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CN101620197B - Rapid response CMOS relative humidity sensor - Google Patents

Rapid response CMOS relative humidity sensor Download PDF

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CN101620197B
CN101620197B CN200910183227A CN200910183227A CN101620197B CN 101620197 B CN101620197 B CN 101620197B CN 200910183227 A CN200910183227 A CN 200910183227A CN 200910183227 A CN200910183227 A CN 200910183227A CN 101620197 B CN101620197 B CN 101620197B
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oxide layer
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赵成龙
黄庆安
秦明
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Southeast University
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Abstract

一种快速响应的CMOS相对湿度传感器,由衬底,氧化层,电容电极,湿度敏感介质组成,氧化层设在衬底上,电容电极设在氧化层上,电容电极由压焊块引出,湿度敏感介质设在电容电极之间和电容电极上方,腐蚀衬底及其上方的氧化层,形成空腔,使得电容电极之间的湿度敏感介质的下表面也与空气接触,电容电极为叉指状电极且交错排列,每组叉指状电极的公共端和叉指状电极的自由端均固定于氧化层上,以保证电极的机械强度。本发明采用聚酰亚胺作为湿度敏感介质,将衬底及其上方的氧化层腐蚀形成空腔,电容电极之间的湿度敏感介质的上方和下方均为空气,该传感器具有响应速度快,灵敏度高,衬底寄生小等优点。

Figure 200910183227

A fast-response CMOS relative humidity sensor, which is composed of a substrate, an oxide layer, a capacitive electrode, and a humidity-sensitive medium. The sensitive medium is set between the capacitor electrodes and above the capacitor electrodes, corroding the substrate and the oxide layer above it to form a cavity, so that the lower surface of the humidity sensitive medium between the capacitor electrodes is also in contact with the air, and the capacitor electrodes are interdigitated The electrodes are arranged in a staggered manner, and the common ends of each group of interdigitated electrodes and the free ends of the interdigitated electrodes are fixed on the oxide layer to ensure the mechanical strength of the electrodes. The invention adopts polyimide as the humidity sensitive medium, corrodes the substrate and the oxide layer above it to form a cavity, and the upper and lower sides of the humidity sensitive medium between the capacitor electrodes are air, and the sensor has fast response speed and high sensitivity. High, small substrate parasitic and other advantages.

Figure 200910183227

Description

一种快速响应的CMOS相对湿度传感器A Fast Response CMOS Relative Humidity Sensor

技术领域 technical field

本发明涉及一种基于标准CMOS工艺的相对湿度传感器,尤其是一种快速响应的CMOS相对湿度传感器。The invention relates to a relative humidity sensor based on a standard CMOS process, in particular to a fast-response CMOS relative humidity sensor.

背景技术 Background technique

湿度测量在国防航空、气象预报、工业制造、农业生产、医疗卫生、食品加工等领域有着广泛的应用。湿度传感器作为湿度测量系统中的重要组成部分,已经发展了很多年。由最初的干湿球湿度计、毛发湿度计等传统的湿度传感器发展到目前可以用标准CMOS工艺制造的微型湿度传感器。用标准CMOS工艺加工出来的湿度传感器具有体积小,价格低,产品一致性好等优点,是近几年来湿度传感器研究的热点。另外,利用标准CMOS工艺容易将湿度传感器和检测电路单片集成,这样可以提高湿度检测系统的稳定性和抗干扰能力。2001年,Y.Y.Qiu(人名)提出了利用CMOS工艺制作的湿度传感器,该湿度传感器采用聚酰亚胺作为湿度敏感介质,将检测电路与湿度敏感电容单片集成,把湿度敏感电容的变化直接转化为电压变化输出,便于后端检测系统进行信号采样和处理,但是这种结构的湿度传感器响应速度较慢。2004年,中国人顾磊提出了一种利用CMOS工艺制作的湿度传感器,该湿度传感器的敏感单元为叉指电容结构,将栅状多晶硅加热电阻置于叉指电极的下方,采用聚酰亚胺作为湿度敏感介质,灵敏度高,线性度好,但是传感器的回滞特性不是很好,而且响应较慢,加热电路工作可以提高湿度敏感单元的温度,进而加快传感器的响应速度,但这样必然会使传感器的功耗增加。Humidity measurement is widely used in national defense aviation, weather forecast, industrial manufacturing, agricultural production, medical and health, food processing and other fields. As an important part of the humidity measurement system, the humidity sensor has been developed for many years. From the original traditional humidity sensors such as wet and dry bulb hygrometers and hair hygrometers to the miniature humidity sensors that can be manufactured by standard CMOS technology. Humidity sensors processed by standard CMOS technology have the advantages of small size, low price, and good product consistency. They are the hotspots of humidity sensor research in recent years. In addition, it is easy to monolithically integrate the humidity sensor and detection circuit by using a standard CMOS process, which can improve the stability and anti-interference ability of the humidity detection system. In 2001, Y.Y.Qiu (name) proposed a humidity sensor made using CMOS technology. The humidity sensor uses polyimide as the humidity sensitive medium, integrates the detection circuit and the humidity sensitive capacitor monolithically, and directly converts the change of the humidity sensitive capacitor It is a voltage change output, which is convenient for the back-end detection system to perform signal sampling and processing, but the response speed of the humidity sensor with this structure is slow. In 2004, Chinese Gu Lei proposed a humidity sensor made using CMOS technology. The sensitive unit of the humidity sensor is an interdigital capacitor structure. The grid-shaped polysilicon heating resistor is placed under the interdigital electrode, and polyimide is used As a humidity sensitive medium, it has high sensitivity and good linearity, but the hysteresis characteristic of the sensor is not very good, and the response is slow. The heating circuit can increase the temperature of the humidity sensitive unit, thereby speeding up the response speed of the sensor, but this will inevitably make The power consumption of the sensor increases.

