CN101738508B - Probe tower and manufacturing method thereof - Google Patents

Abstract

The invention relates to a probe tower and a manufacturing method thereof, which are used for wafer testing and comprise the following steps: a circular body configured with an LCD test area and an I/O test area, the circular body having an upper body seat and a lower body seat; a plurality of groups of probe holes which are arranged in the LCD test area and the I/O test area and vertically penetrate through the upper body seat and the lower body seat; a plurality of groups of test probes arranged in the probe holes; the multiple groups of grounding holes are arranged in the I/O test area, and the multiple groups of grounding pins are tightly embedded into the multiple groups of grounding holes on one of the upper body seat and the lower body seat and are electrically conducted to the circular body. And the plurality of groups of spacing rings are made of insulating materials, are arranged at the end part of the probe hole, fix the test probe on the circular body and electrically insulate the test probe from the circular body. In addition, the circular body is made of glass fiber in the LCD test area, is made of aluminum alloy in the I/O test area, and the test probe in the I/O test area adopts a non-coaxial design taking air as a medium, so that the probe tower has a specific default value of characteristic impedance.

Description

A kind of probe tower and its manufacturing method

technical field

The invention relates to a probe tower, in particular to a probe tower that provides non-coaxial test probes with air as the medium in the I/O area, and a probe tower that has better impedance matching so that the test waveform is not distorted. needle tower.

Background technique

At present, the test probes on the probe tower are respectively arranged in the I/O area and the LCD area of the probe tower. The test probes used in the I/O area are thinner, and the test probes used in the LCD area are thicker. And at present, the test probes in the probe tower I/O area and LCD area are fixed. The part of the test probe sleeve is welded on the PCB board first, and then the test probe needle is put into the test probe sleeve. In the tube, and use the wires on the PCB board to connect the ground of the I/O area and the LCD area to each other, so as to eliminate noise and leakage current. The prior art US Pat. No. 6,114,869, US Pat. No. 6,166,553, US Pat. No. 6,304,092, US Pat. No. 6,741,072, and US Pat. No. 6,876,215 all disclose basic structures related to test probes and probe towers.

And the probe tower of known technology has following five problems in use at present:

1. Since the test probes used in the I/O area are relatively thin, parts of the test probe needles are often broken during computer calibration, and this type of test probe is more expensive.

2. Because the test probe of the probe tower is fixed by putting the test probe needle part into the test probe sleeve, when the test probe sleeve is damaged and needs to be replaced, the test probe sleeve must be removed. Only by welding can the test probe sleeve be removed and replaced, so it is not easy to repair.

3. In addition, because the contact force used by the I/O area of the probe tower and the test probe in the LCD area is too small, it often leads to poor contact, which consumes time for calibration.

4. The test probe in the I/O area of the probe tower is a coaxial design with Teflon as the medium, resulting in high cost.

5. When the test probe uses a non-coaxial design with air as the medium, although the cost is greatly reduced, it is subject to the problem of waveform distortion due to impedance mismatch during testing.

Contents of the invention

In order to solve the above problems, the present invention discloses a probe tower with a characteristic impedance using a body made of different materials. The probe is fixed on the probe tower, instead of welding the test probe to the PCB board first, and then putting the test probe needle into the test probe sleeve to solve the problem of the test probe sleeve in the known technology. When the damage needs to be replaced, the test probe sleeve must be dissoldered before the test probe sleeve can be removed for replacement. In addition, the insulating spacer ring can be used to isolate the test probe and the probe tower body so that they are not connected to each other. In addition, the ground pins are directly fitted into the probe tower body. By using different materials for the probe tower body, the ability of the probe tower to handle noise and leakage current will be improved, and the probe tower and test load can be reached. Impedance matching between the board and the probe card. In addition, the test probes in the I/O area of the probe tower use a non-coaxial design with air as the medium, which can greatly reduce the cost of test probes.

The main purpose of the present invention is to provide a probe tower for wafer testing to achieve the effect of reducing noise.

Another object of the present invention is to provide a method for manufacturing a probe tower for wafer testing, so as to achieve the effect of reducing noise.

Another object of the present invention is to provide a probe tower for wafer testing to achieve the effect of reducing leakage current.

