CN101742818B - Packaging method for combining sleeve screw with printed circuit board - Google Patents

Abstract

The invention relates to a packaging method for combining a telescopic screw with a printed circuit board, which is characterized in that the telescopic screw with a screw head, a screw rod and a sleeve is pressed against the screw head by a clamp, so that the clamp is clamped outside the sleeve; providing a printed circuit board with a through hole and a soldering tin layer; a tool is used for contacting the clamp to take the sleeve screw, so that the screw corresponds to the through hole of the printed circuit board; the tool release clamp enables the flange of the sleeve to be matched with the soldering tin layer to be limited in the through hole; the solder layer is hardened to fix the sleeve. Therefore, the sleeve of the telescopic screw can be accurately arranged without deviation or deflection and is easy to arrange.

Description

Packaging method for combining sleeve screws with printed circuit boards

technical field

The invention relates to a packaging method for combining a sleeve screw with a printed circuit board, in particular to a sleeve screw that can be set accurately, without deviation, without skew and easy to set. A packaging method that is screw-bonded to a printed circuit board.

Background technique

Figures 1 to 5 are schematic diagrams 1 and 2 of sleeve screws, schematic diagrams 1, 2 and 3 of existing conventional packaging methods, respectively. Generally, when combining sleeve screws on a printed circuit board, With a sleeve screw 5 having a screw head 51, a screw rod 52 and a sleeve 53, the sleeve 53 of the sleeve screw 5 corresponds to the perforation 71 of a printed circuit board 7, and then the screw head 51 is pressed down to make the sleeve The sleeve 53 of the screw 5 has a serrated flange 531 pressed into the through hole 71 to combine the sleeve screw 5 on the printed circuit board 7 .

Although the above-mentioned existing conventional method can combine the sleeve screw 5 in the perforation 71 of the printed circuit board 7, the sleeve screw 5 directly corresponds to the perforation 71 with its sleeve 53 when setting, and its screw head 51 and the sleeve 53 It cannot be compressed and fixed, so it needs to be placed manually, and the volume of the sleeve screw 5 and the hole diameter of the perforation 71 are small. Due to errors in manual placement, the flange 531 of the sleeve 53 cannot be aligned with the perforation 71 smoothly, resulting in poor pressing of the printed circuit board and damage to the board, and when the flange 531 of the sleeve 53 cannot be placed on the perforation 71 at one time , often due to the inaccurate plane accuracy of the printed circuit board 7, when the flange 531 of the sleeve 53 is disposed on the perforation 71, it cannot be completely pressed into the perforation 71, and the phenomenon of deviation and skewing is likely to occur. In addition, when assembling the socket screws 5 by pressing, each socket screw 5 must be used for pressing. Therefore, the efficiency of assembling the socket screws 5 cannot be optimized by using the surface mount technology widely used in the industry.

It can be seen that the above-mentioned existing packaging method of combining the sleeve screw with the printed circuit board obviously still has inconvenience and defects in terms of method and use, and needs to be further improved urgently. In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general method has no suitable method to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve. Therefore, how to create a new packaging method for combining the socket screw with the printed circuit board is one of the current important research and development topics, and it has also become a goal that the industry needs to improve.

In view of the above-mentioned existing defects in the packaging method of combining the socket screw with the printed circuit board, the inventor actively researched it based on his rich practical experience and professional knowledge in the design and manufacture of such products for many years, and in cooperation with the application of theories. Innovation, in order to create a new packaging method of combining sleeve screws with printed circuit boards, which can improve the general existing packaging method of combining sleeve screws with printed circuit boards, making it more practical. Through continuous research, design, and after repeated trials and improvements, the present invention with practical value is finally created.

