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CN101620918B - Form-less electronic device and methods of manufacturing - Google Patents

Form-less electronic device and methods of manufacturing Download PDF

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Publication number
CN101620918B
CN101620918B CN2009101489546A CN200910148954A CN101620918B CN 101620918 B CN101620918 B CN 101620918B CN 2009101489546 A CN2009101489546 A CN 2009101489546A CN 200910148954 A CN200910148954 A CN 200910148954A CN 101620918 B CN101620918 B CN 101620918B
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China
Prior art keywords
winding
inductance device
iron
core
magnetic conductivity
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CN101620918A (en
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M·T·吉尔马丁
F·J·基克
A·H·本杰明
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Pulse Electronics Inc
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Pulse Engineering Inc
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Abstract

Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.

Description

Form-less electronic device and manufacture method thereof
The application is filed on July 8th, 2004, and application number is 200410055085.X, is entitled as the dividing an application of patent application of form-less electronic device and manufacture method thereof.
The request priority
It is priority that the application requires the U.S. Provisional Patent Application sequence number of owning together 60/485,801 of the same names of submission on July 8th, 2003, and it proposes in the lump in this as reference.
Background of invention
1. invention field
The present invention relates generally to electronic component, and relate in particular to improved design and the method for manufacturing the miniature electronic part comprise the transformer that there is no reel or other molded component and inductance device (for example " choking-winding ").
2. prior art
Just as is known in the art, sensing element is the electronic device that inductance performance (that is, storing the energy in magnetic field) is provided in alternating current circuit.Inductor is a kind of known inductance device, and typically with the one or more coils or the winding that are wound around or be not wrapped on conducting magnet core, forms.So-called " double winding " inductor is used and is wrapped in two windings that share on iron core.
Transformer is for the another kind of sensing element from an alternating current circuit (AC) to another alternating current circuit (AC) transmitting energy by magnetic coupling.Usually, transformer forms by be wound around one or more wire on ferrite iron core.Wire is for armature winding and from the first circuit electric coupling energy and electric coupling energy to the first circuit.Thereby another root wire also is wound around ferrite iron core and the first wire magnetic coupling, it is as secondary winding and from second circuit electric coupling energy and electric coupling energy to second circuit.The AC power supplies that imposes on armature winding causes the AC power supplies in secondary winding, and vice versa.Transformer can be for changing between voltage swing and size of current, thereby produce phase shift, and change between impedance level.
Ferrite iron core inductor and transformer are used in modern broadband communications circuit usually, and it comprises ISDN (integrated service digital network) transceiver, DSL (Digital Subscriber Loop) modulator-demodulator and cable modem.These equipment provide many functions, comprise shielding, control between vertical inductance (leakage) and the broadband communications equipment connected at them and communication line and carry out impedance matching and separate safely.Promoted the development of ferrite iron core inductors technique at the needs that adapt to chip apparatus manufacture and the determined performance specification of standard housings and for example will provide in ITU-T miniaturization.For example, in the DSL modulator-demodulator, need the transformer of miniaturization, this transformer makes introduces minimized THD (total harmonic distortion) on whole DSL signal bandwidth, makes the DSL signal pass through simultaneously.As another example, the double winding inductor can be used in the telephone line filter so that shielding and high vertical inductance (high-leakage) to be provided.
" typing " device
Usually the ferrite iron core inductance device of prior art is well-known with the EP iron core apparatus.In the prior art, EP and similar device are all well-known.For example, the name that Heringer etc. authorized on February 6th, 1996 is called the U.S. Patent No. 5 of " induced electricity sub-element ", 489,884 disclose a kind of induced electricity sub-element that comprises coil case, this coil case has the coil case flange that limits the winding space and is integrally formed in the contact pilotage bar on the coil case flange, and this contact pilotage bar has extension and cuts by bottom the free end outwards limited by extension formed therein.The U.S. Patent No. 5,434,493 that the name that Woody etc. authorized in July 18 nineteen ninety-five is called " secured core induction electricity charger " discloses the iron core apparatus of a kind of EP iron core apparatus and other typing, and it comprises EE and RS device.Other similar known device comprises the so-called EF of Inter alia, ER, RM and pot core device.Referring to for example, the U.S. Patent No. 5,952,907 that the name that McWilliams etc. authorized on September 14th, 1999 is called " blind hole pot core device for transformer " discloses a kind of pot core device.
Fig. 1 illustrates typical prior art EP transformer configuration, and shows the particular aspects of its manufacturing process.The EP iron core of Fig. 1 device 100 is formed by two EP iron cores, half sheet 104,106, each EP iron core half sheet has semi-circular channel 108 and the newel parts 110 of the tack formed therein, and each EP iron core half sheet is formed as ferrite compounds by magnetic conductive material.As shown in Figure 1, each EP iron core half sheet 104,106 works in coordination to form the effective continuous magnetic conductivity " shell " of surrounding winding 112, and shell is around bobbin bobbin 109, and bobbin 109 is contained on newel parts 110.Thereby can adapt to specific designing requirement with the translation function of adjusting transformer in the accurate gap of the base designs of iron core column 110.When the EP iron core apparatus is installed, the winding 112 be wrapped on bobbin 109 also just is wrapped on newel 110.This makes magnetic flux flow when winding is applied to alternating current cross the EP lamination.Once this device has been installed, the outside of EP iron core is with regard to this winding of self-closing, thereby the magnetic screen of height is provided.Thereby the Ferrite Material in the design iron core is in specific frequency range and provide predetermined magnetic flux density in temperature range.
Bobbin 109 comprises terminal arrangement 114 (aka " bases ") that usually are installed on device 100 bottoms, and winding 112 is through the flat base part 116 of half sheet 104,106, and terminal is arranged 114 and is assembled to printed circuit board (PCB) (PCB) or other assembly.If necessary, externally on the top of winding 112 outsides, use the sideband (not shown) for additional electricity isolation.
