CN101730384A - Soft and hard circuit board - Google Patents

Abstract

The present invention discloses a rigid-flexible circuit board, which includes a plurality of rigid circuits, a flexible circuit and a shielding film. The flexible circuit is connected between the rigid circuits and has a grounding pad, which is exposed on a surface of the flexible circuit. The shielding film covers the surface of the flexible circuit and is connected to the grounding pad. Therefore, by directly connecting the shielding film covering the flexible circuit to the grounding pad of the flexible circuit, the shielding film is indirectly connected to the ground of the rigid circuits through the flexible circuit.

Description

Rigid and flexible circuit board

technical field

The present invention relates to a circuit board, and in particular to a flexible and rigid circuit board with both flexible and rigid circuits.

Background technique

In terms of the soft and hard properties of the dielectric layer, circuit boards include rigid circuit boards (abbreviated as rigid boards), flexible circuit boards (referred to as flexible boards) and flexible and rigid circuit boards (referred to as flexible and rigid boards). The process of rigid-flex boards makes conductive lines on the flexible dielectric layer and hard dielectric layer at the same time, which makes the rigid-flex boards have both flexible lines and hard lines. In the case of rapid compression of the internal space of electronic products, since rigid-flex boards provide the greatest flexibility in parts connection and assembly space, electronic products often use rigid-flex boards as their component carriers.

Contents of the invention

The invention provides a flexible and hard circuit board to provide shielding effect.

The invention provides a flexible and rigid circuit board, which includes a plurality of rigid circuits, a flexible circuit and a shielding film. The flexible circuit is connected between the rigid circuits and has a ground pad exposed on a surface of the flexible circuit. Shielding film covers the surface of the flexible circuit and connects to the ground pad.

In an embodiment of the present invention, the flexible circuit has a protrusion protruding from a side edge of the flexible circuit, and the ground pad is located on the protrusion.

In an embodiment of the present invention, the flexible circuit has a ground wire, and the ground pad is a part of the ground wire.

In an embodiment of the present invention, the flexible circuit further has a flexible dielectric layer covering the ground wire but exposing the ground pad.

In an embodiment of the present invention, the shielding film is connected to the ground of these rigid circuits via a ground wire.

In an embodiment of the present invention, the rigid-flex circuit board further includes a flexible insulating layer disposed on the surface of the flexible circuit and covering the shielding film.

In an embodiment of the invention, the shielding film is a conductive material.

In an embodiment of the invention, the shielding film is a silver film.

The present invention further proposes an electronic device, which includes the above-mentioned hard-flex circuit board.

Based on the above, the present invention directly connects the shielding film covering the flexible circuit to the grounding pad of the flexible circuit, so that the shielding film is indirectly connected to the ground of these rigid circuits through the flexible circuit.

Description of drawings

In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein:

FIG. 1 is a top view of a rigid-flex circuit board according to an embodiment of the present invention.

FIG. 2 is an enlarged view of area A of the rigid-flex circuit board in FIG. 1 .

FIG. 3 is a cross-sectional view of the rigid-flex circuit board in FIG. 2 along line 3-3.

Description of main component symbols:

100: soft and hard circuit board

110: hard line

120: soft line

120a: Convex part

122: conductive pattern

122a: Ground wire

122a': Ground pad

122b: signal line

124: Soft dielectric layer

124a: opening

130: shielding film

140: Soft insulating layer

Detailed ways

FIG. 1 is a top view of a rigid-flex circuit board according to an embodiment of the present invention. Please refer to FIG. 1 , the rigid and flexible circuit board 100 of this embodiment has a plurality of rigid circuits 110 and a flexible circuit 120 . These rigid circuits 110 use rigid dielectric material as their dielectric layer material, and these rigid circuits 110 are used to carry electronic components or connectors. In addition, the flexible circuit 120 uses a flexible dielectric material as its dielectric layer material, and the flexible circuit 120 is connected between the rigid circuit boards 110 for transmitting electrical signals.

