CN101555613A - 外壳的表面处理方法及由该方法制得的外壳 - Google Patents
外壳的表面处理方法及由该方法制得的外壳 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000004381 surface treatment Methods 0.000 title claims abstract description 19
- 238000007747 plating Methods 0.000 claims abstract description 32
- 238000007639 printing Methods 0.000 claims abstract description 31
- 239000000126 substance Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 31
- 238000005034 decoration Methods 0.000 claims description 13
- 239000011159 matrix material Substances 0.000 claims description 13
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 10
- 229920003023 plastic Polymers 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 10
- 238000010306 acid treatment Methods 0.000 claims description 8
- 238000002161 passivation Methods 0.000 claims description 8
- 239000004417 polycarbonate Substances 0.000 claims description 8
- 238000006263 metalation reaction Methods 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- 230000004913 activation Effects 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims description 4
- 238000001311 chemical methods and process Methods 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 238000004140 cleaning Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 8
- 238000001465 metallisation Methods 0.000 abstract 1
- 239000002585 base Substances 0.000 description 28
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 19
- 229910052759 nickel Inorganic materials 0.000 description 10
- 239000000243 solution Substances 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000003854 Surface Print Methods 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 230000002860 competitive effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- -1 nickel metals Chemical class 0.000 description 1
- 238000006396 nitration reaction Methods 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- RPBNQQGUJBCUGO-UHFFFAOYSA-N sulfanylidenechromium Chemical compound [S].[Cr] RPBNQQGUJBCUGO-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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Abstract