Shape and size with respect to each iron core, can adopt various bobbin.Bobbin itself (except other parts of primary and secondary device) has a lot of different characteristics; They can provide that the pin/terminal of varying number, different winding are selected, different final mounting technique, with through hole, relative surface installation etc. is installed.For example, the U.S. Patent No. 6,587,023 that the name that Miyazaki etc. authorized on July 1st, 2003 is called " electromagnetism inductance device " discloses a kind of flat bobbin with axially aligned through hole.The U.S. Patent No. 5,350,980 that the name that Dye etc. authorized on September 27th, 1994 is called " non-linear inductor that magnetic field reduces " especially discloses a kind of ferrite iron core of the dumb-bell shape with inductance coil and other things.
Electromagnetic wire be generally used for reeling transformer and inductance device (for example inductor and transformer, comprise aforementioned EP type device).Magnet-wire is by having applied polymer insulation film or hybrid polymer film as polyurethane, polyester, polyimides (aka " Kapton tM") etc. copper or other electric conducting material form.The thickness of film coating and composition have determined the insulating capacity of wire.Although other size also can be used in application-specific, the magnet-wire in 31 to 42AWG scopes is most commonly used to the application of microelectronic transformer.
The EP of above-mentioned prior art and similar inductance device have several shortcomings.The major defect of EP device is the complexity of its manufacturing process, and it has increased manufacturing cost.The use of bobbin (also referred to as " formwork " or " drum stand ") has not only increased cost, and because bobbin just remains on device inside after manufacturing process completes, thereby increased size and the complexity of resulting device.Bobbin has taken the space in device, and these spaces originally can be for other function, or cannot give less size and/or the footprint of resulting device on the contrary.
In addition, EP iron core half sheet itself is shaped and produces relatively expensive.For example, to EP transformer Installation And Test the time, its volume production cost higher (being the scope of about 0.50 to 0.70 dollar now).Be expected to manufacture the performance characteristics that its performance characteristics at least equals the EP transformer, and the device that cost reduces greatly.
For example, and the iron core apparatus of the shaping of " base is housed " defect that the device of Fig. 1 also has is that base or terminal are arranged 144 uses own.This structure has increased cost and manufacturing step in addition, has at least strengthened the vertical cross section that installs 100.In some applications, if possible, can need to use the structure of lower vertical section.
Bonded wire
Bonded wire is product/technique used for a long time, for the production of so-called " air core coil ".Air core coil itself is inductor, and typically for RFID label, voice coil loudspeaker voice coil and sensor.Producing material and the manufacturing equipment of bonded wire can buy from various channels well known to those skilled in the art.
Bonded wire is the important wire that scribbles enamel paint, and (wire is sold business or device producer) is coated with additional coating on the enamel paint outer surface.Usually, when being wound around, (although can comprise by the processing of other type radiant flux, chemicals etc., usually by heating) thus can make the bonded wire coating have the wire that activity will coat bonds/combines.This processing can provide certain advantage, and cost is lower in the electronic unit production process.
Therefore, need to improve the method without the electronic installation that uses bobbin or other formwork (drum stand) and this device of manufacture.For simplified manufacturing technique and further reduce costs, this improved device should utilize existing in the field of bobbin/formwork (drum stand) and known technology ideally, but can also in the overall dimensions that reduces device and/or footprint, keep it to form desirable electricity and the physical property of the homologue of winding.
In addition, for specific application, wish to remove base of the prior art (terminal arrangement) very much from the iron core apparatus of shaping is overall.
Summary of the invention
The present invention is by providing improved electronic inductance device and manufacture method thereof to meet above-mentioned needs.
In a first aspect of the present invention, improved amorphous electronic installation is disclosed.This device generally includes iron core and at least one winding, and described at least one winding forms and is arranged in described device, but does not use inner bobbin.In one embodiment, this device comprises the bonded wire coil be formed in the shaping iron core, and the bonded wire of this coil is not used inner bobbin or other similar structure.For example be provided with termination components, so that coil windings terminates to female component (, PCB) in this bottom of device.
In a second aspect of the present invention, many iron core apparatus are disclosed.In the exemplary embodiment, these many iron core apparatus comprise a plurality of above-mentioned amorphous electronic inductance devices, and its orientation with end to end (or side by side) is arranged in the common terminal stub (tube), thereby save the footprint of PCB.Merge and there is the pin of shared signal selectively, thereby reduce equally required terminal lead quantity.
In a third aspect of the present invention, the termination base for the amorphous inductance device of termination is disclosed.In one embodiment, the termination base comprises with the molded assembly that embeds the SMT terminal, with the standard bonding technique, the SET connecting terminals is received to an independent device.In another embodiment, base is for holding a plurality of iron cores adjacent one another are.
In a fourth aspect of the present invention, the manufacture method of manufacturing above-mentioned amorphous electronic installation is disclosed.The method generally includes: the providing end stub (tube); The iron core of the shaping that is divided at least two elements is provided; Bonded wire is provided, and this bonded wire comprises the wire with end; By described winding being arranged in described iron-core element to expose end, thus the core assembly of forming shaped; The core assembly of shaping is connected with the termination components with a plurality of terminals; Terminate to the end of terminal with the end by described winding.
In a fifth aspect of the present invention, a kind of improved " directly installing " amorphous device is disclosed.In one embodiment, this device comprises aforementioned amorphous inductance device, but this amorphous inductance device directly is assemblied in female component, (for example, PCB) above, has therefore saved the termination base.The free end of winding is outstanding from installing through the hole formed in lower component.This end is welded on the conductive spacer on the PCB substrate.
In a sixth aspect of the present invention, disclose aforementioned amorphous and without the manufacture method of base inductance device.The method generally includes: the iron core that the shaping that is divided at least two elements is provided; At least one long section lead with end is provided; This wire is formed to the iron core winding with multiturn, thereby also comprise that processing this wire forms these circles the element that is essentially whole; Thereby with winding is arranged in iron-core element expose described winding end for termination.In one embodiment, this wire comprises heat activated bonded wire, and this bonded wire is wrapped on axle and then is heated, thereby removes bobbin.Then the device of this assembling directly is installed on above-mentioned PCB or other device.
