CN101670541B - Fast polishing traversing processing method of heavy-calibre planar optical elements - Google Patents
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Abstract
大口径平面光学元件的快速抛光横移式加工方法,涉及一种大口径平面光学元件。提供一种大口径平面光学元件的快速抛光横移式加工方法。采用数控抛光机床,设有抛光盘、抛光垫、真空薄膜、工件旋转轴、修整轮、修整轮轴和工作横移轴。选择加工方式,设定加工参数,利用空间坐标变换和傅立叶级数计算工件相对抛光盘速度的步骤;利用压强分布表面模型计算工件横移过程中的压强分布,对工件一个横移加工周期进行线性切割,结合普林斯顿公式得到工件不同半径上点的材料去除率的步骤;计算工件上不同半径上点露出抛光盘和落入不同压强区域的几率,采用比值对所得材料去除率加权赋值,预测加工后工件面型变化趋势,加工后检测结果与预测相符合的步骤。
The invention discloses a fast polishing and traverse processing method for a large-diameter flat optical element, relating to a large-diameter flat optical element. Provided is a fast polishing and traverse processing method for large-caliber planar optical elements. CNC polishing machine is adopted, equipped with polishing disc, polishing pad, vacuum film, workpiece rotating shaft, dressing wheel, dressing wheel shaft and working traverse shaft. Select the processing method, set the processing parameters, and use the spatial coordinate transformation and Fourier series to calculate the relative velocity of the workpiece to the polishing disc; use the pressure distribution surface model to calculate the pressure distribution during the workpiece traverse process, and perform linear processing on a traverse process cycle of the workpiece Cutting, combined with the Princeton formula to obtain the material removal rate of the points on the different radii of the workpiece; calculate the probability of the points on the workpiece on different radii exposing the polishing disc and falling into different pressure areas, and use the ratio to weight the obtained material removal rate to predict after processing The change trend of the workpiece surface shape, and the steps in which the inspection results after processing are in line with the predictions.
Description
技术领域 technical field
本发明涉及一种大口径平面光学元件,尤其是涉及一种大口径平面光学元件的快速抛光横移式加工方法。The invention relates to a large-diameter flat optical element, in particular to a fast polishing and traverse processing method for the large-diameter flat optical element.
背景技术 Background technique
目前大尺寸高精密光学元件的加工受到国内外的重视,如何使高精度大口径光学元件,特别是大口径平面和非球面元件实现高效批量化加工,是摆在光学制造领域的一个重要课题,也是对目前光学制造领域的一次严峻挑战。(参见文献:1、朱海波,“大口径平面元件的数控抛光技术研究,”[D].工学硕士学位论文,四川大学,2005;2、J.Luo and D.A.Domfeld,“Material removal mechanism in chemical mechanical polishing:theory and modeling,”[J].IEEETransactions on Semiconductor Manufacturing,Vol.14,No,2,112-123,2001)。At present, the processing of large-size and high-precision optical components is valued at home and abroad. How to realize high-efficiency batch processing of high-precision large-diameter optical components, especially large-diameter flat and aspheric components, is an important issue in the field of optical manufacturing. It is also a serious challenge to the current field of optical manufacturing. (Refer to literature: 1. Zhu Haibo, "Research on CNC polishing technology for large-diameter planar components," [D]. Dissertation for Master of Engineering, Sichuan University, 2005; 2. J.Luo and D.A.Domfeld, "Material removal mechanism in chemical mechanical polishing: theory and modeling," [J]. IEEE Transactions on Semiconductor Manufacturing, Vol.14, No, 2, 112-123, 2001).
大口径平面光学元件在经过粗磨、细磨或者精密磨削阶段后,要求经过抛光,以提高工件表面面型精度、降低表面粗糙度和亚表面缺陷。传统的初抛和环形抛光都是机械化学抛光(CMP)过程,可以满足工件加工要求,但是需要熟练工程师靠经验操作来得到所需的工件面型,耗费较多时间,降低了生产效率。初抛和环形抛光这两个工序又都是承上启下的工序,加工出来的结果对其后工序的加工效果和效率有极大的影响。因此有必要改进初抛和环形抛光的加工工艺,提高加工效率和加工精度,预测和控制面型变化趋势,加工出对数控抛光有利的表面形貌。After rough grinding, fine grinding or precision grinding, large-aperture planar optical components are required to be polished to improve the surface accuracy of the workpiece and reduce surface roughness and subsurface defects. Traditional primary polishing and circular polishing are mechanochemical polishing (CMP) processes, which can meet the processing requirements of workpieces, but require experienced engineers to obtain the required surface shape of workpieces, which consumes a lot of time and reduces production efficiency. The two processes of initial polishing and circular polishing are both processes that connect the preceding and the following, and the processed results have a great influence on the processing effect and efficiency of the subsequent processes. Therefore, it is necessary to improve the processing technology of initial polishing and ring polishing, improve processing efficiency and processing accuracy, predict and control the change trend of surface shape, and process a surface morphology that is beneficial to CNC polishing.
