CN101579856A - Bad crystal grain selecting machine and method thereof - Google Patents

Abstract

The invention discloses a bad crystal grain selecting machine and a method thereof. The bad die sorting machine comprises an operation base, a sorting device and an exclusion device. The sorting device comprises a suction nozzle, the bad crystal grains arranged on the operation base are adsorbed in a vacuum adsorption mode, and then the bad crystal grains are removed through the removing device. The removing device is in a non-contact type and removes the bad grains in a fluid spraying mode, or in a contact type and removes the bad grains in a mode that a direct contactor and a suction nozzle are in mutual contact.

Description

Defective die sorting machine and method thereof

technical field

The invention relates to a bad grain sorting machine and a method thereof, in particular to a bad grain sorting machine and a method using a contact or non-contact elimination device.

Background technique

A die is a basic electronic component in the electronics industry. It undergoes epitaxy and subsequent processes through the semiconductor process steps, and has become a common product on the market. In the die manufacturing process, the wafer needs to be cut into dies to facilitate subsequent packaging and other processing. However, during the cutting process, the dies are likely to be damaged, so it is necessary to select and collect bad dies for subsequent processing. Disposal, etc.

The traditional bad die selection method adopts manual selection, and by comparing the dies on the wafer, the bad dies are sorted out and discarded. However, with the miniaturization of the semiconductor manufacturing process, the size of the grains is getting smaller and smaller, which makes manual selection more difficult, and it takes a long time to select bad grains for a wafer.

In response to the above problems, the known technology proposes a grain sorting machine. After the bad grains are selected by the sorting machine, a suction nozzle is used to absorb the bad grains, and through an absorption device, for example, by vacuum absorption, the bad grains are removed. absorb. For example, Chinese Taiwan Patent No. M253466 proposes an improvement in the fast die picking structure of a die sorting machine. However, the miniaturization of the semiconductor manufacturing process has made the weight of the die lighter. Taking the die as an example, the wafer is placed on an adhesive film after being cut into dies. The residual adhesive will be absorbed by the suction nozzle at the same time, so the die is easily adhered to the suction nozzle by the residual adhesive of the film, which increases the difficulty of removing bad die. The absorption device only has the function of absorption and does not remove The function of removing bad die from the nozzle. Therefore, there is still a need for a mechanism for removing bad grains that can solve the above-mentioned problems, so as to improve the removal efficiency.

Contents of the invention

On the one hand, the present invention provides a bad die sorting machine capable of improving the efficiency of removing bad dies.

In order to realize the above-mentioned purpose of the invention, the present invention adopts following technical scheme:

The present invention provides a bad grain sorting machine, which includes an operating base for placing grains; a sorting device, including a suction nozzle, which is connected to a vacuum source, and is used for absorbing the grains placed on the operating base bad grains; and a non-contact removal device, which includes a nozzle connected to a fluid source, and the bad grains on the suction nozzle are sprayed through the fluid. The above-mentioned non-contact type removal device includes a static electricity removal device. Wherein, the electrostatic removal device includes an electrostatic gun or an electrostatic fan.

Another defective grain sorting machine provided by the present invention includes an operating base for placing grains; a sorting device includes a suction nozzle connected to a vacuum source for absorbing grains placed on the operating base The bad grains in it; and the contact removal device, which includes a direct contactor, through which the direct contactor and the suction nozzle are in contact with each other, so as to eliminate the bad grains on the suction nozzle. The above-mentioned contact type removal device includes a static electricity removal device. Wherein, the electrostatic removal device includes an electrostatic gun or an electrostatic fan.

On the other hand, the present invention provides a method for selecting bad grains that can improve the efficiency of removing bad grains.

In order to realize the above-mentioned purpose of the invention, the present invention adopts following technical scheme:

A method for selecting bad grains provided by the present invention includes preparing an operating base for placing grains; absorbing bad grains in the grains on the operating base through a sorting device; and removing the sorting device through fluid spraying bad grains on the In addition, the bad die sorting method further includes removing static electricity from the sorting device.

