CN101600534B - Apparatus and method for arranging through openings in movable band - Google Patents
Apparatus and method for arranging through openings in movable band Download PDFInfo
- Publication number
- CN101600534B CN101600534B CN200780039146.5A CN200780039146A CN101600534B CN 101600534 B CN101600534 B CN 101600534B CN 200780039146 A CN200780039146 A CN 200780039146A CN 101600534 B CN101600534 B CN 101600534B
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- CN
- China
- Prior art keywords
- openings
- laser
- pass
- recess
- band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- 239000013307 optical fiber Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 2
- 238000001354 calcination Methods 0.000 claims 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 230000003321 amplification Effects 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Packages (AREA)
Abstract
The invention relates to an apparatus and a method for arranging through openings (16) serially in at least one row in a flexible, movable band (1), wherein each through opening (16) is arranged in numerous depressions (2) arranged serially in at least one row in order to accommodate electronic components on the base side. A laser device (4) with at least one laser beam (5-8) is arranged to act on the sides (11) turned away from the bases (13) of the depressions (2), wherein the laser device (4) is formed in such a way that with the at least one laser beam (5-8), the through openings (16) can be burned in within a predetermined time span in a predetermined section (3) of the band (1) in predetermined positions of the base sides (11).
Description
According to the aforementioned part of claim 1 to 16, the present invention relates to a kind of flexibility, the apparatus and method of band arranging through openings (through-openings) movably, described pass through openings is with at least one row's form continuous arrangement, wherein each pass through openings is arranged on the bottom of of multiple recesses for containing electronic components, and described recess is with at least one row's form continuous arrangement.
Blister tape (blister tapes) is usually used to minimum element to pack into and be arranged in described blister tape and be designed in the bag (pocket) of recess, for further transmission.For this reason, need to vacuum passage (vacuum channels) be set at downside the bottom of recess (), (this vacuum passage for having very minor diameter, for example 0.4mm) the form of minimum through hole (through-bores), to realize by the vacuum applying, element is fixed in bag.
At present, this pass through openings is mechanically cut away or is gone out by cutting punch, and wherein, due to the necessary minimum diameter of cutting punch, this mechanical shearing method only limits to hole or the pass through openings for being not less than 0.4mm.
If cutting punch is designed to have less diameter, there will be burr and elevated regions in the region at punching press edge, these burrs and elevated regions hinder minimum element (for example crystal (die)) and are directed according to expection, thereby can not guarantee that this element can be taken out reliably from described bag again.
Therefore, the object of the present invention is to provide a kind of flexibility, the apparatus and method of band arranging through openings movably, described pass through openings is with at least one row's form continuous arrangement, this makes at the recess of band, pass through openings to be set in quick and simple mode, and can not produce any burr at the fringe region of these pass through openings.
This purpose realizes by having the device of feature of claim 1 and the method with the feature of claim 16.
An importance of the present invention is: a kind of flexibility, movably in the device of band arranging through openings, described pass through openings is with at least one row's form continuous arrangement, and described band has the continuously arranged recess for containing electronic components, is provided with pass through openings in the bottom of described recess; Setting has the laser aid of at least one laser beam, so that concave bottom is not worked towards the face of this recess.The design of this laser aid makes, and by least a branch of laser beam, pass through openings can be can be in predetermined time, bottom surface can precalculated position, what burnt into band can predetermined portions.This makes fast, simply and in large quantities multiple through holes to be set and does not produce burr, each through hole is arranged in a recess of band, wherein owing to using laser, for example, even if the very little pass through openings (, being less than 0.3mm) of diameter also may be set up.
According to a preferred embodiment of the present invention, pass through openings is circular, and diameter is less than 0.3mm, is preferably 0.1-0.15mm.
Method of the present invention advantageously make may be simultaneously or adjoining land use a branch of or multiple laser bundle with at band arranging through openings, described pass through openings is by continuous arrangement, wherein determine easily specific strip portion, these pass through openings by from below (or, if this band is put upside down setting, from top) effectively and at high speed burn into this strip portion, and do not produce burr.
