CN101629679A - Light emitting diode and light emitting diode efficiency control method - Google Patents

Abstract

The invention discloses a light-emitting diode and a light-emitting diode efficiency control method, wherein the control method comprises the following steps: firstly, presetting a preset standard value of luminous efficacy of a light-emitting diode; then, measuring the luminous efficacy of the LED to be measured; then, calculating the difference value between the luminous efficacy of the LED to be detected and a preset standard value; finally, according to the difference value, a destructive structure is formed on at least one element in the light-emitting path of the light-emitting diode, and the range of the destructive structure is in direct proportion to the difference value. The optical characteristics of the elements in the light-emitting path of the light-emitting diode are changed through the destructive structure, so that the light-emitting efficiency of the elements in the light-emitting path is reduced, the elements do not emit light or the light penetration rate of the elements is reduced, and each light-emitting diode has consistent light-emitting efficiency.

Description

Light-emitting diode and light-emitting diode efficiency control method

technical field

The invention relates to a light-emitting diode technology, in particular to a light-emitting diode capable of controlling light-emitting brightness in a manufacturing process and a method for controlling the brightness of the light-emitting diode.

Background technique

With the rapid development of electronic technology, display devices have become an indispensable product in daily life and working environment. With the development of display devices towards thinner and more environmentally friendly, light-emitting diodes gradually replace cold cathode tubes as the light source inside the display device .

When a display device must use multiple light emitting diodes as light sources due to brightness or display range requirements, it is usually required that the multiple light emitting diodes have the same luminous intensity, so that the brightness and display range of the display device can meet the required luminous intensity distribution. For example, existing large and medium-sized TVs all have requirements for luminous intensity, so multiple light-emitting diodes must be used to illuminate each area separately, and a suitable light guide plate and diffuser must be used to produce a light source with sufficient brightness and uniformity.

However, the difference in luminous intensity between each LED can cause significant brightness differences between the various illuminated areas. In order to improve this problem, current display device manufacturers obtain light-emitting diodes with similar luminous intensity in a classified manner as light sources for large and medium-sized TVs. However, there are still differences in luminous efficiency between LEDs produced in the same process. When they are applied to display devices with stricter average luminous brightness, the production quality of LEDs cannot meet the requirements. At the same time, sorting operations will increase production costs. Difficulty with material preparation.

Contents of the invention

One of the objectives of the present invention is to provide a light-emitting diode with controllable luminance, so that each light-emitting diode can have consistent luminous efficacy.

In order to achieve the above object, the present invention provides a light emitting diode, including a substrate, a first metal pin, a second metal pin, a light-emitting chip and a wire, the first metal pin and the second metal pin are respectively arranged on the substrate , the light-emitting chip is arranged on the first metal pin, one side of the light-emitting chip forms a first light-emitting surface, the wire connects the light-emitting chip and the second metal pin, the light-emitting chip can emit light beams, and the light beams are emitted from the first light-emitting surface to form a light-emitting path , a destructive structure is formed on at least one element in the light-emitting path.

Another object of the present invention is to provide a method for controlling the brightness of the above-mentioned LED.

In order to achieve the above object, the method for controlling the brightness of light-emitting diodes provided by the present invention includes the following steps:

Step 1: Setting the preset standard value of the luminous efficacy of the LED;

Step 2: measure and record the luminous efficiency of the light-emitting diode to be tested;

Step 3: Calculate the difference between the luminous efficacy of the LED to be tested and the preset standard value; and

Step 4: forming a destructive structure on at least one element in the light-emitting path of the LED, and the range of the destructive structure is proportional to the difference value.

The light-emitting diode of the present invention uses a destructive structure to change the optical characteristics of the elements in the light-emitting path, so that its luminous efficiency decreases, it does not emit light, or its light transmittance is reduced, and the luminous efficiency of a single light-emitting diode is further reduced. Therefore, each light-emitting diode can be made Light emitting diodes have consistent luminous efficacy.

Description of drawings

In the accompanying drawings of the manual:

Fig. 1 is a structural cross-sectional view of a first embodiment of a light-emitting diode of the present invention;

2 is a structural sectional view of a second embodiment of a light emitting diode of the present invention;

3 is a flow chart of the steps of the method for controlling the performance of light-emitting diodes of the present invention;

Fig. 4 is a flow chart of the steps of changing the optical characteristics of a specific area in the light-emitting path of the light-emitting diode by using electromagnetic wave beams in the light-emitting diode efficiency control method of the present invention;

Fig. 5 is a flow chart of the steps of changing the optical characteristics of a specific area in the light-emitting path of the light-emitting diode by sandblasting in the light-emitting diode efficiency control method of the present invention;

6 is a structural sectional view of a third embodiment of a light emitting diode of the present invention;

Fig. 7 is a structural sectional view of a fourth embodiment of a light emitting diode of the present invention;

Fig. 8 is a structural sectional view of a fifth embodiment of a light emitting diode of the present invention;

FIG. 9 is a cross-sectional view of the structure of the sixth embodiment of the light emitting diode of the present invention.

