CN101765810A - 喷涂用正型感光性树脂组合物、使用该喷涂用正型感光性树脂组合物的固化膜的形成方法、固化膜以及半导体装置 - Google Patents
喷涂用正型感光性树脂组合物、使用该喷涂用正型感光性树脂组合物的固化膜的形成方法、固化膜以及半导体装置 Download PDFInfo
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- CN101765810A CN101765810A CN200880100464A CN200880100464A CN101765810A CN 101765810 A CN101765810 A CN 101765810A CN 200880100464 A CN200880100464 A CN 200880100464A CN 200880100464 A CN200880100464 A CN 200880100464A CN 101765810 A CN101765810 A CN 101765810A
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- 238000009835 boiling Methods 0.000 claims description 10
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 9
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- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 125000005931 tert-butyloxycarbonyl group Chemical group [H]C([H])([H])C(OC(*)=O)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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Classifications
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
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- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Abstract
在半导体元件搭载基板、陶瓷基板、铝基板等基板上喷涂喷涂用正型感光性树脂组合物而形成涂布膜时,前述涂布用正型感光性树脂组合物的特征在于,含有(A)碱溶性树脂、(B)通过光产生酸的化合物和(C)溶剂,并且,该涂布用正型感光性树脂组合物的粘度为2~200cP。
Description
技术领域
本发明涉及喷涂用正型感光性树脂组合物、使用该喷涂用正型感光性树脂组合物的固化膜的形成方法、固化膜以及半导体装置。
背景技术
以往,半导体元件的表面保护膜、层间绝缘膜采用耐热性优良且具有卓越的电特性、机械特性等的聚苯并噁唑树脂或聚酰亚胺树脂。另外,为了简化制造工艺,也使用将这些聚苯并噁唑树脂或聚酰亚胺树脂和作为感光剂的醌二叠氮化合物(quinondiazide compound)加以组合的正型感光性树脂组合物(例如,参照专利文献1)。