快速抛光横移式加工方法可以极大的提高加工效率,材料去除率(Material Removal Rate,MRR)可达5~10um/h,是初抛的8~10倍,与环形抛光相比,又可以较准确地预测和控制工件面型的变化趋势。快速抛光横移式加工方法,利用在横移过程中工件和抛光盘接触区压强分布的不均匀性,实现工件材料整体上的不均匀去除,从而得到所需的工件面型精度。The rapid polishing traverse processing method can greatly improve the processing efficiency, and the material removal rate (Material Removal Rate, MRR) can reach 5-10um/h, which is 8-10 times that of initial polishing. Compared with ring polishing, it can More accurately predict and control the change trend of workpiece surface shape. The rapid polishing traverse processing method utilizes the inhomogeneity of the pressure distribution in the contact area between the workpiece and the polishing disc during the traverse process to realize the uneven removal of the workpiece material as a whole, so as to obtain the required surface accuracy of the workpiece.
发明内容 Contents of the invention
本发明的目的在于针对大口径平面光学元件抛光加工中效率低、较难预测和控制工件面型变化趋势的缺点,提供一种大口径平面光学元件的快速抛光横移式加工方法。The object of the present invention is to provide a fast polishing and lateral movement processing method for large-diameter planar optical elements in order to address the shortcomings of low efficiency and difficulty in predicting and controlling the variation trend of workpiece surface shape in the polishing process of large-diameter planar optical elements.
本发明采用大口径平面光学元件快速抛光系统(即数控抛光机床),所述数控抛光机床设有抛光盘、抛光垫、真空薄膜、工件旋转轴、修整轮、修整轮轴和工作横移轴。抛光盘设有抛光盘旋转轴,抛光盘在抛光盘旋转轴带动下独立旋转,抛光垫设在抛光盘上,工件设在抛光垫的工件旋转轴上,真空薄膜设在工件表面,为了保持抛光垫具有一定表面粗糙度和平整性,修整轮在修整轮轴带动下根据需要可对抛光垫表面进行修整。在抛光垫上注入抛光液。The present invention adopts a fast polishing system for large-caliber planar optical elements (that is, a numerically controlled polishing machine tool). The numerically controlled polishing machine tool is provided with a polishing disc, a polishing pad, a vacuum film, a workpiece rotating shaft, a dressing wheel, a dressing wheel shaft and a working traverse shaft. The polishing disc is provided with a rotating shaft of the polishing disc, and the polishing disc rotates independently under the drive of the rotating shaft of the polishing disc. With a certain surface roughness and flatness, the dressing wheel can dress the surface of the polishing pad as required under the drive of the dressing wheel shaft. Inject polishing fluid on the polishing pad.
所述抛光垫可采用聚氨酯抛光垫。The polishing pad can be a polyurethane polishing pad.
所述抛光盘可采用大理石抛光盘。The polishing disc can be a marble polishing disc.
所述抛光液可由氧化铈和去离子水混合组成。The polishing liquid may be composed of cerium oxide mixed with deionized water.
本发明包括以下步骤:The present invention comprises the following steps:
1)1个选择加工方式,设定加工参数,利用空间坐标变换和傅立叶级数计算工件相对抛光盘的速度的步骤;1) a step of selecting a processing method, setting processing parameters, and calculating the velocity of the workpiece relative to the polishing disc by using spatial coordinate transformation and Fourier series;
2)1个利用压强分布表面模型(skin model)计算工件横移过程中的压强分布,对工件一个横移加工周期进行线性切割,结合普林斯顿(Preston)公式得到工件不同半径上点的材料去除率(Material Removal Rate,MRR)的步骤;2) One uses the pressure distribution surface model (skin model) to calculate the pressure distribution during the workpiece traversing process, performs linear cutting on the workpiece for one traversing processing cycle, and combines the Princeton (Preston) formula to obtain the material removal rate of the points on the different radii of the workpiece (Material Removal Rate, MRR) steps;
3)1个计算工件上不同半径上点露出抛光盘和落入不同压强区域的几率,根据几率采用比值对所得到的材料去除率MRR进行加权赋值,预测加工后工件面型变化趋势,加工后检测结果与预测相符合的步骤。3) One calculates the probability of exposing the polishing disc and falling into different pressure areas on different radii on the workpiece, and uses the ratio to weight the obtained material removal rate MRR according to the probability to predict the surface shape change trend of the workpiece after processing. The step in which the detection results match the prediction.