And, the reference numerals in the above-mentioned accompanying drawings are explained as follows:

100 LEDs

1 Substrate

2 first metal pin

3 second metal pin

4 Light-emitting chips

5 wires

6 reflective wall

7 The first light emitting surface

8 The first carbonization structure

9 Packaging Department

10 Second light emitting surface

11 Second carbonization structure

12 fluorescent microparticles

13 The first concave structure

14 Second concave structure

15 transparent glass

16 light reflective element

Detailed ways

The technical content, structural features, achieved goals and effects of the present invention will be described in detail below with reference to the embodiments and accompanying drawings.

Referring to FIG. 1 , in the first embodiment of the present invention, a light-emitting diode 100 is provided with a substrate 1 , and the substrate 1 is provided with a first metal pin 2 , a second metal pin 3 , a light-emitting chip 4 , a wire 5 and a reflective wall 6 . The first metal pin 2 and the second metal pin 3 are disposed on two sides of the substrate 1 and extend from the top surface of the substrate 1 to the bottom surface. The reflective wall 6 extends upward from opposite sides of the top surface of the substrate 1 , the light-emitting chip 4 and the wire 5 are respectively arranged in the space formed by the substrate 1 and the reflective wall 6 , and the light-emitting chip 4 is arranged on the first metal pin 2 On the top, the wire 5 connects the light-emitting chip 4 and the second metal pin 3, and the first light-emitting surface 7 is formed on one side of the light-emitting chip 4. In this embodiment, a destructive structure is formed on the first light-emitting surface 7. The destructive structure is a The first carbonized structure 8 . When the light-emitting diode 100 is working, after the first metal pin 2 and the second metal pin 3 are respectively introduced with positive and negative voltages, the light-emitting chip 4 can be excited to emit a light beam, and the light beam forms a light-emitting path outside the light-emitting chip 4 (shown by the arrow in the figure). ).

Referring to FIG. 2 , an encapsulation part 9 is provided in the light-emitting path of a light-emitting diode 100 according to the second embodiment of the present invention. The encapsulation part 9 fills the space formed by the substrate 1 and the reflective wall 6 and covers the light-emitting chip 4 and the wire 5 to form a second Two light-emitting surfaces 10. A destructive structure is formed on the second light-emitting surface 10. In this embodiment, the destructive structure is a second carbonized structure 11. The encapsulating portion 9 can be doped with fluorescent microparticles 12 or completely transparent.

When using a completely transparent encapsulation part 9, the excitation light of the light-emitting chip 4 is emitted after penetrating the second light-emitting surface 10 of the encapsulation part 9; when using the encapsulation part 9 containing fluorescent microparticles 12, the emission spectrum of the light beam emitted by the light-emitting chip 4 is selected. After the absorption and emission spectrum of the fluorescent microparticles 12, they can interact with each other to generate the outgoing light of the desired emission spectrum.

Referring to Fig. 3, the method for controlling the efficiency of light-emitting diodes of the present invention includes the following steps:

Step 1: measure and record the luminous efficiency of the LED 100;

Step 2: Calculate and judge whether the luminous efficacy of the light emitting diode 100 is within the preset allowable range, if the luminous efficacy of the light emitting diode 100 is within the preset allowable range, perform step 3, if the luminous efficacy of the light emitting diode 100 is low At the preset allowable value, execute step 4, and if the luminous efficacy of the LED 100 is higher than the preset allowable value range, execute step 5;

Step 3: The luminous efficacy of the light emitting diode 100 meets the requirements, and can be used directly without adjustment;

Step 4: The luminous efficacy of the light emitting diode 100 does not meet the requirements, cannot be adjusted and cannot be used;

Step 5: Change the optical characteristics of the optical elements in the light-emitting path of the LED 100 to reduce the luminous efficacy of the LED 100 so that the luminous efficacy of the LED 100 is within a preset allowable range.

