CN101746090A - Bonding layer resisting high-temperature oxidation and formation of secondary reaction zone on high-temperature alloy surface and method for preparing same - Google Patents

Abstract

The invention discloses a bonding layer resisting high-temperature oxidation and the formation of a secondary reaction zone on a high-temperature alloy surface and a preparation method thereof. The preparation method comprises the following steps: firstly, electroplating a Ru layer on a substrate by using the electroplating method; and secondly, depositing a MCrAlYHf layer by using an electronic-beam physical vapor deposition method to obtain the bonding layer with a MCrAlYHf/Ru double-layer structure. The double-structured bonding layer can effectively resist the mutual-diffusion between the substrate and a coating element, resist the formation of the secondary reaction zone (SRZ), thereby improving the high-temperature oxidization resistant performance of the high-temperature alloy. The bonding layer is a novel thermal barrier coating bonding layer material.

Description

A bonding layer that resists high-temperature oxidation on the surface of a high-temperature alloy and prevents the formation of the second reaction zone and its preparation method

technical field

The present invention relates to a new type of thermal barrier coating bonding layer material and its preparation method, more specifically refers to a combination of two methods of electroplating and electron beam physical vapor deposition to prepare a MCrAlYHf/Ru double-layer structure resistant to high temperature oxidation and Effectively prevent the thermal barrier coating bonding layer material formed in the Secondary Reaction Zone (SRZ).

Background technique

In order to improve the thrust/mass ratio and service life of advanced turbine engines and reduce fuel consumption, the materials used for turbine blades have been developed from superalloys and directionally solidified crystalline alloys to single crystal superalloys. Use extreme temperature. As a surface thermal protection technology, thermal barrier coating plays an important role in further increasing the service temperature of alloy materials.

Thermal barrier coatings are mainly composed of ceramic layers and metal bonding layers (see Figure 1). The ceramic layer mainly plays the role of heat insulation, and the bonding layer mainly plays the role of resisting high temperature oxidation and alleviating the thermal expansion coefficient mismatch between the substrate and the ceramic layer. MCrAlY alloys (M is generally Ni, Co or Ni+Co) are traditional bonding layer materials, (Reference 1: Stiger MJ, Yanar NM, Topping M.G.. Thermal Barrier Coatings for 21 ^st Century[J]. Materials Research and Advanced Techniques, 1999, 12: 1069-1087) are generally used in an environment lower than 1150°C. MCrAlY coatings have been widely used as bonding layer materials due to their mature preparation technology, good matching with the thermal expansion coefficient of the ceramic layer and the substrate, and the ability to add other elements (such as Hf) for modification.

With the continuous development of Ni-based superalloys, especially Ni-based single crystal superalloys containing Re, the problem of interdiffusion between the substrate and the coating is quite serious. Refractory elements (such as W, Mo, Ta, Re, etc.) in the substrate diffuse to the coating, and Al elements in the coating diffuse to the substrate, resulting in the formation of the Secondary Reaction Zone (SRZ) (Reference 2: WalstonW.S., Schaeffer J.C., Murphy W.H..A New Type of Microstructural Instability inSuperalloys-SRZ[J].Superalloys 1996, ed.Kissinger R.D., et al.: 9-18), severely reduced the mechanical properties of the superalloy matrix And the high temperature oxidation resistance of the coating.

Contents of the invention

One of the objectives of the present invention is to provide a thermal barrier coating bonding layer material that is applied to superalloys and has high temperature oxidation resistance and can effectively prevent the formation of the second reaction zone (SRZ).

Another object of the present invention is to propose a method for preparing a thermal barrier coating by combining electroplating and electron beam physical vapor deposition. This preparation method is to first electroplate a layer of Ru on the substrate by electroplating, and then deposit a layer of MCrAlYHf (M is Ni+Co) by electron beam physical vapor deposition to obtain a MCrAlYHf/Ru double-layer structure adhesive. knot layer. This double-layer structural bonding layer can effectively block the interdiffusion of elements between the substrate and the coating, and inhibit the formation of the second reaction zone (SRZ), thereby improving the high-temperature oxidation resistance of the superalloy. Barrier Coating Tie Coat Material.