In seventh aspect present invention, the bootstrap electronic installation of installing for surface is disclosed, it generally includes without bobbin sensing element and the bootstrap termination components that is connected sensing element, this bootstrap termination components comprises a plurality of terminal components, each terminal component, for receiving at least one winding overhang of induction winding on it, is installed thereby can carry out surface.In an example embodiment, termination components comprises the molded plastics base with terminal post, and the iron core winding is wrapped on this terminal post.
In eighth aspect present invention, a kind of low section, electronic building brick are cheaply disclosed, generally include: there is the first hole of forming therein and the PCB of a plurality of contact pins of formation thereon; And have the shaping iron core and have a plurality of free-ended windings without the bobbin inductance device, this shaping iron core has the second hole formed therein, this first and second hole is connected with each other basically, makes free end pass two holes and each free end terminates to a contact pins.At least a portion winding is contained in the second hole, thereby the integral body (installation) that can reduce inductance device highly.
In a ninth aspect of the present invention, the many iron cores electronic building brick that footprint has reduced is disclosed.This assembly generally include basically work in coordination and be linear structure arrange a plurality of without bobbin with without the base inductance device.In one embodiment, with adjacent, the form of (side by side) arranges this device side by side, and directly be installed to female device and (for example, PCB), thereby take as far as possible little footprint.
The accompanying drawing explanation
By reference to the accompanying drawings, from detailed description given below, will make advantage of the present invention more clear, wherein:
Fig. 1 is the exploded view of EP transformer device structure with typical prior art of two-piece type EP iron core and bobbin, shows its element;
Fig. 2 a is the decomposition diagram of the first exemplary embodiment of the improved electronic installation of the present invention;
Fig. 2 b is the side view of Fig. 2 a device;
Fig. 2 c is the cross-sectional view of the device of Fig. 2 a along line 2c-2c;
Fig. 2 d is the logical flow chart of an exemplary manufacture method that the device of Fig. 2 a-2c is shown.
Fig. 3 is the perspective view of the second embodiment of the amorphous device of the present invention with a plurality of inductive iron cores and integral end stub (tube);
Fig. 4 is for example the present invention, for directly being installed to female device (, top perspective of another embodiment of amorphous electronic installation PCB);
Fig. 4 a is the bottom perspective view of the device of Fig. 4, shows an exemplary termination schemes wherein used;
Fig. 4 b is for the front view of another example arrangement of " the directly installing " inductance device on the PCB that do not have hole or groove or other device according to the present invention;
Fig. 4 c is the top plan view that is arranged on the many core configuration on PCB of typical prior art, shows its relatively large footprint;
Fig. 4 d and 4e be top and the bottom plan view of exemplary according to the present invention " coaxially being connected " many core configuration (on PCB) respectively, shows the footprint of comparing minimizing with the prior art arrangement of Fig. 4 c;
Fig. 5 is the logical flow chart of an exemplary manufacture method that the device of Fig. 4-4a is shown;
Fig. 6 a is the decomposition diagram of another embodiment of inductance device of the present invention, and the use of substrate and interface element is shown;
Fig. 6 b is the perspective view of the device of Fig. 6 a while installing fully;
Fig. 6 c is the decomposition diagram of another embodiment of inductance device of the present invention, and the simplified structure that there is no interface element is shown;
Fig. 6 d is the decomposition diagram of another embodiment of inductance device of the present invention;
Fig. 6 e and 6f illustrate another embodiment of inductance device of the present invention.
Embodiment
With reference now to accompanying drawing,, wherein identical Reference numeral means identical parts in the whole text.
As the application here, term " inductance device " refers to application or completes any device of induction, includes but not limited to inductor, transformer and reactor (or " choking-winding ").
As the application here, term " bobbin " and " formwork " (or " drum stand ") are used in reference to and are arranged on inductance device or any structure or the parts of one or more windings of help formation wherein or holding device.
As the application here, term " Signal Regulation " or " adjusting " are construed as and include but not limited to that signal voltage transitions, filtration and noise are eliminated, signal separates, impedance Control and correction, current limliting and time delay.
As the application here, term " Digital Subscriber Loop " (or " DSL ") refers to any type of DSL structure or device, no matter symmetrical or asymmetric, (for example comprise unlimited what is called " G.lite " ADSL, G.992.2, ITU covers), RADSL:(rate adaptation DSL), VDSL (Very High Speed DSL), SDSL (symmetrical DSL), SHDSL or ultrahigh speed DSL are also with G.shdsl (for example, ITU recommends G.991.2 covering, ITU-T ratified in July calendar year 2001) and known, HDSL:(high speed DSL), HDSL2:(second generation HDSL) and IDSL (integrated service digital network DSL), and the landline telephone spider lines (for example, HPN).
Summary
One main aspect in, the invention provides improved without bobbin electronic equipment and manufacture method thereof.This electronic equipment can be used for many electronic circuits, and it comprises for example those circuit for Signal Regulation or DSL circuit.Coiling does not have the major advantage of the coil of bobbin (or drum stand) to be that the space that usually taken by bobbin can be for other function in device, or this design make size and/or footprint less.
Particularly, make and can in design, apply following each point (or its combination) in the inner more winding of device space: (i) in given design, can use more wound convolution, can obtain thus higher inductance/performance (that is, higher winding density) under given form factor; (ii) selectable, can use the wire of higher size and keep the number of turn of same quantity, thereby other electric property advantage is provided; (iii) can under less " without bobbin " design, obtain using the performance of the given design of bobbin.Less device is usually more cheap.Except the advantage of cost, the advantage that also provides final usage space and footprint to reduce for the smaller szie of given performance, this is very attractive in high-density applications.
Except main electrical design advantage, also provide other important advantage without the bobbin design, comprise the optionally winding of this device of termination before or after iron core is installed, and can be by various termination means, this takes full advantage of the advantage without bobbin project organization and manufacture method.
Schematic equipment
When the appendiron core transformer for schematic shaping carries out discussion subsequently, will recognize that, the present invention can be equivalently for example, for other inductance device (, inductor) and core structure.Convincing ground, have a plurality of wound convolutions and require any device of electric insulation to be benefited from the application of the present invention's proposition.Therefore, the discussion to the appendiron core transformer that is shaped the subsequently illustration of wider content just.