在半导体制造工序中,作为在半导体晶片上涂布正型感光性树脂组合物的方法,通常是采用旋转器的旋转涂布法。旋转涂布法在能够以简单的设备形成均匀的涂布膜方面是非常有效的方法,但是,最初分配在晶片上的树脂的大部分在旋转时被吹飞,并不是经济的涂布方法。因此,人们一直在研究各种各样的涂布方法,但是,现阶段的情况是并没有涂布性优良且经济性优良的方法和能与之对应的正型感光性树脂组合物。
专利文献1:日本特开平1-46862号公报
发明内容
本发明的目的在于提供一种喷涂用正型感光性树脂组合物,该树脂组合物在喷涂时没有针孔,膜厚均匀性优良,而且与旋涂法比较时经济性优良。
为了实现上述目的,下述(1)~(7)所记载的本发明为:
(1)一种喷涂用正型感光性树脂组合物,其用于通过喷涂在基板上形成涂布膜的方法中,其特征在于,前述喷涂用正型感光性树脂组合物含有(A)碱溶性树脂、(B)通过光产生酸的化合物和(C)溶剂,并且,粘度为2~200cP。
(2)根据(1)中记载的喷涂用正型感光性树脂组合物,其中,前述(A)碱溶性树脂是:具有聚苯并噁唑结构和聚酰亚胺结构中的至少一种结构,并且主链或者侧链上具有羟基、羧基、醚基或者酯基的树脂;具有聚苯并噁唑前驱体结构的树脂;具有聚酰亚胺前驱体结构的树脂;或是,具有聚酰胺酸酯结构的树脂。
(3)根据(1)或(2)中记载的喷涂用正型感光性树脂组合物,其中,前述(B)通过光产生酸的化合物是苯酚化合物和1,2-萘醌-2-二叠氮基-5-磺酸或者1,2-萘醌-2-二叠氮基-4-磺酸的酯化合物。
(4)根据(1)、(2)或(3)中记载的喷涂用正型感光性树脂组合物,其中,前述(C)溶剂的沸点是210℃以下并且前述(C)溶剂在20℃下的蒸汽压是25kPa以下。
(5)一种固化膜的形成方法,其特征在于,将(1)~(4)中任一项所记载的喷涂用正型感光性树脂组合物,在基板上依次进行喷涂、烘焙、曝光、显影来形成图案,进一步进行前述图案的固化,得到固化膜。
(6)一种固化膜,其特征在于,由(1)~(4)中任一项所记载的喷涂用正型感光性树脂组合物的固化物构成。
(7)一种半导体装置,其特征在于,具备:半导体基板;设置在前述半导体基板的半导体元件;以及,设置在前述半导体元件上部的(6)中所记载的固化膜。
具体实施方式
本发明的喷涂用正型感光性树脂组合物用于通过喷涂在基板上形成涂布膜的方法中,其特征在于,含有(A)碱溶性树脂、(B)通过光产生酸的化合物和(C)溶剂,且粘度为2~200cP。另外,本发明的喷涂用正型感光性树脂组合物的固化膜的形成方法的特征在于,将喷涂用正型感光性树脂组合物在基板上依次进行喷涂、烘焙、曝光、显影来形成图案,进一步进行前述图案的固化,得到固化膜。另外,本发明的固化膜的特征在于,由上述喷涂用正型感光性树脂组合物的固化物构成。另外,本发明的半导体装置的特征在于,具备:半导体基板;设置在前述半导体基板的半导体元件;以及设置在前述半导体元件上部的固化膜。
下面,对本发明的正型感光性树脂组合物的各成分进行详细说明。另外,下述是例示,本发明并不受下述内容的任何限制。