The invention provides a material suitable as a bonding layer of a thermal barrier coating. The bonding layer has a MCrAlYHf/Ru double-layer structure, the thickness of Ru is 3-8 μm, and the thickness of the MCrAlYHf layer is 40-60 μm.

The Ru layer has the effect of preventing interdiffusion of elements. After vacuum heat treatment, the Al in the MCrAlYHf layer diffuses to the Ru layer to form Ni(Ru)Al, thereby preventing the inward diffusion of the Al element in the coating and the difficulty in the substrate. The outward diffusion of molten elements such as W, Mo, Ta, Re, etc. inhibits the formation of SRZ zone. The MCrAlYHf layer, wherein M is Ni and Co, the content of Co is 15-25 at%, the content of Cr is 12-22 at%, the content of Al is 10-18 at%, the content of Y is 0.5-1 at%, and the content of Hf is ≤0.5 at %, the balance being Ni. The Al content is higher than that of traditional MCrAlY alloys.

To make the MCrAlYHf/Ru double-layer structure bonding layer, the present invention adopts the combination of two methods of electroplating and electron beam physical vapor deposition to prepare, and the preparation method includes the following steps:

The first step, substrate pretreatment

(A) Grind the substrate with 150#, 400#, 800# SiC water abrasive paper, so that the surface roughness of the substrate is Ra<0.8;

(B) Putting the substrate treated in step (A) into an alkaline cleaning solution and cleaning it with ultrasonic waves, wherein the temperature of the cleaning solution is 50-70° C., and cleaning for 2-5 minutes. Then wash with deionized water 2 to 3 times;

The alkaline cleaning solution is prepared from NaOH, Na ₂ CO ₃ , Na ₃ PO ₄ and deionized water, the concentration of which is:

NaOH: 10~30g/L; Na ₂ CO ₃ : 10~30g/L; Na ₃ PO ₄ : 10~30g/L;

(C) Put the substrate treated in step (B) into a sulfamic acid solution for activation for 50-100 seconds, and rinse it with deionized water for 2-3 times;

The sulfamic acid solution is prepared from sulfamic acid and deionized water, wherein the concentration of sulfamic acid is 5g/L.

(D) Wash the substrate treated in step (C) for 2 to 3 times in double distilled water, wherein the temperature of the last washing water is 60 to 70°C, and stay for 5 to 15 minutes to preheat;

In the present invention, the substrate is a Ni-based superalloy or a Ni-based single crystal superalloy;

The second step, electroplating the Ru layer

Putting the substrate pretreated in the first step into the Ru plating solution to electroplate the Ru layer;

The Ru plating solution is composed of RuCl ₃ , sulfamic acid and deionized water, the concentration of which is: RuCl ₃ : 4-10 g/L; sulfamic acid: 40-100 g/L.

The process parameters of Ru electroplating: the current density is 1.2-3.0A/ ^dm2 ; the temperature of the plating solution is 60-70°C; the anode is a titanium-coated ruthenium electrode; the cathode is the substrate to be plated; the electroplating time is 40-100min; 3 to 8 μm.

In the third step, electron beam physical vapor deposition of MCrAlYHf layer on the Ru layer

An MCrAlYHf layer was deposited on the Ru layer by electron beam physical vapor deposition (EB-PVD). The EB-PVD equipment model used is UE205. The deposition chamber is evacuated to 3×10 ^-3 Pa; the sample to be sprayed is preheated to 600°C; the electron beam voltage is 15kV; the electron beam current is 0.6A.

The deposition time is 0.5-1 h, and the deposition thickness is 40-60 μm.

Put the sample treated in the third step into a vacuum heat treatment furnace for vacuum heat treatment; after vacuum heat treatment, Al in the MCrAlYHf layer diffuses to the Ru layer to form Ni(Ru)Al.

The vacuum heat treatment parameters are: vacuum degree: P<2×10 ^-2 Pa; temperature: 900°C-1130°C;

Time: 2h～6h.

