CN101752643A - Three-dimensional photoetching method for antenna manufacture - Google Patents
Three-dimensional photoetching method for antenna manufacture Download PDFInfo
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- CN101752643A CN101752643A CN200810204054A CN200810204054A CN101752643A CN 101752643 A CN101752643 A CN 101752643A CN 200810204054 A CN200810204054 A CN 200810204054A CN 200810204054 A CN200810204054 A CN 200810204054A CN 101752643 A CN101752643 A CN 101752643A
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Abstract
The invention relates to a three-dimensional photoetching method for antenna manufacture, which comprises the following steps: proving a basic structural element; forming a conductive layer on the surface of the basic structural element; forming a photosensitive printing ink layer outside the conductive layer; and carrying out the processes of shielding, light exposure, development and etching. The invention is characterized in that the basic structural element is a three-dimensional structural element, and in addition, the formed conductive layer, the photosensitive printing ink layer formed outside the conductive layer and the shielding and the light exposure processes are all carried on the three-dimensional surface. In the invention, patterns of the three-dimensional antenna can be formed in one step, the production period can be shortened, and the requirement of mass production is met.
Description
Technical field
The present invention relates to a kind of manufacture method of antenna, relate in particular to the photoetching manufacturing method that is applicable to the antenna in the wireless telecommunications system.
Background technology
Antenna is the emission of radio frequency signals that circuit board produces to be gone out and the radiofrequency signal that receives is passed to circuit board in the effect of mobile communication terminal, realizes voice signal with this, the wireless two-way transmission of vision signal and data etc.
Present most of mobile communication terminal, especially in mobile phone, PDA, hand-held computer, all adopt the built-in aerial that places terminal inner, and because the size and the frequency dependence of antenna, so it must have the dimensions and highly just can have enough radiation efficiencies to guarantee to transmit and receive electromagnetic wave effectively, causing antenna is one of element maximum in the mobile communication terminal.Along with mobile communication terminal to miniaturization and ultra-thinization development, keep for the space of antenna more and more littler, therefore in order to make full use of all spaces as much as possible, antenna presents complicated three-dimensional structure day by day.
At present, built-in antenna normally is made up of radio-frequency (RF) component and matrix fixed support thereof, and radio-frequency (RF) component is the metal sheet metal component or the flexible printed circuit board of a given shape normally.Radio-frequency (RF) component and matrix fixed support are assembled together both after need machining respectively again.The major defect that this method exists is:
1, because their matching relationship instability causes bigger radio-frequency performance to change sometimes, causes the instability in the production;
2, because a lot of radio-frequency (RF) component and matrix fixed support must present three-dimensional geometry, and some radio-frequency (RF) component than complicated shape are difficult to produce and assembling.
Therefore need find a kind of radio frequency figure to be molded directly within method on the matrix fixed support with antenna.For example, platable plastic is expelled on the electroless coating plastics by the aerial radiation shape, electroplates the antenna of formation then.The shortcoming of this method is the material thickness height, and space hold is bigger, and the mould structure relative complex, and the radio-frequency performance adjustment is owed flexibly, so the design cycle is long.
But also have a kind of utilization on the plastics of chemical plating behind the laser activation, going out the shape of antenna and then changing the antenna that plating forms in addition with laser engraving.Its shortcoming is to adopt specific modified plastics and equipment, these plastics and equipment are very expensive, and 3-D graphic for complexity, thereby come runing rest to be carved out the shape that needs by laser radiation on all surfaces thereby need carry out multiple working procedure, therefore the production cycle is long, production capacity is limited, is not suitable for a large amount of productions.