在步骤1)中,所述加工方式最好为横移式加工方式,所述加工参数为外界施加压力、抛光盘转速、工件转速、普林斯顿(Preston)系数、抛光盘半径、工件半径、偏心距、横移速度和工件最大露边距离。所述选择加工方式,设定加工参数,利用空间坐标变换和傅立叶级数计算工件相对抛光盘的速度的步骤,可在工件中心建立相对运动和相对静止两个坐标系,在抛光盘中心建立相对运动和相对静止两个坐标系,利用空间坐标变换和傅立叶级数计算工件在横移过程中相对抛光盘速度。In step 1), the processing method is preferably a traversing processing method, and the processing parameters are external pressure, polishing disc rotation speed, workpiece rotation speed, Princeton (Preston) coefficient, polishing disc radius, workpiece radius, eccentricity , traversing speed and the maximum exposed edge distance of the workpiece. The steps of selecting the processing method, setting the processing parameters, and calculating the speed of the workpiece relative to the polishing disc by using spatial coordinate transformation and Fourier series can establish two coordinate systems of relative movement and relative stillness at the center of the workpiece, and establish relative motion at the center of the polishing disc. Moving and relatively static two coordinate systems, using space coordinate transformation and Fourier series to calculate the relative velocity of the workpiece during the traverse process.
在步骤2)中,所述“利用压强分布表面模型(skin model)计算工件横移过程中的压强分布,对工件一个横移加工周期进行线性切割,结合普林斯顿(Preston)公式得到工件不同半径上点的材料去除率(Material Removal Rate,MRR)”,可利用压强分布表面模型计算工件横移过程中的压强分布,对工件一个横移加工周期进行线性切割,建立切割点,利用压强分布表面模型计算工件横移过程中各个切割点的压强分布;再结合普林斯顿(Preston)公式,计算出工件不同半径上点在切割点处旋转一周的材料去除率MRR,最后,根据工件的移动距离和每个切割点旋转一周的材料去除率,可以对整个横向移动过程的材料去除率进行积分,计算出工件上不同半径上点总的材料去除率;所述普林斯顿(Preston)公式为MRR=k·p·v,其中k为普林斯顿Preston系数,p为工件上某一点所受的压强,v为工件上某一点相对抛光盘的速度。In step 2), the "Use the pressure distribution surface model (skin model) to calculate the pressure distribution during the workpiece traverse process, perform linear cutting on the workpiece during one traverse process cycle, and combine the Princeton (Preston) formula to obtain the different radii of the workpiece. The material removal rate (Material Removal Rate, MRR) of the point, can use the pressure distribution surface model to calculate the pressure distribution during the workpiece traverse process, perform linear cutting on a traverse processing cycle of the workpiece, establish the cutting point, and use the pressure distribution surface model Calculate the pressure distribution of each cutting point during the traverse of the workpiece; combined with the Princeton (Preston) formula, calculate the material removal rate MRR of the points on different radii of the workpiece at the cutting point for one revolution, and finally, according to the moving distance of the workpiece and each The material removal rate of one rotation of cutting point can be integrated to the material removal rate of the whole lateral movement process, and calculates the total material removal rate of points on different radii on the workpiece; said Princeton (Preston) formula is MRR=k·p· v, where k is the Princeton Preston coefficient, p is the pressure on a certain point on the workpiece, and v is the speed of a certain point on the workpiece relative to the polishing disc.
在步骤3)中,所述计算工件上不同半径上点露出抛光盘和落入不同压强区域的几率,根据几率采用比值对所得到的材料去除率MRR进行加权赋值,预测加工后工件面型变化趋势,加工后检测结果与预测相符合的步骤是计算工件上不同半径上点露出抛光盘和落入不同压强区域的几率,根据几率采用比值对积分所得到的工件上不同半径上点总的材料去除率MRR进行加权赋值,预测加工后工件面型变化趋势,加工后检测结果与预测相符合。In step 3), the probability of exposing the polishing disk and falling into different pressure regions on different radii on the workpiece is calculated, and the obtained material removal rate MRR is weighted according to the probability, and the surface shape of the workpiece after processing is predicted. Trend, the step in which the detection results after processing are consistent with the prediction is to calculate the probability of the points on the workpiece with different radii exposed to the polishing disc and falling into different pressure areas, and the total material of the points on the workpiece with different radii obtained by integrating the ratio according to the probability The removal rate MRR is weighted to predict the change trend of the workpiece surface shape after processing, and the detection results after processing are consistent with the prediction.
快速抛光的原理是采用聚合物材料一聚氨酯作为抛光垫,依据所施加的压强,结合较快的相对速度和横移式加工方法对大口径平面光学元件进行快速抛光。以其他的抛光方式相比,本发明采用的聚氨酯抛光垫,可以避免沥青抛光垫抛光工件产生的水合沉淀层、减少亚表面缺陷、降低抛光中所产生的热量。较快的相对速度和横移式加工方法可以显著地提高抛光效率,预测和控制工件面型变化趋势。The principle of rapid polishing is to use polymer material-polyurethane as a polishing pad, and according to the applied pressure, combine with relatively fast relative speed and traverse processing method to quickly polish large-diameter flat optical elements. Compared with other polishing methods, the polyurethane polishing pad used in the present invention can avoid the hydration precipitation layer produced by the asphalt polishing pad to polish workpieces, reduce subsurface defects, and reduce heat generated during polishing. The relatively fast relative speed and the traverse processing method can significantly improve the polishing efficiency, predict and control the change trend of the workpiece surface shape.