Referring to FIG. 4, changing the optical characteristics of the optical elements in the light path may include the following steps:

Step 6: Calculate the difference between the luminous efficacy of the LED 100 and the preset standard value; and

Step 7: Use the electromagnetic wave beam control system to form a micro-focus point on the optical element in the light-emitting path, and emit an electromagnetic wave beam with instantaneous concentrated energy at the micro-focus point to produce carbonized structures 8 and 11, and further change the micro-focus point on the optical element The optical properties of the place.

In actual implementation, the preset standard value of the luminous efficacy of the LED 100 can be preset to be 100 lumens per watt, and the allowable value range is plus or minus one percent of the standard value, that is, 99 lumens per watt to 101 lumens per watt , when the luminous efficiency of the light emitting diode 100 exceeds 101 lumens per watt, an electromagnetic wave beam control system, such as an infrared laser control system, can be used to generate micro-focus points on the optical elements in the light-emitting path, for example, on the first light-emitting surface of the light-emitting chip 4 7 or the second light-emitting surface 10 of the encapsulation part 9 uses an infrared laser control system to generate a micro focus point.

After that, irradiate the first light-emitting surface 7 of the light-emitting chip 4 or the micro-focus point of the second light-emitting surface 10 of the packaging part 9 with an infrared laser that concentrates energy instantaneously, so that it produces the first carbonization structure 8 or the second carbonization structure. 11. For example, carbonize the micro-focus point of the first light-emitting surface 7 or the second light-emitting surface 10 to make it dark, so as to change the optical characteristics at the micro-focus point. If the encapsulation part 9 is doped with fluorescent microparticles 12 , the micro-focus point can be controlled to align with the fluorescent microparticles 12 , and then the external laser with instantaneous concentrated energy is irradiated and destroys the fluorescent microparticles 12 so that they do not emit light.

When the difference between the luminous efficacy of the light-emitting diode 100 and the preset standard value is large, more micro-focus points can be set so that the first light-emitting surface 7 of the light-emitting chip 4 or the second light-emitting surface 10 of the packaging material 9 More first carbonized structures 8 and second carbonized structures 11 are formed, and when the difference between the luminous efficacy of the light-emitting diode 100 and the preset standard value is small, fewer micro-focus points can be set, so that the second carbonized structure of the light-emitting chip 4 A light-emitting surface 7 or the second light-emitting surface 10 of the encapsulation material 9 forms fewer first carbonized structures 8 and second carbonized structures 11 .

Alternatively, when the difference between the luminous efficacy of the light-emitting diode 100 and the preset standard value is large, the infrared laser can be set to irradiate the micro-focus point for a long time, so that the first light-emitting surface 7 of the light-emitting chip 4 The carbonized structure 8 or the second carbonized structure 11 on the second light-emitting surface 10 of the encapsulation material 9 has a larger range. The time set at the micro-focus point is relatively short, so that the range of the first carbonized structure 8 on the first light-emitting surface 7 of the light-emitting chip 4 or the second carbonized structure 11 on the second light-emitting surface 10 of the packaging material 9 is relatively small.

Therefore, the carbonized area or carbonization degree of the first carbonized structure 8 on the first light-emitting surface 7 of the light-emitting chip 4 or the second carbonized structure 11 on the second light-emitting surface 10 of the packaging material 9 can be adjusted according to the luminous efficacy of the light-emitting diode 100 . The light-emitting diode 100 with higher luminous efficacy can increase or expand the carbonization structure 8, 11 of the optical elements in its light-emitting path, while the light-emitting diode 100 with lower luminous efficacy but still higher than the preset allowable value can reduce the carbonization structure 8, 11 in its light-emitting path. The carbonized structures 8 and 11 of the optical elements, and the light emitting diodes 100 whose luminous efficacy is within the preset allowable range are not processed.

The optical characteristics of the optical elements in the light-emitting path of the light-emitting diode 100, such as the light transmittance, can be changed through the carbonized structures 8 and 11, so that the luminous efficiency at the micro-focus point is reduced, no light is emitted, or the light transmittance is reduced, so as to reduce the single light emission. The luminous efficacy of the diodes 100 can make each LED 100 have the same luminous efficacy.

In addition, during actual implementation, the light-emitting diodes 100 whose luminous efficacy is lower than the preset allowable value can be eliminated first, and then the other light-emitting diodes 100 whose luminous efficacy is between the preset allowable value range and beyond the preset allowable value range are measured. and processing steps.