Another method for selecting bad grains provided by the present invention includes preparing an operation base for placing grains; adsorbing bad grains in the grains on the operation base by a sorting device; The suction nozzles of the picking device are in contact with each other to remove bad grains on the suction nozzles. In addition, the bad die selection method further includes removing static electricity from direct contacts.

Description of drawings

The present invention can be understood through several preferred embodiments and detailed description in the specification and accompanying drawings. However, those skilled in the art should understand that all preferred embodiments of the present invention are used to illustrate rather than limit the claims of the present invention, wherein:

Fig. 1 is the schematic diagram of operation of the bad grain sorting machine of the present invention;

Fig. 2 is a side view of the sorting device of the defective grain sorting machine of the present invention shown in Fig. 1;

Fig. 3 is a side view of the non-contact elimination device of the bad grain sorting machine of the present invention shown in Fig. 1;

Fig. 4 is a cross-sectional view of an embodiment of the contact type elimination device of the defective grain sorting machine of the present invention;

Fig. 5 is a cross-sectional view of another embodiment of the contact elimination device of the defective grain sorting machine of the present invention;

Fig. 6 is a cross-sectional view of another embodiment of the contact elimination device of the bad grain sorting machine of the present invention;

Fig. 7 is the upper view of the contact elimination device of the defective grain sorting machine shown in Fig. 6;

FIG. 8 is a schematic diagram of the steps of the method for selecting bad grains of the present invention.

Detailed ways

In order to enable those skilled in the art to better understand the technical solution of the present invention, and to make the above-mentioned purpose, features and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

As shown in Figure 1, in the preferred embodiment of the bad grain sorting machine provided by the present invention, it includes: an operation base 101, a sorting device 102 and an exclusion device, wherein the exclusion device is a non-contact exclusion device 103, a contact type Exclude device 104 or comprise both; The effect of operation base 101 is to place grain 106, and picking device 102 comprises suction nozzle 1021, is connected to vacuum source 111 by suction nozzle 1021, to absorb the defective crystal on operation base 101 The removal device mainly removes bad grains on the suction nozzle 1021 through the non-contact removal device 103 using the fluid removal method or through the contact removal device 104 using the direct contactor and the suction nozzle 1021 to contact each other.

As shown in FIG. 1 , the operation base 101 is used to place crystal grains, generally speaking, it is used to place the adhesive film 107 carrying the crystal grains 106; the operation base 101 is connected to a vacuum source 109 through a pipeline 108, and the The way of fixing the glue film 107 on the operating base 101 is to fix the glue film 107; the way of fixing the glue film 107 mentioned in the present invention can also be done by mechanical fixing or other ways. The mechanical fixing method fixes the expansion ring on the outer periphery of the adhesive film on the operation base 101, that is, a ring is used to surround the outer periphery of the expansion ring, so that the surrounding space of the ring is reduced by a set of clamping parts, so that the adhesive film 107 is fixed on the ring inside.

