CN101621023B - Device for treating substrates and support frame thereof - Google Patents
Device for treating substrates and support frame thereof Download PDFInfo
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- CN101621023B CN101621023B CN2009101587089A CN200910158708A CN101621023B CN 101621023 B CN101621023 B CN 101621023B CN 2009101587089 A CN2009101587089 A CN 2009101587089A CN 200910158708 A CN200910158708 A CN 200910158708A CN 101621023 B CN101621023 B CN 101621023B
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- scaffold
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
- F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
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- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
Abstract
The present invention provides a device for treating substrates and a support frame thereof. By means of the support frame, it is capable of using a space below a timber support used for maintenance operations and the like of the device for treating the substrate efficiently. On the support frame (140) located on ground for supporting the device (100) which is provided with a plurality of treating chambers (110), a portion away from the ground by a presetting height is provided with the timber support (160) directly in a mode of projecting toward an external side from the circumference of the treating chambers. The timber support is provided with a plurality of support brackets (162) mounted on the external side of the support frame, and a timber support plate (164) supported by the support brackets horizontally.
Description
Technical field
The present invention relates to possess to processed substrate implement predetermined processing process chamber substrate board treatment and be used for the bearing support of this substrate board treatment of supporting.
Background technology
In semiconductor manufacturing process, use to be used for the processed substrates such as glass substrate (such as the flat panel display substrate of liquid crystal display etc.) or semiconductor wafer (below, also referred to as " wafer ") are implemented the substrate board treatment of the PROCESS FOR TREATMENT of the regulations such as etch processes, film forming processing.In recent years, turn to purpose with highly integrated and format high throughput, be widely used the multi-chamber type substrate board treatment that possesses a plurality of process chambers (chamber).In this substrate board treatment, a plurality of process chambers are connected gate valve with carrying room and connect, and utilize the transport mechanism that possesses in the carrying room, and processed substrate is moved into chambers continuously successively, manage throughout indoorly, processed substrate is implemented separately PROCESS FOR TREATMENT.
When being arranged on substrate board treatment as described above in the clean room, can load the bearing support of the size of process chamber in the configuration of the ground of clean room, process chamber is positioned on this bearing support, and at the inner space of bearing support configuration control appliance, adaptation, vacuum pump, various cable, flue etc.For example, in following patent documentation 1,2, put down in writing the bearing support of supporting process chamber.
But if as described above process chamber is positioned on the bearing support, then process chamber will be positioned at clean room above the ground.And recently, the maximization of process chamber makes progress day by day, and further increase at the top of process chamber, and the operator is difficult to the attended operation that carries out process chamber under the ground state being standing directly in.Therefore, in the prior art, along bearing support assembling scaffold, the operator stands in the attended operation that carries out process chamber on this scaffold.
Patent documentation 1: Japanese kokai publication hei 7-193115 communique
Patent documentation 2: Japanese kokai publication hei 8-335540 communique
But, in the prior art, in order to assemble scaffold, need to the bearing support that scaffold is used be set with the bearing support adjacency of process chamber, lay scaffold thereon, so the bearing support that scaffold is used becomes obstacle, can't place the instrument used such as attended operation or sensing equipment etc., can't effectively utilize the space under the scaffold.
Particularly along with processed substrate maximizes, substrate board treatment today of large-scale day by day; the trend that exists the bearing support area shared on the ground of clean room further to enlarge; if can not utilize the space under the scaffold, then probably cause occurring the problem that needs further increase the floor area of clean room.
In addition, in the situation that be large-scale process chamber, the lower side space that is housed in process chamber namely is housed in the interior equipment of bearing support, also must increase such as vacuum pump, adaptation etc., so process chamber is supported on the higher position.Under this environment, the operator can enter the lower side space of process chamber, carries out attended operation etc., can utilize the lower side space of the scaffold of safeguarding usefulness.But in the prior art, the frame of using with the scaffold of bearing support adjacency hinders the current of operator, the problem that also exists operability to descend.
Summary of the invention
Therefore, the present invention finishes in view of this problem, and its purpose is, a kind of substrate board treatment of the lower side space such as can effectively utilizing the scaffold that uses in the attended operation etc. and the bearing support that this substrate board treatment uses are provided.
In order to address the above problem, according to a viewpoint of the present invention, a kind of bearing support is provided, it is used for supporting and possesses the substrate board treatment of processed substrate being implemented the process chamber of predetermined processing, this bearing support configuration on the ground, it is characterized in that: at the position apart from above-mentioned ground specified altitude, directly be provided with scaffold in the mode of around above-mentioned process chamber, stretching out laterally.This scaffold for example possesses a plurality of frame support brackets in the outside that is installed in above-mentioned bearing support and by the scaffolding board of horizontal supporting on above-mentioned frame support bracket.
In order to address the above problem, according to another viewpoint of the present invention, a kind of substrate board treatment is provided, it possesses implements the process chamber of predetermined processing and is configured in ground bearing support be used to supporting above-mentioned process chamber processed substrate, the aforesaid substrate processing unit is characterised in that, possess: a plurality of frame support brackets, it is directly installed on the outside of above-mentioned bearing support at the position apart from above-mentioned ground specified altitude in the mode of stretching out laterally around above-mentioned process chamber; With by the scaffold of horizontal supporting on above-mentioned frame support bracket.
