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CN101636011B - Hollow heat source - Google Patents

Hollow heat source Download PDF

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Publication number
CN101636011B
CN101636011B CN200810142610XA CN200810142610A CN101636011B CN 101636011 B CN101636011 B CN 101636011B CN 200810142610X A CN200810142610X A CN 200810142610XA CN 200810142610 A CN200810142610 A CN 200810142610A CN 101636011 B CN101636011 B CN 101636011B
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China
Prior art keywords
heat source
heating
hollow
hollow heat
zone
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CN101636011A (en
Inventor
王鼎
刘长洪
范守善
姜开利
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Tsinghua University
Hongfujin Precision Industry Shenzhen Co Ltd
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Tsinghua University
Hongfujin Precision Industry Shenzhen Co Ltd
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Priority to CN200810142610XA priority Critical patent/CN101636011B/en
Priority to US12/456,071 priority patent/US20100126985A1/en
Priority to EP20090164766 priority patent/EP2157831A3/en
Priority to KR1020090063076A priority patent/KR101195273B1/en
Priority to US12/460,817 priority patent/US20100108664A1/en
Priority to US12/460,853 priority patent/US20090321419A1/en
Priority to US12/460,851 priority patent/US20090321418A1/en
Priority to US12/460,854 priority patent/US20090321420A1/en
Priority to US12/460,868 priority patent/US20090321421A1/en
Priority to US12/460,859 priority patent/US20100000989A1/en
Priority to US12/460,849 priority patent/US20100000986A1/en
Priority to US12/460,852 priority patent/US20100140258A1/en
Priority to US12/460,867 priority patent/US20090314765A1/en
Priority to US12/460,848 priority patent/US20100000985A1/en
Priority to US12/460,869 priority patent/US20100139845A1/en
Priority to US12/460,850 priority patent/US20100140257A1/en
Priority to US12/460,858 priority patent/US20100000988A1/en
Priority to US12/460,871 priority patent/US20100230400A1/en
Priority to US12/460,870 priority patent/US20100000990A1/en
Priority to US12/460,855 priority patent/US20100000987A1/en
Priority to JP2009174783A priority patent/JP5048730B2/en
Priority to US12/462,188 priority patent/US20100139851A1/en
Priority to US12/462,153 priority patent/US20100000669A1/en
Priority to US12/462,155 priority patent/US20100140259A1/en
Priority to US12/655,507 priority patent/US20100122980A1/en
Publication of CN101636011A publication Critical patent/CN101636011A/en
Priority to US12/658,198 priority patent/US20100147830A1/en
Priority to US12/658,182 priority patent/US20100147827A1/en
Priority to US12/658,184 priority patent/US20100147828A1/en
Priority to US12/658,193 priority patent/US20100147829A1/en
Priority to US12/658,237 priority patent/US20100154975A1/en
Priority to US12/660,356 priority patent/US20110024410A1/en
Priority to US12/660,820 priority patent/US20100163547A1/en
Priority to US12/661,165 priority patent/US20100170891A1/en
Priority to US12/661,150 priority patent/US20100170890A1/en
Priority to US12/661,133 priority patent/US20100200568A1/en
Priority to US12/661,115 priority patent/US20100200567A1/en
Priority to US12/661,110 priority patent/US20100218367A1/en
Priority to US12/661,926 priority patent/US20100187221A1/en
Priority to US12/750,186 priority patent/US20100180429A1/en
Application granted granted Critical
Publication of CN101636011B publication Critical patent/CN101636011B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/40Heating elements having the shape of rods or tubes
    • H05B3/42Heating elements having the shape of rods or tubes non-flexible
    • H05B3/46Heating elements having the shape of rods or tubes non-flexible heating conductor mounted on insulating base
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/40Heating elements having the shape of rods or tubes
    • H05B3/54Heating elements having the shape of rods or tubes flexible
    • H05B3/56Heating cables
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013Heaters using resistive films or coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2214/00Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
    • H05B2214/04Heating means manufactured by using nanotechnology

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  • Resistance Heating (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

A hollow heat source comprises a hollow substrate, a heating layer and at least two electrodes, wherein, the heating layer is arranged on the surface of the hollow substrate; the two electrodes are arranged at intervals and are electrically connected with the heating layer respectively; the heating layer comprises a carbon nano tube layer which comprises a plurality of mutually wound carbon nano tubes.

Description

空心热源hollow heat source

技术领域 technical field

本发明涉及一种空心热源,尤其涉及一种基于碳纳米管的空心热源。The invention relates to a hollow heat source, in particular to a hollow heat source based on carbon nanotubes.

背景技术 Background technique

热源在人们的生产、生活、科研中起着重要的作用。空心热源是热源的一种,其特点为空心热源具有一空心结构,将待加热物体设置于该空心结构的空心中对物体进行加热,因此,空心热源可对待加热物体的各个部位同时加热,加热面广、加热均匀且效率较高。空心热源已成功用于工业领域、科研领域或生活领域等,如工厂管道、实验室加热炉或厨具电烤箱等。Heat sources play an important role in people's production, life and scientific research. The hollow heat source is a kind of heat source, and its characteristic is that the hollow heat source has a hollow structure, and the object to be heated is arranged in the hollow of the hollow structure to heat the object. Therefore, the hollow heat source can heat all parts of the object to be heated at the same time. Wide area, uniform heating and high efficiency. Hollow heat sources have been successfully used in industrial fields, scientific research fields, or living fields, such as factory pipes, laboratory heating furnaces, or electric ovens for kitchen utensils, etc.

