CN101719227A - Communication module with industrial smart card chip - Google Patents
Communication module with industrial smart card chip Download PDFInfo
- Publication number
- CN101719227A CN101719227A CN200910238107A CN200910238107A CN101719227A CN 101719227 A CN101719227 A CN 101719227A CN 200910238107 A CN200910238107 A CN 200910238107A CN 200910238107 A CN200910238107 A CN 200910238107A CN 101719227 A CN101719227 A CN 101719227A
- Authority
- CN
- China
- Prior art keywords
- communication module
- pin
- card
- smart card
- sim
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004891 communication Methods 0.000 title claims abstract description 72
- 238000005516 engineering process Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 2
- 238000012536 packaging technology Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000003044 adaptive effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
Images
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses a communication module with an industrial smart card chip, which can improve the reliability of communication. In the communication module, a smart card is packaged with the communication module by dual-in-line packaging technology or surface mount technology, or is packaged in the communication module in a form of an IP core. Compared with the prior art, the communication module of the invention improves the reliability of the communication module because the smart card chip is connected with a wireless communication module or a wired communication module in a mode of welding.
Description
Technical field
The present invention relates to the communication technology, relate in particular to a kind of communication module that has industrial smart card chip.
Background technology
Along with the widespread use at industrial circle of wireless and wire communication module, the adaptive capacity to environment of the subscriber identity module that accompanies with it (SIM) card has met with unprecedented challenge.Common SIM card is relatively more fragile on a kind of structure, easily loses, for limited devices of tolerance range such as temperature, humidity, potential of hydrogen, vibrations and dusts.
The existing wireless communications module mostly adopts the SIM card of common consumer electronics, with PVC, PET, ABS or PVC and the encapsulation of ABS composite material, pin is generally 6 pin to this kind SIM card usually, and 8 pin are also arranged.
The pinout of 6 pin or 8 pin SIM card meets the integrated circuit card standard of ISO7816 contact-carrying.In conjunction with 8 pin SIM card pin synoptic diagram in the prior art shown in Figure 1, the pinout of 6 pin or 8 pin SIM card is as follows:
C1, supply voltage (VCC) pin is used to SIM card that supply voltage is provided;
C2, (RST) pin that resets is used to SIM card that reset signal is provided;
C3, clock (CLK) pin is used to SIM card that clock signal is provided;
C4 keeps (RFU) pin, keeps pin;
C5, ground connection (GND) pin is used to the SIM card chip that earth potential is provided;
C6, high pressure programming (VPP) pin is used for the erase function (can not provide the VPP signal by the outside) at inside realization EEPROM;
C7, input and output (IO) pin is used to finish SIM card and extraneous communication interaction;
C8 keeps (RFU) pin, keeps pin;
Wherein:
These five pins of C1, C2, C3, C5 and C7 are conventional SIM card pins;
The C6 pin is ineffective as VPP (high pressure programming pin);
C4 and C8 have been expanded to the high-speed interface of SIM card of new generation by International Standards Organization.
In the commercial Application of reality, because industrial environment varies and be comparatively abominable usually.Smart cards such as SIM card common in the prior art variety of problems such as operation irregularity, distortion or loose contact often occur under this environment, cause wireless or wire communication module can't be carried out proper communication.In addition, need carry out frequent operation to smart card usually in the commercial Application, this just requires smart card to have higher read-write number of times and longer serviceable life.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of communication module that has industrial smart card chip, to improve communication reliability.
In order to solve the problems of the technologies described above, the invention provides a kind of communication module that has industrial smart card chip, wherein:
Described smart card is packaged together with dual-in-line package technology or surface installation technique and described communication module, perhaps with the form of IP kernel, described smart card is packaged in the described communication module.
Preferably, described smart card comprises user identity module card, universal subscriber identity module card, radio-frequency identification card or near-field communication card.
Preferably, the annexation of each pin of described user identity module card and described communication module comprises:
The C1 pin connects the power interface of described communication module;
The C2 pin connects the SIM_RST interface of described communication module;
The C3 pin connects the SIM_CLK interface of described communication module;
The C4 pin connects the SIM_PRESENCE interface of described communication module;
The C5 pin, ground connection;
The C7 pin connects the SIM_DATA interface of described communication module;
The C8 pin, ground connection.
Preferably, described communication module comprises wireless communication module or wire communication module.
The present invention compared with prior art adopts the intelligent card chip of DIP or SMT encapsulation, and making it has better adaptive faculty to temperature, humidity etc., and vibrations, corrosion are had better resistibility, meets harsh commercial Application environment.In addition, intelligent card chip of the present invention is connected with wireless communication module or wire communication module by welding manner, has improved the reliability of communication.