发明内容 Contents of the invention

技术问题:本发明的目的是提出一种与标准CMOS工艺兼容的快速响应的CMOS相对湿度传感器,具有响应速度快,灵敏度高,结构简单,衬底寄生小等优点。Technical problem: The purpose of this invention is to propose a CMOS relative humidity sensor with fast response compatible with standard CMOS technology, which has the advantages of fast response speed, high sensitivity, simple structure and small substrate parasitic.

技术方案:本发明是一种高速响应的CMOS相对湿度传感器,由衬底,氧化层,电容电极,湿度敏感介质组成,氧化层设在衬底上,电容电极设在氧化层上,电容电极由压焊块引出,湿度敏感介质设在电容电极之间和电容电极上方,腐蚀衬底及其上方的氧化层,形成空腔,使得电容电极之间的湿度敏感介质的下表面也与空气接触,电容电极为叉指状电极且交错排列,每组叉指状电极的公共端和叉指状电极的自由端均固定于氧化层上,以保证电容电极的机械强度。Technical solution: The present invention is a high-speed response CMOS relative humidity sensor, which is composed of a substrate, an oxide layer, a capacitor electrode, and a humidity-sensitive medium. The oxide layer is arranged on the substrate, and the capacitor electrode is arranged on the oxide layer. The capacitor electrode consists of The pressure welding block is drawn out, and the humidity sensitive medium is arranged between and above the capacitor electrodes, corroding the substrate and the oxide layer above it, forming a cavity, so that the lower surface of the humidity sensitive medium between the capacitor electrodes is also in contact with the air, The capacitor electrodes are interdigitated electrodes arranged in a staggered manner, and the common ends of each group of interdigitated electrodes and the free ends of the interdigitated electrodes are fixed on the oxide layer to ensure the mechanical strength of the capacitor electrodes.

有益效果:本发明工艺步骤简单,利用标准CMOS工艺与MEMS加工技术相结合进行制造,成本低,精度高,长期稳定性好。本发明提出的湿度传感器采用聚酰亚胺作为湿度敏感介质,灵敏度高,将衬底及其上方的氧化层腐蚀形成空腔,这样电容电极之间的湿度敏感介质的上方和下方均为空气,使得传感器的响应速度加快,衬底寄生效应减小。Beneficial effects: the invention has simple process steps, is manufactured by combining standard CMOS process and MEMS processing technology, has low cost, high precision and good long-term stability. The humidity sensor proposed by the present invention uses polyimide as the humidity sensitive medium, which has high sensitivity, and the substrate and the oxide layer above it are corroded to form a cavity, so that the upper and lower sides of the humidity sensitive medium between the capacitor electrodes are air, The response speed of the sensor is accelerated, and the parasitic effect of the substrate is reduced.

附图说明 Description of drawings

图1是本发明的俯视图,图中有:氧化层2,第一电容电极3,第二电容电极4,叉指状电极的第一公共端31,叉指状电极的第二公共端41,叉指状电极的第一自由端32,叉指状电极的第二自由端42,第一压焊块33,第二压焊块43,湿度敏感介质5,空腔6。Fig. 1 is a top view of the present invention, in which there are: an oxide layer 2, a first capacitance electrode 3, a second capacitance electrode 4, a first common end 31 of the interdigitated electrodes, a second common end 41 of the interdigitated electrodes, The first free end 32 of the interdigitated electrode, the second free end 42 of the interdigitated electrode, the first pressure welding block 33 , the second pressure welding block 43 , the humidity sensitive medium 5 , and the cavity 6 .