作为在本发明中使用的(A)碱溶性树脂,例如,可举出甲酚型酚醛清漆树脂;羟基苯乙烯树脂;甲基丙烯酸树脂、甲基丙烯酸酯树脂等丙烯酸系树脂;含有羟基、羧基等的环状烯烃系树脂;聚酰胺系树脂等。其中,优选为聚酰胺系树脂,具体来说,可举出具有聚苯并噁唑结构和聚酰亚胺结构中的至少一种结构,并且主链或者侧链上具有羟基、羧基、醚基或者酯基的树脂;具有聚苯并噁唑前驱体结构的树脂;具有聚酰亚胺前驱体结构的树脂;具有聚酰胺酸酯结构的树脂等。作为这种聚酰胺系树脂,例如,可举出下述式(1)表示的聚酰胺系树脂。
[化学式1]
(式(1)中,X、Y是有机基团。a、b表示摩尔百分数,a+b=100,a为60~100,b为0~40。R1是羟基或者-O-R3,相同或者不同。R2是羟基、羧基、-O-R3、-COO-R3中的任一种,相同或者不同。m是0~2的整数,n是0~4的整数。R3是碳原子数1~15的有机基团。此处,作为R1没有羟基的情况下,R2中的至少一个必须是羧基。另外,作为R2没有羧基的情况下,R2中的至少一个必须是羟基。Z由-R4-Si(R6)(R7)-O-Si(R6)(R7)-R5-表示,R4~R7是有机基团。)
含有通式(1)表示的结构的聚酰胺树脂,例如,通过使选自含有X的二胺或者双(氨基苯酚)、2,4-二氨基苯酚等的化合物和选自含有Y的四羧酸酐、偏苯三酸酐、二羧酸或者二羧酸二酰氯、二羧酸衍生物、羟基二羧酸、羟基二羧酸衍生物等的化合物进行反应而制得。在二羧酸的情况下,为了提高反应收率等,可以使用预先与1-羟基-1,2,3-苯并三唑等反应的活性酯型的二羧酸衍生物。
在含有通式(1)表示的结构的聚酰胺树脂中,作为X的取代基的-O-R3、作为Y的取代基的-O-R3、-COO-R3是用R3保护的基团,以调节羟基、羧基对碱水溶液的溶解度,其中,R3是碳原子数1~15的有机基团,可以根据需要保护羟基、羧基。作为R6的例子,可举出甲酰基、甲基、乙基、丙基、异丙基、叔丁基、叔丁氧羰基、苯基、苄基、四氢呋喃基、四氢吡喃基等。
当加热时该聚酰胺树脂脱水闭环,制得聚酰亚胺树脂或聚苯并噁唑树脂、或者两者共聚物形式的耐热性树脂。
作为通式(1)的X,例如,可举出下述式表示的基团。
[化学式2]
(上述式中,A是-CH2-、-C(CH3)2-、-O-、-S-、-SO2-、-CO-、-NHCO-、-C(CF3)2-或者单键。R8表示从烷基、烷酯基、卤原子中选出的一种,各自相同或者不同。r是0~2的整数。另外,R9表示从氢原子、烷基、烷酯基、卤原子中选出的一种。)
其中,作为特别优选的基团,可举出下述式表示的基团。这些可以使用1种或者组合2种以上来使用。
[化学式3]
(上述式中,R8表示从烷基、烷酯基、卤原子中选出的一种,各自相同或者不同。r是0~2的整数。)
另外,作为通式(1)的Y,例如,可举出下述式表示的基团。
[化学式4]
(上述式中,A是-CH2-、-C(CH3)2-、-O-、-S-、-SO2-、-CO-、-NHCO-、-C(CF3)2-或者单键。R8表示从烷基、烷酯基、卤原子中选出的一种,各自相同或者不同。r是0~2的整数。)
[化学式5]
[化学式6]
其中,作为特别优选的基团,可举出下述式表示的基团。这些可以使用1种或者组合2种以上来使用。
[化学式7]
(R8表示从烷基、烷酯基、卤原子中选出的一种,各自相同或者不同。r是0~2的整数。)
[化学式8]
通式(1)中的含有Z和Y的重复单元的摩尔百分数即b可以为0。
另外,在本发明中,从保存性的观点考虑,优选封闭末端。就封端而言,可以将含有具有至少一个烯基或炔基的脂肪族基团或者环式化合物基团的衍生物作为酸衍生物或者胺衍生物导入通式(1)所示的聚酰胺的末端。