Please refer to FIG. 1 and FIG. 2 at the same time. The sorting device 102 includes a suction nozzle 1021, which is connected to a vacuum source 111 through a pipeline 110. A vacuum path is formed between the suction nozzle 1021 and the vacuum source 111, so that the suction nozzle 1021 absorbs the operating substrate by vacuum. Die 106 on the seat 101; through a judging device to confirm that each die 106 is complete or defective, the sorting device 102 will cooperate with the thimbler 105 to absorb the bad die 106a, and remove the operation base 101 to one for removal Area; Wherein, exclusion area refers to the area that gets rid of and collects bad grain 106a, and exclusion device promptly is arranged on exclusion area, and here, judging device is with visual display, as electron microscope, digital camera, digital microscope camera, industrial microscope Equipment, etc., observe the pattern of the grain 106, cooperate with the microprocessor analysis to determine the bad grain and its position; and the thimble device 105 is close to the adhesive film 107, and at the position of the bad grain 106a, the thimble punctures the adhesive film 107 The defective die 106 a is removed from the adhesive film 107 , and the structure of the ejector 105 is a prior art, and the detailed description of the ejector 105 is omitted here. The adhesive film 107 has a certain viscosity, so when the ejector 105 removes the defective die 106a from the adhesive film 107, the sorting device 102 needs to absorb the defective die 106a through the suction nozzle 1021 at the same time, so that the defective die 106a can be accurately adsorbed on the suction nozzle 1021. The picking device 102 also includes a robot arm 1022 and a moving device 1023 . In one embodiment, the robot arm 1022 is composed of two joints and three skeletons for moving the suction nozzle 1021 , but its structure is not limited to the above description. The moving device 1023 is used to control the vertical position and the horizontal position of the mechanical arm 1022, so as to facilitate three-dimensional movement. In one embodiment, the moving device 1023 includes two motors or other driving components, such as stepping motors, servo motors, voice coil motors (voice coil motors) and direct drive motors (direct drive motors), etc., one of which is used for The vertical position of the robot arm 1022 is controlled to rise or fall at a fixed point, and then perform the action of sucking or removing bad dies. Another motor is used to control the horizontal position of the robot arm 1022 to move between several devices in the process steps, such as the removal device and the operation base 101, so as to facilitate continuous steps. After the suction nozzle 1021 absorbs the bad die 106a, the sorting device 102 uses the robot arm 1022 to move the suction nozzle 1021 and the bad die 106a to the removal device in the removal area. When the operating base 101 absorbs the adhesive film 107 by vacuum, the vacuum source 109 connected to it through the pipeline 108 is the same vacuum source as the vacuum source 111. Of course, in another embodiment, the vacuum source 109 and the vacuum source 111 can be for different vacuum sources.

Please refer to FIG. 1, when the suction nozzle 1021 absorbs the bad die 106a, the bad die 106a often carries the residual adhesive on the adhesive film, so the residual adhesive is easy to adhere to the suction nozzle 1021, causing the bad die 106a to stick to the suction nozzle 1021. The nozzle 1021 cannot be removed, so the bad die 106a and even the residual glue on the suction nozzle 1021 need to be removed by a removal device. As mentioned above, the removal device includes a non-contact removal device 103 (as shown in the upper left corner of Figure 1), a contact removal device 104 (as shown in the upper right corner of Figure 1), or both, and the following will The configurations of the non-contact type removal device 103 and the contact type removal device 104 will be described respectively. After the contact or non-contact removal device 104 or 103 removes the defective die 106a, the sorting device 102 returns to the position of the operating base 101 to repeat the same steps above.

Fig. 3 is the side view of the non-contact type removal device of Fig. 1; Please refer to Fig. 1 and Fig. 3 simultaneously, non-contact type removal device 103 comprises nozzle 1031, and nozzle pipe 1031 is connected to fluid source 113 by pipeline 112; When picking device 102, when the bad grains 106a are adsorbed by the suction nozzle 1021 and moved to the non-contact removal device 103, the fluid source 113 provides the nozzle 1031 with a fluid to get rid of the bad grains on the suction nozzle 1021; the fluid source 113 is a gas source 1. A liquid source or one of the above two, the gas or liquid supplied by the fluid source 113 is delivered to the nozzle 1031, and is sprayed out through the outlet of the nozzle 1031, and then the bad crystal grains 106a are removed to facilitate subsequent processing. In one embodiment, the gas may be general air, inert gas or other gases. In one embodiment, the liquid may be water or other liquids.