In addition, in the manufacturing of present planar circuit printed panel (PCB), adopted a kind of the photoetching technique that single face of substrate is handled widely.Here be referred to as two-dimentional photoetching technique.Roughly process is as follows:
Pcb board is a surface on dull and stereotyped insulating substrate is covered with one deck Copper Foil equably by the mode of calendering or electrolysis a substrate.For the circuitous pattern that on PCB, to need, need responsive a kind of main component on the one hand to special spectrum and the light-sensitive surface generation chemical reaction cover substrate should the surface on.Light-sensitive surface divides two kinds on photo-polymerization type and photolysis type.The photo-polymerization type film can harden under the rayed of special spectrum, becomes water-insoluble from water-soluble substances, and photolysis type film is then just in time opposite.On the other hand, circuitous pattern being printed as the two dimensional surface film with mask aligner, being called the circuit egative film, is example with the situation of photo-polymerization type light-sensitive surface, and circuit pack is transparent on this circuit egative film, and that the place that does not need is black is light tight.Cover this layer line road egative film on the pcb board of light-sensitive surface again and expose being coated with subsequently by it.The process of this exposure also be ultraviolet light only from folk prescription to this list surface irradiation.Through overexposure, the local light-sensitive surface generation chemical reaction of transparent logical light on the film is tightly on the Copper Foil attached to substrate surface.It more than is exposure process.Next be developing process.Remove not by the film of illumination part, do not need the Copper Foil in zone (part that does not have circuitous pattern) to expose thereby allow.Pass through etching process then, promptly use etching solution that substrate is carried out etching, etch away the copper that does not have the film protection fully.At this moment, the line pattern that finally needs just presents on substrate.
For the two-sided pcb board that circuit is all arranged, then be that positive and negative two faces repeat above process, be not one-shot forming.
The shortcoming of this method is to carry out at single surface of flat board.If antenna be shaped as three-dimensional, be single plane incessantly promptly, then this method is inappropriate.
Summary of the invention
At these problems, the invention provides the three-dimensional photoetching method that a kind of antenna is made, comprising: basal body structure spare is provided, forms conductive layer on the surface of basal body structure spare, the top formation photosensitive printing ink layer of conductive layer, and cover, etching process is developed in exposure.Described conductive layer is formed on the three-dimensional surface of basal body structure spare, and described photosensitive printing ink layer is formed on the three-dimensional surface of conductive layer, described cover with exposure process all be that three-dimensional surface to photosensitive printing ink layer carries out.
As a kind of optimal way, described photosensitive-ink is that a kind of main component is to the responsive photosensitive etching resisting ink that chemical reaction takes place of special spectrum.
As a kind of optimal way, described special spectrum is a ultraviolet light.
As a kind of optimal way, described conductive layer is a metal level.
As a kind of optimal way, described metal level is copper or nickel or silver layer; Metal level is one or more layers.
As a kind of optimal way, described metal level is for electroplating chemical plating, the metal level that is coated with or brushes.
As a kind of optimal way, described basal body structure spare is for can plate plastic cement.
As a kind of optimal way, the described plastic cement that plates is ABS.
As a kind of optimal way, if described conductive layer needs directly exposure, behind etching process, described method also comprises and takes off the film step.
Beneficial effect:
1, adopt conventional plastic cement, thereby reduce the cost of raw material,
2, to make simply, the dimensional tolerance of antenna is easy to control, and the antenna of complicated shape is easy to accurate realization,
3, by the shape that tool is covered in adjustment, can adjust antenna pattern neatly, thereby make that the debugging of antenna RF performance is very flexible, shorten the design cycle,
4, the figure of dimensional antenna can once form, and shortens the production cycle, satisfies and produces in enormous quantities.
Description of drawings
The schematic diagram of the antenna that Fig. 1 will form for the present invention.The dash area of Fig. 1 is exactly the shape of antenna.Be distributed on three planes.
Fig. 2 is basal body structure spare 1 schematic diagram.The A-A cross section of Fig. 2 is described in detail among a few below width of cloth figure.
Fig. 3 is for there being the A-A sectional view behind the conductive layer 2 on the basal body structure spare 1.
Fig. 4 adds that photosensitive-ink is for example to the A-A sectional view after the photosensitive printing ink layer 3 of ultraviolet light sensitivity.
Fig. 5 is the A-A sectional view after structural member crested tool 4 surrounds.This covers tool and is suitable for photo-polymerization type printing ink.5 for covering the tool vacancy, and it is to UV transparent, and remainder covers fully to ultraviolet light.
