CN101777508B - Defective circuit chip sorting system and method thereof - Google Patents

Abstract

The invention relates to a defective circuit chip picking system and a method thereof. The expansion ring platform comprises a bearing seat and a platform surface adjacent to the bearing seat, the bearing seat is used for bearing the patch wafer, and the platform surface is used for arranging a storage box. The pick-and-place device moves between the bearing seat and the surface of the platform in a linear movement mode.

Description

Defective circuit chip sorting system and method thereof

technical field

The present invention relates to a system and method for picking out defective circuit chips, in particular to a pick-and-place mechanism for defective circuit chips that uses a linear pick-and-place mechanism to perform pick-and-place procedures on an integrated platform provided with wafer carriers and storage boxes. system and its method.

Background technique

In the chip packaging process, if the automated optical inspection (Automated Optical Inspection; AOI) equipment is used between the wafer dicing process and the chip sorting process to check the defective or contaminated circuit chips caused between the wafer cutting and the sorting process , and then use the classification program to select these circuit chips, which can effectively improve the yield rate of the packaging process.

Generally, the AOI equipment in the prior art includes a circuit chip inspection platform and a storage box (Bin) placement platform. The chip is placed on the chip inspection platform for inspection, and the defective circuit chips found after inspection are picked up by the swing arm mechanism from the chip inspection platform to the storage box on the storage box placement platform.

However, in the prior art AOI equipment, the chip pick-and-place platform and the storage box placement platform each have an independent drive system, and the two drive systems need to be controlled simultaneously, which is complex in control and prone to action delays. Moreover, a larger space is required to accommodate the two movable platforms. In addition, using the swing arm mechanism to pick and place the chip, in addition to requiring a large space for movement, is another major disadvantage of slow speed. In addition to the above-mentioned shortcomings, marking the detected defective circuit chips on the wafer test chart is still performed manually. This method is not only inefficient, but also easily leads to errors.

At present, the conventional AOI equipment does not have the function of automatic feeding and unloading, and the pick-and-place of the circuit chips cannot arrange the circuit chips in order, so it is still inconvenient to use.

In summary, due to the large space occupied by the existing AOI equipment, complex control, low equipment stability, no automatic feeding and discharging functions, and the inability to arrange neatly picked and placed circuit chips, etc., it is still necessary to manually update the wafer test chart. The location of defective circuit chips, so the related technologies of AOI equipment still need to be further improved.

Contents of the invention

The object of the present invention is to provide a system and method for picking out defective circuit chips in an integrated platform provided with wafer carriers and storage boxes for pick-and-place procedures.

A defective circuit chip sorting system according to an embodiment of the present invention includes an expansion ring platform and a pick-and-place device. The expansion ring platform includes a bearing seat and a platform surface adjacent to the bearing seat, the bearing seat is used to carry the patch wafer, and the platform surface is used for setting a storage box. The pick-and-place device moves linearly between the bearing seat and the platform surface.

The method for sorting out defective circuit chips according to another embodiment of the present invention includes the following steps: first, obtain a defect inspection map from a patch wafer, wherein the patch wafer is placed on a bearing seat on an expansion ring platform, and the expansion ring platform A platform surface adjacent to the bearing seat is included. Then, according to the defect inspection chart, the pick-and-place device that moves linearly picks out the defective circuit chips on the patch wafer to the storage box arranged on the surface of the platform.

Description of drawings

FIG. 1 shows a three-dimensional schematic view of a defective circuit chip sorting system according to a specific embodiment of the present invention;

FIG. 2 shows a schematic perspective view of a bearing seat according to a specific embodiment of the present invention;

FIG. 3 shows a schematic perspective view of an optical sensing device and its moving and adjusting mechanism according to a specific embodiment of the present invention;

Fig. 4 shows a perspective view of a pick-and-place device and its movement and adjustment mechanism according to a specific embodiment of the present invention;

Fig. 5 shows a schematic perspective view of a pick-and-place device and a thimble mechanism according to a specific embodiment of the present invention;

Fig. 6 shows the three-dimensional schematic view of the feeding and discharging mechanism of a specific embodiment of the present invention;

Fig. 7 shows the system control block diagram of a specific embodiment of the present invention; And

FIG. 8 shows a schematic diagram of the moving range of the pick-and-place device according to a specific embodiment of the present invention.