本发明采用大口径平面光学元件快速抛光系统(即数控抛光机床),包括3轴联动机床、聚氨酯抛光垫、金刚石修整轮和抛光液供给系统。采用横移式加工方法快速抛光完成大口径平面光学元件表面加工,并且预测加工后工件面型变化趋势,加工后检测结果与预测相符合,因此可用于加工中控制工件面型变化趋势。The invention adopts a fast polishing system for large-diameter flat optical elements (ie, a numerically controlled polishing machine tool), which includes a 3-axis linkage machine tool, a polyurethane polishing pad, a diamond dressing wheel and a polishing liquid supply system. The surface processing of large-diameter flat optical elements is completed by rapid polishing using the traverse processing method, and the surface shape change trend of the workpiece after processing is predicted. The detection results after processing are consistent with the prediction, so it can be used to control the surface shape change trend of the workpiece during processing.
附图说明 Description of drawings
图1为本发明实施例采用的大口径平面光学元件快速抛光系统(即数控抛光机床)的结构示意图。FIG. 1 is a schematic structural diagram of a fast polishing system for a large-aperture planar optical element (ie, a numerically controlled polishing machine tool) adopted in an embodiment of the present invention.
图2为图1的俯视结构示意图。FIG. 2 is a schematic top view of the structure of FIG. 1 .
图3为本发明实施例采用的预测和控制工件面型变化趋势流程图。Fig. 3 is a flow chart of predicting and controlling the change trend of workpiece surface shape adopted by the embodiment of the present invention.
图4为本发明实施例采用的计算工件上某点N相对速度的示意图。Fig. 4 is a schematic diagram of calculating the relative velocity of a certain point N on the workpiece used in the embodiment of the present invention.
图5为本发明实施例采用的压强分布表面模型(skin model)示意图。Fig. 5 is a schematic diagram of a pressure distribution surface model (skin model) used in an embodiment of the present invention.
图6为本发明实施例采用的工件上半径为100mmN点材料去除率随工件圆心行进距离变化关系图。在图6中,横坐标为工件圆心行进距离(m),纵坐标为材料厚度平均去除率(m/s)。Fig. 6 is a diagram showing the relationship between the material removal rate of the N point on the workpiece with a radius of 100 mm and the distance traveled by the center of the workpiece used in the embodiment of the present invention. In Fig. 6, the abscissa is the travel distance (m) of the center of the workpiece, and the ordinate is the average removal rate of the material thickness (m/s).
图7为本发明实施例采用的横移式加工过程中工件上不同半径上N点的材料去除率随工件圆心行进距离变化关系图。在图7中,横坐标为工件圆心行进距离(m),纵坐标为材料厚度平均去除率(m/s)。■为0mm,●为20mm,▲为40mm,为60mm,☆为80mm,◇为100mm,□为120mm,○为140mm,为160mm。Fig. 7 is a diagram showing the relationship between the material removal rate at N points on different radii on the workpiece and the distance traveled by the center of the workpiece during the traverse processing adopted in the embodiment of the present invention. In Fig. 7, the abscissa is the travel distance (m) of the center of the workpiece, and the ordinate is the average removal rate of the material thickness (m/s). ■ is 0mm, ● is 20mm, ▲ is 40mm, 60mm, ☆ is 80mm, ◇ is 100mm, □ is 120mm, ○ is 140mm, is 160mm.
图8为本发明实施例采用的横移式加工过程中对图7中各条曲线进行积分得到的不同半径上N点在一个横移周期总的材料去除率示意图。在图8中,横坐标为工件半径(m),纵坐标为材料厚度平均去除率(m/s)。Fig. 8 is a schematic diagram of the total material removal rate of N points on different radii in one traversing cycle obtained by integrating the curves in Fig. 7 in the traversing machining process adopted in the embodiment of the present invention. In Fig. 8, the abscissa is the workpiece radius (m), and the ordinate is the average removal rate of material thickness (m/s).
图9为本发明实施例采用的加权赋值后的横移式加工过程中预测不同半径上N点在一个横移周期总的材料去除率示意图。在图9中,横坐标为工件半径(m),纵坐标为材料厚度平均去除率(m/s)。Fig. 9 is a schematic diagram of the total material removal rate of N points on different radii predicted in one traverse cycle during the weighted traverse machining process adopted in the embodiment of the present invention. In Fig. 9, the abscissa is the workpiece radius (m), and the ordinate is the average removal rate of material thickness (m/s).
图10和图11为本发明实施例采用的数据处理后工件x、y方向上面型测量图。在图10和11中,横坐标为工件半径(m),纵坐标为测量高度差(nm)。Fig. 10 and Fig. 11 are the surface measurement diagrams of the x and y directions of the workpiece after data processing adopted in the embodiment of the present invention. In FIGS. 10 and 11, the abscissa is the workpiece radius (m), and the ordinate is the measured height difference (nm).