In another embodiment, the removal device can be a contact removal device 104, as shown in the upper right corner of FIG. The defective grains 106a fall off from the suction nozzle 1021 ; wherein, the direct contactor is a brush 10401 , an elastic soft board or other elastic materials, so as to avoid damaging the structure of the sorting device 102 when in contact with the suction nozzle 1021 . The elastic soft board is a soft board made of rubber, PU or other equivalent materials. Figures 4 to 6 are schematic diagrams of three implementations of the contact-type removal device. Here, for the convenience of description, the direct contactor uses a brush 10401 as an example; please refer to Figures 1 and 4, the contact-type removal device 104 includes a hair brush 10401, the base 10406 and the placement mechanism 10408; the base 10406 has two ends, the brush 10401 is located on one end of the base 10406, and the other end of the base 10406 is placed on the through hole of the placement mechanism 10408, locked with screws, glued In addition, the base 10406 and the placement mechanism 10408 can also be integrally formed; when the suction nozzle 1021 moves to the exclusion area, the placement mechanism 10408 is placed on the moving track of the suction nozzle 1021, so that the brush 10401 It is in direct contact with the suction nozzle 1021 to eliminate the bad crystal grains 106 a on the suction nozzle 1021 .

Please refer to Fig. 1 and Fig. 5, contact-type removing device 104 comprises hairbrush 10401, base 10406, slide rail 10409 and mover 10410; One end is connected to the through hole 10411 of the mover 10410, and is connected to the mover 10410 by means of screw locking or glue fixing. In addition, the base 10406 and the mover 10410 can also be integrally formed; the mover 10410 is set on the Outside the slide rail 10409, the mover 10410 is restricted from moving in the horizontal direction of the slide rail 10409 (the direction of the arrow in Figure 5), and the mover 10410 is moved in the horizontal direction through a pneumatic cylinder, solenoid valve or other horizontally moving devices; When 1021 moves to the exclusion area, the mover 10410 moves horizontally on the slide rail 10409, driving the brush 10401 to the moving track of the suction nozzle 1021, so that the brush 10401 is in direct contact with the suction nozzle 1021, and the defective parts on the suction nozzle 1021 are eliminated. Die 106a. In addition to pneumatic cylinders and solenoid valves, according to the diversity of mechanism design, linkage devices such as screws and belts can also be connected between a motor and the mover 10410. The motors are stepping motors and servo motors. Or the servo motor drives the interlocking device, and then drives the brush 10401 to move horizontally.

Fig. 7 is a top view of the contact removal device in Fig. 6, please refer to Fig. 1, Fig. 6 and Fig. 7, the contact removal device 104 includes a brush 10401, a base 10406, an outer frame 10402, a cross bar 10403, and two interlocking screws 10405 and motor (not shown). The base 10406 has two ends, the brush 10401 is located on one end of the base 10406, and the other end of the base 10406 is connected to a through hole 10404 of the crossbar 10403, the base 10406 is placed in the through hole 10404, and is locked by screws and adhesive Fixing and other methods are connected to the cross bar 10403 of the driving device. In addition, the base 10406 and the cross bar 10403 can also be integrally formed; The two interlocking screws 10405 pass through the holes of the two support plates, and lock the two ends of the cross bar 10403 to fix the cross bar 10403 between the two support plates. In order to reduce the complexity of making the outer frame 10402, as shown in Figure 7, the outer frame 10402 is designed as a hollow square or rectangular mechanism to effectively control the distance between the two support plates, and the cross bar 10403 is placed inside the outer frame 10402. The motor is a stepping motor or a servo motor, which is connected to the interlocking screw 10405, and the interlocking screw 10405 is driven by the motor to rotate clockwise or counterclockwise. When the suction nozzle 1021 moves to the exclusion area, the motor acts, and the interlocking screw 10405 rotates clockwise or counterclockwise, and the brush 10401 rotates clockwise or counterclockwise in the outer frame 10402, to the moving track of the suction nozzle 1021 Above, make the brush 10401 directly contact with the suction nozzle 1021 to remove the bad crystal grains 106a on the suction nozzle 1021. In this embodiment, there may be multiple brushes 10401 , and the motor drives the multiple brushes 10401 to rotate clockwise or counterclockwise, so as to remove the bad crystal grains 106 a on the suction nozzle 1021 . A plurality of brushes 10401 are placed on one end of the plurality of bases 10406 respectively, and the brushes 10401 and the bases 10406 are fixed on the cross bar 10403 by connecting the other ends of the plurality of bases 10406 to the through holes 10404 of the cross bar 10403 .