Fig. 6 for the parts among Fig. 5 allow responsive light for example ultraviolet light (UV) shine fully.The direction of arrow is exactly radiation direction.Light is that all directions have.By covering the opening 5 on the tool, UV light directly shines on the structural member, and the zone that the crested tool hides is not illuminated.
Fig. 7 is the parts after developing.Through developing, to accept the part that the UV irradiate light crosses in the photosensitive-ink 3 and kept, all the other parts of crossing without irradiate light are removed.
Fig. 8 is the structural member after the etching.Through etching, have only the photosensitive printing ink layer 3 crossed through irradiate light and the conductive layer 2 of its covering to keep, other conductive layer all is removed.
Fig. 9 is the structural member that removes after the photosensitive printing ink layer 3, obtains the antenna pattern 2 that need be made up of conductive layer.
Embodiment
Describe in detail below in conjunction with accompanying drawing.
Fig. 1 is a final schematic diagram of the present invention.The dash area of Fig. 1 is exactly the shape of antenna.As can be seen, the distribution of shapes of antenna is a 3 D stereo on three planes.So the present invention once finishes the antenna of 3D shape to make, but not only at two dimensional surface, making the two dimensional surface antenna is the special case of this method.Antenna pattern in this example is arbitrarily, and its specifically making aspect is as follows:
The first step as Fig. 2, provides basal body structure spare 1.
This basal body structure spare 1 can adopt can metallized plastic cement such as ABS etc., adopts traditional technology such as injection mo(u)lding and makes, and its shape customizes as required.Basal body structure spare 1 is three-dimensional, and three-dimensional surface all can be used.
In second step, as Fig. 3, conductive layer 2 is formed on the three-dimensional surface of basal body structure spare.
In this step, form conductive layer 2 on all surface of basal body structure spare 1, as seen this conductive layer is three-dimensional, and in this example, conductive layer all forms on six faces of structural member.Certainly, also can be as required only therein subregion form conductive layer.Conductive layer 2 can be metal level, for example, and metallic copper, nickel or silver layer.Can be to use chemical plating, electroplate, be coated with, technologies such as brush form metal level on basal body structure spare 1 surface.Should not be limited to chemical plating or plating in the method for the present invention, also be not limited to metallic nickel, the technology of copper or silver also can be used other suitable smithcraft.Metal layer thickness can be determined as required.This metal level can be one deck, also can be the metal level more than one deck.
In the 3rd step, as Fig. 4, photosensitive printing ink layer 3 is formed on the three-dimensional surface of conductive layer 2.
The generation chemical reaction can be divided into photo-polymerization type and photolysis type to the main component of this printing ink to special spectrum is responsive, and photo-polymerization type printing ink can harden under the rayed of special spectrum, becomes water-insoluble from water-soluble substances, and the photolysis type is then just in time opposite.Adopt the photo-polymerization type photosensitive-ink in this example.The printing ink of photolysis type therewith in like manner, only need transposing cover the printing opacity of tool and the part of covering just passable.
Photosensitive-ink is that a kind of main component is to the responsive photosensitive etching resisting ink that chemical reaction takes place of special spectrum.Specific light herein is exactly a ultraviolet light.
The thickness of the printing ink that adopts is suitably chosen as required in this step.Printing ink can form by modes such as brushing, coating, spraying, immersions, also can be with other mode that is fit to.
Photosensitive printing ink layer 3 is formed on the conductive layer 2 uniformly.Because conductive layer 2 is a three-dimensional surface, so photosensitive printing ink layer also is three-dimensional.Certainly, as special case, also can be two-dimensional plane.
In the 4th step,, cover as Fig. 5.Cover tool 4 (Mask) with what structural member was put into a three-dimensional.
The tool 4 that covers in this step also is three-dimensional.Cover tool can be as required package structure spare partially or completely, shown the situation of covering the comprehensive package structure spare 1 of tool in this example.
This covers the light transmission part of tool and lighttight part can be according to the characteristic of printing ink, promptly is photo-polymerization type or photolysis type and decide.Fig. 5 has shown that the printing ink on structural member is photo-polymerization type, covers the situation of tool investing mechanism spare.The place of covering tool and antenna pattern correspondence this moment is transparent to the responsive light of photosensitive-ink, for example covers 5 among tool vacancy such as Fig. 5 and shows.And it is opaque fully to responsive light to cover all the other zones of tool.
