CN101685843B - Method for packaging light emitting diode - Google Patents
Method for packaging light emitting diode Download PDFInfo
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- CN101685843B CN101685843B CN2008102114730A CN200810211473A CN101685843B CN 101685843 B CN101685843 B CN 101685843B CN 2008102114730 A CN2008102114730 A CN 2008102114730A CN 200810211473 A CN200810211473 A CN 200810211473A CN 101685843 B CN101685843 B CN 101685843B
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Abstract
本发明提供一种以热塑性共聚物封装发光二极管的方法，其中热塑性共聚物是由100重量份的丙烯酸酯、0.1至30重量份的氢键单体、及0.1至70重量份的大立体障碍单体共聚而成。由于上述聚合物的透明度大于90％，耐热温度大于130℃，吸水率小于0.5wt％，因此适用于发光组件的封装材料。 The present invention provides a method for encapsulating a light-emitting diode with a thermoplastic copolymer, wherein the thermoplastic copolymer is copolymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bonding monomer, and 0.1 to 70 parts by weight of a large steric hindrance monomer. Since the above polymer has a transparency greater than 90%, a heat-resistant temperature greater than 130°C, and a water absorption rate less than 0.5wt%, it is suitable for packaging materials of light-emitting components.
Description
Technical field
The present invention relates to a kind of method of encapsulation LED, more specifically relates to the applied thermoplastic of the method and forms.
Background technology
The material of encapsulation LED (light-emitting diode is called for short LED) is based on epoxy resin (epoxy resin) and silicones (silicone) at present.Considering factors such as cost and electrical characteristic, epoxy resin is mainly used in automobile-used illumination and red signal lamp used by rail workers, and silicones is mainly used in high power LCD.Yet epoxy resin belongs to thermosets, needs to encapsulate in modes consuming time such as form or handover moulding.In addition, epoxy resin has not UV resistant (ultraviolet is called for short UV), easy xanthochromia, poor durability, and shortcoming such as can't reclaim.Compare therewith, polymethyl methacrylate (polymethylmethacrylate is called for short PMMA) is low price not only, and has splendid anti-UV and weather resisteant.But the Tg of PMMA (about 100 ℃) is than low about 30 ℃ of epoxy resin (about 130 ℃), and the water absorption of PMMA (2.0wt%) also is higher than epoxy resin (0.5wt%), and the refractive index of PMMA (1.49) is also less than epoxy resin (1.54).In sum, still need new thermoplastic to have the advantage of PMMA and epoxy resin simultaneously at present, in order to packaged LED.
Summary of the invention
The object of the present invention is to provide a kind of method of defective when having overcome above-mentioned encapsulation LED basically, and the encapsulating material that uses of this method has the advantage of PMMA and epoxy resin concurrently.
The invention provides a kind of method of encapsulation LED, it comprises: light-emitting diode is provided; And with the thermoplastic encapsulation LED; Wherein thermoplastic be by the hydrogen bond monomer of 100 parts by weight of acrylic esters, 0.1 to 30 weight portion, and the big steric hindrance monomer copolymerization of 0.1 to 70 weight portion form.
The transparency that is used as the polymer that encapsulates thermoplastic provided by the invention is greater than 90%, and heat resisting temperature is greater than 130 ℃, and water absorption rate is applicable to the encapsulating material of luminescence component less than 0.5wt%.
Embodiment
The invention provides a kind of method of encapsulation LED.Be applicable to that light-emitting diode of the present invention can be general Organic Light Emitting Diode (OLED), optical grade sheet material or solar energy backboard.Then encapsulate above-mentioned light-emitting diode with thermoplastic, method for packing can be ejection formation, form or screw rod granulation.
Above-mentioned thermoplastic is terpolymer (terpolymer), be by acrylate, hydrogen bond monomer, and big steric hindrance (bulky) monomer copolymerization form.The structure of acrylate as shown in Equation 1, R wherein
1Be hydrogen or C
1-4Alkyl and R
2Be C
1-4Alkyl.Acrylate accounts for most ratio of terpolymer, and this is in order to make copolymer still have cheap, splendid anti-UV and weather resisteant, to reach advantages such as recyclable.