Another object of the present invention is to provide a method for manufacturing a probe tower for wafer testing, so as to achieve the effect of reducing leakage current.

Another object of the present invention is to provide a probe tower for wafer testing to form impedance matching between the probe tower, the test carrier board and the needle test card, thereby solving the problem of waveform distortion caused by the test.

Another object of the present invention is to provide a method for manufacturing a probe tower for wafer testing, so as to form an impedance matching between the probe tower, the test carrier board and the needle test card, thereby solving the problem of waveform distortion caused by the test. question.

Another object of the present invention is to provide a probe tower for wafer testing, which reduces the cost of the test probes by using non-coaxial test probes with air as the medium in the I/O area.

Another object of the present invention is to provide a method for manufacturing a probe tower for wafer testing, by using non-coaxial test probes with air as the medium in the I/O area to reduce the cost of the test probes.

Accordingly, the present invention provides a probe tower for wafer testing, comprising: a circular body configured with an LCD test area and an I/O test area, and the circular body has a body upper seat and a body lower seat; Multiple groups of probe holes are arranged in the LCD test area and I/O test area, and vertically pass through the upper body and the lower body of the body; multi-group test probes are arranged in the probe holes to pass the test through the circular body Signal; multi-group ground holes and ground pins are arranged in the I/O test area, among which the multi-group ground pins are embedded in the multi-group ground holes of one of the upper body and the lower body of the body in a tight fit, and are electrically connected to the The circular body is used to ground the noise and leakage current of adjacent test probes; and a plurality of spacer rings, made of insulating material, are arranged at the ends of the probe holes to fix the test probes on equal probes. In the pinhole, and provide electrical insulation of equal test probes and circular body; it is characterized in that the circular body is made of glass fiber in the LCD test area, and aluminum alloy in the I/O test area. In addition The test probes in the I/O test area are non-coaxial with air as the medium, so that the probe tower has a specific default characteristic impedance.

Next, the present invention provides a probe tower manufacturing method for wafer testing, including: providing a circular body, the circular body is configured with an LCD test area and an I/O test area, and the circular body has a body upper seat And a body lower seat, in which the circular body in the LCD test area is made of glass fiber, and the circular body in the I/O test area is made of aluminum alloy; multiple groups of probe holes are provided, and the probe holes are arranged in the LCD The test area and the I/O test area vertically run through the upper seat and the lower seat of the body; and provide multiple groups of test probes, which are arranged in the probe holes to transmit test signals passing through the circular body. The probe adopts a non-coaxial design with air as the medium, so that the probe tower has a predetermined value of characteristic impedance; provide multiple groups of grounding holes, arranged in the I/O test area; provide multiple groups of grounding pins to The tight fitting method is embedded in the multi-group grounding hole that runs through the upper body or the lower body of the body, and is electrically connected to the circular body to ground the noise and leakage current of the adjacent test probes; and provide multi-group spacing rings , made of insulating material, arranged at the end of the probe hole, used to fix the test probe in the probe hole, and provide electrical insulation between the test probe and the circular body.

Description of drawings

Fig. 1 is a perspective view, is the first preferred embodiment that the present invention proposes, is a kind of probe tower that is used for wafer testing;

Fig. 2 is a sectional view, is the LCD test area A-A section of Fig. 1 that the present invention proposes;

Fig. 3 is a sectional view, is the I/O test area B-B section of Fig. 1 that the present invention proposes;

Fig. 4 is a top view, which is an illustration of the staggered arrangement of test probes and ground pins in the I/O test area of the first preferred embodiment of the present invention;

Fig. 5 is a cross-sectional view, which is an enlarged illustration of Fig. 4;

Fig. 6 is a flow chart, is the second preferred embodiment that the present invention proposes, is a kind of probe tower manufacturing method for wafer testing;

FIG. 7 is a schematic diagram of a test system with a probe tower according to a third preferred embodiment of the present invention.

Explanation of main component symbols

Probe Tower 10, 312

Round Body 11

Main body seat 111

Body lower seat 112

Cover plate 113

LCD test area 12

I/O test area 13

Probe hole 14

Test Probe 15

Air 150

Ground hole 16

Ground pin 17

spacer ring 18

Test System 30

Wafer test socket 31

Sports platform 311

Needle test card 313

Test carrier board 32

Test bench 33

Wafer to be tested 34

Detailed ways

Since the present invention discloses a wafer test of integrated circuit components in a back-end semiconductor process, the basic manufacturing and semiconductor testing principles of the probe towers used have been understood by those with ordinary knowledge in the relevant technical field, so the following Description, no complete description. At the same time, the drawings compared in the following are schematic structural representations related to the features of the present invention, and are not and need not be completely drawn according to the actual size, and are described first.