With reference to figure 2a-2c, for example, illustrative examples without bobbin (amorphous) inductance device (appendiron core transformer is shaped) has been described.As shown in Fig. 2 a-2c, install 200 and generally include iron-core element 202, coiled wire-wound coil 204 and termination components or base 206.Iron-core element in the embodiment introduced is " the E shape " with oval centre pin 203; But can recognize and can use various shape (for example EF, EE, ER and RM even pot core).In addition, can recognize that iron-core element can become any angle with respect to base together with coiled wire-wound coil.For example, Fig. 6 means to install " E shape " iron- core element 602a, 602b and coiled wire-wound coil 604, makes the vertical embodiment that the circuit board plane of base is installed thereon of plane of the opening of iron core.Iron-core element 202 comprises two sheet 202a, 202b of same structure.Manufacture iron core with magnetic conductive material, as soft magnetic ferrite or Powdered iron, this is known in electricity field.The manufacture of this iron core and composition are all known, therefore do not further illustrate here.Iron core is installed on coiled wire-wound coil 204 and termination components 206.
In the embodiment of explanation, main because easily manufactured and low-cost, with binding agent, iron core 202 is assembled on molded polymer termination element 206.But, can use other technology that two parts (that is, iron core 202 and termination components 206) are fixed together.For example, can be with " spring " clip of metal well known in the art.Selectable, also can use friction configuration, for example form the part as termination components 206 transverse to the both sides pad of iron- core element 202a, 202b arranged outside; The iron core 202 of installing is arranged on termination components 206 tops, then makes itself and pad become frictional fit, thereby makes iron core 202 remain on the fixed position on element.Another optional scheme, iron core part 202a, 202b can be cementing or be bonded together, the wire of iron core effectively elongation and termination (for example, winding and/or welding lead) on the terminal 210 of element 206.Therefore, the wire of termination is for keeping the tension force on coiled wire-wound coil 204 (and iron core 202), thus the iron core apparatus be connected with termination components 206 for maintenance.
Termination components 206 comprises a plurality of (for example, the 8) terminal 210 that is assembled to other device such as PCB etc. for physics and electricity.These terminals 210 can be any structures, comprise such as being applicable to surface circle or elliptic cross-section, the ball grid array (ball-grid array) etc. that (SMT) is essentially square-section, installs for through hole are installed.If necessary, can also be carved into or be configured as and contribute to wire to be wound around.In addition, be appreciated that, termination components 206 can comprise the self-booting mechanism (not shown), the name that this device was authorized in 18 days Mays in 1993 of Gutierrez is called the U.S. Patent No. of owning together 5 of " the copline base is installed on the bootstrap surface ", 212,345 or the name of authorizing in 3 days Mays in 1994 of Lint be called the U.S. Patent No. 5,309 of " lead forming of bootstrap surface mount coil ", introduced in 130, introduced their all the elements here as a reference.For example, in one embodiment, termination components 206 is molded polymeric devices, and this device has eight (8) the individual bootstrap terminals that are formed on wherein, has been wound around the different conductor of coil 204 on terminal.
Also recognize for its profile, termination components 206 can be multiple different shape or structure.For example, this termination components 206 can comprise and be essentially square, circle or polygon, and this depends on the needs of special applications.In addition, according to circuit position and the installation on system level, consider to optimize the definite position of terminal 210 in element 206.
In addition, if necessary, can integral body remove termination components by the device of for example describing subsequently with reference to figure 4 and 4a here, or selectively directly conducting terminal 210 is bonded on iron core.
As shown in Figure 2 a, coiled wire-wound coil 204 comprises the winding of one or more wires, and this winding is to be inserted between iron core part 202a and 202b and in being inserted in termination components 206 when being shaped.Coil windings is comprised of the bonded wire of the type of introducing before, and in the situation that there is no inner bobbin or formwork (drum stand) coiling, for example, on movably mould, coiling mandrel or steel drum stand.The shape of coil is determined by the size of coiling mandrel.In an illustrative examples, the coiling mandrel comprises with the groove of center setting or the polished steel axle of otch.Groove/otch is formed by the extension of the pin of selectively removing or axle.Radial two the little pins that arrange with the groove of adjacent shafts or first the fixing bonded wire in wooden peg.Then laterally aim at bonded wire source (for example, bobbin) on groove, rotating shaft forms coiled wire-wound coil 204.After being wound around end, the terminal of second the radial pin fixing cord arranged with the adjacent recess opposite side.Then heat winding (such as passing through at mandrel blowing up hot-air or heating mandrel itself etc.), thus the wire of bonding coil.
Recognize that this method exists a lot of different, for example axle (mandrel) be fix and the wire source rotates around mandrel.This winding technology is known in mechanical field, therefore introduces no longer in detail here.
In addition, be appreciated that and can use different windings to lay pattern according to the particular design purpose obtained.For example, the substantially parallel pattern that lays can provide space packing the most closely, thereby reduces on the whole the size of winding.Selectable, other the pattern that lays can be for specifically applying optimal electricity and/or magnetic performance are provided.Those of ordinary skill just will be familiar with all these variations.
After having completed one or more windings, the centrepin of removing on winding mandrel (it forms groove) withdraws, thereby can remove, be shaped and the coil of bonding, or it drops out because of gravity, can carry out the coiling of new coil.
In illustrative examples, bonded wire comprises the cohesible wire of the 35AWG-42AWG manufactured by the Bridgeport insulated conductor company of Connecticut, USA continent Bridgeport, although also can be with the wire of other manufacturers, structure and size.This wire comprises the circular copper magnetic wire with polyurethane base coating.This polyurethane base coating has polyamide (Kapton) and autoadhesion external coating.Although be not certain requirement, the wire of the embodiment of explanation meets NEMA MW29-C and the IEC317-35 international standard of wire.But, be appreciated that for produce required winding 204 can buy suitable wire then applied (no matter before aforesaid mandrel forming process, among or afterwards).
Should be realized that, aforementioned " amorphous " wire connects technique can be for (i) single continuous winding; (ii) connect into a plurality of windings of whole physical set or structure; Or (iii) connecting into the single or multiple windings of two or more groups of separating, they itself can or cannot finally be connected together with aforementioned interconnection technique or other technical battery.Therefore, the present invention can have various winding/syndetons, and this can be by requiring such as the insulation tolerance, at a plurality of windings of same core interior etc., decide.
