CN101625442B - Method for encapsulating array waveguide grid chip with exterior being of curved shape - Google Patents
Method for encapsulating array waveguide grid chip with exterior being of curved shape Download PDFInfo
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- CN101625442B CN101625442B CN2009100699975A CN200910069997A CN101625442B CN 101625442 B CN101625442 B CN 101625442B CN 2009100699975 A CN2009100699975 A CN 2009100699975A CN 200910069997 A CN200910069997 A CN 200910069997A CN 101625442 B CN101625442 B CN 101625442B
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- 238000010438 heat treatment Methods 0.000 claims abstract description 47
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- 238000010168 coupling process Methods 0.000 claims abstract description 9
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- 238000007711 solidification Methods 0.000 claims abstract description 4
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- 239000000835 fiber Substances 0.000 claims description 23
- 229920002379 silicone rubber Polymers 0.000 claims description 14
- 238000012856 packing Methods 0.000 claims description 13
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
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Abstract
The invention discloses a method for encapsulating array waveguide grid chip with exterior being of curved shape, comprising the following steps: 1. coupling and aligning single-core optical fiber and multi-core optical fiber arrays respectively with the two ends of a curved AWG chip, and adopting UV curing glue to bond the coupling end faces; 2. uniformly coating thermally conductive silicone on the bottom of the curved AWG chip and fixing the curved AWG chip on a heating module; 3. bonding the periphery of the curved AWG chip in contact with the heating module by silastic except for the multi-core output end and the coupling end faces; 4. dotting adhesive on the upper edge or the lower edge of the curved AWG chip corresponding to the multi-core output end for solidification after the silastic used in step 3 is completely solidified; and 5. installing the heating module bonded with curved AWG chip into an encapsulating box. The invention can overcome the change of temperature coefficient of the chip caused by inconsistence between the thermal expansion coefficients of the heating module and the chip in the encapsulation process of the components, thus improving the wavelength stability of the components.
Description
Technical field
The present invention relates to a kind of method for packing of array waveguide grid chip.Particularly relate to and a kind ofly can reduce the optical index that chip deformation causes and change, and improve the method for packing that external form is the array waveguide grid chip of shaped form that is used for of centre wavelength stability.
Background technology
Array waveguide grating (AWG) device is a kind of optical device that is in great demand on the optical communication market, a kind of for dense wave division multipurpose/demodulation multiplexer.Because chip material is a silicon based silicon dioxide, material itself is all very responsive to temperature, stress.Therefore by heating module chip is added gentle temperature control usually, reduce the susceptibility of the external T-Ring of device border temperature.Heating module described here comprises well heater, is used for the thermistor or the RTD of Temperature Feedback, is used to improve the well heater thermal field and improves the heat sink of thermal conductivity.
At present, each optical device producer is in order to reduce chip cost, with original chip external form by the square shaped form chip that changes into.
Fig. 1 is the synoptic diagram of square chip, and Fig. 2 is the synoptic diagram of shaped form chip.As can be seen from Figure 2, silicon chip of the same area can be made more chip, but the curve chip is more responsive more than square shaped core sheet, and its reason is as follows:
Principle of work according to the AWG chip.The light of AWG centre wavelength satisfies the integral multiple that optical path difference must be a wavelength in the entire chip light path, promptly satisfy:
mλ＝n1×a×d+ΔL×n2+n1×b×d
Wherein, m is an integer, and λ is a centre wavelength, and n1 is the refraction coefficient in the free space, and n2 is the refraction coefficient in the waveguide, and a is the inclination angle of the wave front of input light, and b is the inclination angle of the wave front of output light.D is the interval between the adjacent waveguide, and Δ L is the length difference between the adjacent waveguide.In the formula, n1, n2, d, Δ L are that the characteristic by AWG device itself is determined.A is that the position by input waveguide is determined that b is by the determining positions of output waveguide.
When chip by original square become shaped form after, deformation very easily takes place in slight stressed back external form, thereby causes Δ L that significant change takes place, and causes that λ changes, promptly the centre wavelength of device changes.