According to the present invention because scaffold directly being set on the bearing support of supporting substrates processing unit, so, need to be below scaffolding board spatial placement be used for frame or the leg of this scaffolding board of supporting.Thus, can effectively utilize the lower side space of scaffolding board.And, by scaffold directly is set, can form scaffold in the position of easily carrying out attended operation on bearing support.
In addition, preferred above-mentioned each frame support bracket is formed by shaped steel.Thus, the rigidity of frame support bracket improves, and can increase by the maximum load loading on the scaffold of this frame support bracket supporting.
Preferred each frame support bracket with respect to the bearing support loading and unloading freely.Thus, can only need the position mounting support carriage of scaffolding board.And, can carry bearing support taking off under the state of frame support bracket, so can suppress to carry cost.
In addition, preferred above-mentioned process chamber consists of by matrix part with in these matrix part loading and unloading cover body part freely, also possess and to make the guide rail of dodging the position that slides into above-mentioned matrix part side from the above-mentioned cover body part of above-mentioned matrix part disengaging, around above-mentioned guide rail, also be provided with scaffold, make it possible to and above-mentioned process chamber around scaffold between current.Thus, the operator can be on one side passes through between the scaffold around the process chamber and scaffold around the guide rail, Yi Bian carry out the maintenance of matrix part inside, and can carry out the maintenance of the cover body part dodged at guide rail from matrix part.
In addition, can also between the scaffold around the scaffold around the above-mentioned process chamber and the above-mentioned guide rail, the current door that hinders between these scaffolds be set.By by the movement of thresholding system to these scaffolds, can so that except the situation of necessity, can't enter guide rail around scaffold, the fail safe that can improve attended operation.
In this case, possess the transducer of the open and-shut mode that detects above-mentioned door and control the control part of the loading and unloading action of above-mentioned cover body part according to the testing result of the sensor, above-mentioned control part limits, so that the sensor detect above-mentioned door for open state during, can't carry out the loading and unloading action of above-mentioned cover body part.Thus, can with preventing trouble before it happens such as accidents such as cover body part in the loading and unloading actions contact with operator on the scaffolding board, can further improve the fail safe of attended operation.
In addition, above-mentioned door can be the double door structure that is made of external door and the inside door that freely rotates with respect to this external door, above-mentioned external door consists of with the width narrower than above-mentioned scaffold, by the column sections pivot suspension near above-mentioned scaffold arranged outside, above-mentioned inside door is by the in front of the door end one side pivot suspension of above-mentioned external door.Thus, even close external door, also can form in the inboard of scaffold (between the in front of the door end and bearing support of external door) gap that does not have door.Therefore, even in the situation that the part of cover body part is stretched out to the outside (scaffold one side) of bearing support or guide rail, also can when cover body part is slided along guide rail, close external door and inside door, be prohibited from entering the scaffold on every side of guide rail, and can prevent the interference of external door and inside door.In addition, when cover body part is closed, by closing external door opening under the state of inside door, can close the gap of scaffold inboard.Thus, can limit the scaffold on every side that the operator enters guide rail.
In addition, can locking mechanism be set at above-mentioned door, above-mentioned control part locks so that detect above-mentioned cover body part be close state during and carry out the loading and unloading action of above-mentioned cover body part during, above-mentioned door is not opened.When closing state, there is not cover body part in cover body part on the guide rail, so large space near guide rail, occurs, might causes the operator to fall down.In the situation that might cause as mentioned above the operator to fall down, by with door locked, can forcibly make the operator can't enter the scaffold on every side of guide rail.
According to the present invention, by scaffold directly is set on the bearing support of supporting substrates processing unit, the lower side space of scaffolding board also can be utilized effectively, and can form scaffold in the position of the attended operation that easily carries out process chamber etc.
Description of drawings
Fig. 1 is the stereogram of the surface structure of the substrate board treatment that relates to of expression the first execution mode of the present invention.
Fig. 2 is the plane graph when observing substrate board treatment shown in Figure 1 from the top.
Fig. 3 is the front elevation of substrate board treatment shown in Figure 1.
Fig. 4 is the stereogram be used to the structure of the bearing support that substrate board treatment shown in Figure 1 is described.
Fig. 5 is the stereogram be used to the installation example that frame support bracket shown in Figure 4 is described.
Fig. 6 is the figure that observes from the side the connecting portion of frame support bracket shown in Figure 5 and beam parts.
Fig. 7 is the stereogram of the structure of the substrate board treatment that relates to of expression second embodiment of the invention, is the plane graph when observing substrate board treatment from the top.
Fig. 8 is the stereogram of summary of the structure example of expression door shown in Figure 7.
Fig. 9 is the plane graph of observing door shown in Figure 8 from the top.
Figure 10 is the stereogram of summary of another structure example of expression door shown in Figure 7.