The described part of band preferably comprises 2-10 recess, more preferably has 4-8 recess.At the of short duration stopping period of this part, by using the laser aid of multiple laser beams, provide in this section multiple pass through openings simultaneously.
Preferably, described can predetermined time at 50-300ms, more preferably 120ms, thus produce very soon pass through openings, therefore make the whole device for pass through openings is set there is high-throughput.
Certainly,, if use multiple laser beams simultaneously, in the time utilizing method of the present invention, the overall manufacturing amount of this device can significantly improve.It should be noted that, due to the reason in the angled orientation of single laser beam (particularly first and last laser beam of transmitting in a row), need to carry out additional angle calculating to the angle of departure of laser beam, obtain suitable pass through openings so that the inner face at the bottom section face of recess (, towards) is upper.Angle must precompute (optionally calculating by computing equipment), to consider the diameter deviation of the pass through openings causing because of the limited bed thickness of this angled transmitting of laser beam and base material.
The further development according to the present invention, a kind of of short duration device stopping of described part that makes band is provided, and this device makes the processed concave bottom of wanting of described part be positioned at the distance short as far as possible from laser aid due to running face (running plane) effect of band simultaneously.This makes the pass through openings being formed by laser aid may always be formed in temporary transient in that part of the nearest position of laser aid.It is desirable to, middle the pass through openings in a row be arranged on laser aid under, and that first and last pass through openings arrive the distance of laser aid is equal.Or, can use such laser aid, the laser beam that it has and synchronized movement continuous with bar Tape movement can be burnt in band pass through openings in the time of bar Tape movement.This has been avoided the difference of the pass through openings diameter causing due to the angled transmitting of laser beam.
Be preferably the control device on the precalculated position of 4 or 8 recess bottom surfaces for what control laser beam simultaneously or be transmitted into continuously described part, the processing about pass through openings fast as far as possible time of its bottom that is used for realizing recess (, bag).
Recess is preferably square, and its length of side is 0.1-1.0mm, more preferably 0.35mm, and pass through openings is arranged at the center of this square bottom surface.
Certainly, recess and the pass through openings that will be formed can also be arranged to other basic configurations, thereby adapt to ideally each element that will be fixed.
In laser aid, preferably use carbon dioxide laser.As selecting or in addition, can using the laser beam of optical-fiber laser as laser aid.
Sharp light wavelength is preferably 10600 nanometers or 1090 nanometers.
Preferably be developed further into really according to of the present invention, the laser of laser aid is preferably set to it and can moves relative to the running face of band, to avoid obtaining the laser that is incident at a certain angle bottom surface, and obtain the laser with respect to the running face vertical incidence of band.This makes it possible to form pass through openings with more accurate diameter.
Laser aid can comprise multiple laser, and these laser are assigned to the single branch of described part, quickly the bottom surface of the recess arranging on band and band is processed guaranteeing.
Band is preferably made up of carbon content constant material on its whole surface, because can make like this pass through openings have satisfactory edge, and can not form undesirable burr.
According to a preferred embodiment of the present invention, after each laser operations, by compressed air (, by producing over pressure) clean recess from below.Certainly, can use the clean method of any other type.Also can use the mode of adding carbon dioxide snow to clean, to remove from recess or cavity the dirt producing because of laser operations.
Preferably, use laser recesses machined or cavity simultaneously.
How favourable embodiment is shown in dependent claims.
Advantage and favourable feature will display from the description below in conjunction with accompanying drawing.In the accompanying drawings:
Fig. 1 shows the schematic diagram of apparatus of the present invention basic structure;
Fig. 2 shows the local amplification sectional view of the bag of the blister tape band (blistertape band) with pass through openings arranged according to the present invention;
Fig. 3 shows the local amplification sectional view of the bag of blister tape.
Fig. 1 has schematically shown the possible structure of apparatus of the present invention, and this device for arranging through hole or through hole on blister tape or blister tape band 1.Band be reversed place so that the recess 2 that is designed to bag-shaped form upward, that is, it is opening down.
