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CN101728467A - Light-emitting device, backlight module and liquid crystal display - Google Patents

Light-emitting device, backlight module and liquid crystal display Download PDF

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Publication number
CN101728467A
CN101728467A CN200810174616A CN200810174616A CN101728467A CN 101728467 A CN101728467 A CN 101728467A CN 200810174616 A CN200810174616 A CN 200810174616A CN 200810174616 A CN200810174616 A CN 200810174616A CN 101728467 A CN101728467 A CN 101728467A
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light
those
emitting device
scattering particles
substrate
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CN101728467B (en
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杨坤璋
毛立维
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Chi Mei Optoelectronics Corp
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Chi Mei Optoelectronics Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

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Abstract

A light emitting device, a backlight module and a liquid crystal display are provided. The backlight module comprises a frame and a light source, and the light source is arranged in the frame. The light source comprises a substrate and a plurality of light-emitting devices, wherein each light-emitting device comprises at least one light-emitting chip, a plurality of scattering particles and a sealant. The light-emitting chip, the scattering particles and the sealant are all arranged on the substrate, wherein the scattering particles are positioned beside the light-emitting chip, and the sealant coats the light-emitting chip and at least part of the scattering particles.

Description

发光装置、背光模块及液晶显示器 Light emitting device, backlight module and liquid crystal display

技术领域technical field

本发明是有关于一种发光装置、背光模块及液晶显示器,且特别是有关于具有均匀发光光形的发光装置以及使用此发光装置的背光模块及液晶显示器。The present invention relates to a light-emitting device, a backlight module and a liquid crystal display, and in particular to a light-emitting device with a uniform light shape and a backlight module and a liquid crystal display using the light-emitting device.

背景技术Background technique

液晶显示器可大致分为液晶显示面板以及背光模块两大组成,其中背光模块用以提供足够的亮度给液晶显示面板,液晶显示面板才能够显示图像。此外,由于发光装置具有体积小、寿命长、低电压/电流驱动、不易破裂、不含水银(没有污染问题)以及发光效率佳(省电)等特性,因此背光模块中也开始使用发光装置取代传统冷阴极荧光灯管。The liquid crystal display can be roughly divided into two major components: a liquid crystal display panel and a backlight module. The backlight module is used to provide sufficient brightness for the liquid crystal display panel so that the liquid crystal display panel can display images. In addition, because the light-emitting device has the characteristics of small size, long life, low voltage/current drive, not easy to break, mercury-free (no pollution problem), and good luminous efficiency (power saving), etc., light-emitting devices have also begun to be used in backlight modules to replace Traditional cold cathode fluorescent tubes.

图1A为已知一种发光装置的示意图。如图1A示,此种发光装置100是将多个发光芯片110直接设置在基板120上(Chip on Board)(图1A仅示意地绘示一个发光芯片),然后再使封胶130覆盖每一个发光芯片110,以形成光条(Light Bar)或是面光源。这种类型的发光装置100可以降低光条的散热问题。但是,与封装成一颗颗单体的发光装置相比,将这种发光芯片110设置在基板120上的发光装置100应用于背光模块内,发光装置100的发光效率远低于单颗的发光装置。详究其原因,是因为当发光芯片110发光时,仅会有部分的光线离开封胶130而被使用者看到,而其余的光线会因为封胶130与空气的折射率不同,发生全反射的现象,所以降低了发光装置100的发光效率,进而降低了背光模块的亮度,影响液晶显示器的显示品质。FIG. 1A is a schematic diagram of a known light emitting device. As shown in FIG. 1A, in this light-emitting device 100, a plurality of light-emitting chips 110 are directly arranged on a substrate 120 (Chip on Board) (FIG. 1A only schematically shows one light-emitting chip), and then the encapsulant 130 covers each of them. The light emitting chip 110 is used to form a light bar (Light Bar) or a surface light source. This type of light emitting device 100 can reduce the heat dissipation problem of the light strip. However, compared with the light-emitting devices packaged into single pieces, the light-emitting device 100 in which the light-emitting chip 110 is arranged on the substrate 120 is applied in the backlight module, and the luminous efficiency of the light-emitting device 100 is much lower than that of a single light-emitting device. . The reason is that when the light-emitting chip 110 emits light, only part of the light leaves the sealant 130 and is seen by the user, while the rest of the light will be totally reflected due to the difference in refractive index between the sealant 130 and air. Therefore, the luminous efficiency of the light-emitting device 100 is reduced, thereby reducing the brightness of the backlight module and affecting the display quality of the liquid crystal display.