Other features and advantages of the present invention will be set forth in the following description, and, partly from instructions, become apparent, perhaps understand by implementing the present invention.Purpose of the present invention and other advantages can realize and obtain by specifically noted structure in instructions, claims and accompanying drawing.
Description of drawings
Accompanying drawing is used to provide further understanding of the present invention, and constitutes the part of instructions, is used from explanation the present invention with embodiments of the invention one, is not construed as limiting the invention.In the accompanying drawings:
Fig. 1 is 8 pin SIM card pin synoptic diagram in the prior art;
Fig. 2 has the connection diagram of the wireless communication module embodiment of SIM card for the present invention.
Embodiment
Describe embodiments of the present invention in detail below with reference to drawings and Examples, how the application technology means solve technical matters to the present invention whereby, and the implementation procedure of reaching technique effect can fully understand and implements according to this.
Need to prove that if do not conflict, each feature among the embodiment of the invention and the embodiment can mutually combine, all within protection scope of the present invention.In addition, smart card of the present invention comprises the smart card of various identifying user identity informations such as SIM card, universal subscriber identity module (USIM) card, radio-frequency (RF) identification (RFID) card and near-field communication (NFC) card.
According to the standard of 3GPP, wireless or wire communication module need link to each other with the interface of smart cards such as SIM card by standard definition, so the present invention still continues to use this interface.Simultaneously in order to overcome the environmental suitability problem that smart card occurs in commercial Application, the present invention changes the encapsulation of traditional SIM card into (the Dual In-line Package that has dual-in-line package from the film form, DIP) or surface installation technique (Surface Mounted Technology, SMT) Chip Packaging form directly is welded on PCB with the SIM chip and upward is connected by the circuit on the PCB with wireless or wire communication module.
Fig. 2 has the connection diagram of the wireless communication module embodiment of SIM card for the present invention, and present embodiment is that example describes with the wireless communication module.On wireless communication module 220, as shown in Figure 2, each pin annexation of SIM card 210 is as follows with dual-in-line package for SIM card 210:
The C1 pin, power supply (SIM_VDD) interface of connection wireless communication module 220 is for SIM card 210 provides supply voltage;
The C2 pin, the SIM_RST interface of connection wireless communication module 220 is used to SIM card 210 that reset signal is provided;
The C3 pin, the SIM_CLK interface of connection wireless communication module 220 is used to SIM card 210 that clock signal is provided;
The C4 pin, the SIM_PRESENCE interface of connection wireless communication module 220 is used to carry out SIM card 210 and detects;
The C5 pin, ground connection;
The C7 pin, the SIM_DATA interface of connection wireless communication module 220 is used for SIM card 210 and carries out data communication with wireless communication module 220;
The C8 pin, ground connection.
The wiring diagram that the SIM card 210 of the DIP encapsulation shown in Fig. 2 is connected with wireless communication module 220, the interface definition of SIM card 210, level, sequential etc. still meet 7816 standard.Because SIM card 210 changed encapsulation, the high-low temperature resistant more that becomes, moisture-resistant, antidetonation is more suitable in industrial circle and the wireless communication module co-operation.
Embodiment shown in Figure 2 is encapsulated on the wireless communication module in the DIP mode with SIM card.In other embodiments of the invention, can also with DIP or SMT packaged type be encapsulated in the smart card of various identifying user identity informations such as usim card, rfid card and NFC card wireless or wire communication module in.
Technical solution of the present invention can also directly be packaged in smart cards such as SIM card among the wired or wireless communication module with the form of IP kernel.
Traditional SIM card is similar to plastic sheet encapsulation, and the mechanical slot by SIM card is fixed on the circuit board, and mechanical fixation is very poor for the anti-interference of environment, temperature for example, vibration etc.SIM card of the present invention directly is welded on the module with the form of chip, compared to existing technology, promptly saves the space, reduces cost, and has also improved the reliability of communication.
Obviously, those skilled in the art should be understood that, above-mentioned each module of the present invention or each step can realize with the general calculation device, they can concentrate on the single calculation element, perhaps be distributed on the network that a plurality of calculation element forms, alternatively, they can be realized with the executable program code of calculation element, thereby, they can be stored in the memory storage and carry out by calculation element, perhaps they are made into each integrated circuit modules respectively, perhaps a plurality of modules in them or step are made into the single integrated circuit module and realize.Like this, the present invention is not restricted to any specific hardware and software combination.