空心热源的基本结构通常包括基底和设置在基底上的电热层,通过在电热层中通入电流产生焦耳热使电热层的温度升高进而加热物体。现有的空心热源的电热层通常采用金属丝,如铬镍合金丝、铜丝、钼丝或钨丝等通过铺设或缠绕的方式形成。然而,采用金属丝作为电热层具有以下缺点:其一,金属丝表面容易被氧化,导致局部电阻增加,从而被烧断,因此使用寿命短;其二,金属丝为灰体辐射,因此,热辐射效率低,辐射距离短,且辐射不均匀;其三,金属丝密度较大,重量大,使用不便。The basic structure of a hollow heat source usually includes a base and an electric heating layer arranged on the base. By passing an electric current through the electric heating layer to generate Joule heat, the temperature of the electric heating layer is raised to heat the object. The electric heating layer of the existing hollow heat sources is usually formed by laying or winding metal wires, such as chromium-nickel alloy wires, copper wires, molybdenum wires or tungsten wires. However, the use of metal wire as the electric heating layer has the following disadvantages: first, the surface of the metal wire is easily oxidized, resulting in an increase in local resistance and thus being blown, so the service life is short; second, the metal wire is gray body radiation, so the heat The radiation efficiency is low, the radiation distance is short, and the radiation is uneven; third, the metal wire has a high density, a large weight, and is inconvenient to use.

为解决金属丝作为电热层存在的问题,碳纤维因为其具有良好的黑体辐射性能,密度小等优点成为电热层材料研究的热点(请参见“DevelopmentForeground and Market Analyze of Carbon Fiber”,Wang Hai-ying,Hi-TechFiber&Application,Vol8,P765(2007))。碳纤维作为电热层时,通常以碳纤维纸的形式存在。所述碳纤维纸包括纸基材和杂乱分布于该纸基材中的沥青基碳纤维。其中,纸基材包括纤维素纤维和树脂等的混合物,沥青基碳纤维的直径为3~6毫米,长度为5~20微米。In order to solve the problem of metal wire as an electric heating layer, carbon fiber has become a hot spot in the research of electric heating layer materials because of its good black body radiation performance and low density (see "Development Foreground and Market Analyze of Carbon Fiber", Wang Hai-ying, Hi-Tech Fiber & Application, Vol8, P765 (2007)). When carbon fiber is used as an electric heating layer, it usually exists in the form of carbon fiber paper. The carbon fiber paper includes a paper substrate and pitch-based carbon fibers randomly distributed in the paper substrate. Wherein, the paper substrate includes a mixture of cellulose fiber and resin, etc., and the pitch-based carbon fiber has a diameter of 3-6 mm and a length of 5-20 microns.

然而,采用碳纤维纸作为加热层具有以下缺点:其一,碳纤维纸厚度较大,一般为几十微米,使空心热源不易做成微型结构,无法应用于微型器件的加热。其二,由于该碳纤维纸中包含了纸基材,所以该碳纤维纸的密度较大,重量大,使得采用该碳纤维纸的空心热源使用不便。其三,由于该碳纤维纸中的沥青基碳纤维杂乱分布,所以该碳纤维纸的强度较小,柔性较差,容易破裂,限制了其应有范围。其四,碳纤维纸的电热转换效率较低,不利于节能环保。However, the use of carbon fiber paper as the heating layer has the following disadvantages: First, the thickness of carbon fiber paper is relatively large, generally tens of microns, which makes it difficult for the hollow heat source to be made into a microstructure, and cannot be applied to the heating of micro devices. Second, because the carbon fiber paper contains the paper base material, the carbon fiber paper has a high density and a large weight, which makes it inconvenient to use the hollow heat source using the carbon fiber paper. Third, due to the random distribution of pitch-based carbon fibers in the carbon fiber paper, the carbon fiber paper has low strength, poor flexibility, and is easy to break, which limits its scope. Fourth, the electrothermal conversion efficiency of carbon fiber paper is low, which is not conducive to energy saving and environmental protection.

有鉴于此,确有必要提供一种空心热源,该空心热源加热效率高、强度韧性大、寿命长、成本较低、可应用于宏观和微观器件,实际应用性能好。In view of this, it is indeed necessary to provide a hollow heat source, which has high heating efficiency, high strength and toughness, long life, low cost, can be applied to macroscopic and microscopic devices, and has good practical application performance.

发明内容 Contents of the invention

一种空心热源,其包括:一空心基底;一加热层,该加热层设置于空心基底的表面;以及至少两个电极,且所述至少两个电极间隔设置于加热层的表面,并分别与该加热层电连接,其中,所述的加热层包括一碳纳米管层,且该碳纳米管层包括多个相互缠绕的碳纳米管。A hollow heat source, which includes: a hollow base; a heating layer, the heating layer is arranged on the surface of the hollow base; and at least two electrodes, and the at least two electrodes are arranged on the surface of the heating layer at intervals, and respectively The heating layer is electrically connected, wherein the heating layer includes a carbon nanotube layer, and the carbon nanotube layer includes a plurality of intertwined carbon nanotubes.