Symbol description
100 substrate board treatments
102 (the gate valves of 102A～102C)
104,106 gate valves
110 (the process chambers of 110A～110C)
112 (the matrix parts of 112A～112C)
113 (the slide mechanisms of 113A～113C)
114 (the cover body part of 114A～114C)
120 carrying rooms
130 load locking rooms
140 bearing supports
142 beam parts
144 post parts
160 scaffolds
162 frame support brackets
164 scaffolding boards
166 fences
170 base plates
172 secure components
200 substrate board treatments
202 (the guide rails of 202A～202C)
210 (210A1,210A2,210B1,210B2,210C1) door
212 door main bodies
214 column sections
216 hinge parts
218 transducers
220 double door
222 external doors
224 inside doors
260,262 scaffolds
290 control parts
The S gap
Embodiment
Below, the preferred implementation that present invention will be described in detail with reference to the accompanying.Wherein, in this specification and accompanying drawing, the inscape that has in fact the identical function structure is marked same-sign, and omit repeat specification.
(structure example of the substrate board treatment that the first execution mode relates to)
At first, the execution mode during to the substrate board treatment of the multi-chamber type that the present invention is used for possess a plurality of process chambers describes with reference to accompanying drawing.Fig. 1 is the stereogram of summary of the surface structure of the substrate board treatment that relates to of expression present embodiment.Fig. 2 is the plane graph (arrow A of Fig. 1) of substrate board treatment shown in Figure 1, and Fig. 3 is front elevation (arrow B of Fig. 1).Fig. 1～substrate board treatment 100 shown in Figure 3 possesses three and is used for implement the process chamber 110 (110A～110C) of plasma treatment with substrate (FPD substrate) as the flat-panel monitor of processed substrate.
Chambers 110 is by matrix part 112 (112A～112C) and cover body part 114 (114A～114C) consist of.Wherein, matrix part 112 is provided with the mounting table that for example is about the FPD usefulness substrate of 3m for mounting on one side, cover body part 114 is arranged on this matrix part 112 in freely mode of loading and unloading, possesses electrode to process chamber 110 interior supply response energy, to be used to form the spray of processing gas atmosphere first-class.When carrying out the attended operation of process chamber 110 inside, cover body part 114 is taken off from cover body part 112.Thus, can exchange or adjust the parts of process chamber 110 inside of the open-top of process chamber 110.Wherein, chambers 110 can consist of in the mode of carrying out same treatment (such as etch processes etc.), also can consist of in the mode of carrying out mutually different processing (such as etch processes and ashing processing etc.).
(102A～102C) and cross section are that the side of the carrying room 120 of polygon (for example the cross section is rectangle) is connected to chambers 110 by gate valve 102.Also be connected with load locking room 130 by gate valve 104 on the carrying room 120.So, in the substrate board treatment 100 of present embodiment, a plurality of process chambers 110 and load locking room 130 configure in the mode of surrounding carrying room 120.And substrate is taken out of and is moved into mechanism's (omitting diagram at this) and be connected with load locking room 130 by gate valve 106.
Above-mentioned a plurality of process chamber 110, carrying room 120 and load locking room 130 are positioned in and are disposed on the ground bearing support 140 that is the case shape of clean room, and carry out height and regulate, so that be specified altitude apart from the ground of clean room, for example be 1800mm.Thus, on one side FPD is remained on this conveyance height (route via) with substrate, move into substrate board treatment 100 on one side.
In addition, by each chamber is positioned on the bearing support 140, can guarantee each chamber the below, be the space in the bearing support 140.In each space, be equipped with control appliance, high frequency electric source, adaptation, other power equipments, sensing equipment, the exhaust apparatus that comprises vacuum pump, various cable, flue etc. such as the drive division of each chamber of control.
In addition, substrate board treatment 100 also possesses the scaffold 160 that uses in the attended operation for example.Particularly, to possess this scaffold 160 at the ground of distance clean room specified altitude (for example 1800mm) from the mode that bearing support 140 stretches out to its outside level.As mentioned above, in the substrate board treatment 100 of present embodiment, a plurality of process chambers 110 and load locking room 130 configure in the mode of surrounding carrying room 120, and these chambers are positioned on the bearing support 140.Therefore, as shown in Figure 1 and Figure 2, scaffold 160 be positioned at process chamber 110 and load locking room 130 around.The operator can move to the destination at this scaffold 160, carries out the maintenance of chambers 110, carrying room 120 and load locking room 130.
The scaffold 160 of this present embodiment is supported by directly being fixed on the bearing support 140, it is characterized in that not possessing frame or the leg that supports itself.The more specifically structure example of scaffold 160 is described below.
By the substrate board treatment 100 of present embodiment, when FPD is carried out plasma treatment with substrate, at first utilize substrate to take out of to move into mechanism (not shown) FPD is moved in the load locking room 130 with substrate.At this moment, if at the load locking room 130 interior FPD substrates that exist processing to finish, then in load locking room 130, take out of the FPD substrate that this processing finishes, be replaced by untreated FPD substrate.With FPD with substrate move into load locking room 130 interior after, closing gate valve 106.
Then, after being decompressed to the vacuum degree of regulation in the load locking room 130, open the gate valve 104 of 130 of carrying room 120 and load locking rooms.Then, utilize the transport mechanism (not shown) in the carrying room 120, the FPD in the load locking room 130 is moved in the carrying room 120 with substrate, then closing gate valve 104.