图2是本发明的截面图,图中有:衬底1,氧化层2,第一电容电极3,第二电容电极4,湿度敏感介质5,空腔6。FIG. 2 is a cross-sectional view of the present invention, in which there are: a substrate 1 , an oxide layer 2 , a first capacitor electrode 3 , a second capacitor electrode 4 , a humidity-sensitive medium 5 , and a cavity 6 .

具体实施方式 Detailed ways

本发明是一种快速响应的CMOS相对湿度传感器,由衬底1,氧化层2,第一电容电极3,第二电容电极4,湿度敏感介质5组成,氧化层2设在衬底1上,第一电容电极3和第二电容电极4设在氧化层2上,第一电容电极3和第二电容电极4由第一压焊块33和第二压焊块43分别引出,湿度敏感介质5设在第一电容电极3和第二电容电极4之间以及第一电容电极3和第二电容电极4上方,腐蚀衬底1及其上方的氧化层2,形成空腔6,使得第一电容电极3和第二电容电极4之间的湿度敏感介质5的下表面也与空气接触,第一电容电极3和第二电容电极4为叉指状电极且交错排列,每组叉指状电极的第一公共端31和第二公共端41以及叉指状电极的第一自由端32和第二自由端42均固定于氧化层2上,以保证第一电容电极3和第二电容电极4的机械强度。The present invention is a fast-response CMOS relative humidity sensor, which consists of a substrate 1, an oxide layer 2, a first capacitor electrode 3, a second capacitor electrode 4, and a humidity-sensitive medium 5. The oxide layer 2 is arranged on the substrate 1, The first capacitance electrode 3 and the second capacitance electrode 4 are arranged on the oxide layer 2, the first capacitance electrode 3 and the second capacitance electrode 4 are respectively drawn out by the first pressure soldering block 33 and the second pressure soldering block 43, and the humidity sensitive medium 5 Set between the first capacitor electrode 3 and the second capacitor electrode 4 and above the first capacitor electrode 3 and the second capacitor electrode 4, etch the substrate 1 and the oxide layer 2 above it to form a cavity 6, so that the first capacitor The lower surface of the humidity-sensitive medium 5 between the electrode 3 and the second capacitance electrode 4 is also in contact with the air, the first capacitance electrode 3 and the second capacitance electrode 4 are interdigitated electrodes and are arranged in a staggered manner, and each group of interdigitated electrodes The first common end 31 and the second common end 41 and the first free end 32 and the second free end 42 of the interdigitated electrode are all fixed on the oxide layer 2, so as to ensure the contact between the first capacitance electrode 3 and the second capacitance electrode 4 Mechanical strength.

本实施例中衬底1为体硅,氧化层2为二氧化硅,第一电容电极3和第二电容电极4为铝电极,湿度敏感介质5为聚酰亚胺,本发明可以用以下工艺来制作:在硅衬底1上生长一层氧化层2,溅射铝并刻蚀形成第一电容电极3和第二电容电极4以及第一压焊块33和第二压焊块43,利用旋涂法旋涂一层聚酰亚胺,光刻聚酰亚胺,亚胺化,接着在硅衬底1背面淀积一层氮化硅阻挡层并刻蚀出硅衬底1的腐蚀窗口,然后利用体硅各向异性腐蚀从硅衬底1背面向氧化层2方向腐蚀,选用的腐蚀溶液对氧化层2的腐蚀速率远小于该腐蚀溶液对衬底1的腐蚀速率,当衬底1被腐蚀到氧化层2时认为衬底1的腐蚀已经结束,这时在衬底1中得到一个腔体,将该腔体上方的氧化层2腐蚀掉便得到空腔6,此时第一电容电极3和第二电容电极4之间的湿度敏感介质5的下表面也与空气接触,最后再将衬底1背面的氮化硅阻挡层腐蚀掉。In this embodiment, the substrate 1 is bulk silicon, the oxide layer 2 is silicon dioxide, the first capacitor electrode 3 and the second capacitor electrode 4 are aluminum electrodes, and the humidity sensitive medium 5 is polyimide. The present invention can use the following process To make: grow a layer of oxide layer 2 on the silicon substrate 1, sputter aluminum and etch to form the first capacitance electrode 3 and the second capacitance electrode 4 and the first pressure soldering block 33 and the second pressure soldering block 43, using Spin-coating spin coating a layer of polyimide, photoetching polyimide, imidization, then depositing a layer of silicon nitride barrier layer on the back side of the silicon substrate 1 and etching out the etching window of the silicon substrate 1, and then Using the anisotropic etching of bulk silicon to etch from the back of the silicon substrate 1 to the oxide layer 2, the etching rate of the oxide layer 2 by the selected etching solution is much lower than the etching rate of the substrate 1 by the etching solution. When the substrate 1 is etched When the oxide layer 2 is reached, it is considered that the corrosion of the substrate 1 has ended. At this time, a cavity is obtained in the substrate 1, and the oxide layer 2 above the cavity is etched away to obtain a cavity 6. At this time, the first capacitor electrode 3 The lower surface of the humidity sensitive medium 5 between the second capacitance electrode 4 is also in contact with the air, and finally the silicon nitride barrier layer on the back of the substrate 1 is etched away.

