CN101767253A - Solder for lead wire of cold-cathode fluorescent lamp, lead wire of cold-cathode fluorescent lamp and connection thereof - Google Patents
Solder for lead wire of cold-cathode fluorescent lamp, lead wire of cold-cathode fluorescent lamp and connection thereof Download PDFInfo
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- CN101767253A CN101767253A CN200910265525A CN200910265525A CN101767253A CN 101767253 A CN101767253 A CN 101767253A CN 200910265525 A CN200910265525 A CN 200910265525A CN 200910265525 A CN200910265525 A CN 200910265525A CN 101767253 A CN101767253 A CN 101767253A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 23
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 19
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 17
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 17
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052718 tin Inorganic materials 0.000 claims abstract description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052698 phosphorus Inorganic materials 0.000 claims description 13
- 239000011574 phosphorus Substances 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000000452 restraining effect Effects 0.000 abstract 1
- 239000011135 tin Substances 0.000 description 11
- 230000004927 fusion Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229960004643 cupric oxide Drugs 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 206010027439 Metal poisoning Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/46—Leading-in conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/04—Electrodes; Screens; Shields
- H01J61/06—Main electrodes
- H01J61/067—Main electrodes for low-pressure discharge lamps
- H01J61/0672—Main electrodes for low-pressure discharge lamps characterised by the construction of the electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/04—Electrodes; Screens; Shields
- H01J61/06—Main electrodes
- H01J61/067—Main electrodes for low-pressure discharge lamps
- H01J61/0675—Main electrodes for low-pressure discharge lamps characterised by the material of the electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/04—Electrodes; Screens; Shields
- H01J61/06—Main electrodes
- H01J61/09—Hollow cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/36—Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
- H01J61/366—Seals for leading-in conductors
Landscapes
- Vessels And Coating Films For Discharge Lamps (AREA)
Abstract
The present invention provides a solder for lead wires of a cold-cathode fluorescent lamp, the lead wires of the cold-cathode fluorescent lamp and the connection thereof. The solder for the lead wires is capable of restraining a connection part using the solder to generate sliding sound, wherein the connection part is of the lead wires for supplying high-current to electrodes and transmitting the heat generated on the electrodes to the outside of a light transmission pipe. The solder for the lead wires has essential components of tin and bismuth and also contains copper and phosphor. Preferably, the solder contains the tin in a range of bigger than or equal to 50 mass percent and smaller than 85 mass percent, the bismuth in a range of bigger than or equal to 15 mass percent and smaller than 50 mass percent, the copper in a range of bigger than 0 mass percent and smaller than or equal to 1.0 mass percent, and the phosphor in a range of bigger than 0 mass percent and smaller than or equal to 0.1 50 mass percent, and all the components is of 100 mass percent.
Description
Technical field
The lead-in wire that the present invention relates to cold-cathode fluorescence lamp with scolder, use of lead-in wire and the connection thereof of this lead-in wire with the cold-cathode fluorescence lamp of scolder.
Background technology
Cold-cathode fluorescence lamp is in aspect excellences such as high brightness, high-color rendering, long-life, low consumpting powers, thereby the light source that is used for eraser of the light source that is used to read of the backlight that often is used to use in liquid crystal indicators such as TV or computer, facsimile machine etc., duplicator and various demonstration are with light source etc.Cold-cathode fluorescence lamp for example has following structure.As shown in Figure 3, constitute by sealing airtightly by seal members such as spherical glass 3 such as two ends with the light-transmission tube 2 of manufacturings such as glass.The external diameter of light-transmission tube 2 for example in the scope of 1.5～6.0mm, the scope of preferred 1.5～5.0mm.The internal face of light-transmission tube is provided with luminescent coating 4, and this luminescent coating 4 roughly spreads all over its whole length.Also the fluorophor of suitably selecting from the fluorophor of the fluorophor of glow green, the coloured light that turns blue, the fluorophor of burn red etc. can be combined,, can also send white light thus as the fluorophor that is used for luminescent coating.Importing in the inner space 5 of light-transmission tube has the mercury of scheduled volume and for example rare gas such as argon, xenon, and its internal pressure is reduced to atmospheric about 1/tens.Cup-shape electrode 7 is so that peristome 10 relative modes are configured in the two ends on the length direction of light-transmission tube respectively.Be welded with lead-in wire 9 respectively in the bottom surface of the cup-shaped of each electrode, the other end of each lead-in wire passes the outside that seal member 3 is drawn out to light-transmission tube.