In addition, although preferred bonded wire, but install 200 and also can use the U.S. Patent No. of owning together 6 that is called " advanced Miniature electronic coil and manufacture method thereof " according to the name of authorizing on November 4th, 2003,642, the coiled wire-wound coil that 847 description forms and applies, introduce its content here as a reference.Particularly, apply Parylene support coating with for example gas phase or vacuum deposition method on many independent wires that form layer or group.Selecting the Parylene support is because its good characteristic and cheap price; But specific application may require to use other insulating material.This material can be for example fluoropolymer (for example, special teflon, ethylene-tetrafluoroethylene copolymer), polyethylene (for example, XLPE), polyvinylidene chloride (PVC) or may be even artificial rubber of polymer.In addition, can be with the coiled wire-wound coil 204 that soaks stagnant or spraying coating and form described invention.
Note, in embodiments of the present invention, before being wound around, afterwards or weld period (so-called welding is peeled off), use technology well known in the art to peel off the insulation of winding free end (referring to Fig. 2 c).This terminal 210 that contributes to and be connected with free end 220 of peeling off forms good electrical connection.
Because coil is not rely on inner bobbin or formwork (drum stand) and coiling independently, at it in final mounting structure, can be in the device 200 additional spaces of interior acquisition.This additional space makes and can comprise more multiturn on given core design, therefore, has improved valuably inductance and/or the performance of given shape.Otherwise, can be with the wire of weight-normality lattice more by removing that additional space that bobbin produces makes, and maintain the circle of equal number, therefore provide other electrical characteristics advantage, the DC resistance and the insertion loss that for example reduce.
In addition, additional space can be used for reducing overall dimensions and/or the footprint of device 200, with and weight.Less coil not only has cost advantage (owing to using still less material), and final application space advantage is provided, and this is especially attractive in high-density applications.For example, larger prior art (bobbin is arranged) coalignment that has a desired electrical property just can not only be suitable for specific application.Only be appreciated that because the present invention's " without bobbin " or " amorphous " feature the use of just can independently using or interosculate of these design variation and other design variation.
Fig. 2 d illustrates an exemplary process 270 of the inductance device 200 of shop drawings 2a-2c.Although the various steps that have been appreciated that component description to forming or manufacture inductance device 200, thereby can save this step by the assembly of manufacture before optionally obtaining from the third party.
As shown in Figure 2 d, method 270 generally includes and at first forms termination base 206 (step 272), and it comprises formation terminal 210 and it is arranged in base 206 (step 274).Then, provide typing iron core 202, be divided into its element 202a, 202b (step 276).Enough bonded wires (step 278) then are provided.Then pass through step 280, externally form in shape bonded wire and solidify (for example, heat, be exposed under chemical agent, irradiation etc.).Then remove and prepare curing coil 204 from formwork, if necessary, it also comprises location winding free end and peels off free end (step 282).Then, the coil of preparation is arranged between iron core half sheet, if necessary, can optionally iron core half sheet be bonded together (step 284).Then, the iron core assembled can be arranged on termination components 206 (step 286) with binding agent, and free end 220 terminates on its corresponding terminal 210 (step 288).Then this device is optionally tested through step 290.
With reference to figure 3, another embodiment of inductance device of the present invention has been described.Fig. 3 illustrates device assembly 300, and this device assembly is included in a plurality of inductance devices 301 (for example 4) that coaxially link together in the arrangement of combined termination base 306 interior settings.In described embodiment, be provided with device 301, its long limit conllinear, for example, although also can be used other orientation (, side by side) and array format.A plurality of core assemblies 300 of Fig. 3 provide lot of advantages on single core assembly.Particularly, a plurality of iron cores on single base 306 301 reduce and/or eliminate in traditional design desired space or interval between the iron core on single base.This space means the PCB zone of waste, because each device can not be put too closely each other.When a large amount of devices coaxially link together such as the devices such as eight, 12, it is just larger that advantage is preserved in space of the present invention.
A plurality of iron core termination bases 306 have also reduced the termination base quantity that is installed to printed circuit board (PCB) (PCB), because as shown in Figure 3, in many iron core tubes holder structure, shared pin or terminal 310 on separate structure can focus on the single-end contact.
In addition, with two or more separate structures, compare, there are the economic advantages of manufacturing single-end stub (tube) 306.
The welding terminating method directly is installed
Except the said structure advantage, amorphous inductance device of the present invention also is provided at the possibility that termination wire before or after iron core is installed, and does not require as prior art is desired before the installation iron core conductor termination on the pin at bobbin.Before or after iron core is installed, the flexibility of termination wire (has for example not only brought the flexibility on the manufacturing process, change in advance to the order of the step of manufacturing installation 200), and allow at least two kinds of different terminating methods: (i) according to top Fig. 2 a-2b, use above-mentioned termination components (base); (ii) welding directly is installed.Describe rear a kind of technology in detail referring now to Fig. 4 and 4a.Although discussion subsequently is for the EP shaped iron core, be appreciated that the present invention never is limited to this core structure.
As shown in Fig. 4 and 4a, direct installation welding method of the present invention has advantageously been saved the needs to bobbin or base.In this method, inductance device 400 is directly installed and/or is assembled on final assembly or female device, and final assembly or female device can be for example PCB403 or other electron component.In example, assembly or female device comprise and are formed on the one or more devices 405 that wherein make the free conductor end 420 of its applicable storing apparatus coil 404.Inductance device 400 can be cementing or be bonded to PCB 403 or installs on its other assembly, as shown in Figure 4, perhaps selectively friction is installed, for example, by providing tapering to iron core part periphery 402a, 402b or the structure (not shown) of burr being arranged, this sampling device 400 effectively " interlock " in PCB hole 405.Can also by other technology, make device 400 remain on respect to female component 403 and basically become constant orientation, such as double pointed nail, clip etc.