Advantages of the thermal barrier coating of the present invention and its preparation process:

(1) The present invention adopts the MCrAlY series alloy modified by Hf, which improves the binding force between the oxide layer and the bonding layer, thereby improving the life-span of the thermal barrier coating;

(2) The Al content in the MCrAlYHf used in the present invention is relatively high, reaching 10-18 at%, and diffuses to the Ru layer after vacuum heat treatment to form Ni(Ru)Al.

(3) The present invention adopts the electroplating process to deposit the Ru layer, the equipment is simple, the process is simple and convenient, and it is easy to operate. Compared with other methods for depositing Ru, this method has the lowest cost;

(4) The thickness of the Ru layer in the coating of the present invention is 3 to 8 μm, which can prevent the diffusion of Al elements into the matrix, and the outward diffusion of refractory elements W, Mo, Re, Ta, etc. in the matrix, and inhibit the second The formation of the secondary reaction zone (SRZ), thereby improving the creep strength, toughness and plasticity of the superalloy matrix;

(5) The adhesive layer with MCrAlYHf/Ru double-layer structure is oxidized at a high temperature of 900°C to 1130°C for 200h to 210h, and the oxidation weight gain is only 0.4mg/cm ² to 0.9mg/cm ² , and the oxidation resistance is good . After vacuum heat treatment at 900°C to 1130°C for 150h to 155h, no SRZ zone appears in the cross section of the coating, which shows that the adhesive layer of the present invention has excellent performance in preventing the formation of SRZ in the second reaction zone.

Description of drawings

Figure 1 is a schematic cross-sectional view of a traditional thermal barrier coating;

Fig. 2 is the MCrAlYHf/Ru bilayer structure sectional view that the present invention prepares;

Figure 3 is a schematic diagram of the high temperature oxidation resistance of two different coatings at different temperatures;

Figure 4 is a schematic diagram of the cross-sectional SRZ width of two different coatings at different vacuum heat treatment temperatures.

Detailed ways

The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

As shown in FIG. 2 , the present invention discloses a material suitable for a bonding layer of a thermal barrier coating, and the bonding layer has a double-layer structure of MCrAlYHf/Ru. The thickness of the Ru layer is 3-8 μm, which can effectively prevent the in-diffusion of Al in the coating and the out-diffusion of refractory elements in the matrix, thereby preventing the decline in the mechanical properties of the matrix caused by the interdiffusion of elements.

The MCrAlYHf, wherein M is Ni and Co, the Co content is 15-25 at%, the Cr content is 12-22 at%, the Al content is 10-18 at%, the Y content is 0.5-1 at%, and the Hf content is ≤0.5 at%. , and the balance is Ni. The Al content is higher than that of traditional MCrAlY alloys.

The Ru layer is prepared by electroplating with a thickness of 3-8 μm; the MCrAlYHf layer is prepared by an electron beam physical vapor deposition method with a thickness of 40-60 μm.

To make the MCrAlYHf/Ru double-layer structure bonding layer, the present invention adopts the combination of two methods of electroplating and electron beam physical vapor deposition to prepare, and the preparation method includes the following steps:

The first step, substrate pretreatment

(A) Grind the substrate with 150#, 400#, 800# SiC water abrasive paper, so that the surface roughness of the substrate is Ra<0.8;

(B) Putting the substrate treated in step (A) into an alkaline cleaning solution and cleaning it with ultrasonic waves, wherein the temperature of the cleaning solution is 50-70° C., and cleaning for 2-5 minutes. Then wash with deionized water 2 to 3 times;

The alkaline cleaning solution is prepared from NaOH, Na ₂ CO ₃ , Na ₃ PO ₄ and deionized water, the concentration of which is: NaOH: 10-30g/L; Na ₂ CO ₃ : 10-30g/L; Na ₃ PO ₄ : 10～30g/L;

(C) Put the substrate treated in step (B) into a sulfamic acid solution for activation for 50-100 seconds, and rinse it with deionized water for 2-3 times;

The sulfamic acid solution is prepared from sulfamic acid and deionized water, wherein the concentration of sulfamic acid is 5g/L.