与现有技术相比较,所述的空心热源具有以下优点:其一,碳纳米管可以方便地制成任意尺寸的碳纳米管层,既可以应用于宏观领域也可以应用于微观领域。其二,碳纳米管比碳纤维具有更小的密度,所以,采用碳纳米管层的空心热源具有更轻的重量,使用方便。其三,碳纳米管层的电热转换效率高,热阻率低,所以该空心热源具有升温迅速、热滞后小、热交换速度快的特点。其四,所述的碳纳米管层中的碳纳米管无序排列,具有很好的韧性,可以弯曲折叠成任意形状而不破裂,所以具有较长的使用寿命。Compared with the prior art, the hollow heat source has the following advantages: First, carbon nanotubes can be conveniently made into carbon nanotube layers of any size, which can be applied to both macroscopic and microscopic fields. Second, carbon nanotubes have a lower density than carbon fibers, so the hollow heat source using carbon nanotube layers has lighter weight and is easier to use. Third, the carbon nanotube layer has high electrothermal conversion efficiency and low thermal resistivity, so the hollow heat source has the characteristics of rapid temperature rise, small thermal hysteresis, and fast heat exchange speed. Fourth, the carbon nanotubes in the carbon nanotube layer are arranged in disorder, have good toughness, and can be bent and folded into any shape without breaking, so they have a long service life.

附图说明 Description of drawings

图1为本技术方案第一实施例所提供的空心热源的结构示意图。Fig. 1 is a schematic structural view of the hollow heat source provided by the first embodiment of the technical solution.

图2为图1的沿II-II线的剖面示意图。FIG. 2 is a schematic cross-sectional view along line II-II of FIG. 1 .

图3为本技术方案实施例的碳纳米管层的扫描电镜照片。Fig. 3 is a scanning electron micrograph of the carbon nanotube layer of the embodiment of the technical solution.

图4为本技术方案实施例的碳纳米管层的照片。Fig. 4 is a photo of the carbon nanotube layer of the embodiment of the technical solution.

图5为本技术方案第二实施例所提供的空心热源的结构示意图。Fig. 5 is a schematic structural view of the hollow heat source provided by the second embodiment of the technical solution.

图6为图5的VI-VI线的剖面示意图。FIG. 6 is a schematic cross-sectional view of line VI-VI in FIG. 5 .

图7为本技术方案第三实施例所提供的空心热源的结构示意图。Fig. 7 is a schematic structural diagram of the hollow heat source provided by the third embodiment of the technical solution.

图8为图7的沿VIII-VIII线的剖面示意图。FIG. 8 is a schematic cross-sectional view along line VIII-VIII of FIG. 7 .

具体实施方式Detailed ways

以下将结合附图详细说明本技术方案空心热源。The hollow heat source of the technical solution will be described in detail below in conjunction with the accompanying drawings.

请参阅图1及图2,本技术方案第一实施例提供一种空心热源100,该空心热源100包括一空心基底102;一加热层104,该加热层104设置于该空心基底102的内表面;一反射层108,该反射层108位于加热层104的外围,设置于该空心基底102的外表面;一第一电极110及一第二电极112,第一电极110和第二电极112间隔设置于加热层104的表面,并分别与加热层104电连接;一绝缘保护层106,该绝缘保护层106设置于加热层104的内表面。Please refer to Fig. 1 and Fig. 2, the first embodiment of the technical solution provides a hollow heat source 100, the hollow heat source 100 includes a hollow base 102; a heating layer 104, the heating layer 104 is arranged on the inner surface of the hollow base 102 a reflective layer 108, the reflective layer 108 is located at the periphery of the heating layer 104, and is arranged on the outer surface of the hollow substrate 102; a first electrode 110 and a second electrode 112, the first electrode 110 and the second electrode 112 are arranged at intervals on the surface of the heating layer 104 and electrically connected to the heating layer 104 respectively; an insulating protection layer 106 is disposed on the inner surface of the heating layer 104 .

所述空心基底102的材料不限,用于支撑加热层104,可为硬性材料,如:陶瓷、玻璃、树脂、石英、塑料等。空心基底102亦可以选择柔性材料,如:树脂、橡胶、塑料或柔性纤维等。当空心基底102为柔性材料时,该空心热源100在使用时可根据需要弯折成任意形状。所述空心基底102的形状大小不限,其具有一空心结构即可,可为管状、球状、长方体状等,可以为全封闭结构,也可以为半封闭结构,其具体可根据实际需要进行改变。空心基底102的横截面的形状亦不限,可以为圆形、弧形、长方形等。本实施例中,空心基底102为一空心陶瓷管,其横截面为一圆形。The material of the hollow base 102 is not limited, and it is used to support the heating layer 104, and it can be a hard material, such as: ceramics, glass, resin, quartz, plastic, and the like. The hollow base 102 can also be made of flexible materials, such as resin, rubber, plastic or flexible fibers. When the hollow base 102 is made of flexible material, the hollow heat source 100 can be bent into any shape as required during use. The shape and size of the hollow base 102 are not limited, as long as it has a hollow structure, it can be tubular, spherical, cuboid, etc., it can be a fully closed structure, or a semi-closed structure, which can be changed according to actual needs . The shape of the cross-section of the hollow base 102 is not limited, and may be circular, arc-shaped, rectangular and so on. In this embodiment, the hollow base 102 is a hollow ceramic tube with a circular cross section.