具体来说,例如,优选通过使从具有X结构的二胺或者双(氨基苯酚)、2,4-二氨基苯酚等选出的化合物和从具有Y结构的四羧酸酐、偏苯三酸酐、二羧酸或者二羧酸二酰氯、二羧酸衍生物、羟基二羧酸、羟基二羧酸衍生物等选出的化合物进行反应来合成含有通式(1)表示结构的聚酰胺树脂后,采用含有具有至少一个烯基或者炔基的脂肪族基团或者环式化合物基团的酸酐或者酸衍生物将该聚酰胺树脂中含有的末端氨基封端成酰胺。
作为该封端官能团,例如,可举出下述式表示的基团。
[化学式9]
[化学式10]
其中,作为特别优选的基团,是用下述式表示的官能团。这些可以单独使用,也可以组合2种以上来使用。另外,不受该方法的限制,也可以采用含有具有至少一个烯基或者炔基的脂肪族基团或者环式化合物基团的胺衍生物将该聚酰胺树脂中含有的末端酸封端成酰胺。
[化学式11]
本发明中使用的(B)具有特定结构的苯酚的萘醌二叠氮基磺酸酯化合物即感光剂的添加量,相对于碱溶性树脂100重量份优选为1~50重量份。更优选为10~40重量份。当为下限值以上时,未曝光部对碱水溶液具有耐性,因此成图性良好,保持高残膜率、高分辨率,灵敏度也提高。当为上限值以下时,不仅可适度地抑制由浮渣引起的膜中透明性的降低,而且还可以适度地抑制由感光剂自身所导致的膜中透明性降低,由此能够保持高灵敏度、高分辨率,抑制固化时因分解成分所导致的膜厚的收缩,固化后也得到高残膜率。
在本发明中使用的通过光产生酸的化合物(B),例如,可举出鎓盐、卤化有机化合物、醌二叠氮化合物、α,α-双(磺酰基)重氮甲烷系化合物、α-羰基-α-磺酰基-重氮甲烷系化合物、砜化合物、有机酸酯化合物、有机酸酰胺化合物、有机酸酰亚胺化合物等。作为鎓盐的具体例子,可举出未被取代或者被对称或不对称地取代的具有烷基、烯基、芳烷基、芳香族基、杂环基的重氮鎓盐、铵盐、碘鎓盐、锍盐、鏻盐、鉮盐、氧鎓盐等。作为这些鎓盐的对阴离子的具体例子,只要是能形成对阴离子的化合物,就没有特别限制,可举出硼酸、砷酸、磷酸、锑酸、磺酸、羧酸或者它们的卤化物。卤化有机化合物只要是有机化合物的卤化物即可,没有特别限制,可以是各种公知的化合物,作为具体例子,可举出含有卤素的噁二唑系化合物、含有卤素的三嗪系化合物、含有卤素的苯乙酮系化合物、含有卤素的二苯甲酮系化合物、含有卤素的亚砜系化合物、含有卤素的砜系化合物、含有卤素的噻唑系化合物、含有卤素的噁唑系化合物、含有卤素的三唑系化合物、含有卤素的2-吡喃酮系化合物、含有卤素的脂肪族烃化合物、含有卤素的芳香族烃化合物、其他的含有卤素的杂环化合物、硫基卤系化合物等各种化合物。进一步,作为卤化有机化合物,可举出三(2,3-二溴丙基)磷酸酯、三(2,3-二溴代-3-氯丙基)磷酸酯、氯四溴乙烷、六氯苯、六溴苯、六溴环十二烷、六溴联苯、三溴苯基烯丙基醚、四氯双酚A、四溴双酚A、双(溴乙醚)四溴双酚A、双(氯乙醚)四氯双酚A、三(2,3-二溴丙基)异氰脲酸酯、2,2-双(4-羟基-3,5-二溴苯基)丙烷、2,2-双(4-羟基乙氧基-3,5-二溴苯基)丙烷等含卤素系阻燃剂;二氯二苯基三氯乙烷、六氯化苯、五氯苯酚、2,4,6-三氯苯基-4-硝基苯基醚、2,4-二氯苯基-3’-甲氧基-4’-硝基苯基醚、2,4-二氯苯氧基乙酸、4,5,6,7-四氯苯酞、1,1-双(4-氯苯基)乙醇、1,1-双(4-氯苯基)-2,2,2-三氯乙醇、乙基-4,4-二氯二苯乙醇酸酯、2,4,5,4’-四氯二苯硫醚、2,4,5,4’-四氯二苯砜等有机氯系农药等。