Please refer to FIG. 1 , the bad grain sorting machine also includes a collecting device for collecting bad grains, so the functions of the non-contact removing device 103 and the contact removing device 104 are the same. In the following, only the non-contact removal device 103 is taken as an example. Please refer to FIG. 1 and FIG. 3 at the same time. The collection device 114 has a body 1141 and a recess 1142, and is placed near the nozzle 1031; the recess 1142 is formed on the upper surface of the body 1141. , after the nozzle 1031 ejects fluid to remove the defective die 106 a on the suction nozzle 1021 , the defective die 106 a will fall into the concave portion 1142 . The non-contact removal device 103 and the collection device 114 can be separated, or can be designed to be integrally formed. As shown in Figure 3, the side view of the non-contact removal device 103 and the collection device 114 is integrally formed. The nozzle 1031 is arranged on the side wall of the recess 1142 on and in the recess 1142 .

Please refer to FIG. 1, when the suction nozzle 1021 absorbs the bad die 106a and removes it from the adhesive film 107, the suction nozzle 1021 and the bad die 106a will induce static electricity, and this type of static electrode will easily cause the bad die 106a to become more severe. It is difficult to remove from the suction nozzle 1021, therefore, in an embodiment of the present invention, a static elimination device can be added to the removal device.

Please refer to Fig. 1, taking the non-contact type removal device 103 as an example, the fluid source 113 connected to the nozzle 1031, when using a gas source, an ion generating device can be set to generate an ion gas as the fluid source 113 supplies The fluid, and the ionic gas has the function of eliminating static electricity on the suction nozzle 1021 in addition to removing the bad crystal grains 106a on the suction nozzle 1021 . Among them, the ion generating device is a charged object, such as an ion needle, through the principle of electrostatic removal devices such as electrostatic guns or electrostatic fans, that is, when the ion generating device is connected to an external power supply, the ion generating device is corona discharged to make the ion generating device pass through The airflow ionized into a large number of positive and negative ions, so that the ion wind quickly blows to the area where static electricity needs to be removed to neutralize the static electricity. Certainly, while using the fluid source 113, when the fluid source 113 is not an ionic gas, the defective grain sorter can also use an electrostatic gun or an electrostatic fan to remove static electricity from the suction nozzle 1021. There is no specific location for the static removal device, as long as the suction nozzle 1021 can contact the ion gas generated by the static removal device.

Please refer to Fig. 4 to Fig. 6, the ground wire 10407 can be attached to the contact type elimination device 104 to conduct away static electricity, and the ground wire 10407 is connected to the machine surface of the defective grain sorting machine or the grounding point of the power socket, and the contact type elimination device Between 104. In addition, the bad die sorting machine can use a static removal device such as an electrostatic gun or an electrostatic fan to remove static electricity from the suction nozzle 1021 . There is no specific location for the static removal device, as long as the suction nozzle 1021 contacts the ion gas generated by the static removal device.