One of reason that causes the deformation of curve chip is because and inconsistent the causing of thermal expansivity of the heating module surfacing of die bonding.Specifically, after being fixed on the AWG chip on the heating module, because the thermal expansivity of the variation of temperature of device and heating module and chip is inconsistent, heating module can cause internal stress to chip, thereby causes the variation of chip optical index.Be in particular in that device is operated under the same environment temperature, centre wavelength generation overall offset, promptly the temperature coefficient of chip changes.
At the inconsistent problem of bringing of the thermal expansivity of heating module and chip, solution commonly used is to adopt thermal expansivity and the approaching heat sink material of chip, as the ALN material.This method is to limiting in the heat sink selection on heating module or the heating module, and cost is very high.
The another one major reason that causes the deformation of curve chip is pulling force or the thrust that ribbon fiber produces chip.Pulling force that ribbon fiber produces chip or thrust be the pulling force or the thrust to chip of the banded fibre ribbon of extraneous push-and-pull from two aspects on the one hand, show as under same environment temperature, and centre wavelength is offset; For the inconsistent thermal stress that causes of thermal expansivity owing to ribbon fiber and box body, finally show packaged AWG device centre wavelength difference under different environment temperatures on the other hand, promptly the temperature stability of centre wavelength reduces greatly.At this problem, in U.S. Pat 20080080806A1, increase centre wavelength stability by adding some special constructions.This method complex process, cost also increases.
Summary of the invention
Technical matters to be solved by this invention is, in order to overcome the wavelength sensitivity of curved array waveguide grating chip, provide a kind of and can not only overcome that chip and the thermal expansivity of heating module own are inconsistent to bring chip deformation, thereby the overall offset of centre wavelength and the variation of optical index when causing device work, and can also overcome the chip deformation of other reason of bringing owing to external force or packaged type, improve centre wavelength temperature stability be used for the method for packing that external form is the array waveguide grid chip of shaped form.
The technical solution adopted in the present invention is: a kind ofly be used for the method for packing that external form is the array waveguide grid chip of shaped form, it is characterized in that, include following steps:
1) single-core fiber array and multi-core fiber array are coupled and aligned with shaped form AWG chip two ends respectively, the coupling end face adopts that ultra-violet curing is gluing to be connect;
2) evenly coat heat-conducting silicone grease in shaped form AWG chip bottom, and this shaped form AWG chip is fixed on the heating module;
3) in the neighboring area that shaped form AWG chip contacts with heating module, remove outside multicore output terminal and the coupling end region, all adopt silicon rubber bonding;
4) after the silicon rubber full solidification of using in the waiting step 3, with the upper marginal position or the adhesive curing of lower limb location point of the corresponding shaped form AWG of multicore output terminal chip, described glue adopts heat-curable glue or ultraviolet glue;
5) heating module with bonding shaped form AWG chip is installed in the enclosure.
The multicore output terminal of described shaped form AWG chip adopts the glue beyond the silicon rubber described in the step 3 to be completely fixed in the surface of heating module, and the characteristics of this glue are: after the multicore output terminal was fixed, the multicore output terminal can not move relative to the heating module surface; And after shaped form AWG chip other parts adopted silicon rubber bonding, still heating module is surperficial relatively slightly move.
Described multicore output terminal can adopt ribbon fiber, and described multicore output terminal is meant an end at output waveguide place in the shaped form AWG chip.
Described shaped form AWG chip is consistent with described heating module size.
Described heating module is by making the uniform low thermal resistance substrate of thermal field, well heater, high thermal resistance cushion block set gradually from top to bottom and constitute, also be provided with thermistor in the centre position at described heat sink middle part.
Of the present inventionly be used for the method for packing that external form is the array waveguide grid chip of shaped form, can overcome in the device package process, the variation of the temperature coefficient of the inconsistent chip that brings of the thermal expansivity of heating module and chip, can also overcome the different chip deformation that brings of ribbon fiber and packaged type and thermal expansivity, and the wave length shift in the high low temperature cyclic process, the wavelength stability of raising device, this method is simple in structure, with low cost, easy to use.
Description of drawings
Fig. 1 is square chip schematic appearance;
Fig. 2 is a shaped form chip schematic appearance;
Fig. 3 is a device package schematic appearance of the present invention;
Fig. 4 is the vertical section structure synoptic diagram of Fig. 3.