Detailed ways

FIG. 1 shows a schematic perspective view of a system 100 for sorting out defective chips according to an embodiment of the present invention. The defective circuit chip sorting system 100 includes a second linear moving device 102, an expansion ring platform 104 arranged on the second linear moving device 102, and a first linear moving device 106 arranged in an area above the expansion ring platform 104 , an optical sensing device 108 connected to the first linear moving device 106, a pick-and-place device 110 connected to the first linear moving device 106, a thimble mechanism 111, a feeding device 113, a discharging device 115, The swing arm mechanism 117 and the control device (not shown) used for controlling the defective circuit chip sorting system 100 . The expansion ring platform 104 is movable in a first direction by the second linear moving device 102 . The expansion ring platform 104 includes a carrier 112 for carrying the chip die 109 and a platform surface 114 adjacent to the carrier 112 , and the platform surface 114 is used for placing at least one storage box 116 . Since the storage box 116 is placed adjacent to the bearing seat 112, the pick-and-place circuit chip journey from the patch wafer 109 to the storage box 116 is shortened, so the speed of picking and placing the small circuit chip by the defective circuit chip picking system 100 can be improved, and The bearing seat 112 and the storage box 116 are moved by the second linear moving device 102. Compared with the prior art, it can greatly reduce the space required by the defective circuit chip sorting system 100, simplify the control required by the system and improve the system stability. . The bonded wafer 109 refers to a combination of a diced wafer, an adhesive film for wafer attachment, a wafer ring, and the like.

The first linear moving device 106 drives the optical sensing device 108 and the pick-and-place device 110 to move in a second direction, wherein the second direction may be perpendicular to the above-mentioned first direction. In this embodiment, the first linear moving device 106 includes sliding tables 118 , 120 and a linear motor 122 . The optical sensing device 108 and the pick-and-place device 110 are respectively arranged on slide tables 118 , 120 driven by a linear motor 122 , and the linear motor 122 is supported by a bracket 124 and located above the expansion ring platform 104 .

The defective circuit chip sorting system 100 disclosed in the present invention has an automatic feeding and discharging function, which can not only increase the speed of feeding and discharging, but also speed up the alignment time required for the patch chip 109 . The patch wafers 109 are placed on the feeding device 113 in a stacked manner, and the swing arm mechanism 117 sequentially places the patch wafers 109 on the bearing seats 112 on the expansion platform 104 . After the inspection and sorting steps are completed, the swing arm mechanism 117 takes out the SMT wafer 109 placed on the carrier 112 and places it on the discharging device 115 .

FIG. 2 shows a three-dimensional schematic diagram of a bearing seat 112 according to a specific embodiment of the present invention. Referring to FIG. 1 and FIG. 2 , the outer edge of the chip chip 109 is surrounded by a chip ring 126 . The movable clamping part 204 utilizes the pneumatic cylinder 206 to move the clamping part 208 on the movable clamping part 204 to break away from or close to the wafer ring 126 based on the principle of leverage. The expansion ring platform 104 may include a cornering device (not shown), which is used to compensate the angular error of the chip placed on the carrier 112 .

FIG. 3 shows a schematic perspective view of the optical sensing device 108 and its moving and adjusting mechanism according to a specific embodiment of the present invention. Referring to Fig. 1 and Fig. 3, the optical sensing device 108 is placed beside the linear motor 122 and clamped on the sliding seat 302, and a sliding table 306 for slightly moving the sliding seat 302 in the vertical direction is provided beside the sliding seat 302 The fine-tuning mechanism 304. The sliding seat 302 is fixed on one end of the L-shaped structure 308 , and the other end of the L-shaped structure 308 is fixed on the sliding table 118 driven by the linear motor 122 . Between the sliding table 118 and the L-shaped structure 308 on it, there may be a combination of a sliding seat 310 and a fine-tuning mechanism 312 for fine-tuning in the above-mentioned first direction, so that the optical sensing device 108 can be fine-tuned in the first direction . The optical sensing device 108 retrieves images for surface defect inspection, compensating for positional and angular errors of the bonded wafer 109 and providing calculation of die positions, which may include image retrieval sensors of CCD type or CMOS type.

FIG. 4 shows a schematic perspective view of a pick-and-place device 110 and its moving and adjusting mechanism according to a specific embodiment of the present invention. The pick-and-place device 110 is located beside the linear motor 122 and is fixed on the slide table 120 with a bracket 402 . The optical sensing device 108 and the pick-and-place device 110 are driven by the same linear motor 122, which can save space and improve control stability, and a software-controlled anti-collision safety distance can be set between them.

FIG. 5 shows a perspective view of a pick-and-place device 110 and a ejector mechanism 111 according to a specific embodiment of the present invention. Referring to FIG. 1 and FIG. 5 , the thimble mechanism 111 partially disengages the circuit chip located on the adhesive film by pushing up the thimble (not shown), so as to facilitate the removal of the pick-and-place device 110 , which is located under the bearing seat 112 . The upward action of the thimble (not shown) includes actuation by a stepping motor (not shown). The pick-and-place device 110 includes a suction nozzle 502 and a solenoid valve 504 that moves the suction nozzle 502 up and down, and controls the positive and negative pressure of the suction nozzle 502 and the up-and-down position of the suction nozzle 502 to complete the pick-and-place action of the circuit chip. Referring again to FIG. 1 , due to the short travel between the patch wafer 109 and the storage box 116, and the use of a faster linear motor 122 to drive the pick-and-place device 110, the defective circuit chip sorting system 100 disclosed by the present invention has a high Yield advantages.