此外,图1A的发光装置100中的发光芯片110为白光发光芯片,而也有发光装置100’是利用红光发光芯片110a、蓝光发光芯片110b以及绿光发光芯片110c混光成均匀的白光。图1B为使用红、蓝、绿光发光芯片混光的发光装置及其光形的示意图。由图1B可知,红、蓝、绿光发光芯片110a、110b、110c的设置位置会使发光装置100’有明显的亮、暗交错的光形,所以需要增加这三个发光芯片的混光距离,或是在背光模块中配置适当的光学膜片来增加其均齐度。In addition, the light-emitting chip 110 in the light-emitting device 100 of FIG. 1A is a white light-emitting chip, and there is also a light-emitting device 100' that uses a red light-emitting chip 110a, a blue light-emitting chip 110b, and a green light-emitting chip 110c to mix light into uniform white light. FIG. 1B is a schematic diagram of a light-emitting device using red, blue, and green light-emitting chips to mix light and its light shape. It can be seen from FIG. 1B that the installation positions of the red, blue, and green light-emitting chips 110a, 110b, and 110c will cause the light-emitting device 100' to have obvious bright and dark interlaced light shapes, so it is necessary to increase the light mixing distance of the three light-emitting chips. , or configure an appropriate optical film in the backlight module to increase its uniformity.

发明内容Contents of the invention

本发明提供一种发光装置,其具有均匀的光形。The present invention provides a light emitting device with a uniform light shape.

本发明提供一种背光模块,其具有良好的光均齐度。The invention provides a backlight module with good light uniformity.

本发明提供一种液晶显示器,其具有良好的显示品质。The invention provides a liquid crystal display with good display quality.

本发明提出一种发光装置,其包括一基板、至少一发光芯片、多个散射粒子以及一封胶。发光芯片、散射粒子及封胶皆配置于基板上,其中散射粒子位于发光芯片旁,而封胶包覆发光芯片及散射粒子。The invention provides a light-emitting device, which includes a substrate, at least one light-emitting chip, a plurality of scattering particles and a sealant. The light-emitting chip, the scattering particles and the sealant are all arranged on the substrate, wherein the scattering particle is located beside the light-emitting chip, and the sealant covers the light-emitting chip and the scattering particle.

在本发明的发光装置的一实施例中,每一散射粒子的尺寸不完全相同。其中,越相对靠近发光芯片的散射粒子的尺寸越小。In an embodiment of the light emitting device of the present invention, the size of each scattering particle is not completely the same. Wherein, the closer the scattering particles are to the light-emitting chip, the smaller the size is.

在本发明的发光装置的一实施例中,越远离发光芯片的散射粒子的尺寸越大。In an embodiment of the light-emitting device of the present invention, the size of the scattering particles is larger the farther away from the light-emitting chip.

在本发明的发光装置的一实施例中,越远离发光芯片且越靠近封胶边缘的散射粒子的尺寸越小。In an embodiment of the light-emitting device of the present invention, the size of the scattering particles is smaller the farther away from the light-emitting chip and the closer to the edge of the encapsulant.

在本发明的发光装置的一实施例中,越靠近发光芯片的散射粒子的尺寸越小,越远离发光芯片的散射粒子的尺寸越大且越靠近封胶边缘的散射粒子的尺寸越小。In an embodiment of the light-emitting device of the present invention, the size of the scattering particles closer to the light-emitting chip is smaller, the size of the scattering particles farther away from the light-emitting chip is larger, and the size of the scattering particles closer to the edge of the encapsulant is smaller.

在本发明的发光装置的一实施例中,越靠近两相邻的发光芯片中间的散射粒子的尺寸越大。In an embodiment of the light-emitting device of the present invention, the size of the scattering particles is larger closer to the middle of two adjacent light-emitting chips.

在本发明的发光装置的一实施例中,越靠近发光芯片的散射粒子的间距越大。In an embodiment of the light-emitting device of the present invention, the closer to the light-emitting chip, the greater the distance between the scattering particles.

在本发明的发光装置的一实施例中,越远离发光芯片的散射粒子的间距越小。In an embodiment of the light-emitting device of the present invention, the distance between the scattering particles is smaller the farther away from the light-emitting chip.

在本发明的发光装置的一实施例中,越远离发光芯片且越靠近封胶边缘的散射粒子的间距越大。In an embodiment of the light-emitting device of the present invention, the distance between the scattering particles is greater the farther away from the light-emitting chip and the closer to the edge of the encapsulant.

在本发明的发光装置的一实施例中,越靠近发光芯片的散射粒子的间距越大,越远离发光芯片的散射粒子的间距越小且越靠近封胶边缘的散射粒子的间距越大。In an embodiment of the light-emitting device of the present invention, the distance between the scattering particles closer to the light-emitting chip is larger, the distance between the scattering particles farther away from the light-emitting chip is smaller, and the distance between the scattering particles near the edge of the encapsulant is larger.

在本发明的发光装置的一实施例中,越靠近两相邻的发光芯片中间的散射粒子的间距越小。In an embodiment of the light-emitting device of the present invention, the closer to the middle of two adjacent light-emitting chips, the smaller the distance between the scattering particles is.