As shown in Fig. 4 a, the free end 420 of coil windings also directly terminates on PCB contact pins 450 through hole 405, and this contact pins 450 is arranged on the downside 417 of PCB403.In described embodiment, this termination comprises free end 420 (for example by manually or fluctuation welding process) is welded on contact pins 450, although can also use other terminating method.Be further appreciated that the present invention never is limited to as shown in Fig. 4 a with contact pins 450; Thereby can be compatible with the present invention well, so also can use terminal that increase or embedding, pin etc.But described embodiment has advantages of simple and is easy to manufacture.For example, (if inserting the pad (not shown) by apparatus structure, PCB thickness or use) adjusts the degree of depth of hole 405 coils 404 as required, thereby can use the fluctuation welding, this fluctuation is welded on provides very efficient while electrically contacting termination in a large number.Like this, before carrying out this large amount of welding, for the free end 420 that makes wiring remains on required orientation with respect to contact pins 450, if necessary, can carve internal edge 452 (not shown) in hole 405.
Although be further appreciated that the embodiment of Fig. 4 and 4a has utilized the pad 450 on the downside that is arranged on PCB 403 disengagings, this pad can also be arranged on upper (being engaged) side 425 (same side) of PCB403.(Fig. 4 b) in one embodiment, the free end 420 of winding simply from installing below 400, be coated in cabling in the thickness of the viscose glue/binding agent 470 between device 400 and PCB403 out (apply enough thick viscose glue so that lead wire insulation cabling to the pad 450 that is arranged on upside 425).In another embodiment, go between 420 by the groove cabling that forms out in iron-core element 402a, 402b.Equally can be by other method.
Similarly, be appreciated that above-mentioned " same side " pad layout that can use with or without aforementioned PCB hole or groove 405.For example, as shown in Figure 4 b, can construct like this iron-core element 402, make winding (during installation) not outstanding below the iron-core element base plan, therefore not need this groove or hole 405.But the whole setting height(from bottom) that this method makes the upper device 400 of PCB (or other device) is higher a little when using groove/hole 405.But, just need this " without hole " structure when the PCB of erecting device 400 or other device do not have (maybe can not have) hole 405.
Be also noted that, in the time of on being installed to substrate or PCB, at least part of inductance device 400 of the present invention can also for example, seal with epoxy resin or polymeric sealant (silicones), and this is well known in the art.This device can also resemble prior art and shield EMI known, for example, by using known tin or metal Faraday shield.
The expense of bobbin and termination base 206 in aforementioned " the directly install " method shown in Fig. 4-4a has not only been saved and installed 400 (therefore for same electrical performance, providing the simpler and lower device of cost), and advantageously reduced the integral installation height of predetermined inductance apparatus structure.The method of Fig. 4 b is only there is no bobbin or base, and has reached in fact on the contrary higher vertical height, because do not hold PCB hole or the groove of winding bottom.
Be further appreciated that above-mentioned direct installation method can, for a plurality of iron cores, be similar to the structure of earlier figures 3 usually.Particularly, a plurality of iron cores can coaxially link together or with mode side by side be placed on female device (for example, PCB) upper, thereby minimize the footprint that these devices are used.If necessary, these devices can physical connection (not shown) together, such as by with viscose glue etc., with metal holder, arrange, use the molded plastic frame etc. that device is remained on to annexation, they are linked together.As another possibility, (left side and right side iron core half sheet 402a, 402b for interior arrangement can make integral member, there is left side iron core half sheet for a device 400 of right side iron core half sheet of its next-door neighbour's device 400 as its integral part), assembly two ends iron core half sheet is the type shown in Fig. 4.Like this, when iron core is installed, each device 400 is set up physical connection naturally.
Under the art methods of a plurality of typing iron cores (Fig. 4 c), each band bobbin and band base EP iron core need to separate a little each other to prevent for example, to interfere with each other between its footprint (, surperficial mounting terminal)." directly installing " structure (Fig. 4 d and 4e) that contrast the present invention is exemplary, wherein each device 400 can coordinate each other one by one, is arranged side by side as Fig. 4 d or joins end to end (not shown).This reduced this integrated device 400 whole footprint (as Fig. 4 e on length maybe when device is the first while being connected on width).
In addition, Fig. 4 b can implement (except there is no PCB hole 405) with the many devices installation method that is similar to Fig. 4 d and 4e without the hole method, because there is no hole/groove, obtains again higher vertical height.
With reference to figure 5, describe the direct installation method 500 of EP iron core in detail.In first step 502, the step (specifically step 276-284) of the iron core that is used to form device illustrated with reference to figure 2d before using here.Then be formed for holding outstanding coil hole 405 or the groove (or existing PCB with this feature) of (if necessary, also for holding iron core downside contact portion) in PCB by step 504.Then, if necessary, this iron core is bonding, coordinate or be connected to PCB upper (step 506).As mentioned above, can by viscose glue, silicon resin base compound, use " embedded " structure etc. complete above-mentioned bonding, coordinate or connect.Then to installing the pad 450 arranged on the relative side of 400 sides and carry out terminations with having installed on it at PCB; That is, the winding wire free end through hole from core assembly cabling out (step 508) terminate at pad 450 (step 510).
In addition, in another embodiment of the method, coil 404 can be at iron-core element 402a, and it is outer before pre-aligned in hole (and at first optionally terminating on pad 450) that 402b " clamps " coil, then is bonded to each other and/or bonds on PCB403.
Other embodiment
With reference to figure 6a and 6b, another embodiment of the present invention's " amorphous " inductance device has been described.As shown in Figure 6 a, this device 600 comprises the core assembly with two iron- core element 602a, 602b, and usually is similar to those explanations to Fig. 2 a-2c of front, but does not use base termination coil windings, and the substrate 604 that winding 606 terminates at is as on PCB.In described structure, the terminal end of winding 606 be welded on the pad 609 or track of substrate 604 (its can be arranged on substrate 604 and/lower surface on); But, if necessary, can replace this welding (for example using standard electronic solder technology well known in the art).
In order to reduce costs, in described embodiment, select traditional PCB parts as substrate; That is, this PCB is very general in the mill, and has very low unit cost, in other factor, can form a lot simultaneously.