Referring to FIG. 5, in another embodiment of the present invention, changing the optical characteristics of the optical elements in the light-emitting path may include the following steps:

Step 6': Calculate the difference between the luminous efficacy of the LED 100 and the preset standard value; and

Step 7': Use micro-particles to impact the optical element in the light-emitting path, causing irregular depressions in its structure, so as to change the optical characteristics of the light-emitting element.

In actual implementation, the preset standard value of the luminous efficacy of the LED 100 can be preset at 100 lumens per watt, and the allowable value range is plus or minus one percent of the standard value, that is, 99 lumens per watt to 101 lumens per watt , when the luminous efficiency of the LED 100 exceeds 101 lumens per watt, the nozzles with micro-controllable ejection volume can be used to impact the optical elements in the light-emitting path of the LED 100 once.

Referring to FIG. 6 , in the third embodiment of the present invention, sandblasting is performed on the first light-emitting surface 7 of the light-emitting chip 4 to produce a destructive structure. In this embodiment, the destructive structure is a first concave structure 13 . Referring to FIG. 7 , in the fourth embodiment of the present invention, sandblasting is performed on the second light-emitting surface 10 of the packaging material 9 to produce a destructive structure. In this embodiment, the destructive structure is a second concave structure 14 . When the difference between the luminous efficacy of the LED 100 and the preset standard value is large, the amount of sandblasting can be increased, and when the difference is small, the amount of sandblasting can be reduced.

In addition, the nozzle that can micro-control the ejection time can be used to continuously impact the first light-emitting surface 7 of the LED 100 or the second light-emitting surface 10 of the packaging material 9. When the luminous efficacy of the LED 100 is between the preset allowable value When the difference value between is larger, the sandblasting time is longer, and conversely, when the difference value is smaller, the sandblasting time is shorter.

Therefore, the ranges of the first recessed structure 13 on the first light-emitting surface 7 of the light-emitting chip 4 and the second recessed structure 14 on the second light-emitting surface 10 of the packaging material 9 in the LED 100 can be adjusted according to the luminous efficacy of the LED 100 . The light emitting diode 100 with higher luminous efficacy can expand the range of the first recessed structure 13 and the second recessed structure 14 , and the light emitting diode 100 with lower luminous efficacy but still higher than the preset allowable value can shrink the first recessed structure 13 The light-emitting diodes 100 whose luminous efficacy is within the range of the preset allowable value and the range of the second recess structure 14 are not processed.

Therefore, the structure of the optical elements in the light-emitting path of the light-emitting diode 100 is made to be irregularly recessed, so that the light passing through this area is partially scattered, and the energy of the passing light is relatively reduced, so as to reduce the luminous efficacy of a single light-emitting diode 100, so that each The LED 100 has uniform luminous efficacy.

In addition, chemical materials can be used to corrode and destroy the first light-emitting surface 7 of the light-emitting chip 4 in the light-emitting diode 100 or the second light-emitting surface 10 of the packaging material 9, so as to reduce the luminous efficacy of a single light-emitting diode 100, so that each light-emitting diode 100 has Consistent luminous efficacy.

Referring to FIG. 8 , in the fifth embodiment of the present invention, the optical element in the light-emitting path of the LED 100 further includes a light-transmitting element, and the light-transmitting element can be formed of glass material, plastic material, or a combination of glass and plastic. In this embodiment, the light-permeable element is transparent glass 15 , and the transparent glass 15 is disposed on the second light-emitting surface 10 of the encapsulation portion 9 and is separated from the encapsulation portion 9 . In actual implementation, the transparent glass 15 can also be connected to the encapsulation part 9 . Form destructive carbonized structures 8, 11 or recessed structures 13, 14 on the transparent glass 15 to change the optical properties of the transparent glass 15 and reduce the luminous efficacy of the light emitting diode 100, so that the luminous efficacy of the light emitting diode 100 is between the preset within the allowable range.

During implementation, a plurality of transparent glasses 15 made by the above-mentioned method and having different optical properties can be prepared in advance. After measuring and calculating the difference between the luminous efficacy of the light-emitting diode 100 and the preset standard value, it can be matched according to the difference. The transparent glass 15 with corresponding optical properties is used to reduce the luminous efficacy of the LED 100 so that the luminous efficacy of the LED 100 is within a preset allowable range.

Referring to FIG. 9 , in the sixth embodiment of the present invention, the optical elements in the light-emitting path of the light-emitting diode 100 further include a light-reflecting element 16, which is obliquely arranged on the second light-emitting surface 10 and separated from the second light-emitting surface 10. . During implementation, the light-emitting path of the light emitting element emitted by the light-emitting diode 100 can be controlled by adjusting the tilt angle of the light-reflecting element 16 .