In predetermined portions 3 on band 1, be provided with four or eight recesses, these recess each interval 4mm or 2mm, and on band continuous arrangement.
Described part 3 is passed through the distance of advancing device (advance movement device) integrated moving 16mm, and stops below laser aid 4.
Laser aid 4 comprises laser, and this laser can be set to carbon dioxide laser and/or fibre laser.
Simultaneously or continuously transmitting 4 bundle laser beams 5,6,7,8 altogether of laser aid 4, irradiate and exceed 120ms at the downside of the bottom of recess, and by calcination program, through hole to be set thereon, the diameter of described through hole is, for example, and 0.15mm.
Preferably, band, carbon content stable by a kind of carbon content of the whole surface minimum material that fluctuates is made.Owing to can process multiple through holes within same process time simultaneously, thereby can save process time.
Preferably, Merlon is used to band, because it contributes to the calcination program in hole.But polystyrene is not suitable for band.
Fig. 2 shows the schematic sectional view of the part amplification of the bag 2 being arranged on band/band 1.Bag 2 diameter 9 is, for example, and 0.35mm, and be circle.As selection, bag can have square bottom surface, and its length of side is 0.35mm.
On the interior upside 12 of the bottom 13 of recess 2, be provided with the pass through openings 16 having been formed by laser beam, the diameter 10 of this pass through openings 16 is, for example, 0.15mm, this recess 2 has sidewall 14 and 15.On the other hand, at the downside of bottom surface 13, pass through openings 16 has larger diameter.
Fig. 3 has also at length shown the cross-sectional view of bag or recess.Bag 2 comprises sidewall 14,15 and bottom surface 13 equally, is provided with pass through openings 16 in bag.Due to Laser emission, pass through openings preferably has diameter 18 at upside, and has larger diameter 17 at downside.
Due to laser calcination program, only may there is very little raised brim by the fringe region 19 on the downside of bottom surface 13 11.Acceptable maximum height of projection (with respect to the plane of the downside 11 of bottom surface 13) is 0.1mm, to avoid hindering follow-up bar tape handling and vacuum to apply operation.
On the other hand, on the inner side or interior upside 12 of bottom surface 13, if possible, should in the fringe region 20 of inner side, bottom surface 12, there is no elevated regions.
By selecting the material of laser material, band or bottom surface and laser intensity that the temperature of laser calcination program is set, its set-up mode should make bottom surface 13 that deformation of bottom does not occur.
The optimal wavelength of the laser using, for CO
2laser is 10600nm, and if optical-fiber laser is 1090nm.
By using the minimum vacuum hole in blister tape inner fovea part, this blister tape may more be widely used for crystal grader.
Disclosed all features in application documents, as long as their relative prior aries are independent or combination has novelty, are claimed as the important content in the present invention.
Reference numerals list
1 blister tape
2 recesses
3 parts
4 laser aids
5,6,7,8 laser beams
The size of 9 recesses
The size of 10 through holes
The downside of 11 bottom surfaces
The upside of 12 bottom surfaces
13 bottom surfaces
14,15 sidewalls
16 pass through openings
The base diameter of 17 pass through openings
The top diameter of 18 pass through openings
19,20 fringe regions
Claims (22)
1. one kind in flexibility, the device of movable band (1) arranging through openings (16), described pass through openings is arranged continuously with at least one row's form, wherein each pass through openings (16) is arranged on the bottom of for multiple recesses (2) of containing electronic components, described recess arranges continuously with at least one row's form, wherein, also be provided with the laser aid (4) with at least a branch of laser beam (5-8), do not face on the face (11) of this recess (2) with the bottom (13) that acts on recess (2), wherein the design of laser aid (4) makes, by at least a branch of laser beam (5-8), described pass through openings (16) can be can be in predetermined time, in bottom side, (11) can precalculated position, what burnt into band (1) can predetermined portions (3), it is characterized in that:
The described device that pass through openings (16) is set also comprises makes the described of band (1) can the of short duration device stopping of predetermined portions (3), this device makes the described bottom (13) of processed recess (2) of can predetermined portions (3) wanting because the effect of the running face of band (1) is positioned at from the short as far as possible distance of laser aid (4)
Be used for controlling laser beam (5-8) simultaneously or be transmitted into continuously the control device on the precalculated position of described can predetermined portions (3) four or eight recess bottom sides (11),
Described pass through openings (16) is circular, and its diameter (10,18) is less than 0.3mm; And
Described can be 50-300ms predetermined time.