Fig. 6 shows a schematic perspective view of a feeding and discharging mechanism according to a specific embodiment of the present invention. Referring to FIG. 1 and FIG. 6, the feeding device 113 and the discharging device 115 can accommodate a plurality of stacked SMT wafers 109, so that continuous inspection can be performed to increase inspection throughput. The swing arm mechanism 117 sequentially places the patch wafer 109 on the carrier 112, and the feeding device 113 utilizes the lifting mechanism 602 such as the discharge device 115 to make the plurality of suction cups 604 on the swing arm mechanism 117 contact each stacked SMT wafer 109. The swing arm mechanism 117 comprises a swing arm 606, a moving device 610 arranged at one end of the swing arm 606, a suction cup device 608 arranged on the moving device 610, and a rotating device arranged at the other end of the swing arm 606 for rotation. Device 612. The suction cup 604 moves between the feeding device 113 and the discharging device 115 through the moving device 610 .

FIG. 7 shows a system control block diagram of a specific embodiment of the present invention. The defective circuit chip sorting system 100 also includes a computing device 702, which is used to control the first linear moving device 704, the second linear moving device 706, the optical sensing device 708, the pick-and-place device 710, the thimble mechanism 712, and the feeding device 714, discharge device 716 and swing arm mechanism 718 etc., make it coordinate operation. The aforementioned mechanisms or devices controlled by the computing device 702 may also each have a driver. The computing device 702 receives the wafer test pattern transmitted from the testing machine, and automatically combines the wafer test pattern with the defect inspection pattern after generating the defect inspection pattern. Thereafter, an updated wafer test pattern is provided for use in die sorting.

FIG. 8 shows a schematic diagram of the moving range 802 of the pick-and-place device 110 according to an embodiment of the present invention. In this embodiment, the first linear moving device 106 moves the pick-and-place device 110 in a linear way, so that it can quickly pick and place the circuit die. The pick-and-place device 110 moves within a moving range 802, and the moving range 802 covers the bearing seat 112, the platform surface 114 and the area between the two. In one embodiment, the moving range 802 may be long A rectangular area measuring 200mm and 150mm wide. The defective circuit chip sorting system 100 may include a cycle time, and the cycle time refers to that the defect circuit chip is picked up by the pick-and-place device 110 from the patch wafer on the carrier 112 to the pick-and-place device 110 picking up the aforementioned defective circuit chip. After being placed in the storage box 116, the time until the next defective die is moved to. In this embodiment, the cycle time required for the pick-and-place device 110 to move within the moving range 802 is less than 0.35 seconds.

The invention provides a method for sorting out defective circuit chips. The method firstly uses a swing arm mechanism to move a patch chip from a feeding device to a bearing seat. Secondly, the patch wafer is positioned and turned upright. After the patch chip is placed on the carrier, the error of the position and angle of the small circuit chip is measured by an optical sensing device. The corner device rotates the chip to compensate for the angle error, and the position error is provided for compensation during pick-and-place. Then, a scan is performed to obtain a defect inspection map. Afterwards, the computing device calculates the position coordinates of each circuit chip according to the defect inspection map, drives the pick-and-place device according to the position coordinates of each circuit chip, and detects and selects the defective circuit chip. Since the adhesive film used for chip placement is an elastic and soft film, it will be deformed after repeated lifting actions, which will lead to the deviation of the position of the circuit chip. Therefore, it is necessary to correct the position of the circuit chip between the actions of repeatedly picking up the circuit chip. In this embodiment, the small circuit chips of the SMT chip can be divided into several groups, and a reference point is set for each group. After each group is sorted out, the displacement of the reference point of the next group is measured with an optical sensing device. This corrects the die position coordinates within the group. Since the chip pick-and-place is well known to those skilled in the art, its detailed steps will not be described in detail here. Then, the computing device updates the wafer test map with the defect inspection map, and calculates the yield rate for the chip sorting process. Finally, the swing arm device moves the inspected patch wafer to the discharge device.

The system disclosed in this invention can be applied to any wafer fabrication, however the application of light emitting diodes is preferred. Utilizing the system and method disclosed in the present invention, in addition to rejecting the defective circuit chips on the wafer, it can also pick up and place the circuit chips into the system according to the bin codes (Bin Codes) generated after the testing of each circuit chip in the different storage bins set up.

