CN101640547B - Handheld communication device and its motherboard assembly - Google Patents
Handheld communication device and its motherboard assembly Download PDFInfo
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- CN101640547B CN101640547B CN2008101441364A CN200810144136A CN101640547B CN 101640547 B CN101640547 B CN 101640547B CN 2008101441364 A CN2008101441364 A CN 2008101441364A CN 200810144136 A CN200810144136 A CN 200810144136A CN 101640547 B CN101640547 B CN 101640547B
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- 238000004891 communication Methods 0.000 title claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 85
- 238000009413 insulation Methods 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 3
- 239000000725 suspension Substances 0.000 claims 2
- 238000007667 floating Methods 0.000 abstract description 3
- 239000011148 porous material Substances 0.000 description 15
- 239000012212 insulator Substances 0.000 description 11
- 230000003068 static effect Effects 0.000 description 11
- 230000005611 electricity Effects 0.000 description 9
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
Description
技术领域 technical field
本发明关于一种手持通信装置及其主机板总成,特别是一种具有静电放电设计的手持通信装置及其主机板总成。The present invention relates to a handheld communication device and its motherboard assembly, in particular to a handheld communication device with electrostatic discharge design and its motherboard assembly.
背景技术 Background technique
传统通信装置与通信模块可包括主机板总成,主机板总成包括主机板以及金属构件,通常,该等产品中会内建天线,而金属构件可为通信装置的金属壳体或是设在通信装置内部用来强化整体结构之用。若是金属构件没有接地的设计,当金属构件累积到一定程度的静电后,可能产生静电放电,甚至造成通信装置出现不正常现象,例如系统关机或重开机以及屏幕画面不正常,严重可能导致通信装置损毁,传统通信装置可能会将金属构件直接接地来解决静电问题。Traditional communication devices and communication modules may include a motherboard assembly, which includes a motherboard and metal components. Usually, these products will have built-in antennas, and the metal components may be the metal casing of the communication device or the The inside of the communication device is used to strengthen the overall structure. If the metal components are not designed to be grounded, when the metal components accumulate a certain amount of static electricity, electrostatic discharge may occur, and even cause abnormal phenomena in the communication device, such as system shutdown or restart, and abnormal screen images, which may seriously damage the communication device. Damaged, traditional communication devices may directly ground metal components to solve static electricity problems.
然而,由于通信装置中内建天线,因此若是金属构件直接接地,则接地的金属构件却会吸收天线的射频(RF)信号,反而造成天线效能降低,影响通信效能。However, due to the built-in antenna in the communication device, if the metal component is directly grounded, the grounded metal component will absorb the radio frequency (RF) signal of the antenna, which will reduce the performance of the antenna and affect the communication performance.
发明内容 Contents of the invention
本发明提供一种手持通信装置及其主机板总成,其解决了在传统通信装置中,为了解决静电问题,可能将金属构件直接接地,接地的金属构件会吸收天线的射频(RF)信号,造成天线效能降低,影响通信效能的问题。The present invention provides a handheld communication device and its motherboard assembly, which solves the problem of static electricity in traditional communication devices, where metal components may be directly grounded, and the grounded metal components will absorb the radio frequency (RF) signal of the antenna. It causes the performance of the antenna to decrease and affects the communication performance.
本发明的主机板总成包括主机板以及金属构件,其中主机板包括板体以及金属弹片,金属弹片固定在板体上,金属构件设置在主机板的上方,且彼此相隔一距离,金属构件包括本体以及具有孔隙的绝缘件,具有孔隙的绝缘件耦接于本体且与金属弹片接触,金属弹片与金属构件绝缘地接近,且金属弹片与本体之间具有一间隙,而具有孔隙的绝缘件填满间隙,以使金属弹片借由绝缘件与金属构件的本体浮接。The main board assembly of the present invention includes a main board and metal components, wherein the main board includes a board body and metal elastic pieces, the metal elastic pieces are fixed on the board body, the metal components are arranged above the main board, and are separated from each other by a distance, and the metal components include The main body and the insulator with pores, the insulator with pores is coupled to the body and in contact with the metal shrapnel, the metal shrapnel is insulated from the metal member, and there is a gap between the metal shrapnel and the body, and the insulator with pores fills Fill the gap so that the metal shrapnel floats with the body of the metal component through the insulator.