Then, open the gate valve 102 between carrying room 120 and the process chamber 110, utilize the above-mentioned transport mechanism FPD that will be untreated to move on the mounting table in the process chamber 110 with substrate.At this moment, if the FPD substrate that exists processing to finish is then taken out of the FPD substrate that this processing finishes, be replaced by untreated FPD substrate.
In process chamber 110, supply with processing gas to the FPD that is positioned on the mounting table with substrate from spray head, simultaneously any in lower electrode or the upper electrode or two electrode supply high frequency electric power produce the plasma of processing gas between upper electrode and lower electrode.Thus, FPD is implemented the plasma treatment of regulation with substrate.
(structure example of scaffold)
Here, describe the concrete structure example of the scaffold 160 of present embodiment in detail with reference to accompanying drawing.Fig. 4 is the stereogram for the bearing support of explanation substrate board treatment.Wherein, as shown in Figure 4, process chamber 110, carrying room 120 and load locking room 130 are positioned in the upside of bearing support 140.
As shown in Figure 4, on bearing support 140, in the ground of distance clean room specified altitude mode of stretching out laterally around the process chamber 110 a plurality of frame support brackets 162 to be installed directly.But, at the position that scaffold 160 is not set, frame support bracket 162 is not installed.For example, move into respect to taking out of of load locking room 130 with substrate in order not hinder FPD, scaffold 160 can be set below this gate valve 106.Therefore, at this position frame support bracket 162 is not installed.
In addition, in the present embodiment, a plurality of frame support brackets 162 are installed on the beam parts 142 that consist of bearing support 140 upper ends.On these a plurality of frame support brackets 162, be equipped with a plurality of scaffolding boards 164, form thus scaffold 160.Frame support bracket 162 has high rigidity, for example is made of H shaped steel.And the deflection of preferred scaffolding board 164 is little and quality is light, for example is made of cancellated aluminium or stainless steel.In addition, preferably anti-skidding processing is implemented on the surface of scaffolding board 164.
At this, with reference to the concrete installation example of description of drawings frame support bracket 162.Fig. 5 is for the stereogram of the installation example of explanation frame support bracket 162, amplifies the connecting portion that shows frame support bracket 162 and beam parts 142.Fig. 6 is the figure that observes from the side connecting portion shown in Figure 5.As shown in Figure 5 and Figure 6, in order stably to support process chamber 110, carrying room 120 and load locking room 130, the beam parts 142 of present embodiment are made of for example H shaped steel with high rigidity.In addition, also the post parts 144 of preferred these beam parts 142 of supporting also are made of H shaped steel.
By laying a plurality of scaffolding boards 164 and be fixed on a plurality of frame support brackets 162 that are installed on the beam parts 142 of bearing support 140, scaffolding board 164 is formed scaffold 160 by horizontal supporting.And, can also be provided for the fence that prevents that the operator from falling down at scaffold 160.Particularly, for example as shown in Figure 6, can fence 166 be installed along the side in scaffold 160 outsides.Thus, can improve the fail safe of scaffold 160.
But in the present embodiment, a plurality of frame support brackets 162 are installed on the beam parts 142 of bearing support 140 upper ends, so the height of the height of scaffold 160 and bearing support 140 is basic identical.With respect to this, in the situation that scaffold 160 is arranged on more lower position, the mode of for example identical with beam parts 142 beam parts with level between beam parts 142 and the ground can be installed on the post parts 144, and mounting support carriage 162 thereon.
In addition, can particularly according to height dimension, regulate the setting height(from bottom) of scaffold 160 according to the shape of process chamber 110, carrying room 120 and load locking room 130, scaffold 160 be constituted step-like.
As mentioned above, in the present embodiment, owing on the bearing support 140 of supporting substrates processing unit 100, scaffold 160 is set directly, so do not need to support frame or the leg of scaffolding board 164.Therefore, form the space that does not have barrier at the downside of scaffold 160, thus can place the instrument used such as attended operation or sensing equipment etc. at this, can be to effectively utilizing in the clean room.
In addition, by scaffold 160 directly is set on bearing support 140, can be at the position formation scaffold that is easy to carry out attended operation.For example can with and process chamber 110 between do not have the mode in large gap that scaffold is set, and, compare with the situation of assembling independently scaffold on process chamber next door of existing mode, more stable scaffold can be set.
In addition, because scaffold 160 is positioned at apart from the ground of clean room the approximately height of 1800mm, the operator is not passed through for 160 times at scaffold by scaffold 160 can with hindering.Therefore, can be safely and promptly enter the inboard of bearing support 140, no doubt can effectively load the maintenance of process chamber 110, carrying room 120 and load locking room 130 on bearing support 140, also can effectively be housed in the maintenance of the equipment in the bearing support 140.
And, according to present embodiment, by the quantity of increase and decrease frame support bracket 162, can tackle simply the maximum load loading of substrate board treatment 100 required scaffolds 160.
And, because frame support bracket 162 is fastening by secure component 172 and bearing support 140, so can in clean room, arrange before the bearing support 140, take off frame support bracket 162 and scaffold 164.The cost of transportation that therefore, can suppress bearing support 140.
