitive adhesive material, which can be hardened by a heat process and exert adhesiveness. , but not limited to this. Therefore, if the frame glue 14 is made of a light-sensitive adhesive material, the second hardening process can be a lighting process, which can use, for example, ultraviolet light or light in other wavelength ranges to harden the frame glue 14 and exert adhesiveness; if the frame glue 14 If the thermal induction adhesive material is selected, the second hardening process can be a thermal process, which can heat the frame glue 14 to an appropriate temperature to harden the frame glue 14 and exert adhesiveness, but not limited thereto.

In summary, the present invention utilizes the hardened barrier dam to limit the sealant of the light-emitting element in the space formed by the barrier dam, so that the barrier dam can It will not cause the sealant to overflow due to being squeezed and collapsed. In this way, the encapsulant can effectively cover the light-emitting element to prevent moisture and oxygen from affecting the light-emitting efficiency and life of the light-emitting element. In addition, the barrier dam also functions as a spacer in the lamination process, which can maintain a fixed gap between the component substrate and the upper cover substrate.

The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the claims of the present invention shall fall within the scope of the present invention.

Claims (15)

1. A packaging structure for a light-emitting element, comprising: an element substrate, an active area is defined on the element substrate, and a peripheral area surrounds the active area; at least one light emitting element disposed in the active region of the element substrate; and A superstructure, including: An upper cover substrate, an active area is defined on the upper cover substrate, and a peripheral area surrounds the active area, wherein the active area of the upper cover substrate corresponds to the active area of the element substrate, and the upper cover The peripheral area of the substrate corresponds to the peripheral area of the element substrate; a blocking dam disposed in the peripheral region of the upper cover substrate and facing the element substrate, wherein the blocking dam substantially surrounds the active region; a sealant, disposed in the peripheral region of the upper cover substrate and facing the element substrate, wherein the sealant substantially surrounds the barrier dam, and the upper cover substrate and the element substrate are bonded through the sealant; as well as Sealant, the sealant is blocked by the blocking dam and is substantially located in the active area of the upper cover substrate, and the sealant covers at least part of the light emitting element. 2. The package structure of light-emitting devices as claimed in claim 1, wherein the barrier dam has a closed pattern. 3. The package structure of light-emitting devices as claimed in claim 1, wherein the sealant has a closed pattern. 4 . The packaging structure of light-emitting elements as claimed in claim 1 , further comprising a buffer space located between the upper cover substrate and the element substrate between the barrier dam and the sealant. 5. The package structure of light-emitting elements as claimed in claim 1, wherein the barrier dam has the same height as the sealant. 6 . The package structure of the light-emitting device as claimed in claim 1 , wherein the height of the barrier dam and the sealant is between 5 microns and 20 microns. 7. The packaging structure of a light emitting device as claimed in claim 1, wherein the light emitting device comprises an electroluminescent device. 8. A packaging method for a light-emitting element, comprising: providing an upper cover substrate, wherein an active area is defined on the upper cover substrate, and a peripheral area surrounds the active area; forming a barrier dam in the peripheral region of the upper cover substrate, wherein the barrier dam has a first height, and the barrier dam substantially surrounds the active region; performing a first hardening process on the blocking dam body to harden the blocking dam body, and the blocking dam body has a second height after hardening; A sealant is formed in the peripheral area of the upper cover substrate, wherein the sealant substantially surrounds the barrier dam, the sealant has a third height, and the third height is greater than the second height; and injecting a sealant into the active area of the upper cover substrate, wherein the sealant is substantially located in the active area of the upper cover substrate by being blocked by the blocking dam; An element substrate is provided, wherein an active area is defined on the element substrate, and a peripheral area surrounds the active area, and at least one light-emitting element is disposed in the active area of the element substrate; making the active area and the peripheral area of the element substrate substantially correspond to the active area and the peripheral area of the upper cover substrate respectively, performing a lamination process on the element substrate and the upper cover substrate, and making the The sealant on the upper cover substrate is in contact with the element substrate; and A second hardening process is performed on the frame glue to harden the frame glue, so that the upper cover substrate and the element substrate are bonded through the frame glue. 9. The packaging method of a light-emitting element according to claim 8, wherein after the pressing process, the sealant is pressed by the component substrate so that the sealant has the same second height as the barrier dam . 10. The packaging method of a light-emitting element according to claim 8, wherein after the bonding process, a buffer space is formed between the barrier dam and the sealant between the upper cover substrate and the element substrate for The sealant overflowing from the active area of the upper cover substrate is accommodated. 11. The packaging method of a light-emitting device as claimed in claim 8, wherein the first hardening process comprises a lighting process or a thermal process. 12. The packaging method of a light-emitting device as claimed in claim 8, wherein the second hardening process comprises a lighting process or a thermal process. 13. The packaging method of a light-emitting element as claimed in claim 8, wherein the first height is between 6 microns and 20 microns. 14. The packaging method of a light-emitting element as claimed in claim 8, wherein the second height is between 5 microns and 20 microns. 15. The packaging method of a light-emitting device as claimed in claim 8, wherein the third height is between 10 microns and 25 microns.

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