所述加热层104设置于空心基底102的内表面,用于向空心基底102的内部空间加热。所述加热层104包括一碳纳米管层,该碳纳米管层本身具有一定的粘性,可以利用本身的粘性设置于空心基底102的表面,也可以通过粘结剂设置于空心基底102的表面。所述的粘结剂为硅胶。该碳纳米管层的长度、宽度和厚度不限,可根据实际需要选择。本技术方案提供的碳纳米管层的长度为1~10厘米,宽度为1~10厘米,厚度为1微米~2毫米。可以理解,碳纳米管层的热响应速度与其厚度有关。在相同面积的情况下,碳纳米管层的厚度越大,热响应速度越慢;反之,碳纳米管层的厚度越小,热响应速度越快。The heating layer 104 is disposed on the inner surface of the hollow base 102 for heating the inner space of the hollow base 102 . The heating layer 104 includes a carbon nanotube layer. The carbon nanotube layer itself has a certain viscosity, and can be placed on the surface of the hollow substrate 102 by utilizing its own viscosity, or can be arranged on the surface of the hollow substrate 102 through an adhesive. The adhesive is silica gel. The length, width and thickness of the carbon nanotube layer are not limited and can be selected according to actual needs. The carbon nanotube layer provided by the technical solution has a length of 1-10 cm, a width of 1-10 cm, and a thickness of 1 micron-2 mm. It can be understood that the thermal response speed of the carbon nanotube layer is related to its thickness. In the case of the same area, the thicker the carbon nanotube layer, the slower the thermal response speed; conversely, the smaller the carbon nanotube layer thickness, the faster the thermal response speed.

所述碳纳米管层包括相互缠绕的碳纳米管,请参阅图3。所述的碳纳米管之间通过范德华力相互吸引、缠绕,形成网络状结构。该碳纳米管层中,碳纳米管为均匀分布,无规则排列,使得该碳纳米管层呈各向同性;碳纳米管相互缠绕,因此该碳纳米管层具有很好的柔韧性,可以弯曲折叠成任意形状而不破裂,请参阅图4。该碳纳米管层中的碳纳米管包括单壁碳纳米管、双壁碳纳米管及多壁碳纳米管中的一种或多种。所述单壁碳纳米管的直径为0.5纳米~10纳米,双壁碳纳米管的直径为1.0纳米~15纳米,多壁碳纳米管的直径为1.5纳米~50纳米。该碳纳米管的长度大于50微米。本实施例中,碳纳米管的长度优选为200~900微米。The carbon nanotube layer includes intertwined carbon nanotubes, please refer to FIG. 3 . The carbon nanotubes attract and intertwine with each other through van der Waals force to form a network structure. In the carbon nanotube layer, the carbon nanotubes are uniformly distributed and arranged randomly, so that the carbon nanotube layer is isotropic; the carbon nanotubes are intertwined, so the carbon nanotube layer has good flexibility and can be bent Fold into any shape without breaking, see picture 4. The carbon nanotubes in the carbon nanotube layer include one or more of single-wall carbon nanotubes, double-wall carbon nanotubes and multi-wall carbon nanotubes. The single-walled carbon nanotubes have a diameter of 0.5 nm to 10 nm, the double-walled carbon nanotubes have a diameter of 1.0 nm to 15 nm, and the multi-walled carbon nanotubes have a diameter of 1.5 nm to 50 nm. The length of the carbon nanotube is greater than 50 microns. In this embodiment, the length of the carbon nanotubes is preferably 200-900 microns.

本实施例中,加热层104采用厚度为100微米的碳纳米管层。该碳纳米管层的长度为5厘米,碳纳米管层的宽度为3厘米。利用碳纳米管层本身的粘性,将该碳纳米管层设置于空心基底102的内表面。In this embodiment, the heating layer 104 is a carbon nanotube layer with a thickness of 100 microns. The length of the carbon nanotube layer is 5 cm, and the width of the carbon nanotube layer is 3 cm. The carbon nanotube layer is disposed on the inner surface of the hollow substrate 102 by utilizing the viscosity of the carbon nanotube layer itself.

所述第一电极110和第二电极112间隔设置且分别与加热层电连接,第一电极110和第二电极112可设置在加热层104的同一表面上也可以设置在加热层104的不同表面上。所述第一电极110和第二电极112可通过碳纳米管层的粘性或导电粘结剂(图未示)设置于该加热层104的表面上。导电粘结剂在实现第一电极110和第二电极112与碳纳米管层电接触的同时,还可将第一电极110和第二电极112更好地固定于碳纳米管层的表面上。通过该第一电极110和第二电极112可以对加热层104施加电压。其中,第一电极110和第二电极112之间相隔设置,以使采用碳纳米管层的加热层104通电发热时接入一定的阻值避免短路现象产生。优选地,第一电极110和第二电极112间隔设置于空心基底102的两端,并环绕设置于加热层104的表面。The first electrode 110 and the second electrode 112 are arranged at intervals and are respectively electrically connected to the heating layer. The first electrode 110 and the second electrode 112 can be arranged on the same surface of the heating layer 104 or on different surfaces of the heating layer 104 superior. The first electrode 110 and the second electrode 112 can be disposed on the surface of the heating layer 104 through an adhesive or conductive adhesive (not shown) of the carbon nanotube layer. The conductive adhesive can better fix the first electrode 110 and the second electrode 112 on the surface of the carbon nanotube layer while realizing the electrical contact between the first electrode 110 and the second electrode 112 and the carbon nanotube layer. A voltage can be applied to the heating layer 104 via the first electrode 110 and the second electrode 112 . Wherein, the first electrode 110 and the second electrode 112 are spaced apart, so that the heating layer 104 using the carbon nanotube layer is connected with a certain resistance value to avoid short circuit when energized and heated. Preferably, the first electrode 110 and the second electrode 112 are arranged at two ends of the hollow substrate 102 at intervals, and are arranged around the surface of the heating layer 104 .