一种外壳的表面处理方法,其包括如下步骤:提供一外壳基体;对该外壳基体进行表面金属化处理;将所述表面金属化处理后的外壳基体进行钝化处理;在所述钝化处理后的外壳基体上的部分区域印刷图案;对印刷图案后的外壳基体进行酸洗处理;对所述酸洗处理后的外壳基体进行电镀,所述电镀层的外表面高于印刷图案。一种外壳,其包括一基体、一形成于基体上的化学镀层、覆盖于化学镀层表面的印刷图案层及电镀层、及一形成于电镀层上的表面装饰层,所述印刷图案层低于电镀层的表面,所述化学镀层为铜金属层。
Description
技术领域
本发明是关于一种外壳的表面处理方法及由该方法制得的外壳。
背景技术
现有对手机、数码相机、个人数字助理、笔记本电脑等便携式电子装置的塑料外壳通常会进行电镀处理以使外壳表面具有金属效果。电镀处理后的电镀层上通常会印刷图案或字母作为产品的标签,由于电镀层表面平滑且对油墨的附着力较低,因此印刷于电镀层上油墨在使用中容易磨损甚至剥落,从而影响产品的外观。为了避免此问题,人们又想到先将塑料外壳进行金属化处理,再印刷图案层,然后进行电镀,该电镀层高于印刷层,这样商标凹陷于电镀层中,使用时不易被磨损。
然而无论是先电镀后印刷还是先印刷后电镀,均需要对塑料外壳进行化学镀镍处理以使所述塑料外壳具备可电镀性。由于镍是一种对人体健康有危害的物质,因此该含镍的产品很难具市场竞争力。
发明内容
鉴于此,有必要提供一种对人体友好且可防止表面的印刷层被磨损的外壳的表面处理方法;
另外,还有必要提供一种应用所述表面处理方法制得的外壳。
一种外壳的表面处理方法,其包括如下步骤:
提供一外壳基体;
对该外壳基体进行表面金属化处理;
将所述表面金属化处理后的外壳基体进行钝化处理;
在所述钝化处理后的外壳基体上的部分区域印刷图案;
对印刷图案后的外壳基体进行酸洗处理;
对所述酸洗处理后的外壳基体进行电镀,所述电镀层的外表面高于印刷图案。
一种外壳,其包括一基体、一形成于基体上的化学镀层、覆盖于化学镀层表面的印刷图案层及电镀层、及一形成于电镀层上的表面装饰层,所述印刷图案层低于电镀层的表面,所述化学镀层为铜金属层。
相较于现有技术,本发明外壳表面处理方法中不使用到对人体有害的镍金属,适应了对人体友好的要求,且该表面处理方法为先在外壳基体表面印刷图案,然后再电镀金属层,并使图案低于电镀金属层的外表面,从而可避免在使用过程中对印刷图案的磨损;本发明外壳的化学镀层、电镀层及表面装饰层均不含对人体有害的镍金属,适应了对人体友好的要求,产品更具有竞争力。且,本发明外壳的印刷图案层低于电镀层及表面装饰层的表面,在使用过程中可避免对印刷图案层的磨损,使用效果更佳。
附图说明
图1是本发明较佳实施方式外壳的剖视示意图。
具体实施方式
本发明较佳实施方式的外壳的表面处理方法包括如下步骤:
提供一外壳基体,该外壳基体为塑料材料注塑成型制成,该塑料可选自为丙烯腈-丁二烯-苯乙烯(Acrylonitrile-Butadiene-Styrene,ABS)或丙烯腈-丁二烯-苯乙烯与聚碳酸酯(Polycarbonate,PC)的混合物。
对该外壳基体进行表面金属化处理,以使该基体表面转化为可导电的表面。
首先对外壳基体的表面进行蚀刻处理,使其表面粗糙化。该蚀刻处理可通过使用含铬酸、铬硫混酸(chromschwefelsaure)或者高锰酸钾的腐蚀剂对基体表面进行腐蚀来实现,也可采用等离子加工或用氧化浸蚀法来实现。
蚀刻后的外壳基体经酸洗或碱洗中和残余的蚀刻液后,再用清水冲洗,并进一步对该外壳基体进行活化处理。活化处理时,将外壳基体浸渍于一活化剂溶液中,该活化剂溶液中包含有盐酸、聚酰胺酸及贵金属离子,如钯离子。活化处理后该外壳基体的表面上沉积有点状分布的钯金属。
活化处理后再将外壳基体置于含铜溶液中进行浸渍,使铜金属桥架沉积于点状分布的钯金属之间,以使外壳基体的表面全部被铜金属所覆盖,形成一导电层。
将所述表面金属化处理后的外壳基体进行钝化处理。由于金属化处理后形成于外壳基体上的铜金属在空气中易于氧化形成黑色的氧化铜,其一方面会导致后续印刷图案的印刷不良,另一方面影响到后续的电镀。因此对浸渍后形成于基体上的铜化学镀层使用钝化液进行钝化保护处理,使该铜化学镀层表面形成一不导电的氧化物保护膜。
在所述钝化处理后的外壳基体上的部分区域印刷图案。该印刷图案所采用的油墨为耐酸及耐碱性能好的不导电油墨,所采用的印刷方式可为丝网印刷。
对印刷图案后的外壳基体进行酸洗处理,以除去钝化处理后附着于外壳基体上未覆盖有印刷图案的区域的不导电氧化物保护膜。该酸洗处理的溶液可为硫酸或盐酸。