In such cold-cathode fluorescence lamp, when applying voltage between electrode, rare gas is ionized by a small amount of electronics that exists in the light-transmission tube.Discharge secondary electron by the bump of the rare gas after ionization electrode, thereby cause glow discharge.Launch the ultraviolet ray of 253.7nm, 360nm etc. from the mercury that is excited by glow discharge.Accept this ultraviolet fluorophor emitting fluorescence that is set at the coloured light that turns blue on the light-transmission tube inwall, green light, red light etc., the fluorescence of these colors is mixed, is developed the color, thereby sends white light.
Along with liquid crystal indicator is required that body is thin and area is big, the light-transmission tube of this cold-cathode fluorescence lamp needs length long and diameter is little, and has also uprised for the requirement of high mechanical properties.And, big along with requiring cold-cathode fluorescence lamp to have high brightness to the electric current change of electrode supply, cause the obviously heating of electrode part.
In such cold-cathode fluorescence lamp, the lead-in wire that is preferably as follows: not oxidized deterioration when welding with electrode in the mill, and the thermal expansion that the heat that is produced during because of use causes is similar to seal member and light-transmission tube, even volume is owing to thermal change changes, also can keep air-tightness with keeping seal member.And lead-in wire preferably has the heat that will be produced in the electrode portion and discharges the outer thermal conductivity of island light-transmission tube.For satisfying these requirements, as shown in Figure 4, to use copper-inner lead 9a such as Kovar alloy line with the part of electrode welding in the lead-in wire, the part that is in outside the light-transmission tube 2 is then used by outside lead 9b such as iron nickel are connected on the inner lead 9a.Outside lead 9b is by on the socket that scolder is connected with external power source is connected, to supply external power sources to electrode 7.
As being used for above-mentioned lead-in wire is connected to scolder on the socket, uses the scolder that contains tin, silver, aluminium, contain the scolder that environment is produced dysgenic lead with replacement.But if the heat that electrode produces is bigger, then lead-in wire can expand owing to the heat of its conduction, slides in socket thereby go between sometimes, produces the slip sound.
Put down in writing a kind of the inhibition under hot and humid environment in the patent documentation 1 owing to the oxidized lead-free tin alloy scolder plate wire that variable color takes place in plate wire surface.But, the scolder that is not described below in the patent documentation 1: this scolder is being used for cold-cathode fluorescence lamp large-area slim liquid crystal indicator, that seek the long light-transmission tube of minor diameter and high mechanical properties, and the coupling part of use scolder that can be suppressed at the lead-in wire of the heat that is produced on big electric current of electrode supply and conducting electrode produces the slip sound.
Patent documentation 1: the early stage Publication Laid-Open 2002-180226 of Japanese patent application.
Summary of the invention
The objective of the invention is to, a kind of lead-in wire scolder of cold-cathode fluorescence lamp is provided, this lead-in wire can and be sought in the cold-cathode fluorescent etc. of high brightness at the long light-transmission tube of seeking minor diameter and high mechanical properties with scolder, is suppressed to the big electric current of electrode supply and coupling part that the heat that is produced on electrode conducts to the use scolder of the lead-in wire outside the light-transmission tube produces the slip sound.
The present invention relates to a kind of lead-in wire scolder of cold-cathode fluorescence lamp, it is characterized in that, the prime number lead-in wire is main component with tin and bismuth and contains copper and phosphorus with scolder.
In addition, the present invention relates to a kind of lead-in wire, it is characterized in that, the lead-in wire of this involved above-mentioned cold-cathode fluorescence lamp that goes between covers with the solder layer of scolder.And the present invention relates to a kind of connection of lead-in wire of cold-cathode fluorescence lamp, it is characterized in that, used the lead-in wire scolder of cold-cathode fluorescence lamp.
The invention effect
The lead-in wire of cold-cathode fluorescence lamp of the present invention can and be sought in the cold-cathode fluorescent etc. of high brightness at the long light-transmission tube of seeking minor diameter and high mechanical properties with scolder, is suppressed to the big electric current of electrode supply and the coupling part of the use scolder of the lead-in wire of the heat that is produced on electrode to the light-transmission tube produces the slip sound.
Description of drawings
Fig. 1 is the summary structure chart of an example that the lead-in wire of cold-cathode fluorescence lamp of the present invention is shown;
Fig. 2 is the stereogram that is illustrated in the connected body that uses in the example of connection of lead-in wire of cold-cathode fluorescence lamp of the present invention;
Fig. 3 is the summary structure chart that cold-cathode fluorescence lamp is shown;
Fig. 4 is the side view of an example that the lead-in wire of cold-cathode fluorescence lamp is shown.