所述第一电极110和第二电极112为导电薄膜、金属片或者金属引线。该导电薄膜的材料可以为金属、合金、铟锡氧化物(ITO)、锑锡氧化物(ATO)、导电银胶、导电聚合物等。该导电薄膜可以通过物理气相沉积法、化学气相沉积法或其它方法形成于加热层104表面。该金属片或者金属引线的材料可以为铜片或铝片等。该金属片可以通过导电粘结剂固定于加热层104表面。The first electrode 110 and the second electrode 112 are conductive films, metal sheets or metal leads. The material of the conductive thin film can be metal, alloy, indium tin oxide (ITO), antimony tin oxide (ATO), conductive silver paste, conductive polymer and the like. The conductive film can be formed on the surface of the heating layer 104 by physical vapor deposition, chemical vapor deposition or other methods. The material of the metal sheet or the metal lead may be copper sheet or aluminum sheet or the like. The metal sheet can be fixed on the surface of the heating layer 104 by a conductive adhesive.

所述第一电极110和第二电极112还可以为一碳纳米管结构。该碳纳米管结构设置于加热层104的外表面。该碳纳米管结构可通过其自身的粘性或导电粘结剂固定于加热层104的外表面。该碳纳米管结构包括定向排列且均匀分布的金属性碳纳米管。具体地,该碳纳米管结构包括至少一有序碳纳米管薄膜或至少一碳纳米管长线。The first electrode 110 and the second electrode 112 can also be a carbon nanotube structure. The carbon nanotube structure is disposed on the outer surface of the heating layer 104 . The carbon nanotube structure can be fixed on the outer surface of the heating layer 104 by its own adhesive or conductive adhesive. The carbon nanotube structure includes aligned and uniformly distributed metallic carbon nanotubes. Specifically, the carbon nanotube structure includes at least one ordered carbon nanotube film or at least one carbon nanotube long line.

本实施例中,优选地,将两个有序碳纳米管薄膜分别设置于沿空心基底102长度方向的两端作为第一电极110和第二电极112。该两个有序碳纳米管薄膜环绕于加热层104的外表面,并通过导电粘结剂与加热层104之间形成电接触。所述导电粘结剂优选为银胶。由于本实施例中的加热层104也采用碳纳米管层,所以第一电极110和第二电极112与加热层104之间具有较小的欧姆接触电阻,可以提高空心热源100对电能的利用率。In this embodiment, preferably, two ordered carbon nanotube films are respectively arranged at both ends along the length direction of the hollow substrate 102 as the first electrode 110 and the second electrode 112 . The two ordered carbon nanotube films surround the outer surface of the heating layer 104 and form an electrical contact with the heating layer 104 through a conductive adhesive. The conductive adhesive is preferably silver glue. Since the heating layer 104 in this embodiment also adopts a carbon nanotube layer, there is a small ohmic contact resistance between the first electrode 110 and the second electrode 112 and the heating layer 104, which can improve the utilization rate of the hollow heat source 100 for electric energy .

所述反射层108用于反射加热层104所发出的热量,使其有效地对空心基底102内部空间加热。反射层108位于加热层104外围,本实施例中,反射层108设置于空心基底102的外表面。反射层108的材料为一白色绝缘材料,如:金属氧化物、金属盐或陶瓷等。反射层108通过溅射或涂敷的方法设置于空心基底102的外表面。本实施例中,反射层108的材料优选为三氧化二铝,其厚度为100微米~0.5毫米。该反射层108通过溅射的方法沉积于该空心基底102外表面。可以理解,该反射层108为一可选择结构,当空心热源100未包括反射层时,该空心热源100也可用于对外加热。The reflective layer 108 is used to reflect the heat emitted by the heating layer 104 so as to effectively heat the inner space of the hollow substrate 102 . The reflective layer 108 is located on the periphery of the heating layer 104 , and in this embodiment, the reflective layer 108 is disposed on the outer surface of the hollow substrate 102 . The reflective layer 108 is made of a white insulating material, such as metal oxide, metal salt or ceramic. The reflective layer 108 is disposed on the outer surface of the hollow substrate 102 by sputtering or coating. In this embodiment, the reflective layer 108 is preferably made of Al2O3, with a thickness of 100 microns-0.5 mm. The reflective layer 108 is deposited on the outer surface of the hollow substrate 102 by sputtering. It can be understood that the reflective layer 108 is an optional structure, and when the hollow heat source 100 does not include a reflective layer, the hollow heat source 100 can also be used for external heating.

所述绝缘保护层106用来防止该空心热源100在使用时与外界形成电接触,同时还可以防止加热层104中的碳纳米管层吸附外界杂质。本实施例中,绝缘保护层106设置于加热层104的内表面。所述绝缘保护层106的材料为一绝缘材料,如:橡胶、树脂等。所述绝缘保护层106厚度不限,可以根据实际情况选择。优选地,该绝缘保护层106的厚度为0.5~2毫米。该绝缘保护层106可通过涂敷或溅射的方法形成于加热层104的表面。可以理解,所述绝缘保护层106为一可选择结构。The insulating protection layer 106 is used to prevent the hollow heat source 100 from forming electrical contact with the outside world during use, and at the same time prevent the carbon nanotube layer in the heating layer 104 from absorbing foreign impurities. In this embodiment, the insulating protection layer 106 is disposed on the inner surface of the heating layer 104 . The material of the insulating protection layer 106 is an insulating material, such as rubber, resin and the like. The thickness of the insulating protection layer 106 is not limited, and can be selected according to actual conditions. Preferably, the insulating protection layer 106 has a thickness of 0.5-2 millimeters. The insulating protection layer 106 can be formed on the surface of the heating layer 104 by coating or sputtering. It can be understood that the insulating protection layer 106 is an optional structure.