对所述酸洗处理后的外壳基体进行电镀处理。该电镀的金属可为铜或其他非镍金属,该电镀金属层的厚度可由电镀时间的长短来控制。由于外壳基体上印刷图案的油墨为不导电油墨,因此外壳基体上形成有印刷图案层的部位不会被电镀,而外壳基体上未被印刷图案覆盖的区域均被电镀层所覆盖,且本发明较佳实施例中电镀金属层的厚度高于印刷图案的厚度,亦即印刷图案低于电镀金属层的外表面。
在所述电镀处理后的外壳基体上还可再电镀一表面装饰层。该表面装饰层可为电镀铬金属层或其他非镍金属层。所述铬金属层具有较强的化学稳定性及亮泽的色彩效果。
请参阅图1所示,其为应用本发明较佳实施方式表面处理方法所制得的外壳100。该外壳100包括一基体10、一形成于基体10上的化学镀层12、设置于化学镀层12上的印刷图案层13及电镀层14、及一形成于电镀层14上的表面装饰层16。所述印刷图案层13的外表面低于电镀层14及表面装饰层16。
基体10为塑料材料注塑成型制成,该塑料可选自为丙烯腈-丁二烯-苯乙烯(Acrylonitrile-Butadiene-Styrene,ABS)或丙烯腈-丁二烯-苯乙烯与聚碳酸酯(Polycarbonate,PC)的混合物。
化学镀层12为化学镀铜层,其通过含铜的溶液以化学的方法沉积于基体10上形成。
印刷图案层13为采用耐酸及耐碱性能好的不导电油墨印刷于化学镀层12上形成,其覆盖化学镀层12的部分区域。
电镀层14为铜或其他非镍金属电镀形成于化学镀层12上,且化学镀层12上形成有印刷图案层13的部位不被电镀层14所覆盖,而化学镀层12上未被印刷图案层13覆盖的区域均被电镀层14所覆盖。本发明较佳实施例中电镀层14的厚度高于印刷图案层13的厚度,亦即印刷图案层13低于电镀层14的外表面。
表面装饰层16为电镀铬金属层及其他非镍金属层,其形成于电镀层14上。该表面装饰层16具有较强的化学稳定性及亮泽的色彩效果,其为本发明较佳实施方式外壳100起到保护及装饰的作用。
本发明较佳实施方式外壳可为手机、数码相机、个人数字助理或笔记本电脑等便携式电子装置的外壳。
相较于现有技术,本发明较佳实施方式的外壳表面处理方法中不使用到对人体有害的镍金属,适应了对人体友好的要求,且该表面处理方法为先在外壳基体表面印刷图案,然后再电镀金属层,并使图案低于电镀金属层的外表面,从而可避免在使用过程中对印刷图案的磨损;本发明较佳实施方式的外壳100的化学镀层12、电镀层14及表面装饰层16均不含对人体有害的镍金属,适应了对人体友好的要求,产品更具有竞争力。且该外壳100的印刷图案层13低于电镀层14及表面装饰层16的表面,在使用过程中可避免对印刷图案层13的磨损,使用效果更佳。
Claims (12)
1.一种外壳的表面处理方法,其包括如下步骤:
提供一外壳基体;
对该外壳基体进行表面金属化处理;
将所述表面金属化处理后的外壳基体进行钝化处理;
在所述钝化处理后的外壳基体上的部分区域印刷图案;
对印刷图案后的外壳基体进行酸洗处理;
对所述酸洗处理后的外壳基体进行电镀,所述电镀层的外表面高于印刷图案。
2.如权利要求1所述的外壳的表面处理方法,其特征在于:所述基体为塑料注塑成型制成。
3.如权利要求2所述的外壳的表面处理方法,其特征在于:所述塑料为丙烯腈丁二烯苯乙烯或丙烯腈丁二烯苯乙烯与聚碳酸酯的混合物。
4.如权利要求1所述的外壳的表面处理方法,其特征在于:所述金属化处理的方法为化学方法,其包括如下步骤:将所述外壳基体表面粗化;活化该粗化后的外壳基体表面;在活化后的外壳基体表面化学镀覆金属铜。
5.如权利要求1所述的外壳的表面处理方法,其特征在于:所述印刷图案的油墨为耐酸及耐碱性的不导电油墨。
6.如权利要求1所述的外壳的表面处理方法,其特征在于:所述酸洗处理后的外壳基体上印刷有图案的部位不被电镀,外壳基体上未印刷有图案的部位被电镀金属覆盖。
7.一种外壳,其包括一基体、一形成于基体上的化学镀层、覆盖于化学镀层表面的印刷图案层及电镀层、及一形成于电镀层上的表面装饰层,所述印刷图案层低于电镀层的表面,其特征在于:所述化学镀层为铜金属层。
8.如权利要求7所述的外壳,其特征在于:所述基体为塑料注塑成型制成。
9.如权利要求8所述的外壳,其特征在于:所述塑料为丙烯腈-丁二烯-苯乙烯或丙烯腈-丁二烯-苯乙烯与聚碳酸酯的混合物。
10.如权利要求7所述的外壳,其特征在于:所述印刷图案层所用油墨为不导电油墨。
11.如权利要求7所述的外壳,其特征在于:所述电镀层为铜电镀层,该电镀层覆盖于化学镀层上未形成有印刷图案层的区域。
12.如权利要求7所述的外壳,其特征在于:所述表面装饰层为铬电镀层。
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