在本发明的发光装置的一实施例中,发光芯片为蓝光发光芯片且封胶中具有可发出黄光的荧光颗粒。In an embodiment of the light emitting device of the present invention, the light emitting chip is a blue light emitting chip and there are fluorescent particles capable of emitting yellow light in the encapsulant.

在本发明的发光装置的一实施例中,发光芯片包括一红光发光芯片、一蓝光发光芯片以及一绿光发光芯片。In an embodiment of the light emitting device of the present invention, the light emitting chip includes a red light emitting chip, a blue light emitting chip and a green light emitting chip.

在本发明的发光装置的一实施例中,散射粒子的材料为具有高反射性的材料。此材料可为氧化钛(TiO2)或白色油墨。In an embodiment of the light emitting device of the present invention, the material of the scattering particles is a material with high reflectivity. This material can be titanium oxide (TiO 2 ) or white ink.

本发明另提出一种背光模块,包括一框架以及一光源,且光源配置于框架内。光源包括一基板以及多个上述的发光装置。The present invention further provides a backlight module, which includes a frame and a light source, and the light source is arranged in the frame. The light source includes a substrate and a plurality of the above-mentioned light emitting devices.

在本发明的背光模块的一实施例中,光源为一条状光源或一面状光源。In an embodiment of the backlight module of the present invention, the light source is a strip light source or a plane light source.

在本发明的背光模块的一实施例中,还包括一配置于框架的底部上的反射片。In an embodiment of the backlight module of the present invention, it further includes a reflection sheet disposed on the bottom of the frame.

在本发明的背光模块的一实施例中,还包括一配置于框架内的导光板,且导光板位于光源旁。In an embodiment of the backlight module of the present invention, it further includes a light guide plate disposed in the frame, and the light guide plate is located beside the light source.

在本发明的背光模块的一实施例中,还包括一配置于框架的顶部上的光学膜片。其中,光学膜片为增光片、棱镜片或漫射片。In an embodiment of the backlight module of the present invention, it further includes an optical film disposed on the top of the frame. Wherein, the optical film is an enhancement film, a prism film or a diffusion film.

本发明再提出一种液晶显示器,其包括一液晶显示面板以及一上述的背光模块,且背光模块配置于液晶显示面板下。The present invention further proposes a liquid crystal display, which includes a liquid crystal display panel and the above-mentioned backlight module, and the backlight module is arranged under the liquid crystal display panel.

在本发明的液晶显示器的一实施例中,光学膜片配置于框架与液晶显示面板之间。In an embodiment of the liquid crystal display of the present invention, the optical film is disposed between the frame and the liquid crystal display panel.

于本发明的发光装置中,散射粒子配置于基板上且位于发光芯片旁,因此可以减少发光芯片发出的光因为封胶而产生全反射的情形,提高发光装置的发光效率,且发光装置具有均匀的光形。所以,使用此发光装置作为光源的背光模块具有良好的光均齐度,可进而提升液晶显示器的显示品质。In the light-emitting device of the present invention, the scattering particles are arranged on the substrate and located beside the light-emitting chip, so it can reduce the total reflection of the light emitted by the light-emitting chip due to the sealing glue, improve the luminous efficiency of the light-emitting device, and the light-emitting device has a uniform light shape. Therefore, the backlight module using the light emitting device as a light source has good light uniformity, which can further improve the display quality of the liquid crystal display.

为让本发明的上述特征和优点能更明显易懂,下文特举优选实施例,并配合所附图示,作详细说明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, preferred embodiments are specifically cited below, together with the attached figures, and are described in detail as follows.

附图说明Description of drawings

图1A为已知一种发光装置的示意图。FIG. 1A is a schematic diagram of a known light emitting device.

图1B为使用红、蓝、绿光发光芯片混光的发光装置及其光形的示意图。FIG. 1B is a schematic diagram of a light-emitting device using red, blue, and green light-emitting chips to mix light and its light shape.

图2A为本发明一实施例的发光装置的示意图。FIG. 2A is a schematic diagram of a light emitting device according to an embodiment of the present invention.

图2B为应用一版模于基板上形成散射粒子的示意图。FIG. 2B is a schematic diagram of applying a template to form scattering particles on a substrate.

图2C为图2A的发光装置的发光示意图。FIG. 2C is a schematic diagram of light emission of the light emitting device in FIG. 2A .

图2D为图2A的发光装置的俯视图。FIG. 2D is a top view of the light emitting device in FIG. 2A .

图2E为图2A的散射粒子的排列疏密的示意图。FIG. 2E is a schematic diagram of the arrangement of the scattering particles in FIG. 2A .

图3为具有图2A的发光装置的液晶显示器的示意图。FIG. 3 is a schematic diagram of a liquid crystal display having the light emitting device of FIG. 2A .

图4A为本发明的第二实施例的发光装置的示意图。FIG. 4A is a schematic diagram of a light emitting device according to a second embodiment of the present invention.

图4B为图4A的发光装置的局部俯视图。FIG. 4B is a partial top view of the light emitting device in FIG. 4A .