The device 600 of Fig. 6 a also comprises interface element 608, and its electricity separation and mechanical erection are at iron core 602 and winding 606 places on substrate 604 tops.The interface element 608 of the present embodiment is for example, to be formed by the polymer (low-cost plastics) of manufacturing by injection, die casting or other molding technique commonly used, although can also replace by other material and forming technique if need.Substrate 604 selectively comprises that the corresponding pin 612 in 611,Gai hole 611, one or more hole and interface element bottom coordinates, thereby immobile interface element 608 can also make device 600 with respect to base plate alignment by other method.The edge member 614 (as shown in Figure 6 a) for example coordinated with substrate edges 616 can be used separately, or also can provide required aligning with aforementioned hole/pin joint is incompatible.
(Fig. 6 c) in another embodiment, relevant cost and the labour of interface element 608 of the embodiment of Fig. 6 optionally extended to reduce in the bottom of each iron-core element.Particularly, a variant is used two iron core half sheet 622a, 622b, each iron core half sheet has shirt rim or the bottom 625 of the extension for receiving substrate 604, each iron core half sheet has independent formation (or cutting into) hole 627, winding conductor passes through this hole cabling, thereby winding overhang is terminated on substrate 604.Therefore, mandrel lower provides the other machinery provided by the embodiment median surface element 608 of Fig. 6 a to fix.Can also use and provide required machinery coaxial other optional method connected, for example be shaped or processing iron core part 622a, 622b, make it there is the one or more coaxial connecting pin coordinated with the hole formed on substrate 604.
In another variant (Fig. 6 d), formed a plurality of holes or hole 630 on substrate 604, insulated electric conductor passes hole 630 cablings to for example contact pins or the track (trace) 632 of base plate bottom.These contact pins that are electrically connected to it or track or other element for example, as the electric interface of female device (motherboard).
In another embodiment (Fig. 6 e and 6f), substrate 604 parts are absorbed in the bottom of iron-core element 602a, 602b.Then, the winding leads (not shown) can be through forming gap 650 on the face between iron-core element and substrate or passing the hole cabling formed on substrate, perhaps even directly on the upper surface of base plate of cabling below winding on the contact or pad of (that is, in the iron core footprint).If necessary, substrate 604 can also be equipped with the electric termination of type known in this field, for example, and by it directly being bonded to substrate or being inserted into the hole formed on substrate.
Although only be further appreciated that and be illustrated in the scope of single inductance device, above-mentioned technology can also expand to many inductance devices, for example device of Fig. 3 easily.For example, the multiple device 600 of Fig. 6 a-6f shown type can be assembled on substrate commonly used 604 and interface element 608, " OK " structure of Fig. 3 for example, or selectively be assembled into another kind of pattern (for example rectangle or quadrate array).Under the prerequisite of the disclosure of invention, those of ordinary skill can be expected countless other structures.
Can expect, although for the step of the method particular order, particular aspects of the present invention has been described, those explanations are a more illustrative contents of wide region method of the present invention, when specific application needs, can modify.Can inessential or optionally implement particular step under specific environment.In addition, particular step or function can join in disclosed embodiment, or are inverted the execution sequence of two or more steps.All this variations of expecting all will fall in the scope of the present invention of this open and request.
Although the above-mentioned detailed description to each embodiment illustrates, illustrates and pointed out novel features of the present invention, but, be appreciated that, those skilled in the art can be without departing from the present invention, and the device that these have been illustrated or the profile of method and concrete structure carry out different omissions, replacement and change.The explanation of front is to carry out at present the best mode of the present invention.These explanations will limit anything but, and should regard the schematic content of basic principle of the present invention as.Should determine scope of the present invention with reference to claim.

Claims (15)

1. an inductance device of arranging with array format, there is termination components, a plurality of iron core and at least one winding, the plane of the opening of described a plurality of iron cores is configured to vertical with the printed circuit board plane that described termination components is installed on its of described inductance device, described at least one winding forms and is arranged in described inductance device, but does not use inner bobbin;
Wherein, described termination components comprises a plurality of conducting terminals;
Wherein, with the device with described inner bobbin, compare, do not have described inner bobbin to make size reduction that described a plurality of iron core requires;
Wherein, described a plurality of iron core comprises the magnetic conductivity iron-core element of a plurality of shapings, the magnetic conductivity iron-core element of described a plurality of shapings has the first element and second element of mutual coupling, described the first element and described the second element are in wherein forming a winding passage when coupling, and described the first element and described the second element also form the hole be connected with described passage;
Wherein, described termination components also comprises the basal surface that approaches described a plurality of iron core and arrange;
Wherein said a plurality of conducting terminal is outstanding from described basal surface; And
Wherein, described at least one winding comprises the bonded wire winding, and described bonded wire winding has a plurality of circles and is at least partially disposed in described passage, and described winding also comprises at least two through described hole and the end of cabling.
2. inductance device as claimed in claim 1, is characterized in that, described bonded wire winding does not protrude from the below of the basal surface of described termination components.
3. inductance device as claimed in claim 1, is characterized in that, the ferrite iron core that the magnetic conductivity iron-core element of described a plurality of shapings comprises the centre pin with ovalize.
4. inductance device as claimed in claim 2, is characterized in that, described termination components is used adhesive to be bonded to the magnetic conductivity iron-core element of described a plurality of shapings.
5. inductance device as claimed in claim 4, is characterized in that, at least a portion in the magnetic conductivity iron-core element of described a plurality of shapings is used described adhesive to be bonded together.
6. inductance device as claimed in claim 5, is characterized in that, at least a portion in described a plurality of conducting terminals comprises basically rounded cross section.
7. inductance device as claimed in claim 1, is characterized in that, described termination components comprises polygonal shape.
8. inductance device as claimed in claim 1, is characterized in that, the described bonded wire winding with described a plurality of circles is adhered to whole physical structure.