Contents of the invention

The main purpose of the present invention is to overcome the defects of the existing packaging method of combining the sleeve screw with the printed circuit board, and provide a new packaging method of combining the sleeve screw with the printed circuit board. The technology to be solved The problem is to make the setting of the sleeve of the sleeve screw achieve the effects of precision, no deviation, no skew and easy setting, which is very suitable for practical use.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. A packaging method for combining a sleeve screw with a printed circuit board according to the present invention includes the following steps: providing a sleeve screw, the sleeve screw has a screw head, and a screw rod extending from an end surface of the screw head and a sleeve movably sleeved on the outside of the screw rod and limited on the screw rod; press a clamp against the screw head so that the screw head abuts against one end of the sleeve, and part of the screw rod protrudes from the outside the sleeve, and then clamp the jig outside the sleeve; provide a printed circuit board with a plurality of perforations, and make the printed circuit board lay a solder layer; make a tool contact the jig to take the sleeve screw, and move the tool so that the screw rod corresponds to the perforation; cause the tool to release the clamp to drop the clamp and sleeve screw, and place a flange of the sleeve in the perforation; heat the solder layer After melting the tin, it is cooled back to normal temperature to harden the solder layer, and fix the sleeve to the through hole; remove the jig.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned packaging method of combining a sleeve screw with a printed circuit board, the sleeve screw further has a spring, and the two ends of the spring respectively abut against the end surface of the screw head and the inside of the sleeve.

In the aforementioned packaging method of combining the sleeve screw with the printed circuit board, the outer ring of the sleeve is provided with a groove, and the clamp is clamped in the groove.

In the aforementioned packaging method for combining sleeve screws with a printed circuit board, the tool is a vacuum suction tool.

Compared with the prior art, the present invention has obvious advantages and beneficial effects. By means of the above technical solution, the packaging method of the present invention combining the sleeve screw with the printed circuit board has at least the following advantages and beneficial effects:

The present invention can effectively improve the various shortcomings of the conventional packaging method of combining the sleeve screw with the printed circuit board, and can make the sleeve of the sleeve screw achieve precision, no deviation, no skew and easy installation. The effect, and then make the present invention have the effect that technology is more advanced, more practical, more meets user's needs.

To sum up, the present invention can achieve the effects of precision, no deviation, no skew and easy setting when setting the sleeve of the sleeve screw. The present invention has significant progress in technology, and has obvious positive effects, and is a novel, progressive and practical new design.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

Fig. 1 is an exploded three-dimensional schematic diagram 1 of a sleeve screw.

Fig. 2 is an exploded perspective view II of the sleeve screw.

FIG. 3 is a first schematic diagram of a conventional packaging method.

FIG. 4 is a second schematic diagram of a conventional encapsulation method.

FIG. 5 is a third schematic diagram of an existing conventional encapsulation method.

Fig. 6 is a flowchart of the present invention.

Fig. 7 is a schematic diagram of the sleeve screw of the present invention.

Fig. 8 is a schematic diagram of the clip clamping sleeve of the present invention.

Fig. 9 is a schematic diagram of the corresponding perforation of the screw of the present invention.

Fig. 10 is a schematic diagram of the drop of the sleeve screw of the present invention.

Fig. 11 is a schematic view of the flange fixed in the through hole of the present invention.

Figure 12 is a schematic diagram of the removal fixture of the present invention

1: Sleeve screw 11: Screw head

12: Screw 13: Sleeve

131: Flange 132: Groove

14: Spring 15: Clamp

3: Printed circuit board 31: Perforation

32: Solder layer 4: Tools

5: Sleeve screw 51: Screw head

52: Screw 53: Sleeve

531: flange 7: printed circuit board

71: perforation

Detailed ways

In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, below in conjunction with the accompanying drawings and preferred embodiments, the specific implementation of the packaging method for combining sleeve screws with printed circuit boards according to the present invention Ways, methods, steps, features and effects thereof are described in detail below.

The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. Through the description of the specific implementation mode, when the technical means and effects adopted by the present invention to achieve the predetermined purpose can be obtained a deeper and more specific understanding, but the attached drawings are only for reference and description, and are not used to explain the present invention be restricted.