图4C为散射粒子的另一种排列样态图。FIG. 4C is another arrangement state diagram of scattering particles.

图4D为发光芯片二维排列时,散射粒子的一种排列样态图。FIG. 4D is a diagram of an arrangement state of scattering particles when light-emitting chips are arranged two-dimensionally.

图4E为发光芯片二维排列时,散射粒子的一种排列样态图。FIG. 4E is a diagram of an arrangement state of scattering particles when light-emitting chips are arranged two-dimensionally.

附图标记说明Explanation of reference signs

100、100’、200、1400:发光装置100, 100’, 200, 1400: light emitting device

110、220、1420:发光芯片110, 220, 1420: Light-emitting chip

110a、1420a:红光发光芯片110a, 1420a: red light emitting chips

110b、1420b:蓝光发光芯片110b, 1420b: blue light emitting chip

110c、1420c:绿光发光芯片110c, 1420c: green light emitting chip

120、210:基板120, 210: Substrate

130、240:封胶130, 240: sealant

212:铜箔线路212: copper foil line

214:反射层214: reflective layer

230:散射粒子230: Scattering Particles

242:荧光颗粒242: fluorescent particles

300:版模300: template

302:孔洞302: hole

400:液晶显示面板400: Liquid crystal display panel

500:背光模块500: backlight module

510:框架510: frame

520:光源520: light source

530:导光板530: light guide plate

540:反射片540: reflector

550:光学膜片550: Optical film

1000:液晶显示器1000: LCD display

具体实施方式Detailed ways

[第一实施例][first embodiment]

图2A为本发明一实施例的发光装置的示意图。请参考图2A,发光装置200包括一基板210、一发光芯片220、多个散射粒子230以及一封胶240。发光芯片220、散射粒子230以及封胶240皆配置于基板210上,其中散射粒子230分布于基板210上,且位于发光芯片220旁。封胶240包覆发光芯片220以及至少部分的散射粒子230。当发光芯片220发光时,因为封胶240的折射率大于空气的折射率而发生全反射的光会射至散射粒子230,之后再被散射粒子230反射至封胶240之外。所以,本实施例的发光装置200具有优选的发光效率。FIG. 2A is a schematic diagram of a light emitting device according to an embodiment of the present invention. Please refer to FIG. 2A , the light emitting device 200 includes a substrate 210 , a light emitting chip 220 , a plurality of scattering particles 230 and an encapsulant 240 . The light-emitting chip 220 , the scattering particles 230 and the encapsulant 240 are all disposed on the substrate 210 , wherein the scattering particles 230 are distributed on the substrate 210 and located beside the light-emitting chip 220 . The encapsulant 240 covers the light-emitting chip 220 and at least part of the scattering particles 230 . When the light-emitting chip 220 emits light, the light totally reflected because the refractive index of the encapsulant 240 is greater than that of air will hit the scattering particles 230 and then be reflected by the scattering particles 230 to the outside of the encapsulant 240 . Therefore, the light emitting device 200 of this embodiment has preferable luminous efficiency.

请继续参考图2A,在制作本实施例的发光装置200时,是先将发光芯片220配置在基板210上,其中此发光芯片220可以是蓝光发光芯片并且封胶240中具有可发出黄光的荧光颗粒242。然后,将发光芯片220与配置于基板210上的铜箔线路212做电性连接。图2B为应用一版模于基板上形成散射粒子的示意图。接着如图2B示,应用一刻好网点的版模300,然后于版模300上刷上含有高反射成份的染料,如氧化钛(TiO2)或白色油墨,而染料会从版模300的孔洞302滴到基板210上以形成散射粒子230。之后,再将封胶240涂布于基板210上,以覆盖基板210、发光芯片220及位于发光芯片220附近的散射粒子230。或者,也可以是利用网版印刷的方式在基板210上形成散射粒子230。Please continue to refer to FIG. 2A. When manufacturing the light-emitting device 200 of this embodiment, the light-emitting chip 220 is first arranged on the substrate 210, wherein the light-emitting chip 220 can be a blue light-emitting chip and the encapsulant 240 has yellow light-emitting chips. Fluorescent particles 242. Then, the light-emitting chip 220 is electrically connected to the copper foil circuit 212 disposed on the substrate 210 . FIG. 2B is a schematic diagram of applying a template to form scattering particles on a substrate. Next, as shown in FIG. 2B , apply a stencil 300 with a good dot, and then brush a dye containing a high reflective component on the stencil 300 , such as titanium oxide (TiO 2 ) or white ink, and the dye will flow from the hole of the stencil 300 302 is dropped onto the substrate 210 to form scattering particles 230 . After that, the encapsulant 240 is coated on the substrate 210 to cover the substrate 210 , the light-emitting chip 220 and the scattering particles 230 near the light-emitting chip 220 . Alternatively, the scattering particles 230 may also be formed on the substrate 210 by screen printing.