具体实施方式 Detailed ways
以下实施例将结合附图对本发明作进一步的说明。The following embodiments will further illustrate the present invention in conjunction with the accompanying drawings.
参见图1和2,本发明采用的大口径平面光学元件快速抛光系统(即数控抛光机床)包括3轴联动机床、聚氨酯抛光垫、金刚石修整轮和抛光液供给系统。采用横移式加工方法快速抛光完成大口径平面光学元件表面加工,并且预测加工后工件面型变化趋势,加工后检测结果与预测相符合,因此可用于加工中控制工件面型变化趋势。Referring to Figures 1 and 2, the rapid polishing system for large-diameter flat optical elements (ie, a numerically controlled polishing machine tool) used in the present invention includes a 3-axis linkage machine tool, a polyurethane polishing pad, a diamond dressing wheel and a polishing liquid supply system. The surface processing of large-diameter flat optical elements is completed by rapid polishing using the traverse processing method, and the surface shape change trend of the workpiece after processing is predicted. The detection results after processing are consistent with the prediction, so it can be used to control the surface shape change trend of the workpiece during processing.
在图1和2中,工件21由真空薄膜22吸附,工件旋转轴Z1可升降,以对工件21施加不同的压力,工件21在工件旋转轴Z1带动下独立旋转,并且工作横移轴Z3可带动工件21横向移动。聚氨酯抛光垫23由强力胶水粘贴在大理石抛光盘24上,抛光盘24在抛光盘旋转轴Z4带动下独立旋转。为了保持抛光垫23具有一定表面粗糙度和平整性,金刚石修整轮25在修整轮轴Z2带动下根据需要可对抛光垫23表面进行修整。由抛光液P(抛光液由氧化铈和去离子水混合组成,按质量比,氧化铈和去离子水的配比最好为10∶1)供给系统在加工过程中喷洒在抛光垫23表面。轴Z1、轴Z3和轴Z4三轴联动,可对工件21进行材料去除。在图2中,修整轮25的半径为R,工件21的半径为R1。In Figures 1 and 2, the
本发明实施例所用的数控抛光机床采用超精密快速抛光机床,为北京NorthTiger机床股份有限公司PPS100快速抛光机床。The CNC polishing machine used in the embodiment of the present invention is an ultra-precision fast polishing machine, which is a PPS100 fast polishing machine from Beijing NorthTiger Machine Tool Co., Ltd.
图3为本发明预测和控制工件面型变化趋势流程图。其流程为开始——选择加工方式并设定加工参数——计算相对速度——使用表面模型计算压强分布——切割横移过程计算MRR(材料去除率)——加权处理MRR——检测结果与预测相符合——结束。Fig. 3 is a flow chart of the present invention for predicting and controlling the change trend of workpiece surface shape. The process is the beginning—choose the processing method and set the processing parameters—calculate the relative velocity—calculate the pressure distribution using the surface model—calculate the MRR (material removal rate) during the cutting traverse process—weight the MRR——test results and Predictions are met—closed.
本发明的主要实施步骤为:Main implementation steps of the present invention are:
1)选择加工方式,设定加工参数,利用空间坐标变换和傅立叶级数计算工件相对抛光盘的速度:1) Select the processing method, set the processing parameters, and use the spatial coordinate transformation and Fourier series to calculate the speed of the workpiece relative to the polishing disc:
加工方式选择横移式加工方式,加工参数选定外界施加压力105.84N,抛光盘转速为w1,工件转速为w2,w1=w2=36rad/s,普林斯顿(Preston)系数k为0.7×10-12m2/N2,抛光盘半径R=550mm,工件半径R1=160mm,偏心距e=160mm,横移速度Vx=1000mm/min,工件最大露边距离d=80mm。The processing method is the traverse processing method, the processing parameters are selected as the external pressure 105.84N, the rotation speed of the polishing disc is w1, the rotation speed of the workpiece is w2, w1=w2=36rad/s, and the coefficient k of Princeton (Preston) is 0.7×10 -12 m 2 /N 2 , polishing disc radius R=550mm, workpiece radius R1=160mm, eccentricity e=160mm, traverse speed Vx=1000mm/min, workpiece maximum exposed edge distance d=80mm.