作为醌二叠氮化合物的具体例子,可举出1,2-二叠氮苯醌-4-磺酸酯、1,2-二叠氮基萘醌-4-磺酸酯、1,2-二叠氮基萘醌-5-磺酸酯、1,2-二叠氮基萘醌-6-磺酸酯、2,1-二叠氮基萘醌-4-磺酸酯、2,1-二叠氮基萘醌-5-磺酸酯、2,1-二叠氮基萘醌-6-磺酸酯、其他的醌二叠氮衍生物的磺酸酯;1,2-二叠氮基苯醌-4-磺酰氯、1,2-二叠氮基萘醌-4-磺酰氯、1,2-二叠氮基萘醌-5-磺酰氯、1,2-二叠氮基萘醌-6-磺酰氯、2,1-二叠氮基萘醌-4-磺酰氯、2,1-二叠氮基萘醌-5-磺酰氯、2,1-二叠氮基萘醌-6-磺酰氯、其他的醌二叠氮衍生物的磺酰氯等邻醌叠氮化合物。作为α,α-双(磺酰基)重氮甲烷系化合物的具体例子,可举出未被取代或者被对称或不对称地取代的具有烷基、烯基、芳烷基、芳香族基、杂环基的α,α-双(磺酰基)重氮甲烷等。作为α-羰基-α-磺酰基-重氮甲烷系化合物的具体例子,可举出未被取代或者被对称或不对称地取代的具有烷基、烯基、芳烷基、芳香族基、杂环基的α-羰基-α-磺酰基-重氮甲烷等。作为砜化合物的具体例子,可举出未被取代或者被对称或不对称地取代的具有烷基、烯基、芳烷基、芳香族基、杂环基的砜化合物、二砜化合物等。作为有机酸酯的具体例子,可举出未被取代或者被对称或不对称地取代的具有烷基、烯基、芳烷基、芳香族基、杂环基的羧酸酯、磺酸酯等。作为有机酸酰胺的具体例子,可举出未被取代或者被对称或不对称地取代的具有烷基、烯基、芳烷基、芳香族基、杂环基的羧酸酰胺、磺酸酰胺等。作为有机酸酰亚胺的具体例子,可举出未被取代或者被对称或不对称地取代的具有烷基、烯基、芳烷基、芳香族基、杂环基的羧酸酰亚胺、磺酸酰亚胺等。这些可通过活性光线的照射而裂解产生酸的化合物,可以单独或者混合两种以上来使用。
进一步,在它们之中特别优选的是苯酚化合物和1,2-萘醌-2-二叠氮基-5-磺酸或者1,2-萘醌-2-二叠氮基-4-磺酸的酯化合物。例如,可举出下述物质,但并不限于这些。而且,这些可以使用两种以上。
[化学式12]
[化学式13]
[化学式14]
[化学式15]
[化学式16]
[化学式17]
式中,Q是选自氢原子、式(2)、式(3)中的任一种。此处,各化合物的Q中的至少一个是式(2)、式(3)。
本发明中使用的通过光产生酸的化合物(B)的优选的添加量,相对于碱溶性树脂100重量份是1~50重量份。当低于1重量份时,聚酰胺树脂的成图性不良,超过50重量份时,灵敏度大幅降低。
作为在本发明中使用的溶剂,可举出γ-丁内酯、N-甲基-2-吡咯烷酮、N,N-二甲基乙酰胺、N,N-二甲基甲酰胺、二甲基亚砜、二乙二醇二甲醚、二乙二醇二乙醚、二乙二醇二丁醚、丙二醇单甲醚、二丙二醇单甲醚、丙二醇单甲醚乙酸酯、乳酸甲酯、乳酸乙酯、乳酸丁酯、甲基-1,3-丁二醇乙酸酯、1,3-丁二醇-3-单甲醚、丙酮酸甲酯、丙酮酸乙酯、甲基-3-甲氧基丙酸酯、乙酸戊酯、乙酸叔丁酯、丙酸乙酯、2-甲基四氢呋喃、乙酸乙酯等,这些可以单独使用也可以混合使用。