When photosensitive-ink is under the situation of photolysis type, covers tool this moment and uses photo-polymerization type opposite.Promptly corresponding to the shape of complete opaque zone of responsive light and antenna, be transparent and cover all the other places of tool to responsive light.
The 5th step, as Fig. 6, exposure.Will with cover structural member that tool wraps with the light of photosensitive-ink sensitivity for example ultraviolet light carry out the three-dimensional exposure.
In this step, ultraviolet light can also can be exposed parts by rotation and make it comprehensive by uniform irradiation equably from all directions, and ultraviolet wavelength can suitably be chosen according to the photaesthesia characteristic of printing ink.After the exposure, if the photosensitive-ink of polymerism, the part that receives irradiate light will polymerization reaction take place and is produced anti-etching performance.
In the 6th step,, develop as Fig. 7.The structural member of light of will exposing to the sun takes out from cover tool (Mask) 4, puts into developer solution, removes the printing ink that does not need the zone, exposes following conductive layer 2.
Fig. 7 has shown the structural member after being developed, and does not need the printing ink in zone to remove, exposes following conductive layer.And still be coated with anti-etching photosensitive printing ink layer on the regional conductive layer that the antenna pattern zone promptly needs to keep, this part conductive layer is protected.This protective layer can resist for example corrosion of acid solution of etching solution.Developer solution in this step is generally alkalescence, such as sodium carbonate (Na
2CO
3) etc., also being not limited to this alkaline-based developer certainly, any material that does not have sensitization and felt the printing ink of light of can distinguishing can adopt.
The 7th step, as Fig. 8, etching.Put the good structural member that develops into etching solution and for example carry out etching in the acid solution, remove the metal level that exposes, this moment, the figure of antenna just was formed on the basal body structure spare.
Fig. 8 has shown the structural member after etched, and the etched solution corrosion of not protected conductive layer falls in Fig. 8, has exposed the matrix of following structural member.And be not corroded, thereby formed antenna pattern by the conductive layer part that the anti-etching printing ink layer is protected.If conductive layer is a metal, the acid solution in this step can erode the metal on the structural member, such as chloric acid (HCl) etc., also can adopt other any corrodible appropriate solution of falling the metal on the structural member.
In the 8th step,, take off film as Fig. 9.The structural member of etching put into take off in the coating solution, take off the resistant layer of protection antenna pattern, thereby on structural member, exposed antenna pattern.Its result such as Fig. 9 show.
If do not need metal level directly to expose, this step also can be omitted.
Fig. 9 has shown the situation that is taken off film liquid flush away etch-resisting film, and the required metal pattern of antenna pattern just has been directly exposed on the structural member.The film liquid that takes off that uses in this step is generally alkalescence, such as NaOH (NaOH) etc., also can adopt other any suitable solution that removes etch-resisting film.
Here description of the invention and application is illustrative, is not to want with scope restriction of the present invention in the above-described embodiments.Here the distortion of disclosed embodiment and change are possible, and the various parts of the replacement of embodiment and equivalence are known for those those of ordinary skill in the art.Those skilled in the art are noted that under the situation that does not break away from spirit of the present invention or substantive characteristics, and the present invention can be with other forms, structure, layout, ratio, and realize with other elements, material and parts.Under the situation that does not break away from the scope of the invention and spirit, can carry out other distortion and change here to disclosed embodiment.
Claims (9)
1. the three-dimensional photoetching method made of an antenna, comprise: basal body structure spare is provided, surface at basal body structure spare forms conductive layer, the top formation photosensitive printing ink layer of conductive layer, and cover, exposure, develop, etching process is characterized in that: described conductive layer is formed on the three-dimensional surface of basal body structure spare, described photosensitive printing ink layer is formed on the three-dimensional surface of conductive layer, described cover with exposure process all be that three-dimensional surface to photosensitive printing ink layer carries out.
2. three-dimensional photoetching method as claimed in claim 1 is characterized in that, described photosensitive-ink is that a kind of main component is to the responsive photosensitive etching resisting ink that chemical reaction takes place of special spectrum.