应注意的是,间隙的距离与具有孔隙的绝缘件的厚度可为相等。It should be noted that the distance of the gap may be equal to the thickness of the insulation with pores.
应注意的是,间隙的距离为小于或等于0.08mm。It should be noted that the distance of the gap is less than or equal to 0.08mm.
应注意的是,具有孔隙的绝缘件包括热熔胶或双面胶。It should be noted that the insulation with pores includes hot-melt or double-sided adhesive.
应注意的是,主机板还包括接地点,接地点与金属弹片导通。It should be noted that the main board also includes a grounding point, and the grounding point conducts with the metal shrapnel.
应注意的是,主机板还包括通信组件,通信组件与主机板电性连接。It should be noted that the motherboard also includes a communication component, which is electrically connected to the motherboard.
应注意的是,通信组件包括一天线。It should be noted that the communication component includes an antenna.
应注意的是,金属构件可为金属外壳或金属键盘。It should be noted that the metal component can be a metal casing or a metal keyboard.
而本发明的手持通信装置包括上述主机板以及金属构件。However, the handheld communication device of the present invention includes the above-mentioned motherboard and metal components.
本发明的金属构件未直接接地,利用具有孔隙的绝缘件作为中间介质,并使金属弹片借由具有孔隙的绝缘件与金属构件的本体浮接,降低金属构件吸收通信组件的信号,大幅改善通信效能。The metal component of the present invention is not directly grounded, and the insulating part with pores is used as the intermediate medium, and the metal shrapnel is floated with the body of the metal component through the insulating part with pores, so as to reduce the signal absorption of the communication component by the metal component and greatly improve communication efficacy.
为让本发明的上述和其它目的、特征、和优点能更明显易懂,下文特举出优选实施例,并配合附图,作详细说明如下:In order to make the above-mentioned and other purposes, features, and advantages of the present invention more clearly understood, the preferred embodiments are specifically listed below, together with the accompanying drawings, and are described in detail as follows:
附图说明 Description of drawings
图1为本发明的通信装置的示意图;FIG. 1 is a schematic diagram of a communication device of the present invention;
图2为本发明的主机板及金属构件的侧视图。Fig. 2 is a side view of the motherboard and metal components of the present invention.
主要组件符号说明Explanation of main component symbols
本发明this invention
10 手持通信装置10 handheld communication device
11 显示器11 monitors
111 外框架111 outer frame
12 外壳12 shell
13 金属构件13 metal components
131 本体131 Ontology
132 具有孔隙的绝缘件132 Insulation with porosity
14 主机板14 Motherboard
141 通信组件141 communication components
142 金属弹片142 metal shrapnel
143 板体143 plate body
15 输入装置15 input device
151 内外边框151 inner and outer borders
16 主机板总成16 Motherboard assembly
G 接地点G ground point
D 距离D distance
I 间隙I gap
T 厚度T Thickness
具体实施方式 Detailed ways
请参阅图1、图2,图1为本发明的手持通信装置的示意图,图2为本发明的主机板总成的侧视图。在本实施例中,手持通信装置10是以智能型手机作为说明,但手持通信装置10并不仅限于此。Please refer to FIG. 1 and FIG. 2. FIG. 1 is a schematic diagram of the handheld communication device of the present invention, and FIG. 2 is a side view of the motherboard assembly of the present invention. In this embodiment, the