接着请继续参考图2A,在基板210上形成散射粒子230之前,更可以先在基板上210形成一层反射层214,且反射层214覆盖于部分的铜箔线路212。此反射层214的材料可为白漆,以提高发光装置200的光利用率。Please continue to refer to FIG. 2A , before forming the scattering particles 230 on the substrate 210 , a reflective layer 214 may be formed on the substrate 210 first, and the reflective layer 214 covers part of the copper foil circuit 212 . The material of the reflective layer 214 can be white paint, so as to improve the light utilization efficiency of the light emitting device 200 .

图2C为图2A的发光装置的发光示意图。为了图示简洁,因此图2C中并未绘示铜箔线路212及反射层214。请参考图2C,当发光芯片220发光时,以近乎垂直于封胶240的界面的入射光可以射出于封胶240之外。此外,一部分的入射光会因为与封胶240的界面的夹角恰好落在全反射角的范围中,而产生全反射的现象,且被反射回来。被反射的光在射至散射粒子240之后,会被散射出封胶240外,所以可以提升发光装置200的发光效率。FIG. 2C is a schematic diagram of light emission of the light emitting device in FIG. 2A . For simplicity of illustration, the copper foil circuit 212 and the reflective layer 214 are not shown in FIG. 2C . Please refer to FIG. 2C , when the light-emitting chip 220 emits light, the incident light nearly perpendicular to the interface of the encapsulant 240 can be emitted out of the encapsulant 240 . In addition, a part of the incident light will be totally reflected and reflected back because the angle between the interface with the encapsulant 240 falls within the range of the total reflection angle. The reflected light will be scattered out of the encapsulant 240 after hitting the scattering particles 240 , so the luminous efficiency of the light emitting device 200 can be improved.

图2D为图2A的发光装置的俯视图。请参考图2D,配置在基板210上的每一个散射粒子230的尺寸可以是不完全相同。其中,越相对靠近发光芯片220的散射粒子230的尺寸可以越小,而越相对远离发光芯片220的散射粒子230的尺寸可以越大。而在其他的实施例中,散射粒子230的尺寸也可以是完全相同。FIG. 2D is a top view of the light emitting device in FIG. 2A . Please refer to FIG. 2D , the size of each scattering particle 230 disposed on the substrate 210 may not be exactly the same. Wherein, the size of the scattering particles 230 relatively closer to the light emitting chip 220 may be smaller, and the size of the scattering particles 230 relatively farther away from the light emitting chip 220 may be larger. In other embodiments, the sizes of the scattering particles 230 may also be completely the same.

图2E为图2A的散射粒子的排列疏密的示意图。请参考图2E,越相对靠近发光芯片220的散射粒子230之间的间距可越大,而越相对远离发光芯片220的散射粒子230之间的间距可越小。换言之,相对靠近发光芯片220的散射粒子230的排列越疏,反之则越密。请同时参考图2A及图2C,由于封胶240在基板210边缘处的曲率变大,所以由发光芯片220所发出的朝向外部空气方向行进的入射光在封胶与空气的交界的入射角度较小,因此入射光在封胶240与基板210交界的边缘处较容易穿出于封胶240之外,比较不会造成全反射。所以,对应位于封胶240与基板210交界的边缘处的散射粒子230的排列可相对地越疏或者散射粒子230的尺寸可设计为相对地越小。当然,以上叙述仅为举例之用,本发明并不以此为限,设计者也可依照实际的设计需求来改变散射粒子230之间的间距大小以及散射粒子230的尺寸大小。FIG. 2E is a schematic diagram of the arrangement of the scattering particles in FIG. 2A . Referring to FIG. 2E , the distance between the scattering particles 230 relatively closer to the light-emitting chip 220 may be larger, and the distance between the scattering particles 230 relatively farther away from the light-emitting chip 220 may be smaller. In other words, the sparser the arrangement of the scattering particles 230 relatively close to the light-emitting chip 220 is, the denser it is vice versa. Please refer to FIG. 2A and FIG. 2C at the same time. Since the curvature of the encapsulant 240 at the edge of the substrate 210 becomes larger, the incident light emitted by the light-emitting chip 220 and traveling in the direction of the outside air has a smaller incident angle at the interface between the encapsulant and the air. Therefore, the incident light is easier to pass out of the sealant 240 at the edge of the junction between the sealant 240 and the substrate 210 , and less likely to cause total reflection. Therefore, the arrangement of the scattering particles 230 corresponding to the boundary of the encapsulant 240 and the substrate 210 can be relatively sparser or the size of the scattering particles 230 can be designed to be relatively small. Certainly, the above description is only for example, and the present invention is not limited thereto. Designers can also change the distance between the scattering particles 230 and the size of the scattering particles 230 according to actual design requirements.