2. device as claimed in claim 1, is characterized in that, the diameter of described pass through openings is 0.1-0.15mm.
3. device as claimed in claim 1, is characterized in that, described band can comprise 2-10 recess (2) by predetermined portions (3).
4. device as claimed in claim 3, is characterized in that, described recess (2) is 4 or 8.
5. device as claimed in claim 1, is characterized in that, described can be 120ms predetermined time.
6. device as claimed in claim 1, is characterized in that, the shape of cross section of pass through openings (16) is conical (17,18).
7. device as claimed in claim 1, is characterized in that, recess (2) is square, and its length of side (9) is 0.1-1.0mm, and pass through openings (16) is arranged on the center of square bottom surface (12).
8. device as claimed in claim 7, is characterized in that, the length of side of described recess (2) is 0.35mm.
9. device as claimed in claim 1, is characterized in that, the laser of laser aid (4) uses CO
2laser.
10. device as claimed in claim 1, is characterized in that, the laser of laser aid (4) uses optical-fiber laser.
11. devices as claimed in claim 1, is characterized in that, the laser beam of laser aid (4) arrives precalculated position by fiber optic conduction.
12. devices as claimed in claim 9, is characterized in that, sharp light wavelength is 10600nm.
13. devices as claimed in claim 10, is characterized in that, sharp light wavelength is 1090nm.
14. devices as claimed in claim 1, is characterized in that, the running face that the laser of laser aid (4) can be parallel to band (1) moves.
15. devices as claimed in claim 1, is characterized in that, laser aid (4) comprises multiple laser, and these laser are assigned to described single branch that can predetermined portions (3).
16. devices as claimed in claim 1, is characterized in that, band (1) is that constant material is made by carbon content on its whole surface.
17. 1 kinds in flexibility, the method of movable band (1) arranging through openings (16), described pass through openings arranges continuously with at least one row's form, wherein each pass through openings (16) is arranged on the bottom of for multiple recesses (2) of containing electronic components, described recess arranges continuously with at least one row's form, wherein, by thering is the laser aid (4) of at least a branch of laser beam (5-8), pass through openings (16) is arranged on recess (2) bottom (13) not in the face of on the face (11) of recess (2), wherein said at least a branch of laser beam (5-8) is can be in predetermined time, in bottom side, (11) can precalculated position, what pass through openings (16) was burnt into band (1) can predetermined portions (3), it is characterized in that:
Band (1) described can predetermined portions (3) be stopped by specific device is of short duration, this device makes the described bottom (13) of processed recess (2) of can predetermined portions (3) wanting because the effect of the running face of band (1) is positioned at from the short as far as possible distance of laser aid (4), and
By control device control laser beam (5-8) simultaneously or be irradiated to continuously on the precalculated position of described can predetermined portions (3) 4 or 8 recess bottom sides (11),
Described pass through openings (16) is circular, and its diameter (10,18) is less than 0.3mm,
At least a branch of laser beam can be in predetermined time calcination pass through openings, the described scheduled time is 50-300ms.
18. methods as claimed in claim 17, is characterized in that, laser aid (4) is radiated at multiple laser beams (5-8) simultaneously and will be arranged in described pass through openings (16) in can predetermined portions (3).
19. methods as claimed in claim 17, is characterized in that, the diameter of described pass through openings (16) is 0.1-0.15mm.