本实施例所提供的空心热源100在应用时具体包括以下步骤:提供一待加热的物体;将待加热的物体设置于该空心热源100的中心;将空心热源100通过第一电极110与第二电极112连接导线接入1伏-20伏的电源电压后,加热功率为1瓦~40瓦时,该空心热源可以辐射出波长较长的电磁波。通过温度测量仪红外测温仪AZ8859测量发现该空心热源100的加热层104表面的温度为50℃~500℃,加热待加热物体。可见,该碳纳米管层具有较高的电热转换效率。由于加热层104表面的热量以热辐射的形式传递给待加热物体,加热效果不会因为待加热物体中各个部分因为距离空心热源100的不同而产生较大的不同,可实现对待加热物体的均匀加热。对于具有黑体结构的物体来说,其所对应的温度为200℃~450℃时就能发出人眼看不见的热辐射(红外线),此时的热辐射最稳定、效率最高,所产生的热辐射热量最大。The hollow heat source 100 provided by this embodiment specifically includes the following steps during application: providing an object to be heated; placing the object to be heated at the center of the hollow heat source 100; passing the hollow heat source 100 through the first electrode 110 and the second After the connecting wire of the electrode 112 is connected to a power supply voltage of 1V-20V, the heating power is 1W-40Wh, and the hollow heat source can radiate electromagnetic waves with longer wavelengths. The temperature of the surface of the heating layer 104 of the hollow heat source 100 is found to be 50° C. to 500° C. by measuring the infrared thermometer AZ8859, which is used to heat the object to be heated. It can be seen that the carbon nanotube layer has high electrothermal conversion efficiency. Since the heat on the surface of the heating layer 104 is transferred to the object to be heated in the form of thermal radiation, the heating effect will not be greatly different due to the distance from the hollow heat source 100 to each part of the object to be heated, and the uniformity of the object to be heated can be achieved. heating. For an object with a black body structure, when the corresponding temperature is 200°C to 450°C, it can emit thermal radiation (infrared rays) invisible to the human eye. At this time, the thermal radiation is the most stable and efficient, and the generated thermal radiation Heat max.

该空心热源100在使用时,可以将其与待加热的物体表面直接接触或将其与被加热的物体间隔设置,利用其热辐射即可进行加热。该空心热源100可以广泛应用于如工厂管道、实验室加热炉或厨具电烤箱等。When the hollow heat source 100 is in use, it can be directly contacted with the surface of the object to be heated or placed at a distance from the object to be heated, and the heat radiation can be used for heating. The hollow heat source 100 can be widely used in factory pipelines, laboratory heating furnaces or electric ovens for kitchen utensils and the like.

本实施例中所提供的空心热源100具有以下优点:其一,加热层104为一碳纳米管层,碳纳米管具有强的抗腐蚀性,使其可以在酸性环境中工作;其二,碳纳米管比同体积的钢强度高100倍,重量却只有其1/6,所以,采用碳纳米管的空心热源20具有更高的强度和更轻的重量;其三,所述的碳纳米管层中的碳纳米管无序排列,具有很好的韧性,可以弯曲折叠成任意形状而不破裂,所以具有较长的使用寿命。The hollow heat source 100 provided in this embodiment has the following advantages: one, the heating layer 104 is a carbon nanotube layer, and the carbon nanotube has strong corrosion resistance, so that it can work in an acidic environment; Nanotubes are 100 times stronger than steel with the same volume, but their weight is only 1/6. Therefore, the hollow heat source 20 using carbon nanotubes has higher strength and lighter weight; thirdly, the carbon nanotubes The carbon nanotubes in the layer are arranged in disorder, have good toughness, and can be bent and folded into any shape without breaking, so it has a long service life.

请参见图5及图6,本技术方案第二实施例提供一种空心热源200,该空心热源200包括一空心基底202;一加热层204,该加热层204设置于该空心基底202的内表面;一反射层208,该反射层208位于加热层204的外围;一第一电极210及一第二电极212,第一电极210和第二电极212间隔设置于加热层204的表面,并分别与加热层204电连接;一绝缘保护层206,该绝缘保护层206设置于加热层204的内表面。第二实施例中所提供的空心热源200与第一实施例所提供的空心热源100的结构基本相同,其区别在于反射层208设置于空心基底202与加热层204之间,位于加热层204的外表面。所述空心基底202、加热层204、反射层208、第一电极210及第二电极212的结构和材料与第一实施例相同。Please refer to Fig. 5 and Fig. 6, the second embodiment of the technical solution provides a hollow heat source 200, the hollow heat source 200 includes a hollow base 202; a heating layer 204, the heating layer 204 is arranged on the inner surface of the hollow base 202 a reflective layer 208, the reflective layer 208 is located at the periphery of the heating layer 204; a first electrode 210 and a second electrode 212, the first electrode 210 and the second electrode 212 are arranged at intervals on the surface of the heating layer 204, and are respectively connected with The heating layer 204 is electrically connected; an insulating protection layer 206 is disposed on the inner surface of the heating layer 204 . The structure of the hollow heat source 200 provided in the second embodiment is basically the same as that of the hollow heat source 100 provided in the first embodiment. The outer surface. The structures and materials of the hollow substrate 202 , the heating layer 204 , the reflective layer 208 , the first electrode 210 and the second electrode 212 are the same as those of the first embodiment.