Please refer to FIG. 1 to FIG. 3 , according to a first preferred embodiment of the present invention, it is a probe tower 10 for wafer testing. The probe tower 10 includes a circular body 11, multiple groups of probe holes 14, multiple groups of test probes 15, multiple groups of grounding holes 16 (the grounding holes 16 should not penetrate the Pogo tower in Figure 1), multiple groups of grounding pins 17 and Multiple groups of spacer rings 18 . The probe tower 10 is composed of an LCD test area 12 and an I/O test area 13, wherein the LCD test area 12 and the I/O test area 13 are distributed in four quadrants of the circular body, and the LCD test area 12 is opposite to each other. The distribution area ratio of the I/O test area 13 is 3:1, and the top and bottom of the circular body 11 are respectively composed of a body upper seat 111 and a body lower seat 112 . The body upper seat 111 and the body lower seat 112 of the circular body 11 are electrically connected. The multi-group probe holes 14 are arranged in the LCD test area 12 and the I/O test area 13, and vertically run through the body upper seat 111 and the body lower seat 112, as shown in dotted lines in FIG. 2 , and the multi-group test probes 15 are relatively arranged in The probe hole 14 is used to transmit the test signal through the circular body 11 . It should be noted that the biggest difference between the probe tower 10 of the present invention and the generally known probe towers is:

(1) Circular bodies using materials with different conductive properties:

Generally known probe towers use the same conductive material, but the circular body 11 of the probe tower 10 of the present invention is made of glass fiber in the LCD test area 12, which has non-conductive properties, and in the I/O test area 13 It is made of aluminum alloy (No. A6061T6) and has conductive properties.

(2) Use air-based test probes in the I/O test area:

Generally, the test probe of the known probe tower in the I/O test area is a coaxial design with Teflon as the medium, so the cost is relatively high, but the test of the probe tower 10 of the present invention in the I/O test area 13 Probe 15 is a non-coaxial design with air 150 as the medium, as shown in Figure 5, that is, Teflon is removed as the medium, and only the spacer ring 18 is made of Teflon, so the entire test probe Reduce costs.

At the same time, the characteristic impedance is set to have the same impedance matching with the test carrier board and the needle test card connected to the probe tower. In this embodiment, the characteristic impedance is set to 75Ω (ohm), so it can be ensured that the probe tower is used for chip inspection. During the test, the test signal waveform is not distorted. Then, according to the above-mentioned different material properties of the circular body and the calculation formula of the characteristic impedance, the outer diameters of the test probe 15 and the ground pin 17 in the I/O test area are respectively 0.8 cm and 2.8 cm. Apparently, compared with the outer diameter of the test probe used in the I/O test area of the known probe tower of 0.6 cm, the outer diameter of the test probe of the present invention can avoid the problem of easy breakage.

In the above-mentioned embodiment, please refer to FIG. 3 again. Multiple groups of grounding holes 16 are arranged in the I/O test area 13, wherein the grounding holes 16 are arranged in the form of blind holes on the body upper seat 111 or the body lower seat 112, or at the same time It is arranged on the body upper seat 111 and the body lower seat 112. In addition, the body upper seat 111 and the body lower seat 112 are embedded with the above-mentioned grounding pins 17 at the same time. It is electrically connected to the circular body 11 to ground the noise and leakage current of adjacent test probes 14 , thus increasing the ability of the probe tower to deal with noise and reduce leakage current. In addition, multiple groups of spacer rings 18 use Teflon as an insulating material, as shown in FIG. Electrical insulation of the needle 15 and the circular body 11 .

In the above-mentioned embodiment, the test probes 15 and the ground pins 17 of the I/O test area 13 are arranged in a staggered manner, as shown in FIGS. The number of test probes 15, for example, the number of each group of grounding pins in this embodiment is 5. The number of ground pins 17 is smaller than the number of test probes 15 in the I/O test area 13 , and the length of the ground pins 17 is shorter than the thickness of the upper body base 111 or the lower body base 112 .