第一电容电极3和第二电容电极4构成的电容以聚酰亚胺作为湿度敏感介质,当环境湿度发生改变时,聚酰亚胺感湿层的介电常数会发生变化,从而使得湿度敏感电容值发生变化,再利用电容检测电路对湿度敏感电容的变化进行检测便可以得到环境湿度的信息。The capacitance formed by the first capacitance electrode 3 and the second capacitance electrode 4 uses polyimide as the humidity sensitive medium. When the ambient humidity changes, the dielectric constant of the polyimide moisture sensing layer will change, thereby making the humidity sensitive When the capacitance value changes, the environment humidity information can be obtained by using the capacitance detection circuit to detect the change of the humidity sensitive capacitance.

Claims (5)

1.一种快速响应的CMOS相对湿度传感器,其特征在于该传感器包括衬底(1)、氧化层(2)、第一电容电极(3)、第二电容电极(4)和湿度敏感介质(5),氧化层(2)设在衬底(1)上,第一电容电极(3)、第二电容电极(4)设在氧化层(2)上,第一电容电极(3)和第二电容电极(4)由第一压焊块(33)和第二压焊块(43)分别引出,湿度敏感介质(5)设在第一电容电极(3)和第二电容电极(4)之间以及第一电容电极(3)和第二电容电极(4)上方,腐蚀衬底(1)及其上方的氧化层(2),形成空腔(6),使得第一电容电极(3)和第二电容电极(4)之间的湿度敏感介质(5)的下表面也与空气接触。1. a kind of CMOS relative humidity sensor of fast response is characterized in that this sensor comprises substrate (1), oxide layer (2), the first capacitive electrode (3), the second capacitive electrode (4) and humidity sensitive medium ( 5), the oxide layer (2) is arranged on the substrate (1), the first capacitor electrode (3), the second capacitor electrode (4) are arranged on the oxide layer (2), the first capacitor electrode (3) and the second capacitor electrode Two capacitor electrodes (4) are respectively drawn out by the first pressure welding block (33) and the second pressure welding block (43), and the humidity sensitive medium (5) is arranged on the first capacitor electrode (3) and the second capacitor electrode (4) Between and above the first capacitor electrode (3) and the second capacitor electrode (4), etch the substrate (1) and the oxide layer (2) above it to form a cavity (6), so that the first capacitor electrode (3 ) and the lower surface of the humidity sensitive medium (5) between the second capacitive electrode (4) is also in contact with the air. 2.根据权利要求1所述的一种快速响应的CMOS相对湿度传感器,其特征在于第一电容电极(3)、第二电容电极(4)为叉指状电极且交错排列,每组叉指状电极的第一公共端(31)和第二公共端(41)以及叉指状电极的第一自由端(32)和第二自由端(42)均固定于氧化层(2)上,以保证第一电容电极(3)、第二电容电极(4)的机械强度。2. A kind of fast response CMOS relative humidity sensor according to claim 1, is characterized in that the first capacitive electrode (3), the second capacitive electrode (4) are interdigitated electrodes and are arranged in a staggered manner, each group of interdigitated electrodes The first common end (31) and the second common end (41) of the shape electrode and the first free end (32) and the second free end (42) of the interdigitated electrode are all fixed on the oxide layer (2), with The mechanical strength of the first capacitor electrode (3) and the second capacitor electrode (4) is guaranteed. 3.根据权利要求1或2所述的一种快速响应的CMOS相对湿度传感器,其特征在于湿度敏感介质(5)为聚酰亚胺。3. A fast-response CMOS relative humidity sensor according to claim 1 or 2, characterized in that the humidity-sensitive medium (5) is polyimide. 4.根据权利要求1或2所述的一种快速响应的CMOS相对湿度传感器,其特征在于第一电容电极(3)、第二电容电极(4)为铝电极。4. A kind of fast-response CMOS relative humidity sensor according to claim 1 or 2, characterized in that the first capacitance electrode (3) and the second capacitance electrode (4) are aluminum electrodes. 5.根据权利要求1或2所述的一种快速响应的CMOS相对湿度传感器,其特征在于传感器加工工艺与标准CMOS工艺完全兼容,传感器后处理工艺采用MEMS各向异性湿法腐蚀完成。5. A fast-response CMOS relative humidity sensor according to claim 1 or 2, characterized in that the processing technology of the sensor is fully compatible with the standard CMOS technology, and the post-treatment process of the sensor is completed by MEMS anisotropic wet etching.
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