The specific embodiment
The lead-in wire of cold-cathode fluorescence lamp of the present invention is characterised in that with scolder it is a main component with tin and bismuth, and contains copper and phosphorus.Tin can be given corrosion resistance for the connection of using scolder, and raising connects the wellability of the scolder when going between to reach good connection.
The content of tin in scolder is preferably greater than and equals 50 quality % and less than 85 quality %.But in order to make the ratio that ratio reaches hope that contains of other metals of constituting scolder, even total content reaches 100 quality % and regulates.Use the connection of scolder to have corrosion resistance if the content of tin more than or equal to 50 quality %, then can make, can make that using scolder to connect between the connected body of lead-in wire keeps good connection.Become soft if the content of tin less than 85 quality %, then connects, can suppress to produce the slip sound owing to lead-in wire slides with connected body.
Bismuth can be given intensity for the connection of using scolder, even taken place at lead-in wire also to keep under the situation of thermal expansion and being connected of connected body, and can suppress because lead-in wire and connected body slip produce the slip sound.The content of bismuth in scolder is preferably greater than and equals 15 quality % and less than 50 quality %.If the content of bismuth more than or equal to 15 quality %, then uses the intensity of the connection of scolder to increase,, also can keep and being connected of connected body by lead-in wire even expanding.In addition, if the content of bismuth less than 50 quality %, the connection of then using scolder to carry out will have flexibility, can suppress owing to connect the decline that hardness uprises the mechanical strength that causes.
Copper is given flexibility for the connection of using scolder, suppresses the decline of flexibility.The content of copper in scolder is preferably above 0 quality % and smaller or equal to 1.0 quality %.By containing copper, can make the connection of using scolder to carry out have flexibility, can suppress owing to the decline that contains the bendability that bismuth causes.If the content of copper smaller or equal to 1.0 quality %, then can keep using the intensity of the connection that scolder carries out, and can suppress to produce the slip sound owing to lead-in wire and connected body slip.
Phosphorus suppresses the connection generation oxidation that the use scolder carries out.The content of phosphorus in scolder is preferably above 0 quality % and smaller or equal to 0.1 quality %.By containing phosphorus, can suppress the connection generation variable color of using scolder to carry out.Phosphorus is than bismuth, copper, the easier oxidation of tin, and phosphorus is oxidized to colourless phosphorus pentoxide earlier before these bismuths, copper, tin are oxidized, therefore can suppress the formation of coloured tin oxide, bismuth oxide, cupric oxide, thereby it is painted to have suppressed scolder.If the content of phosphorus in scolder smaller or equal to 0.1 quality %, then can suppress owing to containing the phenomenon that too much phosphorus promotes that scolder is oxidized, and can suppress to cause that lead-in wire and connected body take place to slide and then the phenomenon of generation slip sound owing to connect deterioration.
The lead-in wire of such cold-cathode fluorescence lamp also can contain other the thing that contains in the scope of the function that does not hinder said components with scolder.
About the manufacturing of the lead-in wire of above-mentioned cold-cathode fluorescence lamp, can exemplify following method: with near copper fusion fusing point, and near the fusing point of each metal, add successively and molten bismuth, tin, phosphorus, carry out cooling curing then with scolder.In addition, the lead-in wire of above-mentioned cold-cathode fluorescence lamp also can mix the slaine that contains these metals and obtain with scolder in the ratio of expectation.
The lead-in wire of such cold-cathode fluorescence lamp is not particularly limited with the lead-in wire that scolder (use scolder hereinafter referred to as lead-in wire) is employed, and for example can enumerate as shown in Figure 1 the lead-in wire that has copper layer 12 on every side at the heart yearn 11 of iron-nickel alloy.Core line diameter for example can be 0.6mm, and the copper tunic is thick for example can be 60 μ m.Have the copper layer by lead-in wire, when being fused to lead-in wire on the electrode, also can pass through the removal of solvents cupric oxide, form good welding thus even the copper laminar surface is oxidized.And can suppress owing to the heating of being carried out during with seal member sealing light-transmission tube end when making cold-cathode fluorescence lamp causes heart yearn oxidized.
As using above-mentioned lead-in wire the lead-in wire of cold-cathode fluorescence lamp to be connected to method on the connected body, can exemplify out scolder is placed the method that heats between portion's body and the lead-in wire that is connected with scolder.Also can exemplify out following method in addition: for example, as shown in Figure 1, use lead-in wire to cover lead-in wire and forms lead-in wire, and described lead-in wire with solder layer 13 touched on the connected body heat with solder layer 13 with scolder.