Wherein:
1: the multicore output terminal of shaped form AWG chip 1-1:AWG chip
2: ribbon fiber 3,8: multicore output end millet cake glue position
4: single-core fiber array 5: the multi-core fiber array
6: heating module 6-1: well heater
6-2: thermistor 6-3: low thermal resistance substrate
6-4: high thermal resistance cushion block 7: enclosure
Embodiment
Make a detailed description of the present invention below in conjunction with the embodiment accompanying drawing.
As shown in Figure 3, of the present inventionly be used for the method for packing that external form is the array waveguide grid chip of shaped form, include following steps:
1) single-core fiber array 4 and multi-core fiber array 5 are coupled and aligned with shaped form AWG chip 1 two ends respectively after, bonding with the ultra-violet curing glue end face that will be coupled;
2) coat heat-conducting silicone grease uniformly in shaped form AWG chip 1 bottom, and this shaped form AWG chip 1 is fixed on the heating module 6 by anchor clamps;
3) in the chip neighboring area that shaped form AWG chip 1 contacts with heating module 6, remove outside multicore output terminal (1-1) and the coupling end region, all adopt silicon rubber bonding;
4) after the silicon rubber full solidification of using in the waiting step 3, with the upper marginal position or the adhesive curing of lower limb location point of the corresponding shaped form AWG of multicore output terminal (1-1) chip 1, promptly in as shown in Figure 3 multicore output terminal (1-1) side point glue position 3 and position 8 place's point adhesive curings.The described glue that uses in the upper marginal position or the lower limb position of the corresponding shaped form AWG sheet 1 of multicore output terminal (1-1) adopts heat-curable glue or ultraviolet glue.
5) heating module 6 with bonding shaped form AWG chip 1 is installed in the enclosure 7, guarantees the horizontal output of ribbon fiber during installation.
In above-mentioned method, the multicore output terminal 1-1 of described shaped form AWG chip 1 adopts the less glue of elasticity coefficient beyond the silicon rubber described in the step 3 to be completely fixed in the surface of heating module 6, the characteristics of this glue are: after multicore output terminal 1-1 was fixed, multicore output terminal 1-1 can not move relative to heating module 6 surfaces.And after shaped form AWG chip 1 other parts adopted the big silicon rubber of elasticity coefficient bonding, still heating plate is surperficial relatively slightly move.The fiber array of described multicore output terminal 1-1 coupling can adopt ribbon fiber.
Of the present inventionly be used for the method for packing that external form is the array waveguide grid chip of shaped form, because shaped form AWG chip bottom is a heat-conducting silicone grease, be milk, shaped form AWG chip can be movable arbitrarily along the heating module surface, again with soft silicon rubber will around bonding after, activity to shaped form AWG chip is limited, make the shaped form AWG chip can be along heating module surface light activity, like this, when device temperature changes, can eliminate the not exclusively the same thermal stress that produces of thermal expansivity of heating module surface and shaped form AWG chip, thereby eliminate temperature coefficient optical index and shaped form AWG chip.Simultaneously, require the size and the sizableness of shaped form AWG chip own of heating module, improve the anti-physical shock of device and the performance of vibration.
Because ribbon fiber is originally as quartz material, thermal expansivity is very little, therefore, can exist the thermal expansivity of ribbon fiber and enclosure different.When extraneous variation of ambient temperature, enclosure is inevitable to the banded fine external force that produces.Be used for the method for packing that external form is the array waveguide grid chip of shaped form of the present invention, because a side of the hyperchannel output terminal of shaped form AWG chip is completely fixed in the heating module surface with glue, therefore, draw as external force and to push away when banded fine, external force is transferred on the heating module by glue, the type that has reduced shaped form AWG chip becomes, thereby has improved the wavelength stability in high low temperature cyclic process of device.Single core input end both sides then only adopt silicon rubber to fix, and its reason is that the hyperchannel output terminal of shaped form AWG chip is fixed, can move towards single core input end during little the moving of shaped form AWG chip, single-core fiber is softer, can be crooked, can not cause thermal stress to chip as ribbon fiber.