图4为本发明给出了计算工件上某点N相对速度的示意图,在图4中,分别建立4个笛卡尔坐标系:1、随工件运动的坐标系x2o2y2,原点为工件运动中心o2;2、工件相对静止的坐标系X2O2Y2,原点为工件静止中心O2;3、随抛光盘运动的坐标系x1y1o1,原点为抛光盘运动中心o1;4、抛光盘相对静止的坐标系X1O1Y1,原点为抛光盘静止中心O1。抛光盘转速w1,工件转速w2,偏心距为e,工件半径为R1,抛光盘半径为R,工件横向移动速度为Vx。在工件上任取一点N,相对工件运动坐标系x2o2y2半径为r,相对x2轴夹角为a。利用空间坐标变化和傅立叶级数可得,工件上某点N相对抛光盘的速度。Fig. 4 provides the schematic diagram of calculating the relative velocity of a certain point N on the workpiece for the present invention. In Fig. 4, four Cartesian coordinate systems are respectively established: 1. The coordinate system x 2 o 2 y 2 moving with the workpiece, the origin is Workpiece motion center o 2 ; 2. The relative stationary coordinate system X 2 O 2 Y 2 of the workpiece, the origin is the workpiece static center O 2 ; 3. The coordinate system x 1 y 1 o 1 moving with the polishing disc, the origin is the polishing disc movement Center o 1 ; 4. The relative stationary coordinate system X 1 O 1 Y 1 of the polishing disc, the origin being the stationary center O 1 of the polishing disc. The rotational speed of the polishing disc is w 1 , the rotational speed of the workpiece is w 2 , the eccentricity is e, the radius of the workpiece is R1, the radius of the polishing disc is R, and the lateral moving speed of the workpiece is Vx. Take any point N on the workpiece, the radius relative to the workpiece motion coordinate system x 2 o 2 y 2 is r, and the angle relative to the x 2 axis is a. The speed of a certain point N on the workpiece relative to the polishing disc can be obtained by using the space coordinate change and the Fourier series.
在坐标系x2o2y2中:In the coordinate system x 2 o 2 y 2 :
x2=r·cos(a)、y2=r·sin(a);x 2 =r·cos(a), y 2 =r·sin(a);
在坐标系X2O2Y2中:In the coordinate system X2O2Y2 :
X2=x2·cos(w2·t)-y2·sin(w2·t)X 2 =x 2 ·cos(w2·t)-y 2 ·sin(w2·t)
Y2=x2·sin(w2·t)+y2·cos(w2·t);Y 2 =x 2 ·sin(w2·t)+y 2 ·cos(w2·t);
在坐标系X1O1Y1中:In the coordinate system X 1 O 1 Y 1 :
X1=X2+e+F(t)X 1 =X 2 +e+F(t)
Y1=Y2;Y 1 =Y 2 ;
在坐标系x1y1o1中:x1=X1·cos(w1·t)+Y1·sin(w1·t)y1=-X1·sin(w1·t)+Y1·cos(w1·t)。In the coordinate system x 1 y 1 o 1 : x 1 =X1·cos(w1·t)+Y1·sin(w1·t)y 1 =-X 1 ·sin(w1·t)+Y 1 ·cos( w1·t).
其中in
工件上N点相对抛光盘速度上式中,S为工件左右运动摆幅。N point on the workpiece relative to the speed of the polishing disc In the above formula, S is the left and right movement swing of the workpiece.
2)利用压强分布表面模型(skin model)计算工件运动过程中的压强分布,对工件1个横移加工周期进行线性切割,结合Preston公式(MRR=k·p·v)得到工件不同半径上点的材料去除率的步骤:2) Use the pressure distribution surface model (skin model) to calculate the pressure distribution during the workpiece movement, perform linear cutting on the workpiece for one traversing processing cycle, and combine the Preston formula (MRR=k·p·v) to obtain the points on the workpiece with different radii The material removal rate step:
图5为本发明给出的压强分布表面模型(skin model)示意图,工件和抛光盘接触区压强分布分为两个部分,A区和B区,其中B区是一个环带,宽度为S。假设A区的压强为p,B区的压强为p+p0,抛光盘半径为R,工件半径为R1,工件露边的距离为d,工件中心与抛光盘边缘距离为d1。点M1为图5中工件圆和环带s圆的交点,点M2为图5中工件圆和抛光盘圆的交点。环带宽度s露边距离随d的变化关系的公式可表示为以下方程:Fig. 5 is the schematic diagram of the pressure distribution surface model (skin model) that the present invention provides, and the workpiece and the polishing disc contact zone pressure distribution are divided into two parts, A zone and B zone, wherein B zone is an annular zone, and width is S. Suppose the pressure in area A is p, the pressure in area B is p+p0, the radius of the polishing disc is R, the radius of the workpiece is R1, the distance between the exposed edge of the workpiece is d, and the distance between the center of the workpiece and the edge of the polishing disc is d1. Point M1 is the intersection point of the workpiece circle and the ring s circle in FIG. 5 , and point M2 is the intersection point of the workpiece circle and the polishing disc circle in FIG. 5 . The formula of the relationship between the width of the ring belt s and the relationship between the exposed edge distance and d can be expressed as the following equation:
根据牛顿定律中力和力矩的平衡公式,可得方程组:According to the balance formula of force and moment in Newton's law, the equations can be obtained:
依据上述方程组,利用二重积分就可以求出p,可表示为:According to the above equations, p can be obtained by using the double integral, which can be expressed as:
工件横向移动式加工方法是比较复杂的过程,既有工件和抛光盘的转动,又有工件的横向移动,同时在横向移动过程中,工件还有部分时间会露出抛光盘,不进行材料去除。因此,为了简化这个加工过程,可以对工件横移加工周期进行线性切割。不失一般性,选择工件任意半径r上的1个点N进行分析,这个横向移动过程线性切割分为以下两个部分:The workpiece lateral movement processing method is a relatively complicated process, which includes both the rotation of the workpiece and the polishing disc, and the lateral movement of the workpiece. At the same time, during the lateral movement, the workpiece will still be exposed to the polishing disc for part of the time without material removal. Therefore, to simplify this machining process, a linear cut can be made to the workpiece traversing machining cycle. Without loss of generality, a point N on an arbitrary radius r of the workpiece is selected for analysis. The linear cutting of this lateral movement process is divided into the following two parts:
第一部分:工件边缘未露出抛光盘,在这部分的移动过程中,点N始终位于抛光盘内,压强工件在这个区域旋转一圈材料厚度平均去除率为H0。The first part: the polishing disc is not exposed on the edge of the workpiece. During this part of the movement, the point N is always located in the polishing disc, and the pressure The average removal rate of material thickness is H0 when the workpiece rotates one circle in this area.