这些溶剂之中优选的溶剂是γ-丁内酯、乙酸戊酯、乳酸甲酯、乳酸乙酯、乳酸丁酯等沸点为141℃~210℃的溶剂,这样的溶剂在往晶片上涂布时抑制针孔的产生,同时兼具膜厚均匀性。另外,在对半导体元件或半导体元件搭载基板的贯通电极这样的在垂直方向上设置的孔的内壁进行涂布以形成绝缘膜等的情况下,为防止涂布过的液体向下部流挂,优选使用沸点为120℃以下的溶剂即丙二醇单甲醚、乙酸叔丁酯、丙酸乙酯、2-甲基四氢呋喃、乙酸乙酯、丙酮、MEK、乙醇等挥发性高的溶剂。另一方面,当20℃下的蒸汽压为25kPa以上时,在常温保管时由于溶剂的挥发而导致树脂组合物的粘度显著上升,因此,为了兼具涂布时的挥发性和常温保管时的粘度稳定性,特别优选使用蒸汽压为25kPa以下的溶剂即乙酸叔丁酯、丙酸乙酯、乙酸乙酯等。
沸点为120℃以下的溶剂可以单独使用,但为了兼具涂布时的挥发性、对针孔的抑制性以及膜厚均匀性,优选与前述的沸点为141℃~210℃的溶剂并用,作为溶剂的混合比,沸点141℃~210℃的溶剂优选为51~90重量%,沸点120℃以下的溶剂优选为49~10重量%。但是,在想显著提高涂布时的挥发性的情况下,可以使沸点99℃以下的溶剂为50~100重量%。
本发明的正型感光性树脂组合物的粘度为2~200cP,优选为5~100cP。通过处于上述范围内,能够确保抑制从喷嘴中心液漏的效果、对基板的均匀的涂布性乃至针孔抑制效果。作为使正型感光性树脂组合物的粘度处于上述范围内的方法,可通过适当调节(A)碱溶性树脂、(B)通过光产生酸的化合物、(C)溶剂的配合比来实施。
另外,本发明的正型感光性树脂组合物的粘度,可以通过如下测定条件以5分钟后的粘度作为测定值进行测定,所述测定条件为,测定装置:TVE-20L型粘度计圆锥圆盘型(TOKIMEC制造)、使用转子:标准转子(1°34′,R=2.4cm)、旋转数:10rpm、温度:25℃。
进一步,在本发明中,为了提高在喷涂下的涂布性,可以并用表面活性剂。例如,作为表面活性剂,可举出氟系表面活性剂、硅氧烷系表面活性剂、无氟系表面活性剂。作为氟系表面活性剂,是具有全氟烷基的结构的物质,具体来说,有大日本油墨化学工业(株)制造的メガフアツクF-470、F-471、F-472SF、F-474、F-475、R-30、F-477、F-478、F-479、BL-20、R-61、R-90、住友スリ一エム(株)制造的FC-170C、FC-4430等,但并不限于这些。作为硅氧烷系表面活性剂,有聚烷基改性硅氧烷系、聚酯改性硅氧烷系、芳烷基改性硅氧烷系、烷基芳烷基改性硅氧烷系等,但并不限于这些。作为无氟系表面活性剂,有聚氧乙烯月桂醚、聚氧乙烯油醚、聚氧乙烯辛基苯基醚、聚氧乙烯壬基苯基醚、聚乙二醇二月桂酸酯、聚乙二醇二硬酸酯等非离子系表面活性剂以及丙烯酸系或者甲基丙烯酸系聚合物构成的表面活性剂,但并不限于此。
本发明的树脂组合物以及正型感光性树脂组合物也可以根据需要含有硅烷偶联剂等添加剂。
对本发明的正型感光性树脂组合物的使用方法加以说明。
采用喷涂装置等,将本发明的正型感光性树脂组合物喷涂在例如半导体元件搭载基板、陶瓷基板、铝基板等基板上,形成涂布膜。本发明的正型感光性树脂尤其能够适合用作半导体元件搭载基板的绝缘膜或者在半导体元件搭载基板的背面设置的孔的内壁上形成的绝缘膜。另外,作为前述喷涂装置,可以使用SUSS MicroTec公司制造的Delta Altra Spray等。另外,也可以通过通常的喷枪等喷涂本发明的正型感光性树脂组合物。该喷涂中所使用的枪并无特别限制,但为了均匀涂布,优选喷嘴直径小的枪,通常,可以使用喷嘴直径0.1~2mm的枪。另外,优选在喷涂压力为1.0~5.0kg/cm2的范围内进行。当喷涂压力过低时,喷涂过的正型感光性树脂组合物的干燥程度产生偏差,涂布性降低。相反,当喷涂压力过高时,喷嘴前端容易发生正型感光性树脂组合物的堵塞,因此不优选。