9. an amorphous inductance device comprises:
The magnetic conductivity iron-core element of a plurality of shapings that match each other, make the plane of the opening of the magnetic conductivity iron-core element of described a plurality of shapings be configured to vertical with the printed circuit board plane that termination components is installed on its of described amorphous inductance device, the magnetic conductivity iron-core element of described a plurality of shapings that match each other forms at least one winding passage when coupling, and the magnetic conductivity iron-core element of described a plurality of shapings that match each other also forms at least one cable hole be connected with described at least one winding passage jointly;
The bonded wire winding, described bonded wire winding has a plurality of circles and is at least partially disposed in described at least one winding passage, described bonded wire winding also comprises at least two ends, and described end is through described at least one cable hole cabling be connected with described at least one winding passage; And
Described termination components comprises a plurality of conducting terminal associated therewith, and described a plurality of conducting terminals are suitable for electricity coupling or mechanical matching to an external equipment, at least two ends of described winding and the individual electric connection in described terminal;
Wherein, the magnetic conductivity iron-core element of described a plurality of shapings also comprises the first element and second element of mutual coupling, described the first element and described the second element in when coupling in wherein forming a winding passage;
Wherein, described termination components also comprises the magnetic conductivity iron-core element that approaches described a plurality of shapings and the basal surface arranged, and described a plurality of conducting terminals are outstanding from described basal surface; And
Wherein, described amorphous inductance device does not have winding former or bobbin; compare with the magnetic conductivity iron core of the shaping with described winding former or bobbin, do not have described winding former or bobbin to make institute's size that requires and the cost of the magnetic conductivity iron core of described a plurality of shapings reduce.
10. inductance device as claimed in claim 9, is characterized in that, the ferrite iron core that the magnetic conductivity iron-core element of described a plurality of shapings that match each other comprises the centre pin with ovalize.
11. inductance device as claimed in claim 9, is characterized in that, the described bonded wire winding with described a plurality of circles is adhered to whole physical structure.
12. inductance device as claimed in claim 9, is characterized in that, each in a plurality of circles of all described bonded wire windings is to be adhered to one contiguous in the circle of described bonded wire winding by insulating coating basically.
13. inductance device as claimed in claim 12, is characterized in that, the described bonded wire winding with described a plurality of circles is adhered to whole physical structure.
14. inductance device as claimed in claim 9, is characterized in that, described bonded wire winding does not protrude from the below of the basal surface of described termination components.
15. an amorphous inductance device comprises:
The magnetic conductivity iron-core element of a plurality of shapings that match each other, plane of the opening along the magnetic conductivity iron-core element of this shaping matches each other, the printed circuit board plane that termination components is installed on its of this plane of the opening and described amorphous inductance device is vertical, and the magnetic conductivity iron-core element of described a plurality of shapings that match each other forms at least one winding passage when coupling; The magnetic conductivity iron-core element of described a plurality of shapings that match each other also forms at least one cable hole be connected with described at least one winding passage jointly;
A plurality of bonded wire windings, wherein each has a plurality of circles and is at least partially disposed in described passage, and each described bonded wire winding also comprises at least two through described at least one cable hole of being connected with described at least one winding passage and the end of cabling; And
Described termination components comprises basal surface and a plurality of conducting terminal associated therewith, described a plurality of conducting terminal is given prominence to and is suitable for electricity from described basal surface and mates or mechanical matching to an external equipment, at least two ends of described winding and the individual electric connection in described terminal;
Wherein said bonded wire winding does not protrude from the below of the basal surface of described termination components;
Wherein, the magnetic conductivity iron-core element of described a plurality of shapings also comprises the first element and second element of mutual coupling; And
Wherein, described amorphous inductance device does not have winding former or bobbin; compare with the magnetic conductivity iron core of the shaping with described winding former or bobbin, do not have described winding former or bobbin to make institute's size that requires and the cost of the magnetic conductivity iron core of described a plurality of shapings reduce.
CN2009101489546A 2003-07-08 2004-07-08 Form-less electronic device and methods of manufacturing Expired - Fee Related CN101620918B (en)

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202006006825U1 (en) * 2006-04-27 2007-08-30 Bürkert Werke GmbH & Co. KG Valve with an electromagnetic drive
CN103187144A (en) * 2011-12-31 2013-07-03 台达电子企业管理(上海)有限公司 Magnetic element and manufacturing method thereof
CN104217848A (en) * 2013-05-31 2014-12-17 苏州隆亿电子科技有限公司 Magnetic shielding inductance element manufacturing method and magnetic shielding inductance element
CN107108174A (en) * 2014-12-22 2017-08-29 奥的斯电梯公司 Mounting assembly for elevator linear feeding system
JP2017069460A (en) 2015-09-30 2017-04-06 太陽誘電株式会社 Coil component and manufacturing method therefor
CN105207399B (en) * 2015-10-22 2018-03-30 珠海格力节能环保制冷技术研究中心有限公司 Outlet cover and its installation method
TWI685184B (en) * 2018-10-01 2020-02-11 范雲光 Transformer for pulse filter
DE102019103895A1 (en) * 2019-02-15 2020-08-20 Tdk Electronics Ag Coil and method of making the coil
US11915855B2 (en) * 2019-03-22 2024-02-27 Cyntec Co., Ltd. Method to form multile electrical components and a single electrical component made by the method
CN111192760A (en) * 2020-01-03 2020-05-22 深圳青铜剑科技股份有限公司 Manufacturing method of transformer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498067A (en) * 1981-04-20 1985-02-05 Murata Manufacturing Co., Ltd. Small-size inductor
US5212345A (en) * 1992-01-24 1993-05-18 Pulse Engineering, Inc. Self leaded surface mounted coplanar header
US5331536A (en) * 1992-11-05 1994-07-19 Opt Industries, Inc. Low leakage high current transformer
US5760669A (en) * 1994-12-02 1998-06-02 Dale Electronics, Inc. Low profile inductor/transformer component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498067A (en) * 1981-04-20 1985-02-05 Murata Manufacturing Co., Ltd. Small-size inductor
US5212345A (en) * 1992-01-24 1993-05-18 Pulse Engineering, Inc. Self leaded surface mounted coplanar header
US5331536A (en) * 1992-11-05 1994-07-19 Opt Industries, Inc. Low leakage high current transformer
US5760669A (en) * 1994-12-02 1998-06-02 Dale Electronics, Inc. Low profile inductor/transformer component

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平8-17660A 1996.01.19

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