第二部分:从工件边缘开始露出抛光盘到露出最大距离这个过程。假设存在这样一些切割点,每隔8mm为1个点,到达最大露出距离为10个点。当工件中心运动到每个切割点时,假设在每个切割点处停下来旋转1周,N点在这10个切割点处获得的材料厚度平均去除率分别为H1、H2、H3……H10,而后根据工件的移动距离和每个切割点旋转一周的材料去除率,可以对整个横向移动过程的材料去除率进行积分,计算出N点总的材料去除率。在每个切割点位置,由于相对的偏心距e不同,利用压强分布表面模型(skin model)计算出来p和p0也不同。根据步骤1)所求的相对速度以及压强分布表面模型计算出来的p和p0,可以根据普林斯顿Preston公式(MRR=k·p·v)计算工件半径上某点N在各个切割点的材料去除率。The second part: the process of exposing the polishing disc from the edge of the workpiece to the maximum distance. Assuming that there are some cutting points, every 8mm is 1 point, and the maximum exposed distance is 10 points. When the center of the workpiece moves to each cutting point, assuming that it stops and rotates at each cutting point for 1 revolution, the average removal rate of material thickness obtained by N points at these 10 cutting points is H1, H2, H3...H10 , and then according to the moving distance of the workpiece and the material removal rate of each cutting point for one revolution, the material removal rate of the entire lateral movement process can be integrated to calculate the total material removal rate of N points. At each cutting point, due to the difference in relative eccentricity e, p and p0 calculated using the pressure distribution surface model (skin model) are also different. According to the relative velocity obtained in step 1) and the p and p0 calculated by the pressure distribution surface model, the material removal rate of a certain point N on the workpiece radius at each cutting point can be calculated according to the Princeton Preston formula (MRR=k p v) .
图6为工件半径上100mmN点材料去除率随工件圆心行进距离变化关系图。横坐标表示工件圆心行进距离,单位为m,纵坐标表示材料厚度平均去除率,单位为m/s。从图6上可以看到,曲线变化的第1个转折点出现在第1个切割点,究其原因在于工件开始露出抛光盘,压强分布开始由均布转为表面模型;曲线变化的第2个转折点出现在第8个切割点,从第1个切割点到第7个切割点,材料去除率一直处于上升阶段,到第8个切割点时,材料去除率开始呈下降趋势,究其原因在于从第8个切割点开始后,N点开始有部分时间落入抛光盘外部区域,不进行材料去除,造成了材料去除率的显著下降。Figure 6 is a graph showing the relationship between the material removal rate at the 100mmN point on the workpiece radius and the distance traveled by the workpiece circle center. The abscissa indicates the travel distance of the center of the workpiece, in m, and the ordinate indicates the average removal rate of the material thickness, in m/s. It can be seen from Figure 6 that the first turning point of the curve change occurs at the first cutting point. The reason is that the workpiece begins to expose the polishing disc, and the pressure distribution begins to change from uniform to surface model; the second turning point of the curve change The turning point appears at the 8th cutting point. From the 1st cutting point to the 7th cutting point, the material removal rate has been on the rise. At the 8th cutting point, the material removal rate begins to decline. The reason is that From the 8th cutting point, point N began to fall into the outer area of the polishing disc for part of the time, without material removal, resulting in a significant drop in material removal rate.
图7为横移式加工过程中工件不同半径上N点的材料去除率曲线。Fig. 7 is the material removal rate curve of point N on different radii of the workpiece in the process of traversing machining.
图8为横移式加工过程中对图7中各条曲线进行积分得到的不同半径上N点在1个横移周期总的材料去除率。Fig. 8 shows the total material removal rate of points N on different radii in one traversing cycle obtained by integrating the curves in Fig. 7 during traversing processing.