The structure of hydrogen bond monomer as shown in Equation 2, R wherein
3Be hydrogen or C
1-4Alkyl and X be-OH or NH
2As its name suggests, the copolymer that the hydrogen bond monomer helps formation forms hydrogen bond, its-OH or NH
2Hydrogen atom be that hydrogen bond gives body (hydrogen bonding donor), and oxygen atom in the copolymer and/or the lone electron pair on the nitrogen-atoms (lone pair) are hydrogen bond receptor (hydrogen bonding acceptor).The purpose that imports the hydrogen bond monomer in copolymer is to promote thermal endurance (Tg).Weight with acrylate is benchmark (100 weight portion), and the weight portion of above-mentioned hydrogen bond monomer when weight portion is higher than above-mentioned scope, can produce crystallization between 0.1 to 30.Therefore specific hydrogen bond monomer consumption needs to add styrene monomer, can avoid crystalline polamer.
Big steric hindrance monomer can be the monomer of styrene, iso-bornyl acrylate, isobornyl methacrylate or other big steric hindrance.The purpose that copolymer imports big steric hindrance monomer is reducing moisture absorption.Weight with acrylate is benchmark (100 weight portion), and the percentage by weight of above-mentioned big steric hindrance monomer is between 0.1 to 70.
Polymerization methods of the present invention is the block polymerization (block polymerization) that utilizes initator.Generally speaking, above-mentioned initator is preferable with thermal initiator, but also can adopt light trigger.Thermal initiator comprises that the azo class is as 2,2 '-azo two (2,4-dimethyl n valeronitrile) (2,2 '-azobis (2,4-dimethyl valeronitrile)), dimethyl-2,2 '-azo two (2-methyl propionate) (dimethyl2,2 '-azobis (2-methylpropionate), 2,2-azodiisobutyronitrile (2,2-azobisisobutyronitrile, hereinafter to be referred as AIBN), 2,2-azo two (2-methyl isobutyronitrile) (2,2-azobis (2-methylisobutyronitrile)), 1,1 '-azo two (cyclohexane-1-nitrile) 1,1 '-azobis (cyclohexane-1-carbonitrile)), 2,2 '-azo two [N-2-propyl group-2-methyl propanamide] (2,2 '-azobis[N-(2-propenyl)-2-methylpropion amide]), 1-[(cyano group-1-Methylethyl)-and azo group] formamide (1-[(cyano-1-methyl ethyl) azo] formamide), 2,2 '-azo two (N-butyl-2-methyl propanamide) (2,2 '-azobis (N-butyl-2-methylpropionamide)), 2,2 '-azo two (N-cyclohexyl-2-methyl propanamide) (2,2 '-azobis (N-cyclohexyl-2-methylpropionamide), or other suitable azo-initiator; Peroxide comprises benzoyl peroxide (benzoyl peroxide); 1; 1-two (t-butylperoxy) cyclohexane (1; 1-bis (tert-butylperoxy) cyclohexane); 2; 5-two (t-butylperoxy)-2; 5-dimethyl cyclohexane (2; 5-bis (tert-butylperoxy)-2; 5-dimethylcyclohexane); 2; 5-two (t-butylperoxy)-2; 5-dimethyl-3-cyclohexyne (2; 5-bis (tert-butylperoxy)-2,5-dimethyl-3-cyclohexyne); two (1-(t-butylperoxy)-1-Methylethyl) benzene (bis (1-(tert-butylpeorxy)-1-methy-ethyl) benzene); TBHP (tert-butyl hydroperoxide); tert-butyl peroxide (tert-butyl peroxide); t-butyl peroxy yl benzoic acid (tert-butyl peroxybenzoate); anisyl hydrogen peroxide (Cumene hydroperoxide); hexamethylene ketone group peroxide (cyclohexanone peroxide); two anisyl peroxide (dicumylperoxide); lauryl peroxide (lauroyl peroxide); or other suitable peroxide.Light trigger comprises acetophenones such as 2-methyl isophthalic acid-(4-(methyl mercaptan base) phenyl-2-woods base propyl group ketone (2-methyl-1-(4-(methylthio) phenyl)-2-morpholino-propane), 1-hydroxycyclohexylphenylketone (1-hydroxycyclohexyl phenyl ketone), hexichol ethyoxyl ketone (diethoxy acetophenone), 2-hydroxy-2-methyl-1-phenyl-1-propyl group-1-ketone (2-hydroxy-2-nethyl-1-phenyl-propane-1-one), 2-tolyl-2-(dimethyl amido)-1-[4-(Lin Ji) phenyl]-1-butyl-1-ketone (2-benzyl-2-(dimethylamino)-1-[4-(morpholinyl) phenyl]-1-butanone), the acetophenone that other is suitable; Styrax class such as styrax (benzoin), styrax methyl ether (benzoin methyl ether), styrax dimethyl ether (benzyl dimethyl ketal), other suitable styrax; Diphenyl ketone such as diphenylketone (benzophenone), 4-phenyl diphenylketone (4-phenyl benzophenone), hydroxy diphenyl ketone (hydroxyl benzophenone) or other suitable diphenylketone; Thioxanthene ketone such as isopropyl thioxanthone (isopropyl thioxanthone), 2-chloro thioxanthones (2-chlorothioxanthone) or other suitable thioxanthones; Anthraquinone class such as 2-EAQ (2-ethylanthraquinone) or other suitable anthraquinone.