The technical content and technical features of the present invention have been disclosed above, but those skilled in the art may still make various replacements and modifications based on the teaching and disclosure of the present invention without departing from the spirit of the present invention. Therefore, the protection scope of the present invention should not be limited to the contents disclosed in the embodiments, but should include various replacements and modifications that do not depart from the present invention, and are covered by the appended claims.

Claims (20)

1. A system for picking out small defective circuits, which is used to pick up the small chips on the SMT chip into a storage box, is characterized in that the system for picking out small defective circuits includes: The expansion ring platform includes a bearing seat and a platform surface adjacent to the bearing seat, the bearing seat is used to carry the patch wafer, and the platform surface is used for setting the storage box; a second linear moving device for moving the expansion ring platform, wherein the carrier is moved together with the storage box by the second linear moving device; and A pick-and-place device moves linearly between the bearing seat and the platform surface. 2. The defective circuit chip sorting system according to claim 1, characterized in that it further comprises a first linear movement device, which is arranged on the upper area of the expansion ring platform, for providing linear movement of the pick-and-place device . 3. The defective circuit chip sorting system according to claim 2, wherein the first linear moving device comprises two slide tables and a linear motor, the linear motor drives the slide table to move, and the The pick-and-place device is connected to one of the slides. 4. The defective die sorting system according to claim 3, further comprising an optical sensing device for providing a defect inspection map, which is connected to the other one of the slide tables. 5. The defective circuit die sorting system according to claim 4, further comprising a computing device for updating the chip test pattern of the patch wafer with the defect inspection pattern. 6. The defective circuit die sorting system according to claim 4, wherein the optical sensing device comprises an image retrieval sensor, and the image retrieval sensor is a CCD type or a CMOS type. 7. The defective circuit die sorting system according to claim 2, wherein the moving directions of the first linear moving device and the second linear moving device are perpendicular to each other. 8 . The system for sorting out defective circuit chips according to claim 1 , further comprising a ejector mechanism disposed under the bearing base, which makes the circuit chips partly detach from the adhesive film attached thereto. 9 . 9. The defective circuit die sorting system according to claim 1, further comprising: The feeding device is used to accommodate the chip wafers that are about to be inspected; an outfeed device for accommodating inspected patch wafers; and A swing arm mechanism, which includes a swing arm, a moving device and a suction cup device, wherein the suction cup device is arranged on the moving device, so that the suction cup device moves between the feeding device and the discharging device, And the swing arm moves the suction cup device between the bearing seat and the feeding device and the discharging device. 10 . The defective circuit die sorting system according to claim 9 , wherein the feeding device and the discharging device comprise a lifting mechanism for stacking the dies. 11 . 11. The defective circuit die sorting system according to claim 1, wherein the bearing seat further comprises at least one fixed clamp and a movable clamp, the fixed clamp and the movable clamp The holder is used to hold the patch wafer. 12. The defective circuit die sorting system according to claim 1, further comprising a cycle time and a range of movement, the range of movement comprising the carrier, the platform surface, and the carrier and the The area between platform surfaces wherein said cycle time required for said pick and place device to move within said range of motion is less than 0.35 seconds. 13. A method for picking out defective circuit chips, characterized in that it comprises the following steps: Obtaining a defect inspection map from a patch wafer, wherein the patch wafer is placed on a carrier seat on an expansion ring platform, and the expansion ring platform includes a platform surface adjacent to the carrier seat; Picking out the defective circuit chips on the patch wafer to a storage box arranged on the surface of the platform with a linearly moving pick-and-place device according to the defect inspection map; and The bearing seat and the storage box are simultaneously moved by a second linear movement device for moving the expansion ring platform. 14. The method as claimed in claim 13, further comprising a step of updating a wafer test pattern in the bonded wafer with the defect inspection map. 15. The method of claim 13, further comprising the steps of: measuring the angular error of the bonded wafer; and The angle error is corrected. 16. The method according to claim 13, wherein the step of sorting out the defective circuit dies on the patch wafer further comprises a step of calculating the coordinate positions of each circuit chip on the patch wafer. 17. The method of claim 13, further comprising the steps of: Measuring the reference point coordinates of each die group on the patch wafer; and Using the coordinates of the reference point, the coordinates of each die in each die group are updated. 18. The method as claimed in claim 13, wherein the step of obtaining the defect inspection map comprises scanning the bonded wafer with an optical sensing device. 19. The method according to claim 18, wherein the optical sensing device comprises an image retrieval sensor, and the image retrieval sensor is a charge coupled device type or a complementary metal oxide semiconductor type. 20. The method of claim 13, further comprising the steps of: moving the chip stacks to be inspected in the feeding device to the carrier in sequence; and The inspected patch wafers are sequentially stacked on the discharge device.

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