In addition, the scaffold 160 of present embodiment arranges in the mode of surrounding process chamber 110 and load locking room 130, but is not limited thereto, and for example can according to the situation that arranges of substrate board treatment 100, only at the position of necessity scaffold 160 be set.
(the second execution mode)
Below, with reference to description of drawings the second execution mode of the present invention.Fig. 7 is the plane graph of summary of the structure example of the substrate board treatment that relates to of expression the second execution mode.As shown in Figure 7, the substrate board treatment 100 of this substrate board treatment 200 and the first execution mode is same, around carrying room 120, is provided with a plurality of process chambers 110 and load locking room 130.
(((114A～114C) consists of (with reference to Fig. 1) to chambers 110 shown in Figure 7 for 112A～112C) and the cover body part 114 of freely taking off from this matrix part 112 by matrix part 112 for 110A～110C).And, (be respectively arranged with the pair of guide rails 202 of stretching out to its side (202A～202C) among the 110A～110C) at these process chambers 110.(202A～202C) is used for making that the cover body part 114 of taking off from matrix part 112 slides into matrix part 112 sides dodges position (even cover body part 114 is rotated in upturned mode take slide mechanism 113 as axle, the position of interference not occuring with matrix part 112 also) to these pair of guide rails 202.
(114A～114C) is provided with (113A～113C) of pair of sliding mechanism 113 at its sidepiece respectively to cover body part 114.(113A～113C) for example possesses around the trunnion axis free rotary ground supporting cover body part 114 (support unit (not shown) of 114A～114C) slide mechanism 113.And support unit is also as (slide block of 202A～202C) be free to slide plays a role along guide rail 202.Wherein, cover body part 114B shown in Figure 7,114C are closed condition, and cover body part 114A is the state that slides along guide rail 202A.
When carrying out the attended operation of process chamber 110, utilize switching mechanism (not shown) to make cover body part 114 after matrix part 112 disengagings, utilize slide mechanism 113 to make it slide mobile at guide rail 202.Then, make cover body part 114 take the support unit (not shown) of slide mechanism 113 as axle, at 202 Rotate 180s of parallel guide rail °, it is turned.Thus, matrix part 112 and cover body part 114 be inner upwards, so, climb up under scaffold 260,262 the state the operator, can be arranged on the maintenance of matrix part 112 and the various parts of the inside of cover body part 114.
In addition, on the bearing support 140 of supporting substrates processing unit 200 shown in Figure 7, be provided with the scaffold 260 that uses the attended operation for example in the mode of stretching out around chambers 110.This scaffold 260 and the first execution mode consist of equally.Namely, consisted of by a plurality of frame support brackets 162 and a plurality of scaffolding boards 164 that are laid on these frame support brackets 162, wherein, this frame support bracket 162 is directly installed on the bearing support 140 in the mode of stretching out laterally around process chamber at the ground of distance clean room specified altitude.
And, in substrate board treatment shown in Figure 7 200, further manage throughout around the guide rail 202 of 110 sides, chamber, scaffold 262 also is set.Make it possible to pass through between the scaffold 260 of the scaffold 262 around these guide rails 202 and process chamber 110, these scaffolds 260,262 are combined and consist of substrate board treatment 200 scaffold on every side.Like this, by the scaffold 260 around the set handling chamber not only 110, scaffold 262 also is set around guide rail 202, the operator can pass through between these scaffolds 260,262, the maintenance of inside of the matrix part 112 of chambers 110 not only can be carried out, the maintenance of the inside of the cover body part 114 on the guide rail 202 can also be positioned at.
For the scaffold 262 around such guide rail 202, also can consist of equally with the scaffold 260 around the process chamber 110.Wherein, structure according to process chamber 110, sometimes can be without bearing support 140 support rails 202, in this case, the frame support bracket of scaffold 262 is not installed around guide rail 202, so, for scaffold 262, be provided in addition supporting the bearing support of scaffolding board, to replace by frame support bracket supporting scaffolding board.
But, in the time of on the scaffold 262 around the operator is positioned at guide rail 202, owing to make cover body part 114 might cause cover body part 114 to contact with the operator along guide rail 202 slip movements, thereby not preferred.In addition, when the cover body part 114 of matrix part 112 is closed, owing to there not being cover body part 114 on guide rail 202, near waiting guide rail 202 such as 202 of pair of guide rails large space appears.If operator's this moment is positioned on the scaffold 262 around the guide rail 202, might cause such as falling 202 on guide rail owing to walking etc.In order to tackle this problem, can consider in guide rail 202 1 sides of scaffold 262 fence to be set, but this fence might hinder the attended operation of cover body part 114.
Therefore, in the present embodiment, for example as shown in Figure 7, preferred managing throughout between the scaffold 260 and the scaffold 262 around each guide rail 202 on every side of chamber 110 arranges and hinders at these scaffolds 260,262 current a plurality of door 210 (210A1,210A2,210B1,210B2,210C1).Thus, can be so that except necessary situation, can't enter each guide rail 202 scaffold 262 on every side.