(D) Wash the substrate treated in step (C) for 2 to 3 times in double distilled water, wherein the temperature of the last washing water is 60 to 70°C, and stay for 5 to 15 minutes to preheat;

In the present invention, the substrate is a Ni-based superalloy or a Ni-based single crystal superalloy;

The second step, electroplating the Ru layer

Putting the substrate pretreated in the first step into the Ru plating solution to electroplate the Ru layer;

The Ru plating solution is composed of RuCl ₃ , sulfamic acid and deionized water, the concentration of which is: RuCl ₃ : 4-10 g/L; sulfamic acid: 40-100 g/L.

The process parameters of Ru electroplating: the current density is 1.2-3.0A/ ^dm2 ; the temperature of the plating solution is 60-70°C; the anode is a titanium-coated ruthenium electrode; the cathode is the substrate to be plated; the electroplating time is 40-100min; 3~8μm.

In the third step, electron beam physical vapor deposition of MCrAlYHf layer on the Ru layer

An MCrAlYHf layer was deposited on the Ru layer by electron beam physical vapor deposition (EB-PVD). The EB-PVD equipment model used is UE205. The deposition chamber is evacuated to 3×10 ^-3 Pa; the sample to be sprayed is preheated to 600°C; the electron beam voltage is 15kV; the electron beam current is 0.6A.

The deposition time is 0.5-1 h, and the deposition thickness is 40-60 μm.

Carry out SEM, EPMA analysis to the sample section prepared through the above steps, (as shown in Figure 2) the results show that the present invention has successfully prepared the MCrAlYHf/Ru double-layer structure bonding layer.

Put the sample treated in the third step into a vacuum heat treatment furnace for vacuum heat treatment; after vacuum heat treatment, Al in the MCrAlYHf layer diffuses to the Ru layer to form Ni(Ru)Al.

The vacuum heat treatment parameters are: vacuum degree: 3×10 ^-3 Pa; temperature: 900°C-1130°C;

Time: 2h～6h.

Example 1:

The first step, substrate pretreatment

(A) The substrate is a Ni-based superalloy, the brand is DZ125, and the size is 8×13×3mm; the substrate is polished with 150#, 400#, 800# SiC water abrasive paper, so that the surface roughness of the substrate is Ra<0.8;

(B) Put the substrate treated in step (A) into an alkaline cleaning solution and clean it with ultrasonic waves, wherein the temperature of the cleaning solution is 50° C., and wash for 5 minutes. Then wash 3 times with deionized water;

The alkaline cleaning solution is prepared from NaOH, Na ₂ CO ₃ , Na ₃ PO ₄ and deionized water, the concentration of which is: NaOH: 30g/L; Na ₂ CO ₃ : 30g/L; Na ₃ PO ₄ : 30g/L;

(C) Put the substrate treated in step (B) into the sulfamic acid solution for activation for 100 seconds, and rinse it with deionized water for 3 times;

The sulfamic acid solution is prepared from sulfamic acid and deionized water, wherein the concentration of sulfamic acid is 5g/L.

(D) Wash the substrate treated in step (C) for 3 times in double distilled water, wherein the temperature of the last washing water is 60°C, and stay for 15 minutes to preheat;

The second step, electroplating the Ru layer

Putting the substrate pretreated in the first step into the Ru plating solution to electroplate the Ru layer;

The Ru plating solution is composed of RuCl ₃ , sulfamic acid, and deionized water, the concentration of which is: RuCl ₃ : 10 g/L; sulfamic acid: 100 g/L.

The process parameters of Ru electroplating: the current density is 1.2A/dm ² ; the bath temperature is 60°C; the anode is a titanium-coated ruthenium electrode; the cathode is the substrate to be plated; the electroplating time is 100min;

The thickness of the resulting coating was about 3 μm.

In the third step, electron beam physical vapor deposition of MCrAlYHf layer on the Ru layer

An MCrAlYHf layer was deposited on the Ru layer by electron beam physical vapor deposition (EB-PVD). The EB-PVD equipment model used is UE205. The deposition chamber is evacuated to 3×10 ^-3 Pa; the sample to be sprayed is preheated to 600°C; the electron beam voltage is 15kV; the electron beam current is 0.6A.