After polymerization reaction, can get transparency greater than 90%, heat resisting temperature is between 130 ℃ to 165 ℃, and water absorption rate is less than the thermoplastic of 0.5wt%.In an embodiment of the present invention, the molecular weight of thermoplastic is between 100000 to 250000.If it is not the molecular weight of thermoplastic is less than 100000, then can engineering properties good.But if the molecular weight of thermoplastic is greater than 250000, then can flowability poor excessively, die cavity can't be filled, and plastics can be because of long cracking of residence time.
With thermoplastic packaged LED of the present invention is lower than the price of known epoxy resin, the encapsulation time short, and anti-marquis/anti-UV good.The more important thing is that encapsulating material of the present invention is callable thermoplastic, compare the advantage that has in the environmental protection with unrenewable thermosets (as epoxy resin).
For making the clearer feature of the present invention of those skilled in the art, the spy is schematically illustrated in following embodiment.
Embodiment 1
Get acrylate such as methacrylate (MMA), hydrogen bond monomer such as the Methacrylamide (methacrylamide of Different Weight ratio; abbreviation MAAM), big steric hindrance monomer such as isobornyl methacrylate (isobornyl methacrylate; abbreviation IBMA), reach thermal initiator benzoyl peroxide (the benzoyl peroxide of phase I; be called for short I-BPO), in 60 ℃ to 80 ℃ reactions 1-3 hour.After said mixture viscosity raises, add the thermal initiator benzoyl peroxide (being called for short II-BPO) of second stage and reduce the temperature to 40 ℃ to 60 ℃, reacted about 0.5-3 hour.Again said mixture is inserted baking oven at last, react under two hours and 130 ℃ down at 90 ℃ and reacted two hours, to finish the block polymerization reaction.The character such as Tg, transparency and the xanthochromia of anti-UV property of copolymer are measured in the reaction back.The physical property of the weight ratio of above-mentioned reactant and the copolymer of formation as shown in Table 1.
Table one
In Table 1, can find when the ratio of hydrogen bond monomer such as MAAM improves, can improve the thermal endurance of copolymer by the experiment of numbering 01-03.After fixedly the ratio of hydrogen bond monomer such as MAAM imports the monomer such as IBMA of big steric hindrance again, except further lifting thermal endurance, also can reduce the moisture absorption of copolymer to 0.35wt%.
Though the present invention with several embodiment openly as above; right its is not in order to limit the present invention; those of ordinary skill in the technical field under any; without departing from the spirit and scope of the present invention; when can changing arbitrarily and retouching, so protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining.
Claims (5)
Priority Applications (1)
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|---|---|---|---|
| CN2008102114730A CN101685843B (en) | 2008-09-26 | 2008-09-26 | Method for packaging light emitting diode |
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| CN2008102114730A CN101685843B (en) | 2008-09-26 | 2008-09-26 | Method for packaging light emitting diode |
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| CN101685843A CN101685843A (en) | 2010-03-31 |
| CN101685843B true CN101685843B (en) | 2011-03-23 |
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| CN2008102114730A Expired - Fee Related CN101685843B (en) | 2008-09-26 | 2008-09-26 | Method for packaging light emitting diode |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005206704A (en) * | 2004-01-23 | 2005-08-04 | Nippon Shokubai Co Ltd | Resin composition for optical semiconductor element component |
| JP2007184404A (en) * | 2006-01-06 | 2007-07-19 | Showa Highpolymer Co Ltd | Transparent resin composition for optodevice sealing, and led package |
| CN101080121A (en) * | 2007-07-06 | 2007-11-28 | 清华大学 | An organic EL part and its making method |
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- 2008-09-26 CN CN2008102114730A patent/CN101685843B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005206704A (en) * | 2004-01-23 | 2005-08-04 | Nippon Shokubai Co Ltd | Resin composition for optical semiconductor element component |
| JP2007184404A (en) * | 2006-01-06 | 2007-07-19 | Showa Highpolymer Co Ltd | Transparent resin composition for optodevice sealing, and led package |
| CN101080121A (en) * | 2007-07-06 | 2007-11-28 | 清华大学 | An organic EL part and its making method |
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| CN101685843A (en) | 2010-03-31 |
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