就涂布量而言,在涂布于半导体元件搭载基板上时,涂布成固化后的最终膜厚为0.1~30μm。当膜厚低于下限制时,难以充分发挥作为半导体元件的保护表面膜的功能,当超过上限值时,不仅难以得到微细的加工图案,而且加工费时,生产率降低。接下来,在60~130℃下预烘焙而干燥涂膜后,按照所希望的图案形状照射化学射线。作为化学射线,可使用X射线、电子射线、紫外射线、可见光线等,优选波长为200~500nm的射线。
接下来,通过用显影液溶解除去照射部,得到浮雕图案。作为显影液,可以使用碱类的水溶液以及在向该碱类的水溶液添加合适量的甲醇、乙醇等的醇类等水溶性有机溶剂或表面活性剂的水溶液,其中,所述碱类可举出氢氧化钠、氢氧化钾、碳酸钠、硅酸钠、偏硅酸钠、氨水等无机碱类;乙胺、正丙胺等伯胺类;二乙胺、二正丙胺等仲胺类;三乙胺、甲基二乙基胺等叔胺类;二甲基乙醇胺、三乙醇胺等醇胺类;四甲基氢氧化铵、四乙基氢氧化铵等季铵盐等。作为显影方法,可以使用搅拌(paddle)、浸渍、喷洒、超声波等方式。
接下来,漂洗通过显影形成的浮雕图案。作为漂洗液,使用蒸馏水。接下来,进行加热处理,形成噁唑环和/或酰亚胺环,得到富有耐热性的最终图案。
本发明的正型感光性树脂组合物不仅用于半导体中,而且作为多层电路的层间绝缘膜或者挠性覆铜板的覆盖层、阻焊膜或液晶定向膜、显示装置中元件的层间绝缘膜等也是有用的。
实施例
下面,通过实施例对本发明进行具体的说明。
<实施例1>
[碱溶性树脂的合成]
使二苯醚-4,4’-二羧酸4.13g(0.016摩尔)和1-羟基-1,2,3-苯并三唑4.32g(0.032摩尔)反应,得到二羧酸衍生物的混合物(0.016摩尔),将该得到的二羧酸衍生物的混合物(0.016摩尔)和六氟-2,2-双(3-氨基-4-羟基苯基)丙烷7.33g(0.020摩尔)装入到具备温度计、搅拌机、原料投入口、干燥氮气导入管的四口可分离烧瓶中,加入N-甲基-2-吡咯烷酮57.0g使其溶解。然后,利用油浴在75℃下反应12小时。接下来,加入5-降冰片烯-2,3-二羧酸酐1.31g(0.008摩尔)(其溶解于N-甲基-2-吡咯烷酮7g中),进一步搅拌12小时,结束反应。过滤反应混合物后,将反应混合物投入到水/甲醇=3/1(容积比)的溶液中,过滤收集沉淀物,用水充分洗涤后,在真空下干燥,得到目的的碱溶性树脂(A-1)。
[化学式18]
(上式中,n是15~20。)
[正型感光性树脂组合物的制作]
使通过上述合成方法合成的碱溶性树脂(A-1)10g和作为通过光产生酸的化合物的具有下述结构的感光性重氮醌化合物(B-1)2g,溶解于作为溶剂的γ-丁内酯(C-1),进一步,用0.2μm直径的氟树脂制的过滤器过滤,得到粘度30cP的正型感光性树脂组合物。
[化学式19]
(上式中,Q1、Q2、Q3的75%是式(2),25%是氢原子。)
[特性评价]
用喷枪以2kg/cm2的气压,在8英寸的硅晶片(725μm厚度)上喷涂该正型感光性树脂组合物。