3. three-dimensional photoetching method as claimed in claim 2 is characterized in that, described special spectrum is a ultraviolet light.
4. three-dimensional photoetching method as claimed in claim 1 is characterized in that, described conductive layer is a metal level.
5. three-dimensional photoetching method as claimed in claim 4 is characterized in that, described metal level is copper or nickel or silver layer; Metal level is one or more layers.
6. as claim 4 or 5 described three-dimensional photoetching methods, it is characterized in that described metal level is for electroplating chemical plating, the metal level that is coated with or brushes.
7. three-dimensional photoetching method as claimed in claim 1 is characterized in that described basal body structure spare is for can plate plastic cement.
8. three-dimensional photoetching method as claimed in claim 7 is characterized in that, the described plastic cement that plates is ABS.
9. three-dimensional photoetching method as claimed in claim 1 is characterized in that, if described conductive layer needs directly exposure, behind etching process, described method also comprises and takes off the film step.
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| CN200810204054A CN101752643A (en) | 2008-12-04 | 2008-12-04 | Three-dimensional photoetching method for antenna manufacture |
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| CN200810204054A CN101752643A (en) | 2008-12-04 | 2008-12-04 | Three-dimensional photoetching method for antenna manufacture |
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| CN101752643A true CN101752643A (en) | 2010-06-23 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102799076A (en) * | 2012-08-06 | 2012-11-28 | 深圳光启创新技术有限公司 | Exposure method for non-planar base material and exposure device |
| CN102956962A (en) * | 2011-08-24 | 2013-03-06 | 启碁科技股份有限公司 | Portable electronic device, antenna structure and antenna manufacturing method |
| CN103036022A (en) * | 2011-10-10 | 2013-04-10 | 启碁科技股份有限公司 | Portable electronic device, antenna structure thereof and antenna manufacturing method |
| CN103329346A (en) * | 2010-11-09 | 2013-09-25 | 黄基善 | Method for manufacturing three-dimensional conductor pattern using laser and apparatus for same |
| CN103582328A (en) * | 2012-07-23 | 2014-02-12 | 崇鼎科技有限公司 | Method for forming a metal component in a cabinet |
| CN103730720A (en) * | 2013-12-20 | 2014-04-16 | 上海安费诺永亿通讯电子有限公司 | Method for manufacturing antenna circuit on surface of antenna carrier with shielding structure |
-
2008
- 2008-12-04 CN CN200810204054A patent/CN101752643A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103329346A (en) * | 2010-11-09 | 2013-09-25 | 黄基善 | Method for manufacturing three-dimensional conductor pattern using laser and apparatus for same |
| CN102956962A (en) * | 2011-08-24 | 2013-03-06 | 启碁科技股份有限公司 | Portable electronic device, antenna structure and antenna manufacturing method |
| CN103036022A (en) * | 2011-10-10 | 2013-04-10 | 启碁科技股份有限公司 | Portable electronic device, antenna structure thereof and antenna manufacturing method |
| CN103582328A (en) * | 2012-07-23 | 2014-02-12 | 崇鼎科技有限公司 | Method for forming a metal component in a cabinet |
| CN103582328B (en) * | 2012-07-23 | 2016-05-18 | 崇鼎科技有限公司 | Method for forming a metal component in a cabinet |
| CN102799076A (en) * | 2012-08-06 | 2012-11-28 | 深圳光启创新技术有限公司 | Exposure method for non-planar base material and exposure device |
| CN102799076B (en) * | 2012-08-06 | 2016-01-13 | 深圳光启创新技术有限公司 | A kind of exposure method for non-planar substrates and exposure device |
| CN103730720A (en) * | 2013-12-20 | 2014-04-16 | 上海安费诺永亿通讯电子有限公司 | Method for manufacturing antenna circuit on surface of antenna carrier with shielding structure |
| CN103730720B (en) * | 2013-12-20 | 2016-04-13 | 上海安费诺永亿通讯电子有限公司 | A kind of method having the antenna carrier surface of barrier structure to make antenna traces |
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Application publication date: 20100623 |