In the above-mentioned embodiment, the circular body 11 further includes a pair of cover plates 113, which are respectively arranged above the upper body seat 111 and below the lower body seat 112, as shown in FIG. 18, and provide a fixed staggered position of the test probe 15 and the grounding pin 17. The outer diameter of the test probe 15 is obtained by calculating the impedance of the test probe 15, and it is designed with appropriate strength to prevent the test probe from being in the calibration machine , the problem that the part of the needle is easy to break.

In addition, according to the second embodiment provided by the present invention, it is a method for manufacturing a probe tower for wafer testing. This production method includes the following steps:

(1) Provide a circular body (step 21), wherein the circular body is configured with an LCD test area and an I/O test area, and the circular body has a body upper seat and a body lower seat, wherein the circular body in the LCD test area The shaped body is made of glass fiber, while the circular body of the I/O test area is made of aluminum alloy. The upper seat of the circular body and the lower seat of the body are electrically connected. In the four quadrants of the circular body, and the distribution area ratio of the LCD test area to the I/O test area is 3:1;

(2) Provide multiple groups of probe holes (step 22), wherein the probe holes are arranged in the LCD test area and the I/O test area, and vertically penetrate the upper body and the lower body;

(3) Provide multiple groups of test probes (step 23), which are arranged in the probe holes to transmit test signals passing through the circular body, wherein the test probes adopt a non-coaxial design with air as the medium, Accordingly, the probe tower is provided with a characteristic impedance of a predetermined value;

(4) Provide multiple groups of grounding holes (step 24), which are arranged in the I/O test area, wherein the grounding holes are arranged in the form of blind holes on the upper body or the lower body, or at the same time on the upper body and the lower body;

(5) Provide multi-group grounding pins (step 25), which are embedded in the multi-group grounding holes of one of the upper body and the lower body in a tight fit. In addition, the grounding holes of the upper body and the lower body are embedded with the above-mentioned The ground pin is electrically connected to the circular body to ground the noise and leakage current of adjacent test probes to reduce the handling capacity of noise and leakage current; and

(6) Provide multiple groups of spacer rings (step 26), made of insulating material, configured at the end of the probe hole, in order to fix the test probe in the probe hole, and provide the test probe and the circular body Electrically insulated.

In the above embodiments, the test probes and ground pins in the I/O test area are arranged in a staggered manner. The number of each group of grounding pins is less than the number of adjacent test probes, and the number of each group of grounding pins is 5. The number of groups of ground pins is smaller than the number of test probes in the I/O test area, and the length of the ground pins is shorter than the thickness of the upper body or the lower body. In addition, the circular body further includes a pair of cover devices, which are respectively arranged above the upper body seat and below the lower body seat, for blocking the corresponding spacer rings and providing a fixed staggered position for the test probes and the grounding pins. The outer diameter of the test probe is obtained by calculating the impedance of the test probe, and the appropriate strength is designed to avoid the problem that the needle part of the test probe is easily broken when the machine is calibrated.

Please refer to FIG. 7 , according to a third preferred embodiment of the present invention, it is a wafer testing system 30 for wafer testing. This wafer testing system 30 comprises: a test base 31, a test carrier 32 and a test bench 33, wherein the above-mentioned test base 31 has at least a moving platform 311, a probe tower 312 and a needle measuring card 313, and the movement The platform 311 is used to carry a wafer to be tested 34 and provide the movement of the wafer to be tested 34 along the three axes of X-Y-Z on the motion platform 311. The needle test card 313 is to carry out the wafer test of the wafer to be tested 34 and place the wafer to be tested The electrical test signal of 34 is output to the test carrier board 32 via the probe tower 312 to provide the test platform 33 for subsequent signal analysis and processing, and the test carrier board 32 is replaced by As the interface between the test bench 33 and the needle test card 313 , the test bench 33 performs subsequent signal analysis and processing on the test signal received from the test carrier board 32 , and generates and outputs wafer test results after calculation and statistics. The technical features and related structures of the probe tower 312 are as described in the probe tower 10 of the first embodiment.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of rights of the present invention; at the same time, the above descriptions should be clear and implementable for those who are familiar with the technical field, so others do not depart from the disclosure of the present invention. Equivalent changes or modifications completed under the spirit of , shall be included in the scope of the following patent applications.