The deposition time is 60 min, and the deposition thickness is 60 μm.

Put the sample treated in the third step into a vacuum heat treatment furnace for vacuum heat treatment; after vacuum heat treatment, Al in the MCrAlYHf layer diffuses to the Ru layer to form Ni(Ru)Al.

The vacuum heat treatment parameters are: vacuum degree: 3×10 ^-3 Pa; temperature: 900°C;

Time: 6h.

After the sample prepared above was oxidized at 900°C for 200 hours in an atmospheric environment, the oxidation weight gain was 0.4 mg/cm ² , while the oxidation weight gain of the ordinary MCrAlYHf bonding layer was 0.7 mg/cm ² (as shown in Figure 3), indicating that MCrAlYHf The oxidation resistance of the /Ru double-layer structure bonding layer is better. In addition, after vacuum heat treatment at 900°C for 150 hours, the cross-section of the MCrAlYHf/Ru double-layer structure bonding layer did not appear to grow and widen the SRZ region, while the thickness of the SRZ region of the ordinary MCrAlYHf bonding layer increased significantly.

(as shown in Figure 4), it shows that the coating of the present invention has an excellent performance of preventing the formation of SRZ in the second reaction zone.

Example 2:

The first step, substrate pretreatment

(A) The substrate is a Ni-based single crystal superalloy, the grade is DD3, and the size is 8×10×3mm; the substrate is polished with 150#, 400#, 800# SiC water abrasive paper, so that the surface roughness of the substrate is Ra<0.8;

(B) Put the substrate treated in step (A) into an alkaline cleaning solution and clean it with ultrasonic waves, wherein the temperature of the cleaning solution is 65° C., and clean for 3 minutes. Then wash 3 times with deionized water;

The alkaline cleaning solution is prepared from NaOH, Na ₂ CO ₃ , Na ₃ PO ₄ and deionized water, the concentration of which is: NaOH: 20g/L; Na ₂ CO ₃ : 20g/L; Na ₃ PO ₄ : 20g/L;

(C) Put the substrate treated in step (B) into the sulfamic acid solution for activation for 80 seconds, and rinse it with deionized water for 3 times;

The sulfamic acid solution is prepared from sulfamic acid and deionized water, wherein the concentration of sulfamic acid is 5g/L.

(D) Wash the substrate treated in step (C) in double distilled water for 3 times, wherein the temperature of the last washing water is 65°C, and stay for 10 minutes to preheat;

The second step, electroplating the Ru layer

Putting the substrate pretreated in the first step into the Ru plating solution to electroplate the Ru layer;

The Ru plating solution is composed of RuCl ₃ , sulfamic acid, and deionized water, the concentration of which is: RuCl ₃ : 6 g/L; sulfamic acid: 60 g/L.

The process parameters of Ru electroplating: the current density is 2.0A/dm ² ; the bath temperature is 65°C; the anode is a titanium-coated ruthenium electrode; the cathode is the substrate to be plated; the electroplating time is 60min;

The thickness of the obtained coating is about 5 μm;

In the third step, electron beam physical vapor deposition of MCrAlYHf layer on the Ru layer

An MCrAlYHf layer was deposited on the Ru layer by electron beam physical vapor deposition (EB-PVD). The EB-PVD equipment model used is UE205. The deposition chamber is evacuated to 3×10 ^-3 Pa; the sample to be sprayed is preheated to 600°C; the electron beam voltage is 15kV; the electron beam current is 0.6A.

The deposition time is 45 minutes, and the deposition thickness is 50 μm.

Put the sample treated in the third step into a vacuum heat treatment furnace for vacuum heat treatment; after vacuum heat treatment, Al in the MCrAlYHf layer diffuses to the Ru layer to form Ni(Ru)Al.

The vacuum heat treatment parameters are: vacuum degree: 3×10 ^-3 Pa; temperature: 1000°C;

Time: 4h.