Though the disclosed embodiment of the present invention as above, the embodiment that described content just adopts for the ease of understanding the present invention is not in order to limit the present invention.Technician in any the technical field of the invention; under the prerequisite that does not break away from the disclosed spirit and scope of the present invention; can do any modification and variation what implement in form and on the details; but scope of patent protection of the present invention still must be as the criterion with the scope that appending claims was defined.
Claims (4)
1. communication module that has industrial smart card chip is characterized in that:
Described smart card is packaged together with dual-in-line package technology or surface installation technique and described communication module, perhaps with the form of IP kernel, described smart card is packaged in the described communication module.
2. communication module as claimed in claim 1 is characterized in that:
Described smart card comprises user identity module card, universal subscriber identity module card, radio-frequency identification card or near-field communication card.
3. communication module as claimed in claim 2 is characterized in that, the annexation of each pin of described user identity module card and described communication module comprises:
The C1 pin connects the power interface of described communication module;
The C2 pin connects the SIM_RST interface of described communication module;
The C3 pin connects the SIM_CLK interface of described communication module;
The C4 pin connects the SIM_PRESENCE interface of described communication module;
The C5 pin, ground connection;
The C7 pin connects the SIM_DATA interface of described communication module;
The C8 pin, ground connection.
4. communication module as claimed in claim 1 is characterized in that:
Described communication module comprises wireless communication module or wire communication module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910238107A CN101719227A (en) | 2009-11-13 | 2009-11-13 | Communication module with industrial smart card chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910238107A CN101719227A (en) | 2009-11-13 | 2009-11-13 | Communication module with industrial smart card chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101719227A true CN101719227A (en) | 2010-06-02 |
Family
ID=42433799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910238107A Pending CN101719227A (en) | 2009-11-13 | 2009-11-13 | Communication module with industrial smart card chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101719227A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106408074A (en) * | 2016-11-25 | 2017-02-15 | 天津七二通信广播股份有限公司 | SIM card chip having good vibration-resistant performance and realization method thereof |
| CN107005788A (en) * | 2015-12-25 | 2017-08-01 | 华为技术有限公司 | A kind of subscriber identification module card and mobile terminal |
-
2009
- 2009-11-13 CN CN200910238107A patent/CN101719227A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107005788A (en) * | 2015-12-25 | 2017-08-01 | 华为技术有限公司 | A kind of subscriber identification module card and mobile terminal |
| CN106408074A (en) * | 2016-11-25 | 2017-02-15 | 天津七二通信广播股份有限公司 | SIM card chip having good vibration-resistant performance and realization method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8201748B2 (en) | Packaged RFID IC with integrated antenna | |
| US7296754B2 (en) | IC card module | |
| KR101256931B1 (en) | Rfid tag and pcb of electronic product provided with the rfid tag and management system for electronic product | |
| KR100935647B1 (en) | Antenna for plug-in dual interface smart card | |
| KR20090128425A (en) | Integrated circuit card and its data wireless transmission method | |
| WO2002025825A3 (en) | Method for assembling components and antennae in radio frequency identification devices | |
| US20060142063A1 (en) | Antenna communication method for a chip card and associated device | |
| CN103164737A (en) | High-density memory smart card module and manufacture method thereof | |
| CN102915460A (en) | IC tag and electronic apparatus | |
| US8761667B2 (en) | Mobile telephone and NFC communication | |
| CN102480850A (en) | Method for mounting RFID electronic tag on printed circuit board | |
| CN101853421A (en) | Telecom intelligent card for realizing near field communication (NFC) function | |
| CN101719227A (en) | Communication module with industrial smart card chip | |
| CN202904598U (en) | Radio frequency identification tag device using WIFI technology and radio frequency identification tag system using WIFI technology | |
| KR100693204B1 (en) | Antenna for near field communication, near field communication terminal having the same, radio frequency antenna, and ic card having the same | |
| CN201780600U (en) | Telecommunication smart card for realizing double-frequency non-contact communication | |
| CN201025539Y (en) | An intelligent card with extension interface | |
| CN100474332C (en) | Smart card and method for expansion of interface on smart card | |
| CN101950849B (en) | RFID radio frequency identification tag antenna | |
| CN202904615U (en) | Radio frequency identification tag device using CDMA2000 technology and radio frequency identification tag system using CDMA2000 technology | |
| CN209044660U (en) | A kind of multimedia storage card and mobile electronic device | |
| CN202904616U (en) | Radio frequency identification tag device using WCDMA technology and radio frequency identification tag system using WCDMA technology | |
| CN202904614U (en) | Radio frequency identification tag device using GSM/TD SCDMA technology and radio frequency identification tag system using GSM/TD SCDMA technology | |
| CN203217594U (en) | RFID reader and assembly thereof | |
| CN202210800U (en) | Integrated communication module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100602 |