Please refer to Figures 6 to 12, which are the flow chart of the present invention, the schematic diagram of the sleeve screw, the schematic diagram of the clamp clamping the sleeve, the schematic diagram of the corresponding perforation of the screw, the schematic diagram of the sleeve screw falling, and the flange fixed on the Schematic illustration of the perforation and removal of the jig. A packaging method for combining sleeve screws with a printed circuit board according to the present invention at least includes the following steps:

Provide a sleeve screw 1, the sleeve screw 1 has a screw head 11, a screw rod 12 extending from an end surface of the screw head 11, and a sleeve movably sleeved on the outside of the screw rod 12 and limited on the screw rod 12 13;

A clamp 15 is pressed against the screw head 11, so that the screw head 11 abuts against one end of the sleeve 13, and part of the screw rod 12 protrudes from the sleeve 13, and then the clamp 15 is clamped on the sleeve 13. Outside the sleeve 13;

providing a printed circuit board 3 with a plurality of through holes 31, and laying a solder layer 32 on the printed circuit board 3;

Make a tool 4 contact the clamp 15 to take the sleeve screw 1, and move the tool 4 to make the screw rod 12 correspond to the perforation 31, and make the lower edge of the telescopic sleeve 13 of the sleeve screw 1 be away from the perforation 31 About 0.4 mm around the periphery;

Make the tool 4 release the clamp 15 so that the clamp 15 and the sleeve screw 1 fall down, and a flange 131 of the sleeve 13 is arranged in the through hole 31;

The solder layer 32 is heated to melt tin and then cooled back to normal temperature to harden the solder layer 32 and fix the sleeve 13 to the through hole 31 .

The clamp 15 is removed so that the screw head 11 is rebounded by the spring 14 and the screw rod 12 is retracted in the sleeve 13 .

The above-mentioned sleeve screw 1 can also have a spring 14, one end of the spring 14 abuts against the end surface of the screw head 11, and the other end of the spring 14 abuts against the inside of the sleeve 13, by the spring 14, the The sleeve 13 can elastically move on the screw rod 12 .

A groove 132 can be formed around the sleeve 13 , so that the clamp 15 can be clamped in the groove 132 to more firmly fix the screw head 11 , the screw rod 12 and the sleeve 13 .

The above tool 4 can be a vacuum suction tool.

In this way, when the present invention is packaged, the screw head 11 is first pressed against one end of the sleeve 13 by the clamp 15, so that part of the screw rod 12 is exposed outside the sleeve 13, and the sleeve screw 1 is packaged as a unified planar package. height, so that the flange 131 of the sleeve 13 can be accurately introduced into the through hole 31 of the printed circuit board 3 without deviation and skew.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, may use the technical content disclosed above to make some changes or modify them into equivalent embodiments with equivalent changes, but as long as they do not depart from the technical solution of the present invention, the Technical Essence Any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the technical solution of the present invention.

Claims (4)

1. one kind is incorporated into the method for packing of printed circuit board (PCB) with telescopic screw, it is characterized in that it comprises the following step:

1) telescopic screw is provided, this telescopic screw has a screw terminal, it is outer and be limited in the sleeve on this screw rod to extend a screw rod of the first end face of this screw and be movably set in this screw rod;

2) anchor clamps are compressed this screw terminal,, and this screw rod of part is stretched out outside this sleeve, this anchor clamps folder is formed on outside this sleeve so that this screw terminal is resisted against an end of this sleeve;

3) printed circuit board (PCB) with a plurality of perforation is provided, and makes this printed circuit board (PCB) lay a soldering-tin layer;

4) make these anchor clamps of a tool in contact taking this telescopic screw, and this instrument of moving make this screw rod to boring a hole;

5) make this instrument discharge these anchor clamps, and a flange of this sleeve is arranged in this perforation so that this anchor clamps and this telescopic screw fall;

6) make this soldering-tin layer add behind the hot melt tin that normal temperature is replied in cooling again so that the sclerosis of this soldering-tin layer, and make this sleeve be fixedly arranged on this perforation;

7) remove this anchor clamps.

2. according to claim 1 telescopic screw is incorporated into the method for packing of printed circuit board (PCB), it is characterized in that wherein said telescopic screw has more a spring, these spring two ends are resisted against respectively in this end face and this sleeve of this screw terminal.

3. according to claim 1 telescopic screw is incorporated into the method for packing of printed circuit board (PCB), it is characterized in that wherein said sleeve is equipped with a groove outward, this anchor clamps folder is formed on this groove.

4. according to claim 1 telescopic screw is incorporated into the method for packing of printed circuit board (PCB), it is characterized in that wherein said instrument is a vacuum suction instrument.

Images