After the sample prepared above was oxidized at 1000°C for 210 hours in the air environment, the oxidation weight gain was 0.7 mg/cm ² , while the oxidation weight gain of the ordinary MCrAlYHf bonding layer was 1.0 mg/cm ² (as shown in Figure 3), indicating that MCrAlYHf The oxidation resistance of the /Ru double-layer structure bonding layer is better. In addition, after 1000°C vacuum heat treatment for 155h, the cross-section of the MCrAlYHf/Ru double-layer structure bonding layer does not appear to grow and widen in the SRZ region, while the thickness of the SRZ region of the common MCrAlYHf bonding layer obviously widens (as shown in Figure 4), illustrating the present invention The coating has excellent performance in preventing the formation of SRZ in the second reaction zone.

Example 3:

The first step, substrate pretreatment

(A) The substrate is a Ni-based single crystal superalloy, the brand is DD6, and the size is 6×10×3mm; the substrate is polished with 150#, 400#, 800# SiC water abrasive paper, so that the surface roughness of the substrate is Ra<0.8;

(B) Put the substrate treated in step (A) into an alkaline cleaning solution and clean it with ultrasonic waves, wherein the temperature of the cleaning solution is 70° C., and clean for 2 minutes. Rinse twice with deionized water;

The alkaline cleaning solution is prepared from NaOH, Na ₂ CO ₃ , Na ₃ PO ₄ and deionized water, the concentration of which is: NaOH: 10g/L; Na ₂ CO ₃ : 10g/L; Na ₃ PO ₄ : 10g/L;

(C) Put the substrate treated in step (B) into the sulfamic acid solution for activation for 50 seconds, and rinse it twice with deionized water;

The sulfamic acid solution is prepared from sulfamic acid and deionized water, wherein the concentration of sulfamic acid is 5g/L.

(D) Wash the substrate treated in step (C) twice in double distilled water, wherein the temperature of the last washing water is 70°C, and stay for 5 minutes to preheat;

The second step, electroplating the Ru layer

Putting the substrate pretreated in the first step into the Ru plating solution to electroplate the Ru layer;

The Ru plating solution is composed of RuCl ₃ , sulfamic acid, and deionized water, the concentration of which is: RuCl ₃ : 4 g/L; sulfamic acid: 40 g/L.

The process parameters of Ru electroplating: the current density is 3.0A/dm ² ; the bath temperature is 70°C; the anode is a titanium-coated ruthenium electrode; the cathode is the substrate to be plated; the electroplating time is 40min;

The resulting coating thickness is 8 μm;

In the third step, electron beam physical vapor deposition of MCrAlYHf layer on the Ru layer

An MCrAlYHf layer was deposited on the Ru layer by electron beam physical vapor deposition (EB-PVD). The EB-PVD equipment model used is UE205. The deposition chamber is evacuated to 3×10 ^-3 Pa; the sample to be sprayed is preheated to 600°C; the electron beam voltage is 15kV; the electron beam current is 0.6A.

The deposition time is 30 minutes, and the deposition thickness is 40 μm.

Put the sample treated in the third step into a vacuum heat treatment furnace for vacuum heat treatment; after vacuum heat treatment, Al in the MCrAlYHf layer diffuses to the Ru layer to form Ni(Ru)Al.

The vacuum heat treatment parameters are: vacuum degree: 3×10 ^-3 Pa; temperature: 1130°C;

Time: 2h.

After the sample prepared above was oxidized at 1130°C for 210 hours in the air environment, the oxidation weight gain was 0.9 mg/cm ² , while the oxidation weight gain of the ordinary MCrAlYHf bonding layer was 1.2 mg/cm ² (as shown in Figure 3). The oxidation resistance of the MCrAlYHf/Ru double-layer structure bonding layer is better. In addition, after 1130 DEG C of vacuum heat treatment for 155h, the cross-section of the MCrAlYHf/Ru double-layer structure bonding layer does not appear to grow and widen in the SRZ region, while the thickness of the SRZ region of the common MCrAlYHf bonding layer obviously widens (as shown in Figure 4), illustrating the present invention The coating has excellent performance in preventing the formation of SRZ in the second reaction zone.