请参见图7及图8,本技术方案第三实施例提供一种空心热源300,该空心热源300包括一空心基底302;一加热层304;一反射层208;一第一电极310及一第二电极312,第一电极310和第二电极312间隔设置于加热层204的表面,并分别与加热层304电连接。第三实施例中的空心热源300和第一实施例中的空心热源100的结构基本相同,其区别在于,该加热层304设置于该空心基底302的外表面,该反射层308设置于加热层304的外表面,由于加热层304设置于空心基底302和反射层308之间,因此,无需绝缘保护层,且加热层304与反射层308的位置不同。第三实施例中的所述空心基底302、加热层304、反射层308的结构和材料与第一实施例相同。7 and 8, the third embodiment of the present technical solution provides a hollow heat source 300, the hollow heat source 300 includes a hollow base 302; a heating layer 304; a reflective layer 208; a first electrode 310 and a first The two electrodes 312 , the first electrode 310 and the second electrode 312 are arranged at intervals on the surface of the heating layer 204 and are electrically connected to the heating layer 304 respectively. The structure of the hollow heat source 300 in the third embodiment is basically the same as that of the hollow heat source 100 in the first embodiment, the difference is that the heating layer 304 is arranged on the outer surface of the hollow substrate 302, and the reflective layer 308 is arranged on the heating layer. On the outer surface of 304, since the heating layer 304 is disposed between the hollow base 302 and the reflective layer 308, there is no need for an insulating protective layer, and the positions of the heating layer 304 and the reflective layer 308 are different. The structures and materials of the hollow base 302, the heating layer 304, and the reflective layer 308 in the third embodiment are the same as those in the first embodiment.

另外,本领域技术人员还可在本发明精神内做其他变化,当然,这些依据本发明精神所做的变化,都应包含在本发明所要求保护的范围之内。In addition, those skilled in the art can also make other changes within the spirit of the present invention. Of course, these changes made according to the spirit of the present invention should be included within the scope of protection claimed by the present invention.

Claims (15)

1. hollow heat source, it comprises:
One hollow base;
One zone of heating, this zone of heating is arranged at the surface of hollow base; And
At least two electrode gap settings also are electrically connected with zone of heating respectively;
It is characterized in that described zone of heating comprises a carbon nanotube layer, and this carbon nanotube layer comprises a plurality of CNTs that twine each other through Van der Waals force.
2. hollow heat source as claimed in claim 1 is characterized in that described hollow heat source further comprises a reflector, and said reflector is arranged at the periphery of zone of heating.
3. hollow heat source as claimed in claim 2 is characterized in that described hollow heat source further comprises an insulating protective layer, and this insulating protective layer is arranged at the surface of zone of heating.
4. hollow heat source as claimed in claim 3 is characterized in that described zone of heating is arranged at the outer surface of hollow base, and described reflector is arranged at the outer surface of zone of heating, and zone of heating is between hollow base and reflector.
5. hollow heat source as claimed in claim 3 is characterized in that described zone of heating is arranged at the inner surface of hollow base, and described reflector is arranged at the outer surface of hollow base, and described insulating protective layer is arranged at the inner surface of zone of heating.
6. hollow heat source as claimed in claim 3 is characterized in that described zone of heating is arranged at the inner surface of hollow base, and described reflector is arranged between zone of heating and the hollow base, and described insulating protective layer is arranged at the inner surface of zone of heating.
7. hollow heat source as claimed in claim 2 is characterized in that, the material in described reflector is metal oxide, slaine or pottery, and its thickness is 100 microns-0.5 millimeter.
8. hollow heat source as claimed in claim 1 is characterized in that, attracts each other through Van der Waals force between the CNT in the described carbon nanotube layer, forms network-like structure.
9. hollow heat source as claimed in claim 1 is characterized in that, said even carbon nanotube distributes, random arrangement, and carbon nanotube layer is isotropism.
10. hollow heat source as claimed in claim 1 is characterized in that, the thickness of described carbon nanotube layer is 1 micron to 2 millimeters.
11. hollow heat source as claimed in claim 1 is characterized in that, the length of described CNT is greater than 50 microns, and diameter is less than 50 nanometers.
12. hollow heat source as claimed in claim 1 is characterized in that, said at least two electrodes are arranged at the same surface or the different surfaces of zone of heating.
13. hollow heat source as claimed in claim 1 is characterized in that, the material of said at least two electrodes is metal, alloy, indium tin oxide, conductive silver glue, conducting polymer or conductive carbon nanotube.
14. hollow heat source as claimed in claim 1 is characterized in that, the material of said hollow base is flexible material or hard material, and said flexible material is plastics or flexible fiber, and said hard material is pottery, glass, resin, quartz.
15. hollow heat source as claimed in claim 1 is characterized in that, at least one electrode is a carbon nano tube structure in said at least two electrodes, and this carbon nano tube structure comprises at least one ordered carbon nanotube film or at least one carbon nanotube long line.
CN200810142610XA 2008-06-07 2008-07-25 Hollow heat source Expired - Fee Related CN101636011B (en)