Carbonized structures 8, 11 or recessed structures 13, 14 of destructive structure are formed on the side of the light reflecting element 16 corresponding to the second light-emitting surface 10, so as to change the optical characteristics of the light reflecting element 16, further reduce the luminous efficiency of the light emitting diode 100, and make the luminous The luminous efficacy of the diode 100 is within a preset allowable range.

During implementation, a plurality of light reflection elements 16 made by the above-mentioned method and having different optical characteristics can be prepared in advance. After measuring and calculating the difference between the luminous efficacy of the light emitting diode 100 and the preset standard value, the The light reflection element 16 with corresponding optical characteristics is used together to reduce the luminous efficacy of the light emitting diode 100 so that the luminous efficacy of the light emitting diode 100 is within a preset allowable value range.

The light-emitting diode brightness control method of the present invention uses electromagnetic wave beams or sandblasting to change the optical characteristics of the optical elements in the light-emitting path of the light-emitting diode 100 through physical impact or chemical erosion, so as to reduce the luminous efficacy of the light-emitting diode 100, and can be used according to the light-emitting diode The difference between 100 luminous efficacy and the preset standard value changes the optical characteristics of the optical elements in the light-emitting path of the light-emitting diode 100 , so that the light-emitting diodes 100 with different luminous efficacy have consistent luminous intensity.

Claims (10)

1. A light-emitting diode, comprising a substrate, a first metal pin and a second metal pin are arranged on the substrate, a light-emitting chip is arranged on the first metal pin, and one side of the light-emitting chip is formed A first light-emitting surface; a wire is connected between the light-emitting chip and the second metal pin; the light-emitting chip can emit light beams, and the light beams are emitted from the first light-emitting surface and form a light-emitting path; its features In that: a destructive structure is formed on at least one element in the light-emitting path. 2. The light emitting diode according to claim 1, wherein the destructive structure is formed on the first light emitting surface of the light emitting chip. 3. The light emitting diode according to claim 1, wherein an optical element is arranged in the light emitting path. 4. The light emitting diode as claimed in claim 3, wherein the optical element is a light-transmitting element, and the destructive structure is formed on the light-transmitting element. 5. The light emitting diode according to claim 3, wherein the optical element is a light reflective element, the light reflective element forms an oblique angle with the substrate, and the destructive structure is formed on the light reflective element . 6. A light emitting diode as claimed in claim 1 or 2 or 4 or 5, wherein the disruptive structure is a recessed structure. 7. A light emitting diode as claimed in claim 1 or 2 or 4 or 5, wherein the destructive structure is a carbonized structure. 8. A method for controlling the performance of light-emitting diodes, comprising: Firstly, a preset standard value of luminous efficacy of a light emitting diode is set; Secondly, measure and record the luminous efficacy of the light emitting diode to be tested; Next, calculate the difference between the luminous efficacy of the light emitting diode to be tested and a preset standard value; and Finally, a destructive structure is formed on at least one element in the light-emitting path of the LED, and the range of the destructive structure is proportional to the difference value. 9. The method for controlling the performance of light-emitting diodes according to claim 8, wherein the method of forming a destructive structure comprises: When setting the preset standard value of the luminous efficacy of the light-emitting diode, an error tolerance range is set; After calculating the difference between the luminous efficacy of the light emitting diode to be tested and a preset standard value, it is judged whether the difference is within an error tolerance range; If the difference is within the tolerance range, the LED can be used directly; and If the difference exceeds the allowable range of error, use the electromagnetic beam control system to form a micro-focus point on at least one component in the light-emitting path, and emit an electromagnetic beam with instantaneous concentrated energy at the micro-focus point to produce a carbonized structure. The range of the carbonized structure is the same as The difference is proportional to the value. 10. The method for controlling the performance of light-emitting diodes according to claim 8, wherein the method of forming a destructive structure comprises: When setting the preset standard value of the luminous efficacy of the light-emitting diode, an error tolerance range is set; After calculating the difference between the luminous efficacy of the light emitting diode to be tested and a preset standard value, it is judged whether the difference is within an error tolerance range; If the difference value is within the tolerance range of error, the LED can be used directly; and If the difference value exceeds the tolerance range of the error, the micro-particles are used to impact the light-emitting element in the light-emitting path with the nozzle of micro-control ejection amount, so that it produces a concave structure, and the range of the concave structure is proportional to the difference value.

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