图3为具有图2A的发光装置的液晶显示器的示意图。请参考图3,本实施例的液晶显示器1000包括一液晶显示面板400以及一背光模块500,其中背光模块500例如是侧边入光式背光模块,且其配置于液晶显示面板400下。FIG. 3 is a schematic diagram of a liquid crystal display having the light emitting device of FIG. 2A . Please refer to FIG. 3 , the liquid crystal display 1000 of this embodiment includes a liquid crystal display panel 400 and a backlight module 500 , wherein the backlight module 500 is, for example, a side-illuminated backlight module, and it is disposed under the liquid crystal display panel 400 .

背光模块500包括一框架510以及一光源520,且光源520配置在框架510内,其中光源520为一条状光源,可称为光条(Light Bar)。值得留意的是,同一基板210上配置有多个发光芯片220,而散射粒子230设置于基板210上并位于发光芯片220旁,因此是利用封胶240包覆发光芯片220以及发光芯片220周围的散射粒子230以区隔出每一个发光装置200。The backlight module 500 includes a frame 510 and a light source 520, and the light source 520 is disposed in the frame 510, wherein the light source 520 is a strip light source, which may be called a light bar (Light Bar). It is worth noting that a plurality of light-emitting chips 220 are arranged on the same substrate 210, and the scattering particles 230 are disposed on the substrate 210 and located beside the light-emitting chips 220, so the light-emitting chips 220 and the surroundings of the light-emitting chips 220 are covered by the sealant 240. The scattering particles 230 are used to separate each light emitting device 200 .

此外,背光模块500还包括一导光板530,配置于框架510内,并位于光源520旁。导光板530用以将发光芯片220的光导向朝着液晶显示面板400的方向出射。另外,背光模块500还包括一反射片540,配置于该框架510的底部上,用以帮助将光导向朝着液晶显示面板400的方向出射以及避免光源520的光从框架510的底部漏出于框架510之外。再者,背光模块500还包括一配置于液晶显示面板400以及框架510之间的光学膜片550,此光学膜片550可以提升背光模块500的出光效果,进而提升液晶显示器1000的显示品质。In addition, the backlight module 500 further includes a light guide plate 530 disposed in the frame 510 and located beside the light source 520 . The light guide plate 530 is used to guide the light of the light-emitting chip 220 toward the direction of the liquid crystal display panel 400 to output. In addition, the backlight module 500 also includes a reflective sheet 540 disposed on the bottom of the frame 510 to help direct the light toward the liquid crystal display panel 400 and prevent light from the light source 520 from leaking out of the frame from the bottom of the frame 510. 510 outside. Furthermore, the backlight module 500 further includes an optical film 550 disposed between the liquid crystal display panel 400 and the frame 510 , the optical film 550 can improve the light output effect of the backlight module 500 , and further improve the display quality of the liquid crystal display 1000 .

虽然本实施例的背光模块500是以侧边入光式为例说明,但本技术领域具通常知识者也可将发光装置200应用于直下式背光模块。Although the backlight module 500 of this embodiment is described as an example of a side-lit type, those skilled in the art can also apply the light-emitting device 200 to a direct-type backlight module.

[第二实施例][Second embodiment]

本实施例与第一实施例大致相同,且相同或相似的元件标号代表相同或相似的元件。This embodiment is substantially the same as the first embodiment, and the same or similar element numbers represent the same or similar elements.

图4A为本发明的第二实施例的发光装置的示意图。请参考图4A,本实施例与第一实施例的不同之处在于:本实施例的发光装置1400包括三个发光芯片1420,其分别为红光发光芯片1420a、蓝光发光芯片1420b以及绿光发光芯片1420c。通过散射粒子230的设置,可以使红光发光芯片420a、蓝光发光芯片420b以及绿光发光芯片420c个别发出的光,在被全反射之后可以于封胶240中更为均匀地混光后被散射出封胶240之外。另外,也可以使本实施例的发光装置1400的光形均匀。所以,将本实施例的发光装置应用于液晶显示器的背光模块中,可以提升背光模块的光均齐度以及白光的均匀度,进而增加液晶显示器的显示品质。FIG. 4A is a schematic diagram of a light emitting device according to a second embodiment of the present invention. Please refer to FIG. 4A. The difference between this embodiment and the first embodiment is that the light emitting device 1400 of this embodiment includes three light emitting chips 1420, which are respectively a red light emitting chip 1420a, a blue light emitting chip 1420b and a green light emitting chip 1420b. Chip 1420c. Through the arrangement of the scattering particles 230, the light emitted by the red light-emitting chip 420a, the blue light-emitting chip 420b, and the green light-emitting chip 420c can be mixed more uniformly in the sealing glue 240 after being totally reflected and then scattered. Out of sealing glue 240. In addition, the light shape of the light emitting device 1400 of this embodiment can also be made uniform. Therefore, applying the light-emitting device of this embodiment to the backlight module of the liquid crystal display can improve the uniformity of light of the backlight module and the uniformity of white light, thereby increasing the display quality of the liquid crystal display.