Claims (9)

1. a superalloy surface anti-high temperature oxidation and prevent the bonding layer from forming in the second reaction zone, it is characterized in that: described bonding layer is MCrAlYHf/Ru double-layer structure, the thickness of Ru layer on the superalloy substrate surface The thickness of the MCrAlYHf layer on the Ru layer is 40-60 μm. 2. The bonding layer according to claim 1, characterized in that: the MCrAlYHf layer, wherein M is Ni and Co, the Co content is 15-25 at%, the Cr content is 12-22 at%, and the Al content is 10-25 at%. 18at%, the Y content is 0.5-1 at%, the Hf content is ≤0.5 at%, and the balance is Ni. 3. The bonding layer according to claim 1, characterized in that: the bonding layer of the MCrAlYHf/Ru double-layer structure is oxidized at a high temperature of 900°C to 1130°C for 200h to 210h, and the oxidation weight gain is 0.4 mg/ cm ² ~0.9mg/cm ² , after vacuum heat treatment at 900°C~1130°C for 150h~155h, no SRZ zone appears in the coating cross section. 4. A method for preparing a high-temperature oxidation-resistant superalloy surface and a bonding layer that prevents the formation of the second reaction zone, characterized in that: The first step, substrate pretreatment; In the second step, the Ru layer is electroplated; Putting the substrate pretreated in the first step into the Ru plating solution to electroplate the Ru layer; The Ru plating solution is composed of RuCl ₃ , sulfamic acid and deionized water, the concentration of which is: RuCl ₃ : 4-10 g/L; sulfamic acid: 40-100 g/L; The process parameters of Ru electroplating: the current density is 1.2-3.0A/dm ² ; the bath temperature is 60-70°C; The anode is a titanium-coated ruthenium electrode; the cathode is the substrate to be plated; the electroplating time is 40-100 minutes; the thickness of the obtained coating is 3-8 μm; The third step, electron beam physical vapor deposition MCrAlYHf layer on the Ru layer; The MCrAlYHf layer was deposited on the Ru layer by electron beam physical vapor deposition, and the deposition chamber was evacuated to 3×10 ^-3 Pa; the sample to be sprayed was preheated to 600°C; the electron beam voltage was 15kV; the electron beam current was 0.6A; the deposition time It is 0.5～1h. 5. preparation method according to claim 4, it is characterized in that: also comprise the step of vacuum heat treatment, put into vacuum heat treatment furnace through the sample that the 3rd step handles and carry out vacuum heat treatment; Al orientation in MCrAlYHf layer after vacuum heat treatment The Ru layer is diffused to form Ni(Ru)Al; the vacuum heat treatment parameters are: vacuum degree: P<2×10 ^-2 Pa; temperature: 900°C-1130°C; time: 2h-6h. 6. The preparation method according to claim 4, characterized in that: the substrate pretreatment described in the first step is specifically, (A) Grinding the substrate with SiC water abrasive paper so that the surface roughness of the substrate is Ra<0.8; (B) Put the substrate treated in step (A) into an alkaline cleaning solution and clean it with ultrasonic waves, wherein the temperature of the cleaning solution is 50-70° C., and wash it for 2-5 minutes; then wash it with deionized water for 2-3 times; (C) Put the substrate treated in step (B) into a sulfamic acid solution for activation for 50-100 seconds, and rinse it with deionized water for 2-3 times; (D) Wash the substrate treated in step (C) for 2 to 3 times in double distilled water, wherein the temperature of the last washing water is 60 to 70°C, and stay for 5 to 15 minutes to preheat; 7. The preparation method according to claim 6, characterized in that: the alkaline cleaning solution is prepared from NaOH, Na ₂ CO ₃ , Na ₃ PO ₄ and deionized water, wherein the concentration is: NaOH: 10 ～30g/L; Na ₂ CO ₃ : 10～30g/L; Na ₃ PO ₄ : 10～30g/L. 8. The preparation method according to claim 6, characterized in that: the sulfamic acid solution is prepared from sulfamic acid and deionized water, wherein the concentration of sulfamic acid is 5g/L. 9. The preparation method according to any one of claims 4-8 above, characterized in that: the substrate is a Ni-based superalloy or a Ni-based single crystal superalloy.

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