In another embodiment, as shown in FIG. 8 , a method for selecting bad grains provided by the present invention; A plurality of crystal grains are on it; afterward, in step 202, the bad grains in the grains on the above-mentioned operating base are adsorbed by the picking device; please refer to Fig. 1, in this step, the bad grains need to be poked by the thimbler 105 Break the adhesive film 107 to lift the bad grains 106a and at the same time cooperate with the sorting device 102 to absorb the bad grains 106a, so that the bad grains 106a can be adsorbed to the sorting device 102; then, step 203 or step 204 can be performed, and in step 203 The bad grains on the sorting device are removed by fluid spraying, and in step 204, the direct contactor and the suction nozzle of the sorting device are in contact with each other to eliminate the bad grains on the suction nozzle. The step 203 is to use non-contact elimination The device 103 removes the bad grains 106a on the sorting device 102 by spraying the fluid, and the step 204 uses the contact type removing device 104 to contact the suction nozzle 1021 of the picking device 102 through a direct contactor to eliminate the picking device 102 on the bad die 106a. In step 204, according to Fig. 4 to Fig. 6, there are three implementation methods for the direct contactor, one is to place the direct contactor on a placement mechanism, fix the direct contactor on the placement mechanism, and place it on On the moving track of the suction nozzle, the direct contactor is in direct contact with the suction nozzle; the second method is to connect the direct contactor to a mover, and drive the mover to move horizontally on the slide rail through the driving device, and then drive the direct contactor Horizontal action to make contact with the suction nozzle; the third method is to connect the direct contactor to a horizontal bar, and form two opposite holes on the two opposite support plates of the outer frame, and then pass two interlocking screws through them. hole and lock the two ends of the cross bar, and drive the interlocking screw to rotate through the driving device, and then drive the direct contactor to rotate to contact with the suction nozzle.

The bad grain sorting machine provided by the present invention, while sorting bad grains, through contact or non-contact exclusion device, overcomes the sticking of bad grains on the suction nozzle due to residual glue on the suction nozzle and cannot Excluded issues. Moreover, the static electricity on the suction nozzle can be removed by the static electricity removal device attached to the removal device, which can improve the removal efficiency of bad crystal grains. In addition, the contact type removal device of the bad grain sorting machine of the present invention directly contacts the suction nozzle through the direct contactor, and the actual removal ability is better than that of the non-contact type removal device, which can improve the removal efficiency.

The above is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed in the present invention can easily think of changes or Replacement should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.

Claims (26)

1, a kind of bad crystal grain selector is characterized in that, comprises:

One operational base is in order to put crystal grain;

One sorting plant comprises a suction nozzle, and this suction nozzle is connected to a vacuum source, places the bad crystal grain of this crystal grain on this operational base in order to absorption; And

One contactless remover comprises a jet pipe and is connected to a fluid source, and the fluid that provides by this fluid source sprays the bad crystal grain that removes on the suction nozzle.

2, bad crystal grain selector according to claim 1 is characterized in that, described fluid source is a gas source or a fluid supply.

3, bad crystal grain selector according to claim 2 is characterized in that, described gas source is an ionized gas source.

4, bad crystal grain selector according to claim 1 is characterized in that, also comprises a collection apparatus, behind the bad crystal grain that removes by described fluid spray on the suction nozzle, collects the bad crystal grain that is removed by spray.

5, bad crystal grain selector according to claim 4 is characterized in that, described collection apparatus and this contactless remover are formed in one.

6, bad crystal grain selector according to claim 1 is characterized in that, also comprises a static removal device, removes the incidental static of this suction nozzle.

7, bad crystal grain selector according to claim 6 is characterized in that, described static removal device comprises a static gun or a static fan.

8, a kind of bad crystal grain selector is characterized in that, comprises:

One operational base is in order to put crystal grain;

One sorting plant comprises a suction nozzle, and this suction nozzle is connected to a vacuum source, places the bad crystal grain of this crystal grain on this operational base in order to absorption; And

One contact remover comprises a direct contactor, is in contact with one another by this direct contactor and this suction nozzle, to get rid of the bad crystal grain on the suction nozzle.

9, bad crystal grain selector according to claim 8 is characterized in that, described direct contactor is a hairbrush or an elasticity soft board.

10, bad crystal grain selector according to claim 9 is characterized in that, described elasticity soft board is a rubbery flexible sheet or a PU soft board.