Below, with reference to the concrete structure example of this door 210 of description of drawings.Fig. 8 is the stereoscopic figure of summary of the structure example of expression door 210, and Fig. 9 is the plane graph of observing door 210 from the top.Door 210 constitutes, with hinge part 216 with door main body 212 pivot suspensions on the column sections that erects 214 for example shown in Figure 8.Column sections 214 can be arranged on process chamber 110 scaffold 260 on every side, can also be arranged on guide rail 202 scaffold 262 on every side.In the time of on the scaffold 260 around column sections 214 being arranged on process chamber 110, for example can be installed on a plurality of frame support brackets 162 (in Fig. 8, omitting diagram).
In addition, as shown in Figure 9, be provided with the transducer 218 of the open and-shut mode of detecting gate main body 212 at door 210.As this transducer 218, can enumerate such as non-contact switch or limit switch etc.In the situation that use non-contact switch as transducer 218, transducer 218 is installed on the door main body 212, so that for example when door main body 212 is closed fully, the metal section of column sections 214 enters the detection range of transducer 218.
This transducer 218 is electrically connected with the control part 290 of control substrate board treatment 200 integral body, and control part 290 can be according to the open and-shut mode of grasping door 210 from the detection signal of transducer 218.And control part 290 also is electrically connected with the switching mechanism of the cover body part 114 of chambers 110.Therefore, control part 290 can be according to the sliding action of open and-shut mode control cover body part 114 on guide rail 202 of door 210.Concrete example as this interlocked control has following example.
At this moment, for example the switching mechanism at cover body part 114A is in the situation of manual mode, for example can remove the braking of opening and closing structure, is carried out the sliding action of cover body part 114A by the operator.In addition, be in the situation of automated manner at the switching mechanism of cover body part 114A, the switching mechanism of control part 290 control cover body part 114A makes cover body part 114A slide along guide rail 202A mobile.
With respect to this, at least one in 210A1 and door 210A2 are gone out in detection is for during opening, and control part 290 is forbidden the sliding action of cover body part 114A.
In this case, when the cover body part 114 of matrix part 112 is closed, can enter door 210 Close Alls of guide rail 202 scaffold 262 on every side of cover body part 114 slips, during just at the scaffold 262 enterprising line operate around the guide rail 202, need to open the door 210 that can enter this scaffold 262 the operator.
For example, the operator at door 210A1 and door in the situation on the scaffold 262 between the 210A2, among two door 210A1, the 210A2 at least one opened, in the situation that the operator is not positioned on this scaffold 262, can be closed two door 210A1,210A2.
Thus, at two door 210A1, when 210A2 closes, owing to the operator is not positioned on the guide rail 202A scaffold 262 on every side, so, even make cover body part 114 slide the possibility that does not also exist the operator to contact with cover body part 114 along guide rail 202A.And, even when making cover body part 114 slide into matrix part 112 along guide rail 202, the danger that the operator falls down from scaffold 262 can not occur yet.
In addition, for example can be according to the locking mechanism of unblanking, locking from the control of control part 290 door 210 setting, according to the on-off action of cover body part 114, the locking mechanism of control gate 210.That is, when the cover body part 114 of matrix part 112 is closed or when cover body part 114 is slided along guide rail 202, automatically lock at door 210, make forcibly the operator can't enter guide rail 202 scaffold 262 on every side.And, can face sensor be set the scaffold 262 around guide rail 202, direct-detection has or not the operator, according to this testing result, the sliding action of control cover body part 114.
So according to the second execution mode, can access the effect same with the first execution mode.And, by the scaffold 260 around process chamber 110 and guide rail 202 scaffold 262 on every side door 210 is set, so that only can enter where necessary the scaffold 262 around the guide rail 202, the fail safe that can further improve thus attended operation.
And the structure that is arranged on the door on scaffold 260 and the scaffold 262 around the guide rail 202 around the process chamber 110 is not limited to structure shown in Figure 8, the so-called double door structure that two doors further being provided with door in the inboard of door of also can serving as reasons consist of.For example as shown in Figure 7, (slide mechanism 113 of 114A～114C) is (in the situation of 113A～113C) do not stretch out to the outside of bearing support 140 or guide rail 202 in cover body part 114, even use door 210 shown in Figure 8, when cover body part 114 is slided, can not disturb with door 210 yet.
But because the shape of cover body part 114 or its slide mechanism 113 etc., for example as shown in Figure 1, the part of the slide mechanism 113 of cover body part 114 can reach the outside of bearing support 140 or guide rail 202 sometimes.When this cover body part 114 is slided along guide rail 202, might cause the part of cover body part 114 or slide mechanism 113 that the door 210 of closing is caused interference.Therefore, in this case, by using the door of two doors, for example double door shown in Figure 10 replaces the door 210 of a door, disturbs with door 210 in the time of can preventing that cover body part 114 from sliding.
Below, the concrete structure example as the double door of the variation of this door is described.Figure 10 is the stereoscopic figure of the double door of present embodiment.Double door 220 shown in Figure 10 is made of two doors, namely is made of external door (main door) 222 and the inside door (secondary door) 224 that overlaps on the next door of external door 222.External door 222 is same with above-mentioned 210 door main body 212 shown in Figure 8, for example utilizes hinge part 216 pivot suspensions on the column sections 214 that erects.