手持通信装置10包括显示器11、外壳12、输入装置15、主机板总成16。显示器11可用以显示来电、输入或接收信息,并且可观看图片及影片,与一般手机功用相同,同时显示器11亦可具有触控式的功能。外壳12用以保护整个手持通信装置10,而输入装置15可提供拨号以及输入文字的功能,主机板总成16包括主机板14以及金属构件13,主机板14则用以控制整个手持通信装置10的作动。在本实施例中,输入装置15的金属材质的内外边框151即为金属构件13,但金属构件13不仅限于此,例如,围绕于显示器11周遭的金属材质的外框架111、本身的金属材质的外壳12也可为金属构件13,或是其它设在手持通信装置10中,用来强化整体结构的金属材质的支架体。The
手持通信装置10包括主机板总成16,主机板总成16包括主机板14以及金属构件13,主机板14包括板体143、金属弹片142、接地点G、通信组件141,其中金属弹片142固定在板体143上,接地点G与金属弹片142导通,以使主机板14借由金属弹片142而接地,通信组件141与板体143电性连接。金属构件13包括本体131以及具有孔隙的绝缘件132,且金属构件13设置在主机板14的上方,且彼此相隔一距离D,具有孔隙的绝缘件132耦接于本体131且与金属弹片142接触,而使金属弹片142与金属构件13绝缘地接近,且金属弹片与金属构件13之间具有一间隙I,而具有孔隙的绝缘件132填满间隙I,以使金属弹片142借由具有孔隙的绝缘件132与金属构件13的本体131浮接。The
应注意的是,间隙I的距离与具有孔隙的绝缘件132的厚度T可为相等,亦或间隙I的距离小于或等于0.08mm,并且具有孔隙的绝缘件132可为热熔胶或双面胶,但不仅限于此,而在本实施例中,通信组件141为天线。It should be noted that the distance between the gap I and the thickness T of the
当金属构件13累积过多静电或外在任意一静电信号打在金属构件13上,当静电压超过临界值时,金属构件13上的静电会利用尖端放电的方式,使静电跳过具有孔隙的绝缘件132后,再传至金属弹片142,最后静电会导入主机板14上的接地点G而达到静电保护的目的。应注意的是,本发明必须选用具有孔隙的绝缘件132作为中间介质,由于绝缘件132具有孔隙,因此静电才可借由孔隙通过绝缘件132。与传统技术相比较,本发明除了可达成静电防护的功效外,由于本发明的金属构件13并未直接接地,而是利用具有孔隙的绝缘件132作为中间介质,并使金属弹片142借由具有孔隙的绝缘件132与金属构件13的本体131浮接,因此可降低金属构件13吸收通信组件141的信号,大幅改善通信效能。When the
惟以上所述者,仅为本发明的优选实施例而已,当不能以此限定本发明实施的范围,即大凡依本发明内容所作的简单的等效变化与修饰,均仍属本发明的范围内。另外本发明的任一实施例不须达成本发明所公开的全部目的或优点或特点。此外,摘要部分和标题仅是用来辅助专利文件搜寻之用,并非用来限制本发明的权利范围。But what is described above is only a preferred embodiment of the present invention, and should not limit the scope of the present invention with this, that is, all simple equivalent changes and modifications made according to the contents of the present invention still belong to the scope of the present invention Inside. In addition, any embodiment of the present invention does not necessarily achieve all the objects or advantages or features disclosed in the present invention. In addition, the abstract and the title are only used to assist in the search of patent documents, and are not used to limit the scope of rights of the present invention.
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TWI549370B (en) * | 2014-12-30 | 2016-09-11 | 和碩聯合科技股份有限公司 | Antenna structure |
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CN109041555A (en) * | 2018-07-16 | 2018-12-18 | Oppo广东移动通信有限公司 | Electronic device |
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CN2616006Y (en) * | 2003-04-21 | 2004-05-12 | 纬创资通股份有限公司 | Housing device for electronic equipment |
CN1522103A (en) * | 2003-02-14 | 2004-08-18 | 盛群半导体股份有限公司 | Electrostatic protection structure on circuit board and method thereof |
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CN1522103A (en) * | 2003-02-14 | 2004-08-18 | 盛群半导体股份有限公司 | Electrostatic protection structure on circuit board and method thereof |
CN2616006Y (en) * | 2003-04-21 | 2004-05-12 | 纬创资通股份有限公司 | Housing device for electronic equipment |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI549370B (en) * | 2014-12-30 | 2016-09-11 | 和碩聯合科技股份有限公司 | Antenna structure |
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