图4B为图4A的发光装置的局部俯视图。请同时参考图4A及4B,朝向发光芯片1420上方射出的光,因为入射光以近乎垂直的角度入射至封胶240外,所以比较不会有全反射的问题存在,散射粒子230的数量可较少。因此,越相对靠近发光芯片220的散射粒子230之间的间距可越大。并未正对于发光芯片1420上方的封胶240,入射光便是以一较大的入射角入射至封胶240,而此入射角可能会造成全反射,散射粒子230的数量需要较多,所以越相对远离发光芯片220的散射粒子230之间的间距可越小。换言之,相对靠近发光芯片220的散射粒子230的排列越疏,反的则越密。特别的是,封胶240在基板210边缘处因为曲率变大,所以由发光芯片220所发出的朝向外部空气方向行进的入射光在封胶与空气的交界的入射角度较小,因此入射光在封胶240与基板210交界的边缘处较容易穿出于封胶240之外,比较不会造成全反射。所以,对应位于封胶240与基板210交界的边缘处的散射粒子230的排列可越疏。FIG. 4B is a partial top view of the light emitting device in FIG. 4A . Please refer to FIG. 4A and 4B at the same time. The light emitted toward the top of the light-emitting chip 1420, because the incident light is incident on the outside of the sealant 240 at a nearly vertical angle, there is relatively no problem of total reflection, and the number of scattering particles 230 can be reduced. few. Therefore, the distance between the scattering particles 230 that are relatively closer to the light-emitting chip 220 can be larger. Not facing the encapsulant 240 above the light-emitting chip 1420, the incident light is incident on the encapsulant 240 at a relatively large incident angle, and this incident angle may cause total reflection, and the number of scattering particles 230 needs to be large, so The distance between the scattering particles 230 relatively farther away from the light emitting chip 220 may be smaller. In other words, the sparser the arrangement of the scattering particles 230 relatively close to the light-emitting chip 220 is, the denser it is. In particular, because the curvature of the sealant 240 becomes larger at the edge of the substrate 210, the incident light emitted by the light-emitting chip 220 and traveling toward the outside air has a smaller incident angle at the interface between the sealant and the air, so the incident light is at the boundary between the sealant and the air. The border of the sealant 240 and the substrate 210 is easier to penetrate out of the sealant 240 and less likely to cause total reflection. Therefore, the arrangement of the scattering particles 230 corresponding to the boundary of the encapsulant 240 and the substrate 210 can be sparser.

当然,以上叙述仅为举例之用,本发明并不以此为限,设计者也可依照实际的设计需求来改变散射粒子230之间的间距大小以及散射粒子230的尺寸大小。图4C为散射粒子的另一种排列样态图。由图4C可知,在两个发光芯片1420的中间处的散射粒子230的颗粒尺寸较大,而越邻近发光芯片1420的散射粒子230的颗粒尺寸越小。此外,越接近封胶240与基板210交界的边缘处的散射粒子230的颗粒尺寸也会越小。Certainly, the above description is only for example, and the present invention is not limited thereto. Designers can also change the distance between the scattering particles 230 and the size of the scattering particles 230 according to actual design requirements. FIG. 4C is another arrangement state diagram of scattering particles. It can be seen from FIG. 4C that the particle size of the scattering particles 230 in the middle of the two light-emitting chips 1420 is larger, and the particle size of the scattering particles 230 closer to the light-emitting chips 1420 is smaller. In addition, the particle size of the scattering particles 230 will be smaller as it gets closer to the edge where the encapsulant 240 and the substrate 210 meet.

图4D为发光芯片二维排列时,散射粒子的一种排列样态图。图4E为发光芯片二维排列时,散射粒子的一种排列样态图。请同时参考图4D及图4E,散射粒子230也可应用在发光芯片1420为二维排列的发光装置(未标示)中。详细而言,散射粒子230也可应用于多个发光芯片1420同时封装于一个发光装置内,其中发光芯片1420的排列可依照设计者的需求有不同的应用颗数以及排列方式,例如环状排列、多边形排列等,或者是环状排列及多边形排列的发光芯片1420中间还包围了至少一个以上的发光芯片1420,其中图4D及图4E示的发光芯片1420的排列形状呈矩形。另外,散射粒子230的排列形状也可以依照实际需求加以变化。有关于发光芯片1420及散射粒子230的排列方式及尺寸小为本技术领域具通常知识者可以依照实际需求加以变化,因此不再多作描述。FIG. 4D is a diagram of an arrangement state of scattering particles when light-emitting chips are arranged two-dimensionally. FIG. 4E is a diagram of an arrangement state of scattering particles when light-emitting chips are arranged two-dimensionally. Please refer to FIG. 4D and FIG. 4E at the same time, the scattering particles 230 can also be applied in a light-emitting device (not shown) in which the light-emitting chips 1420 are arranged two-dimensionally. In detail, the scattering particles 230 can also be applied to multiple light-emitting chips 1420 to be packaged in one light-emitting device at the same time, where the arrangement of the light-emitting chips 1420 can have different application numbers and arrangements according to the designer's needs, such as ring arrangement , polygonal arrangement, etc., or at least one light-emitting chip 1420 is surrounded by ring-shaped or polygonal arrangement of light-emitting chips 1420, wherein the arrangement of light-emitting chips 1420 shown in FIG. 4D and FIG. 4E is rectangular. In addition, the arrangement shape of the scattering particles 230 can also be changed according to actual requirements. The arrangement and size of the light-emitting chips 1420 and the scattering particles 230 are those skilled in the art and can be changed according to actual needs, so no further description is given here.