FIG. 2 is an enlarged view of area A of the rigid-flex circuit board in FIG. 1 , and FIG. 3 is a cross-sectional view along line 3-3 of the rigid-flex circuit board in FIG. 2 . Please refer to FIG. 1 , FIG. 2 and FIG. 3 , in order to provide good shielding for multiple wires in the flexible circuit 120 , the flexible and rigid circuit board 100 further includes a shielding film 130 (see FIG. 3 ), which covers the flexible circuit 120 of a surface.

In order to ground the shielding film 130, the flexible circuit 120 has a grounding pad 122a' exposed on the above-mentioned surface of the flexible circuit 120, as shown in FIG. 3 . Therefore, when the shielding film 130 covers the above-mentioned surface of the flexible circuit 120, the shielding film 130 will pass through the opening 124a of the upper flexible dielectric layer 124 and structurally connect the ground pad 122a' for electrically connecting to the rigid circuit. The ground of line 110.

In this embodiment, the shielding film 130 can be connected to the ground of the rigid circuit 110 via the ground pad 122a'. The conductive shielding film 130 can be a silver film.

In this embodiment, the flexible circuit 120 has a ground wire 122a and a flexible dielectric layer 124a, wherein the ground pad 122a' is a part of the ground wire 122a and is exposed outside the flexible dielectric layer 124a. In addition, the flexible circuit 120 further has a convex portion 120a, which protrudes from one side edge of the flexible circuit 120, and the ground pad 122a' is a convex portion of the ground wire 122a, and is located on the convex portion 120a.

In this embodiment, in addition to the upper flexible dielectric layer 124, the flexible circuit 120 further has two conductive patterns 122 and another two flexible dielectric layers 124, wherein these conductive patterns 122 and these flexible dielectric layers 124 The conductive patterns 122 above are alternately stacked to form a ground line 122a and a plurality of signal lines 122b beside the ground line 122a.

In this embodiment, the rigid-flex circuit board 100 further has a flexible insulating layer 140 disposed on the surface of the flexible circuit 120 and covering the shielding film 130 , the detailed structure of which is shown in FIG. 3 . The flexible insulating layer 140 prevents the shielding film 130 from being electrically connected to the outside world.

The above-mentioned hard and soft circuit board 100 can be applied in various electronic devices, such as personal computer (PC), mini mobile computer (UMPC), mobile phone (Mobile Phone), personal digital assistant (PDA), satellite navigation device (GPS) wait.

To sum up, the present invention directly connects the shielding film covering the flexible circuits to the grounding pads of the flexible circuits, so that the shielding film is indirectly connected to the ground of the rigid circuits through the flexible circuits.

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection should be defined by the claims.

Claims (9)

1. soft hard circuit board comprises:

A plurality of rigid circuits;

One soft circuit is connected between those rigid circuits, and has a ground mat, and it is exposed to a surface of this soft circuit; And

One shielded film covers this surface of this soft circuit, and connects this ground mat.

2. soft hard circuit board as claimed in claim 1 is characterized in that, this soft circuit has a protuberance, its outstanding lateral margin from this soft circuit, and this ground mat is positioned at this protuberance.

3. soft hard circuit board as claimed in claim 1 is characterized in that, this soft circuit has an earth connection, and this ground mat is the part of this earth connection.

4. soft hard circuit board as claimed in claim 3 is characterized in that, this soft circuit has more a soft dielectric layer, and it covers this earth connection, but exposes this ground mat.

5. soft hard circuit board as claimed in claim 1 is characterized in that, this shielded film is connected to the ground connection of those rigid circuits by this earth connection.

6. soft hard circuit board as claimed in claim 1 is characterized in that, more comprises:

One soft insulating barrier is disposed on this surface of this soft circuit, and covers this shielded film.

7. soft hard circuit board as claimed in claim 1 is characterized in that, this shielded film is a conductive material.

8. soft hard circuit board as claimed in claim 1 is characterized in that, this shielded film is a silverskin.

9. an electronic installation comprises soft hard circuit board as claimed in claim 1.

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