Claims (9)

1. A probe tower for wafer testing comprising: A circular body is configured with an LCD test area and an I/O test area, and the circular body has a body upper seat and a body lower seat; Multiple groups of probe holes are arranged in the LCD test area and the I/O test area, and vertically penetrate the upper body and the lower body; Multiple groups of test probes are arranged in the probe holes for transmitting test signals passing through the circular body; It is characterized by: Multiple groups of grounding holes and grounding pins are arranged in the I/O test area, wherein these multiple groups of grounding pins are embedded in the multiple groups of grounding holes of one of the upper body and the lower body of the body in a tight fit, and are electrically connected to the the circular body for grounding noise and leakage currents of adjacent test probes; and Multiple groups of spacer rings, made of insulating material, are arranged at the ends of the probe holes for fixing the test probes in the probe holes and providing electrical insulation between the test probes and the circular body ; The circular body is made of glass fiber in the LCD test area, and aluminum alloy in the I/O test area. In addition, the test probes in the I/O test area use a non-coaxial design with air as the medium. Furthermore, the probe tower has a characteristic impedance of a specific default value, wherein the characteristic impedance of a specific default value is 75 ohms, the diameters of these test probes and grounding pins are 0.8 cm and 2.8 cm respectively, the body upper seat and the body The lower seat is electrically connected, and the circular body is made of conductive material. 2. The probe tower according to claim 1, wherein the LCD test area and the I/O test area are distributed in four quadrants of the circular body, and the LCD test area is opposite to the I/O test area. The distribution area ratio of the test area is 3:1. 3. The probe tower according to claim 1, wherein the grounding holes are blind holes in the upper seat of the main body. 4 . The probe tower according to claim 1 , wherein the ground holes are blind holes in the lower seat of the main body. 5. according to the described probe tower of claim 1, it is characterized in that, described body upper seat and this These grounding pins are embedded in the base of the main body at the same time. 6. The probe tower according to claim 1, characterized in that, the test probes and the ground pins in the I/O test area are arranged in a staggered manner, and the number of each group of ground pins is smaller than its adjacent test pins The number of probes, and the number of each group of grounding pins is 5. 7. according to the described probe tower of claim 1, it is characterized in that, the group number of these ground pins is less than the group number of the test probe of this I/O test area, and the length of these multi-group ground pins is shorter than The thickness of the body upper seat or body lower seat. 8. The probe tower according to claim 1, wherein the circular body further includes a pair of cover devices, which are respectively arranged above the upper seat of the body and below the lower seat of the body for blocking and corresponding The spacer rings, and the outer diameter of the test probe is calculated from its impedance. 9. A method for making a probe tower, the probe tower can be used for wafer testing, characterized in that, comprising: A circular body is provided, the circular body is configured with an LCD test area and an I/O test area, and the circular body has a body upper seat and a body lower seat, wherein the circular body in the LCD test area is made of glass fiber material, and the circular body of the I/O test area is made of aluminum alloy; Provide a plurality of groups of probe holes, these probe holes are arranged in the LCD test area and the I/O test area, and vertically pass through the body upper seat and the body lower seat; and Multiple groups of test probes are provided, and these test probes are arranged in these probe holes to transmit test signals through the circular body, wherein these test probes adopt a non-coaxial design with air as the medium, accordingly Make the probe tower have a characteristic impedance of a predetermined value, wherein the characteristic impedance of the predetermined value is 75 ohms, the diameters of these test probes and grounding pins are 0.8 cm and 2.8 cm respectively, and the upper seat of the body and the lower seat of the body are electrically connected Sexual conduction, the circular body is made of conductive material; Provide multiple groups of grounding holes, configured in the I/O test area; Provide multiple groups of grounding pins, which are embedded in multiple groups of grounding holes in one of the upper body and the lower body in a tight fit, and are electrically connected to the circular body to eliminate noise from adjacent test probes and earth leakage current; and Provide a plurality of groups of spacer rings, made of insulating material, configured at the ends of the probe holes, for fixing the test probes in the probe holes, and providing the electrical properties of the test probes and the circular body insulation. the

Images