综上所述,于本发明的发光装置中,利用散射粒子的设置,可以增加发光装置的发光效率,并且调整发光装置的光形,使发光装置具有良好的光均齐度。所以,使用此发光装置的背光模块具有良好的发光效果,进而提升液晶显示器的显示品质。To sum up, in the light-emitting device of the present invention, the arrangement of the scattering particles can increase the light-emitting efficiency of the light-emitting device, and adjust the light shape of the light-emitting device, so that the light-emitting device has good light uniformity. Therefore, the backlight module using the light-emitting device has a good light-emitting effect, thereby improving the display quality of the liquid crystal display.

虽然本发明已以优选实施例披露如上,然其并非用以限定本发明,任何所属技术领域中普通技术人员,在不脱离本发明的精神和范围内,当可作些许的更动与润饰,因此本发明的保护范围当视后附的权利要求所界定者为准。Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims (10)

1. light-emitting device comprises:
One substrate;
At least one luminescence chip is disposed on this substrate;
A plurality of scattering particless are disposed on this substrate, and are positioned at by those luminescence chips; And
One sealing is disposed on this substrate and coats those luminescence chips and those scattering particless.
2. light-emitting device as claimed in claim 1, wherein the size the closer to those scattering particless of those luminescence chips is more little, and the size away from those scattering particless of those luminescence chips is big more more.
3. light-emitting device as claimed in claim 1, wherein the size the closer to those scattering particless of those luminescence chips is more little, and is big more and more little the closer to the size of those scattering particless at this sealing edge away from the size of those scattering particless of those luminescence chips more.
4. light-emitting device as claimed in claim 1, wherein the spacing the closer to those scattering particless of those luminescence chips is big more, and is more little and big more the closer to the spacing of those scattering particless at this sealing edge away from the spacing of those scattering particless of those luminescence chips more.
5. backlight module comprises:
One framework;
One light source is disposed in this framework, comprises a substrate and a plurality of light-emitting device, and wherein each light-emitting device comprises:
At least one luminescence chip is disposed on this substrate;
A plurality of scattering particless are disposed on this substrate, and are positioned at by those luminescence chips; And
One sealing is disposed on this substrate and coats those luminescence chips and to those scattering particless of small part.
6. backlight module as claimed in claim 5, wherein the size the closer to those scattering particless of those luminescence chips is more little, and is big more and more little the closer to the size of those scattering particless at this sealing edge away from the size of those scattering particless of those luminescence chips more.
7. backlight module as claimed in claim 5, wherein the spacing the closer to those scattering particless of those luminescence chips is big more, and is more little and big more the closer to the spacing of those scattering particless at this sealing edge away from the spacing of those scattering particless of those luminescence chips more.
8. LCD comprises:
One display panels;
One backlight module is disposed under this display panels, and this backlight module comprises a framework and a light source, and wherein this light source is disposed in this framework, and this light source comprises a substrate and a plurality of light-emitting device, and wherein each light-emitting device comprises:
At least one luminescence chip is disposed on this substrate;
A plurality of scattering particless are disposed on this substrate, and are positioned at by those luminescence chips; And
One sealing is disposed on this substrate and coats those luminescence chips and to those scattering particless of small part.
9. LCD as claimed in claim 8, wherein the size the closer to those scattering particless of those luminescence chips is more little, and is big more and more little the closer to the size of those scattering particless at this sealing edge away from the size of those scattering particless of those luminescence chips more.
10. LCD as claimed in claim 8, wherein the spacing the closer to those scattering particless of those luminescence chips is big more, and is more little and big more the closer to the spacing of those scattering particless at this sealing edge away from the spacing of those scattering particless of those luminescence chips more.
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CN1702507A (en) * 2004-05-28 2005-11-30 三星电机株式会社 LED package and backlight assembly for LCD comprising the same

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Publication number Priority date Publication date Assignee Title
TW200516784A (en) * 2003-11-14 2005-05-16 Hon Hai Prec Ind Co Ltd Surface light source devie and light emitting diode
CN1702507A (en) * 2004-05-28 2005-11-30 三星电机株式会社 LED package and backlight assembly for LCD comprising the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111812884A (en) * 2019-04-10 2020-10-23 中强光电股份有限公司 Light source module and display device

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