20. methods as claimed in claim 17, is characterized in that, the described of band (1) can comprise 2-10 recess (2) by predetermined portions (3).
21. methods as claimed in claim 20, is characterized in that, described recess (2) is 4 or 8.
22. methods as claimed in claim 17, is characterized in that, the described scheduled time is 120ms.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE202006016155.4 | 2006-10-21 | ||
| DE202006016155U DE202006016155U1 (en) | 2006-10-21 | 2006-10-21 | Machine for producing vacuum channels in bases of blisters in blister tapes used for packing electronic components comprises laser producing several beams which burn channels simultaneously in blisters along section of tape |
| DE102007050501A DE102007050501A1 (en) | 2006-10-21 | 2007-10-19 | Apparatus and method for arranging through-holes in a traveling band |
| DE102007050501.0 | 2007-10-19 | ||
| PCT/EP2007/061293 WO2008046929A1 (en) | 2006-10-21 | 2007-10-22 | Apparatus and method for arranging through openings in a movable band |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101600534A CN101600534A (en) | 2009-12-09 |
| CN101600534B true CN101600534B (en) | 2014-05-14 |
Family
ID=37576275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200780039146.5A Expired - Fee Related CN101600534B (en) | 2006-10-21 | 2007-10-22 | Apparatus and method for arranging through openings in movable band |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101600534B (en) |
| DE (1) | DE202006016155U1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1078186A (en) * | 1990-09-19 | 1993-11-10 | 株式会社日立制作所 | Processing method and apparatus using multi-pulse laser beams |
| US5690233A (en) * | 1995-03-30 | 1997-11-25 | Kaneko Denki Kabushiki Kaisha | Carrier tape with recesses for electronic parts |
| CN1266776A (en) * | 1999-01-28 | 2000-09-20 | 莱斯特加工技术公司 | Laser welding method and apparatus for welding plastic workpiece or plastics or other materials |
| CN1303756A (en) * | 1999-12-23 | 2001-07-18 | 莱斯特加工技术公司 | Method of heating at least two component through laser beam with high energy flux and its apparatus |
| WO2002081097A1 (en) * | 2001-04-05 | 2002-10-17 | Aradigm Corporation | Method of generating uniform pores in thin polymer films |
| CN1653207A (en) * | 2002-04-08 | 2005-08-10 | 应用材料有限公司 | Laser drilled surfaces for substrate processing chambers |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006502006A (en) * | 2002-10-04 | 2006-01-19 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | Method for forming precisely sized slots in an elastic mask of a microparts carrier |
-
2006
- 2006-10-21 DE DE202006016155U patent/DE202006016155U1/en not_active Expired - Lifetime
-
2007
- 2007-10-22 CN CN200780039146.5A patent/CN101600534B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1078186A (en) * | 1990-09-19 | 1993-11-10 | 株式会社日立制作所 | Processing method and apparatus using multi-pulse laser beams |
| US5690233A (en) * | 1995-03-30 | 1997-11-25 | Kaneko Denki Kabushiki Kaisha | Carrier tape with recesses for electronic parts |
| CN1266776A (en) * | 1999-01-28 | 2000-09-20 | 莱斯特加工技术公司 | Laser welding method and apparatus for welding plastic workpiece or plastics or other materials |
| CN1303756A (en) * | 1999-12-23 | 2001-07-18 | 莱斯特加工技术公司 | Method of heating at least two component through laser beam with high energy flux and its apparatus |
| WO2002081097A1 (en) * | 2001-04-05 | 2002-10-17 | Aradigm Corporation | Method of generating uniform pores in thin polymer films |
| CN1653207A (en) * | 2002-04-08 | 2005-08-10 | 应用材料有限公司 | Laser drilled surfaces for substrate processing chambers |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101600534A (en) | 2009-12-09 |
| DE202006016155U1 (en) | 2006-12-21 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: The German city of Rodin Patentee after: Samuel Bauer GmbH & Co.KG Address before: The German city of Rodin Patentee before: Muhlbauer AG |
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Granted publication date: 20140514 |
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