Inside door 224 is the doors be used to the outside of the in front of the door end of closing external door 222, even making under the overlapping state of inside door 224 and external door 222,, can not pass (can not pass through) if close external door 222 between scaffold 260 and scaffold 262.Particularly, inside door 224 can centered by holding in front of the door, be rotated to the direction of arrow R or L by the hinge part of holding in front of the door a side (not shown) pivot suspension that is installed in external door 222.
According to the double door 220 of formation like this, by closing external door 222, can limit the operator current on scaffold 260,262.And, the Width scaffold 260 of external door 222,262 width are narrow, thus, even close external door 222 fully, also can its hold in front of the door and bearing support 140 between, namely form gap S in scaffold 260,262 inboard, this gap S be used for preventing when cover body part 114 from sliding and external door 222 between interference.
Particularly, if inside door 224 is rotated and overlapping with external door 222 to the direction of arrow R, can form the gap S that does not have door in scaffold 260,262 inboard.With respect to this, if inside door 224 is rotated to the direction of arrow L, will make inside door 224 turn to the in front of the door outside of end of external door 222, so, by inside door 224, can block the gap S of scaffold 260,262 inboard.
For example, when cover body part 114 is closed, rotate to arrow L direction by making inside door 224, and close external door 222, gap S is blocked.Thus, can limit the operator and enter each guide rail 202 scaffold 262 on every side from the scaffold 260 around the chambers 110.
In addition, when cover body part 114 is carried out sliding action, making under the overlapping state of inside door 224 and external door 222, close external door 222.Thus, can between the in front of the door end and bearing support 140 of external door 222, (and between process chamber 110) guarantee gap S, so, can anti-skidding mechanism 113 grades and external door 222 disturb.That is, even when being the shape that the part of slide mechanism 113 stretches out laterally since this part of stretching out when cover body part 114 is slided by gap S, so can not disturb with double door 220.And in this case, the operator can't enter the scaffold 262 around each guide rail 202.
And, when cover body part 114 is opened fully, keep inside door 224 and external door 222 overlapping, open external door 222, the operator can enter each guide rail 202 scaffold 262 on every side from chambers 110 scaffold 260 on every side thus.
And, by near external door 222 and inside door 224, the transducers such as non-contact switch or limit switch being set, can be according to the open and-shut mode of external door 222 and inside door 224, the sliding action of control cover body part 114.
In addition, be illustrated for the situation of using respectively hinged door to consist of door 210, double door 220 in the second execution mode, but be not limited to this, also can consist of door 210, double door 220 by sliding door or folding door etc. respectively.
Above, with reference to the accompanying drawings of preferred implementation of the present invention, but the present invention is not limited thereto.So long as various modifications or fixed case that those skilled in the art can access in the scope that claim is put down in writing can think clearly that certainly it belongs to technical scope of the present invention.
For example, embodiments of the present invention are illustrated as an example of plasma processing apparatus example as substrate board treatment, but the present invention is not limited thereto, and also is applicable to sputter equipment, coating developing device, decontaminating apparatus, CMP (Chemical Mechanical Polishing: chemico-mechanical polishing) device, PVD (Physical Vapor Deposition: physical vapour deposition (PVD)) device, exposure device, ion implantation apparatus etc.
In addition, the present invention not only can be applicable to multi-chamber type substrate board treatment, can also be applicable to the substrate board treatment that is made of single process chamber.And, not only can be applicable to one chip substrate board treatment that substrate is processed one by one, can also be applicable to the batch type processing unit that multi-piece substrate is processed in the lump.
In addition, processed substrate is not limited to above-mentioned FPD substrate, can also be such as semiconductor wafer, CD substrate, printed base plate, ceramic substrate, solar cell substrate etc.
Utilizability on the industry
The present invention can be applicable to possess processed substrate is implemented the substrate board treatment of process chamber of predetermined processing and the bearing support that is used for this substrate board treatment of supporting.
Claims (7)
1. bearing support, it is used for supporting and possesses the substrate board treatment of processed substrate being implemented the process chamber of predetermined processing, and this bearing support configuration is characterized in that on the ground:
At the position apart from described ground specified altitude, directly be provided with scaffold in the mode of around described process chamber, stretching out laterally,
Described scaffold comprises:
Be installed in a plurality of frame support brackets in the outside of described bearing support; With by the scaffolding board of horizontal supporting on described frame support bracket,
Described process chamber consists of by matrix part with in these matrix part loading and unloading cover body part freely, also possesses to make the guide rail of dodging the position that slides into the side of described matrix part from the described cover body part of described matrix part disengaging,
Around described guide rail, also be provided with scaffold, make it possible to and described process chamber around scaffold between current,
Between the scaffold around the scaffold around the described process chamber and the described guide rail, be provided with and hinder door current between these scaffolds.
2. bearing support as claimed in claim 1 is characterized in that:
Described each frame support bracket is formed by shaped steel.
3. bearing support as claimed in claim 2 is characterized in that:
Described each frame support bracket with respect to described bearing support loading and unloading freely.
4. bearing support as claimed in claim 1 is characterized in that:
Possess the transducer of the open and-shut mode that detects described door and control the control part of the loading and unloading action of described cover body part according to the testing result of described transducer,
Described control part limits so that described transducer detect described door for open state during, can't carry out the loading and unloading action of described cover body part.