Lead-in wire with solder layer can be by making with scolder the above-mentioned lead-in wire after the fusion by the method that coating, impregnating are coated on the lead-in wire.For example, can exemplify following method: lead-in wire is put into the above-mentioned lead-in wire that accommodates after the fusion with in the solder bath of scolder and the dipping lead-in wire, cooling forms solder layer in atmosphere afterwards.The gas phase part of solder bath can be filled inert gas.Thickness as solder layer for example can exemplify 1～20 μ m.
The connection of the lead-in wire of cold-cathode fluorescence lamp of the present invention is characterised in that has used above-mentioned lead-in wire scolder.The connected body that lead-in wire connected as above-mentioned cold-cathode fluorescence lamp can exemplify out the connected body with the terminal that is connected with external power source.For example, as an example, can exemplify socket shown in Figure 2.Has the terminal 15 that is connected with the external power source that do not illustrate among the figure at the socket shown in the stereogram of Fig. 2 14.The shape of terminal also can be to have the metal part in the hole that supplies the lead-in wire insertion or two metallic plates of the leaf spring that the formation clamping goes between etc.The lead-line configuration that will have above-mentioned solder layer heats with fusion welding on connected body, and carries out cooling curing and form connection.
The connection of lead-in wire of the present invention also can followingly form: the above-mentioned lead-in wire scolder after configuration on the connected body does not have the lead-in wire of solder layer and pours fusion into, carry out cooling curing afterwards.
Like this, even if the lead-in wire that uses the cold-cathode fluorescence lamp that lead-in wire connects with scolder is being applied in owing to electrode under the situation that the high heat that external voltage produced expands, also because scolder has excellent corrosion resistance and flexibility, the bonding strength height of scolder, can keep it well and connect, the generation of the sound that therefore can suppress to slide.
[embodiment]
Exemplify the lead-in wire scolder that embodiment illustrates cold-cathode fluorescence lamp of the present invention.
[embodiment 1]
The copper of fusion 0.5 quality % adds the bismuth of 10 quality %, adds the tin of 59.55 quality %, carries out fusion to modulate the lead-in wire scolder after adding the phosphorus of 0.05 quality %, then with in this scolder adding solder bath.As shown in Figure 1 the lead-in wire that has the copper layer on iron nickel heart yearn is immersed in lead-in wire in the solder bath with in the scolder, in atmosphere, cools off, make scolder thus with lead-in wire to form the thick solder layer of 10 μ m.
The scolder that obtains is fused on the electrode of cold-cathode fluorescent shown in Figure 4 etc. with an end that goes between, makes cold-cathode fluorescence lamp thus.The other end of lead-in wire is inserted in the terminal of socket shown in Figure 2, and they is coupled together by heating.So 20 cold-cathode fluorescence lamps have been formed the connection of lead-in wire.
[comparative example]
Except that not adding bismuth, similarly to Example 1, the modulation lead scolder is made the lead-in wire that has formed solder layer by this scolder, makes cold-cathode fluorescence lamp, and the other end of lead-in wire is connected on the socket.Form with this of embodiment 1 similar number and be connected.
[evaluation that relevant slip sound produces]
The linking number that has just produced the slip sound via socket after cold-cathode fluorescence lamp supply 6.5mA has been shown in the table 1.
[embodiment 2～4]
Except that the bismuth that has added 20 quality %, 30 quality %, 40 quality % content, similarly to Example 1, the modulation lead scolder is made the lead-in wire that has formed solder layer by this scolder, make cold-cathode fluorescence lamp, and the other end of lead-in wire is connected on the socket.Form with this of embodiment 1 similar number and be connected, estimate with regard to the generation of the sound that slides.The results are shown in the table 1.
[table 1]
| Bi content (quality %) | Unusual sound produces number (number) | |
| Comparative example | ??0 | ??20 |
| Embodiment 1 | ??10 | ??15 |
| Embodiment 2 | ??20 | ??10 |
| Embodiment 3 | ??30 | ??6 |
| Embodiment 4 | ??40 | ??0 |
From the result, in the comparative example that has used the scolder that does not contain bismuth, all connections have all produced the slip sound, in addition along with the increase of the bi content in the scolder, the connection that produces the slip sound reduces, and is in the scolder of 40 quality % at bi content, the connection of slip sound occurs producing.
Claims (4)
1. the lead-in wire scolder of a cold-cathode fluorescence lamp is characterized in that, described lead-in wire is main component with scolder with tin and bismuth, and contains copper and phosphorus.