Shaped form AWG chip 1 of the present invention is consistent with described heating module 6 sizes.As shown in Figure 4, described heating module 6 is to be set gradually from top to bottom and constituted by low thermal resistance substrate 6-3, well heater 6-1, high thermal resistance cushion block 6-4, also is provided with thermistor 6-2 in the hollow position at described heat sink 6-3 middle part.
Well heater 6-1 generates heat after energising, and shaped form AWG chip is heated to working temperature.Thermistor 6-2 is used for the actual temperature of feedback profile type AWG chip, by the peripheral temperature control circuit, and can be under fixing temperature with shaped form AWG chip operation.Low thermal resistance substrate 6-3 is used to improve the thermal field homogeneity of well heater itself, uses the lower material of thermal resistivity usually, as metal etc.High thermal resistance cushion block 6-4 is positioned at well heater below, thermal resistance height.According to thermal conduction principle, heat is towards the low direction transmission of thermal resistance, and therefore, the design of heating module passes to the AWG chip temperature of well heater, thereby reduces the power consumption requirement of device.
Claims (4)
1. one kind is used for the method for packing that external form is the array waveguide grid chip of shaped form, it is characterized in that, includes following steps:
1) single-core fiber array (4) and multi-core fiber array (5) are coupled and aligned with shaped form AWG chip (1) two ends respectively, the coupling end face adopts that ultra-violet curing is gluing to be connect;
2) evenly coat heat-conducting silicone grease in shaped form AWG chip (1) bottom, and this shaped form AWG chip (1) is fixed on the heating module (6);
3) in shaped form AWG chip (1) and the neighboring area that heating module (6) contacts, remove outside multicore output terminal (1-1) and the coupling end region, all adopt silicon rubber bonding;
4) after the silicon rubber full solidification of using in the waiting step 3, with the upper marginal position or the adhesive curing of lower limb location point of multicore output terminal (1-1) corresponding shaped form AWG chip (1), described glue adopts heat-curable glue or ultraviolet glue;
5) heating module (6) with bonding shaped form AWG chip (1) is installed in the enclosure (7);
The multicore output terminal (1-1) of described shaped form AWG chip (1) adopts the glue beyond the silicon rubber described in the step 3 to be completely fixed in the surface of heating module (6), the characteristics of this glue are: after multicore output terminal (1-1) was fixed, multicore output terminal (1-1) can not move relative to heating module (6) surface; And after shaped form AWG chip (1) other parts adopt silicon rubber bonding, still can slightly move relative to heating module (6) surface.
2. according to claim 1ly be used for the method for packing that external form is the array waveguide grid chip of shaped form, it is characterized in that, described multicore output terminal (1-1) adopts ribbon fiber, and described multicore output terminal (1-1) is meant an end at output waveguide place in the shaped form AWG chip (1).
3. according to claim 1ly be used for the method for packing that external form is the array waveguide grid chip of shaped form, it is characterized in that described shaped form AWG chip (1) is consistent with described heating module (6) size.
4. according to claim 1ly be used for the method for packing that external form is the array waveguide grid chip of shaped form, it is characterized in that, described heating module (6) is by making the uniform low thermal resistance substrate of thermal field (6-3), well heater (6-1), high thermal resistance cushion block (6-4) set gradually formation from top to bottom, also be provided with thermistor (6-2) in the centre position at described low thermal resistance substrate (6-3) middle part.
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| CN2009100699975A CN101625442B (en) | 2009-07-31 | 2009-07-31 | Method for encapsulating array waveguide grid chip with exterior being of curved shape |
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| CN101625442B true CN101625442B (en) | 2010-12-01 |
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| CN102621638A (en) * | 2011-01-31 | 2012-08-01 | 广东海粤集团有限公司 | A wavelength division multiplexer based on thermally insensitive planar waveguide array grating |
| CN110672205A (en) * | 2018-07-03 | 2020-01-10 | 浙江澍源智能技术有限公司 | Micro spectrometer device based on array waveguide grating |
| CN110058371B (en) * | 2019-04-08 | 2021-05-11 | 武汉光迅科技股份有限公司 | Optical module |
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