5. bearing support as claimed in claim 4 is characterized in that:
Be provided with locking mechanism at described door,
Described control part locks so that detect described cover body part be close state during and carry out described cover body part loading and unloading actions during, described door is not opened.
6. bearing support as claimed in claim 1 is characterized in that:
Described door is to rotate the double door structure that inside door freely consists of by external door with respect to this external door,
Described external door consists of with the width narrower than described scaffold, by the column sections pivot suspension near described scaffold arranged outside,
Described inside door is by the in front of the door end one side pivot suspension of described external door.
7. substrate board treatment, it possesses implements the process chamber of predetermined processing and is configured in ground bearing support be used to supporting described process chamber processed substrate, and described substrate board treatment is characterised in that, comprising:
A plurality of frame support brackets, it is directly installed on the outside of described bearing support at the position apart from described ground specified altitude in the mode of stretching out laterally around described process chamber; With
By the scaffold of horizontal supporting on described frame support bracket,
Described process chamber consists of by matrix part with in these matrix part loading and unloading cover body part freely, also possesses to make the guide rail of dodging the position that slides into the side of described matrix part from the described cover body part of described matrix part disengaging,
Around described guide rail, also be provided with scaffold, make it possible to and described process chamber around scaffold between current,
Between the scaffold around the scaffold around the described process chamber and the described guide rail, be provided with and hinder door current between these scaffolds.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-174128 | 2008-07-03 | ||
| JP2008174128A JP5350692B2 (en) | 2008-07-03 | 2008-07-03 | Substrate processing apparatus and support frame used therefor |
| JP2008174128 | 2008-07-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101621023A CN101621023A (en) | 2010-01-06 |
| CN101621023B true CN101621023B (en) | 2013-03-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101587089A Active CN101621023B (en) | 2008-07-03 | 2009-07-03 | Device for treating substrates and support frame thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5350692B2 (en) |
| KR (2) | KR20100004880A (en) |
| CN (1) | CN101621023B (en) |
| TW (1) | TWI513882B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6217611B2 (en) * | 2014-12-02 | 2017-10-25 | 株式会社ダイフク | Goods storage facility |
| US10014196B2 (en) * | 2015-10-20 | 2018-07-03 | Lam Research Corporation | Wafer transport assembly with integrated buffers |
| KR102497795B1 (en) * | 2016-07-04 | 2023-02-09 | 세메스 주식회사 | Apparatus for treating substrate |
| CN110556317B (en) * | 2019-08-13 | 2022-11-11 | 世源科技工程有限公司 | Semiconductor processing system |
| JP7177130B2 (en) * | 2020-11-30 | 2022-11-22 | キヤノントッキ株式会社 | Film deposition equipment and scaffolding unit |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5611655A (en) * | 1993-04-23 | 1997-03-18 | Tokyo Electron Limited | Vacuum process apparatus and vacuum processing method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001023872A (en) * | 1999-07-09 | 2001-01-26 | Hitachi Ltd | Semiconductor substrate processing equipment |
| JP2002147811A (en) * | 2000-11-08 | 2002-05-22 | Sharp Corp | Cleanroom |
| TWI276157B (en) * | 2005-01-31 | 2007-03-11 | Dainippon Screen Mfg | Substrate processing apparatus |
| JP4108092B2 (en) * | 2005-10-19 | 2008-06-25 | 株式會社 村上工務店 | Work scaffold support device and work scaffold installation method |
| KR20070043214A (en) * | 2005-10-20 | 2007-04-25 | 삼성전자주식회사 | Semiconductor equipment management mechanism |
| TWM306250U (en) * | 2006-07-19 | 2007-02-11 | Cheng Lee Steel Sheet Co Ltd | Structure of supporting rack frame capable of having safety net hooked onto |
| JP4800149B2 (en) * | 2006-08-17 | 2011-10-26 | 東京エレクトロン株式会社 | Semiconductor manufacturing equipment |
-
2008
- 2008-07-03 JP JP2008174128A patent/JP5350692B2/en not_active Expired - Fee Related
-
2009
- 2009-07-02 KR KR1020090060369A patent/KR20100004880A/en not_active Ceased
- 2009-07-02 TW TW098122421A patent/TWI513882B/en active
- 2009-07-03 CN CN2009101587089A patent/CN101621023B/en active Active
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2012
- 2012-03-13 KR KR1020120025565A patent/KR101278800B1/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5611655A (en) * | 1993-04-23 | 1997-03-18 | Tokyo Electron Limited | Vacuum process apparatus and vacuum processing method |
Non-Patent Citations (2)
| Title |
|---|
| JP特开平8-162515A 1996.06.21 |
| JP特开平8-335540A 1996.12.17 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI513882B (en) | 2015-12-21 |
| KR20120044950A (en) | 2012-05-08 |
| TW201016933A (en) | 2010-05-01 |
| JP5350692B2 (en) | 2013-11-27 |
| KR101278800B1 (en) | 2013-06-25 |
| CN101621023A (en) | 2010-01-06 |
| KR20100004880A (en) | 2010-01-13 |
| JP2010016144A (en) | 2010-01-21 |
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