然后,用加热板在120℃下预烘焙4分钟,得到膜厚约7μm的涂膜。通过凸版印刷(株)制造的掩模(测试图No.1:描绘有宽0.88~50μm的残留图案和去掉图案),采用i射线步进机((株)尼康制造的4425i),以使曝光量变化的方式照射该涂膜。接下来,通过在2.38%的四甲基氢氧化铵水溶液中浸渍50秒钟,溶解除去曝光部,然后,用纯水漂洗10秒钟。其结果,可确认出通过曝光量180mJ/cm2照射的部分成形出图案(灵敏度为180mJ/cm2)。显影后的膜厚为6.2μm,分辨率为3μm,显示出非常高的值。
<实施例2>
将实施例1的溶剂变更为γ-丁内酯/乙酸乙酯=45/55(C-2)。关于溶剂以外的树脂组合物的制作方法以及评价方法,与实施例1相同。显影后的膜厚为6.3μm,灵敏度为165mJ/cm2,分辨率为3μm。
<实施例3>
将实施例1的溶剂变更为γ-丁内酯/2-甲基四氢呋喃=40/60(C-3)。关于溶剂以外的树脂组合物的制作方法以及评价方法,与实施例1相同。显影后的膜厚为6.0μm,灵敏度为195mJ/cm2,分辨率为3μm。
<实施例4>
将实施例1的溶剂变更为γ-丁内酯/丙酸乙酯=40/60(C-4)。关于溶剂以外的树脂组合物的制作方法以及评价方法,与实施例1相同。显影后的膜厚为6.2μm,灵敏度为155mJ/cm2,分辨率为3μm。
<实施例5>
将实施例1的溶剂变更为γ-丁内酯/乙酸叔丁酯=55/45(C-5)。关于溶剂以外的树脂组合物的制作方法以及评价方法,与实施例1相同。显影后的膜厚为6.0μm,灵敏度为175mJ/cm2,分辨率为3μm。
工业实用性
根据本发明,能够提供一种喷涂用正型感光性树脂组合物,该组合物在喷涂时没有针孔,膜厚均匀性优良,而且与旋涂法比较时经济性优良。因而,具有工业上的实用性。
Claims (7)
1.一种喷涂用正型感光性树脂组合物,其用于通过喷涂在基板上形成涂布膜的方法中,其特征在于,
所述喷涂用正型感光性树脂组合物含有(A)碱溶性树脂、(B)通过光产生酸的化合物以及(C)溶剂,
并且,所述喷涂用正型感光性树脂组合物的粘度为2~200cP。
2.根据权利要求1所述的喷涂用正型感光性树脂组合物,其中,所述(A)碱溶性树脂是:
具有聚苯并噁唑结构和聚酰亚胺结构中的至少一种结构,并且主链或者侧链上具有羟基、羧基、醚基或者酯基的树脂;
具有聚苯并噁唑前驱体结构的树脂;
具有聚酰亚胺前驱体结构的树脂;或是,
具有聚酰胺酸酯结构的树脂。
3.根据权利要求1或2所述的喷涂用正型感光性树脂组合物,其中,所述(B)通过光产生酸的化合物是苯酚化合物和1,2-萘醌-2-二叠氮基-5-磺酸或者1,2-萘醌-2-二叠氮基-4-磺酸的酯化合物。
4.根据权利要求1、2或3所述的喷涂用正型感光性树脂组合物,其中,所述(C)溶剂的沸点是210℃以下,并且所述(C)溶剂在20℃下的蒸汽压是25kPa以下。
5.一种固化膜的形成方法,其特征在于,将权利要求1~4中任一项所述的喷涂用正型感光性树脂组合物,在基板上依次进行喷涂、烘焙、曝光、显影来形成图案,进一步进行所述图案的固化,得到固化膜。
6.一种固化膜,其特征在于,由权利要求1~4中任一项所述的喷涂用正型感光性树脂组合物的固化物构成。
7.一种半导体装置,其特征在于,具备:半导体基板;设置在所述半导体基板上的半导体元件;以及设置在所述半导体元件上部的权利要求6所述的固化膜。
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