2. the lead-in wire scolder of cold-cathode fluorescence lamp as claimed in claim 1 is characterized in that, contains: more than or equal to 50 quality % and less than the tin of the scope of 85 quality %;
More than or equal to 15 quality % and less than the bismuth of the scope of 50 quality %;
Greater than 0 quality % and smaller or equal to the copper of the scope of 1.0 quality %; And
Greater than 0 quality % and smaller or equal to the phosphorus of the scope of 0.1 quality %,
And make that the total content of whole components is 100 quality %.
3. the lead-in wire of a cold-cathode fluorescence lamp is characterized in that, described lead-in wire is covered by solder layer, comprises the lead-in wire scolder of claim 1 or 2 described cold-cathode fluorescence lamps in the described solder layer.
4. the connection of the lead-in wire of a cold-cathode fluorescence lamp is characterized in that, has used the lead-in wire scolder of claim 1 or 2 described cold-cathode fluorescence lamps.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008332987A JP2010149177A (en) | 2008-12-26 | 2008-12-26 | Solder for lead wire of cold cathode fluorescent lamp, lead wire of cold cathode fluorescent lamp using the same, and connection thereof |
| JP2008-332987 | 2008-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101767253A true CN101767253A (en) | 2010-07-07 |
Family
ID=42500435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910265525A Pending CN101767253A (en) | 2008-12-26 | 2009-12-25 | Solder for lead wire of cold-cathode fluorescent lamp, lead wire of cold-cathode fluorescent lamp and connection thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2010149177A (en) |
| KR (1) | KR20100076896A (en) |
| CN (1) | CN101767253A (en) |
| TW (1) | TW201032939A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103586597A (en) * | 2013-11-12 | 2014-02-19 | 宁波市鄞州恒迅电子材料有限公司 | Fluorescence discoloration lead-free soldering paste |
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|---|---|---|---|---|
| JPH1034376A (en) * | 1996-07-26 | 1998-02-10 | Nippon Genma:Kk | Lead-free solder |
| JP2000141079A (en) * | 1998-09-04 | 2000-05-23 | Toyota Central Res & Dev Lab Inc | Lead-free solder alloy |
| JP2001179483A (en) * | 1999-12-24 | 2001-07-03 | Toyota Central Res & Dev Lab Inc | Electronic component mounting structure and method of manufacturing the same |
| JP2003017847A (en) * | 2001-04-02 | 2003-01-17 | Seiko Instruments Inc | Electronic circuit device and manufacturing method therefor |
| JP2003290974A (en) * | 2002-03-28 | 2003-10-14 | Fujitsu Ltd | Joint structure of electronic circuit device and electronic component used for the same |
| CN101060064A (en) * | 2006-04-20 | 2007-10-24 | 哈利盛东芝照明株式会社 | Cold cathode discharge lamp |
-
2008
- 2008-12-26 JP JP2008332987A patent/JP2010149177A/en active Pending
-
2009
- 2009-12-11 TW TW098142578A patent/TW201032939A/en unknown
- 2009-12-23 KR KR1020090129941A patent/KR20100076896A/en not_active Ceased
- 2009-12-25 CN CN200910265525A patent/CN101767253A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1034376A (en) * | 1996-07-26 | 1998-02-10 | Nippon Genma:Kk | Lead-free solder |
| JP2000141079A (en) * | 1998-09-04 | 2000-05-23 | Toyota Central Res & Dev Lab Inc | Lead-free solder alloy |
| JP2001179483A (en) * | 1999-12-24 | 2001-07-03 | Toyota Central Res & Dev Lab Inc | Electronic component mounting structure and method of manufacturing the same |
| JP2003017847A (en) * | 2001-04-02 | 2003-01-17 | Seiko Instruments Inc | Electronic circuit device and manufacturing method therefor |
| JP2003290974A (en) * | 2002-03-28 | 2003-10-14 | Fujitsu Ltd | Joint structure of electronic circuit device and electronic component used for the same |
| CN101060064A (en) * | 2006-04-20 | 2007-10-24 | 哈利盛东芝照明株式会社 | Cold cathode discharge lamp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103586597A (en) * | 2013-11-12 | 2014-02-19 | 宁波市鄞州恒迅电子材料有限公司 | Fluorescence discoloration lead-free soldering paste |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201032939A (en) | 2010-09-16 |
| JP2010149177A (en) | 2010-07-08 |
| KR20100076896A (en) | 2010-07-06 |
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Application publication date: 20100707 |