11, bad crystal grain selector according to claim 8 is characterized in that, described contact remover comprises one and puts mechanism, and directly contactor is positioned over and puts in the mechanism.

12, bad crystal grain selector according to claim 8, it is characterized in that, described contact remover comprises a mover, a slide rail and a drive unit, this direct contactor is connected on this mover, driving this mover by this drive unit moves horizontally on this slide rail, and then drive this direct contactor horizontal balance, be in contact with one another with this suction nozzle.

13, bad crystal grain selector according to claim 12 is characterized in that, described drive unit comprises a stepper motor or a servo motor or a pneumatic cylinder or a magnetic valve.

14, bad crystal grain selector according to claim 8, it is characterized in that, described contact remover comprises a cross bar, a housing, two interlock screws and a drive unit, this direct contactor is connected on this cross bar, this housing comprises two relative gripper shoes, it has two relative Durchgangshohle and is formed at wherein, this interlock screw wears the two ends of this Durchgangshohle and this cross bar that locks, driving this interlock screw by this drive unit rotates, and then drive this direct contactor rotation, be in contact with one another with this suction nozzle.

15, bad crystal grain selector according to claim 14 is characterized in that, described drive unit comprises a stepper motor or a servo motor.

16, bad crystal grain selector according to claim 8 is characterized in that, also comprises a static removal device, removes the incidental static of this suction nozzle.

17, bad crystal grain selector according to claim 16 is characterized in that, described static removal device comprises a static gun or a static fan.

18, bad crystal grain selector according to claim 16, it is characterized in that described static removal device comprises a conductor and an earth connection, this conductor electrically connects this earth connection, be in contact with one another by this direct contactor and this conductor, to remove the incidental static of direct contactor.

19, a kind of bad crystal grain selection method is characterized in that, comprises:

Purchase an operational base, in order to put crystal grain;

Adsorb bad crystal grain in this crystal grain on this operational base by a sorting plant; And

Spray the bad crystal grain that removes on the sorting plant by a fluid.

20, bad crystal grain selection method according to claim 19 is characterized in that, also comprises the static of removing this sorting plant.

21, a kind of bad crystal grain selection method is characterized in that, comprises:

Purchase an operational base, in order to put crystal grain;

Adsorb the bad crystal grain in the crystal grain on this operational base by a sorting plant; And

Suction nozzle by a direct contactor and this sorting plant is in contact with one another, to get rid of the bad crystal grain on the suction nozzle.

22, bad crystal grain selection method according to claim 21 is characterized in that, also comprises the static of removing described direct contactor.

23, bad crystal grain selection method according to claim 21 is characterized in that, the step that the suction nozzle of described direct contactor and sorting plant is in contact with one another, and the suction nozzle that comprises with a hairbrush or an elasticity soft board and sorting plant is in contact with one another.

24, bad crystal grain selection method according to claim 21 is characterized in that, the step that the suction nozzle of described direct contactor and sorting plant is in contact with one another comprises and direct contactor is placed on one puts in the mechanism.

25, bad crystal grain selection method according to claim 21, it is characterized in that, the step that the suction nozzle of described direct contactor and sorting plant is in contact with one another, comprise and to be connected on the mover by direct contactor, driving this mover by a drive unit moves horizontally on a slide rail, and then drive direct contactor horizontal balance, be in contact with one another with suction nozzle.

26, bad crystal grain selection method according to claim 21, it is characterized in that, the step that the suction nozzle of described direct contactor and sorting plant is in contact with one another, comprise and to be connected on the cross bar by direct contactor, and on two relative gripper shoes of a housing, form two relative Durchgangshohle, and again two interlock screws are worn the two ends of this Durchgangshohle and this cross bar that locks, drive this interlock screw by a drive unit and rotate, and then drive direct contactor rotation, be in contact with one another with suction nozzle.

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