3)计算工件上不同半径上点露出抛光盘和落入不同压强区域的几率,根据几率采用比值对所得到的材料去除率进行加权赋值的步骤:3) Calculate the probability of exposing the polishing disc and falling into different pressure regions on different radii on the workpiece, and use the ratio to weight the obtained material removal rate according to the probability:
按照线性切割计算旋转一周材料厚度平均厚度去除率的假设,位于较大半径上的N点露出抛光盘的几率较大,它的去除率应该小一些,位于较小半径上的N点不露出抛光盘,那么它的去除率应该较大一些。但是由于运动的不连续性和旋转的不完全性,线性切割存在一定的局限性,工件不会在某个切割点处停留下来旋转一周,然后继续旋转并横向移动到下一个切割点停留下来再旋转一周;而且有可能也不是旋转一周,有可能是几分之一周。在实际加工过程中有可能半径较小的N点在切割点旋转时落入压强p的区域,而半径较大的N点在切割点旋转时落入比压强p大得多的p+p0区域,为了平衡露出抛光盘几率和N点落入不同压强区域对材料厚度平均去除率所造成的影响,可以用一个比值表示这种影响,以半径为0mm上N点的轨迹圆心坐标离抛光盘边缘的距离为基准,将这个距离与不同半径上N点轨迹圆心坐标离抛光盘边缘的距离之间比值作为衡量参数,来表示加工过程中露出抛光盘几率和落入压强较大区域这两种可能性所带来的影响,然后根据不同的比值对图7中的材料去除率进行加权赋值。表1为根据不同圆心坐标离抛光盘边缘距离的比值对去除率进行加权赋值后的材料去除率。According to the assumption of linear cutting to calculate the average thickness removal rate of the material thickness for one revolution, the N point on the larger radius has a higher probability of exposing the polishing disc, and its removal rate should be smaller, and the N point on the smaller radius does not expose the polishing disc. CD, then its removal rate should be higher. However, due to the discontinuity of motion and the incompleteness of rotation, there are certain limitations in linear cutting. The workpiece will not stop at a certain cutting point and rotate for a circle, then continue to rotate and move laterally to the next cutting point to stop and stop again. One revolution; and it may not be one revolution, it may be a fraction of a revolution. In the actual processing process, it is possible that the N point with a smaller radius falls into the area of pressure p when the cutting point rotates, while the N point with a larger radius falls into the p+p0 area which is much larger than the pressure p when the cutting point rotates , in order to balance the probability of exposing the polishing disc and the influence of point N falling into different pressure regions on the average removal rate of material thickness, this effect can be expressed by a ratio, and the center coordinate of the trajectory of point N on the radius of 0mm is from the edge of the polishing disc The distance between this distance and the distance between the center coordinates of N points on different radii and the edge of the polishing disc is used as a measurement parameter to indicate the probability of exposing the polishing disc during processing and the possibility of falling into a high pressure area. According to the influence of property, the material removal rate in Fig. 7 is weighted according to different ratios. Table 1 shows the material removal rate after the weighted assignment of the removal rate according to the ratio of the distance between the coordinates of the center of the circle and the edge of the polishing disc.
表1Table 1
图9为加权赋值后横移式加工过程中预测不同半径上N点在一个横移周期总的材料去除率。Fig. 9 shows the total material removal rate of points N on different radii predicted in one traversing cycle during traversing machining after weighted assignment.
图10和图11为数据处理后工件x、y方向上面型测量图。Fig. 10 and Fig. 11 are the upper surface measurement diagrams of the workpiece in x and y directions after data processing.
如上所述,从图9~11中可以看到,随着工件半径的增加,预测材料去除率越来越高,因此工件边缘越来越低;越靠近工件中心,高度越高,越靠近工件边缘,高度越低,实际加工后工件面型的变化趋势与预测的相一致。因此,可以根据快速抛光横移式方法,采用不同运动方式,高效率地对工件进行抛光,并可以根据预测的结果对实际工件加工面型进行控制。As mentioned above, it can be seen from Figures 9 to 11 that as the radius of the workpiece increases, the predicted material removal rate is higher and higher, so the edge of the workpiece is lower and lower; the closer to the center of the workpiece, the higher the height, and the closer to the workpiece The lower the edge, the lower the height, the change trend of the workpiece surface shape after actual processing is consistent with the prediction. Therefore, the workpiece can be polished efficiently by adopting different motion modes according to the rapid polishing traverse method, and the actual processed surface shape of the workpiece can be controlled according to the predicted result.
另外,本发明并不仅限于上述的实施形式,自然可在不脱离本发明的主旨的范围内进行各种变更。In addition, the present invention is not limited to the above-mentioned embodiments, and various changes can be made without departing from the gist of the present invention.
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CN112846977B (en) * | 2021-01-04 | 2022-05-20 | 大连理工大学 | Method for reducing flatness error of double-sided grinding workpiece |
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