Priority Applications (39)

Application Number Priority Date Filing Date Title
CN200810142610XA CN101636011B (en) 2008-07-25 2008-07-25 Hollow heat source
US12/456,071 US20100126985A1 (en) 2008-06-13 2009-06-11 Carbon nanotube heater
EP20090164766 EP2157831A3 (en) 2008-07-11 2009-07-07 Hollow heater
KR1020090063076A KR101195273B1 (en) 2008-07-11 2009-07-10 Three-dimensional heat source
US12/460,853 US20090321419A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,851 US20090321418A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,854 US20090321420A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,868 US20090321421A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,817 US20100108664A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,849 US20100000986A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,852 US20100140258A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,867 US20090314765A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,848 US20100000985A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,869 US20100139845A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,850 US20100140257A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,858 US20100000988A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,871 US20100230400A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,870 US20100000990A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,855 US20100000987A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
US12/460,859 US20100000989A1 (en) 2008-06-13 2009-07-23 Carbon nanotube heater
JP2009174783A JP5048730B2 (en) 2008-07-25 2009-07-27 Hollow heat source
US12/462,188 US20100139851A1 (en) 2008-06-13 2009-07-30 Carbon nanotube heater
US12/462,153 US20100000669A1 (en) 2008-06-13 2009-07-30 Carbon nanotube heater
US12/462,155 US20100140259A1 (en) 2008-06-13 2009-07-30 Carbon nanotube heater
US12/655,507 US20100122980A1 (en) 2008-06-13 2009-12-31 Carbon nanotube heater
US12/658,198 US20100147830A1 (en) 2008-06-07 2010-02-04 Carbon nanotube heater
US12/658,182 US20100147827A1 (en) 2008-06-13 2010-02-04 Carbon nanotube heater
US12/658,184 US20100147828A1 (en) 2008-06-13 2010-02-04 Carbon nanotube heater
US12/658,193 US20100147829A1 (en) 2008-06-13 2010-02-04 Carbon nanotube heater
US12/658,237 US20100154975A1 (en) 2008-06-13 2010-02-04 Carbon Nanotube heater
US12/660,356 US20110024410A1 (en) 2008-06-13 2010-02-25 Carbon nanotube heater
US12/660,820 US20100163547A1 (en) 2008-06-13 2010-03-04 Carbon nanotube heater
US12/661,165 US20100170891A1 (en) 2008-06-13 2010-03-11 Carbon nanotube heater
US12/661,150 US20100170890A1 (en) 2008-06-13 2010-03-11 Carbon nanotube heater
US12/661,133 US20100200568A1 (en) 2008-06-13 2010-03-11 Carbon nanotube heater
US12/661,115 US20100200567A1 (en) 2008-06-13 2010-03-11 Carbon nanotube heater
US12/661,110 US20100218367A1 (en) 2008-06-13 2010-03-11 Method for making carbon nanotube heater
US12/661,926 US20100187221A1 (en) 2008-06-13 2010-03-25 Carbon nanotube hearter
US12/750,186 US20100180429A1 (en) 2008-06-13 2010-03-30 Carbon nanotube heater

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CN115515265B (en) * 2022-10-23 2024-12-06 余定益 An instant heating wire-wound thick film heating element

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007089118A1 (en) * 2006-02-03 2007-08-09 Exaenc Corp. Heating element using carbon nano tube
JP2007272223A (en) * 2006-03-10 2007-10-18 Ist Corp Heat-generating fixing belt, manufacturing method thereof, and image fixing apparatus
CN101090586A (en) * 2006-06-16 2007-12-19 清华大学 Nano flexible electrothermal material and heating device containing the nano flexible electrothermal material
CN101102838A (en) * 2004-11-17 2008-01-09 海珀里昂催化国际有限公司 Method for preparing catalyst support and supporting catalyst from single-walled carbon nanotubes

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60159591A (en) * 1984-01-27 1985-08-21 住友電気工業株式会社 Heating furnace
JPS6460988A (en) * 1987-08-31 1989-03-08 Dainippon Screen Mfg Heat treatment furnace for semiconductor substrate
JP2000077167A (en) * 1998-08-31 2000-03-14 Kyocera Corp Planar heating element
JP5017522B2 (en) * 2005-09-13 2012-09-05 株式会社アイ.エス.テイ Planar heating element and manufacturing method thereof
CN101409961B (en) * 2007-10-10 2010-06-16 清华大学 Surface heat light source, its preparation method and its application method for heating objects
CN101407312B (en) * 2007-10-10 2011-01-26 鸿富锦精密工业(深圳)有限公司 Apparatus and method for preparing carbon nano-tube film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101102838A (en) * 2004-11-17 2008-01-09 海珀里昂催化国际有限公司 Method for preparing catalyst support and supporting catalyst from single-walled carbon nanotubes
WO2007089118A1 (en) * 2006-02-03 2007-08-09 Exaenc Corp. Heating element using carbon nano tube
JP2007272223A (en) * 2006-03-10 2007-10-18 Ist Corp Heat-generating fixing belt, manufacturing method thereof, and image fixing apparatus
CN101090586A (en) * 2006-06-16 2007-12-19 清华大学 Nano flexible electrothermal material and heating device containing the nano flexible electrothermal material

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