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CN101540942A - Miniature sound system - Google Patents

Miniature sound system Download PDF

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Publication number
CN101540942A
CN101540942A CN200810084039A CN200810084039A CN101540942A CN 101540942 A CN101540942 A CN 101540942A CN 200810084039 A CN200810084039 A CN 200810084039A CN 200810084039 A CN200810084039 A CN 200810084039A CN 101540942 A CN101540942 A CN 101540942A
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circuit board
sound system
micro sound
micro
module
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陈财铭
杨雅龙
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HUAXUN CORP
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HUAXUN CORP
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Abstract

A miniature sound system comprises a loudspeaker, a circuit board coupled with the loudspeaker and a sound cavity, wherein the sound cavity covers the loudspeaker and the circuit board, is provided with a resonance space and is provided with an opening corresponding to the sound production position of the loudspeaker. The miniature sound system integrates a signal processing unit, a loudspeaker unit and an audio resonance structure, and the volume of the sound cavity is less than 10 cubic centimeters, so that the volume of the loudspeaker and the listening effect can be simultaneously considered.

Description

微型音响系统 micro sound system

技术领域 technical field

本发明涉及一种微型音响系统,尤其涉及一种整合信号处理单元、扬声单元及音频共振结构的微型音响系统。The invention relates to a miniature audio system, in particular to a miniature audio system integrating a signal processing unit, a loudspeaker unit and an audio resonance structure.

背景技术 Background technique

随着电子与机构发展与整合技术的日新月异,如移动电话、随身影音播放器、个人数字助理、笔记型计算机或平板计算机等具有多媒体播放功能的消费性电子产品日渐普遍,甚至已成为日常生活中所不可或缺的一部分。With the rapid development of electronic and institutional development and integration technologies, consumer electronic products with multimedia playback functions such as mobile phones, portable audio-visual players, personal digital assistants, notebook computers or tablet computers are becoming more and more common, and have even become part of our daily life. an integral part.

上述的消费性电子装置,除了提供使用者电子数据处理外,另外还搭配影音播放、游戏、语音输入、实时视频、及影音撷取等多媒体应用功能,此已成为消费性电子装置的发展方向。其中,影音播放功能通常包括用以呈现影像的视频信号、用以呈现声音的音频信号或是影像及声音的整合等功能。In addition to providing user electronic data processing, the above-mentioned consumer electronic devices are also equipped with multimedia application functions such as video playback, games, voice input, real-time video, and video and video capture. This has become the development direction of consumer electronic devices. Wherein, the video and audio playback function usually includes functions such as video signals for presenting images, audio signals for presenting sounds, or integration of images and sounds.

然由于消费性电子产品在体积上发展趋势为轻薄短小,因此如何在不增加甚至缩小产品体积的前提下,尽可能的增加多样化功能模块,遂成为业界研究发展的重要课题。However, since the volume of consumer electronics products tends to be light, thin, and small, how to add as many functional modules as possible without increasing or even reducing the volume of the product has become an important topic for research and development in the industry.

而在解决将多种功能模块整合至单一消费性电子产品的课题后,接下来所要面对的课题,即是如何提升产品功能呈现的质量。具体言之,对于现有需外接耳机或扬声器始能播放声音(音频)信号的多媒体播放器(如市贩的MP3录音笔)而言,使用者若要收听如音乐等声音信号时,就必须戴上耳机或接上外部扬声器,往往会造成行动携带上的不便,或需额外增加收纳耳机或扬声器的空间。After solving the problem of integrating multiple functional modules into a single consumer electronic product, the next problem to be faced is how to improve the quality of product function presentation. Specifically, for existing multimedia players (such as commercially available MP3 recording pens) that require external earphones or loudspeakers to play sound (audio) signals, if users want to listen to sound signals such as music, they must Wearing earphones or connecting external speakers often causes inconvenience in mobility, or requires extra space for earphones or speakers.

为解决此一课题,遂有提出将扬声器整合在消费性电子产品中的技术,如移动电话或笔记型计算机均具有扬声器,使用者无需外接耳机或扬声器即能播放并收听声音信号。现有具有扬声器的消费性电子产品,为顾及产品的体积,因此必须利用10立方公分或甚至5立方公分体积以下的微型音响系统,而现有的微型音响系统仅具有扬声单体而不具有音频信号处理单元,必须接受消费性电子产品本身或外部的驱动始能发声。此外,现有的微型音响系统受限于消费性电子产品的容设空间,无法如一般的扬声器般结合扬声单体与共振腔及/或对应不同音频的反射孔,故包括音量与音质的整体聆赏效果,无法与一般体积的外接扬声器相提并论。In order to solve this problem, a technology of integrating speakers into consumer electronic products has been proposed. For example, mobile phones or notebook computers have speakers, and users can play and listen to audio signals without external earphones or speakers. Existing consumer electronic products with loudspeakers, in order to take into account the volume of the product, must use a miniature audio system with a volume of less than 10 cubic centimeters or even 5 cubic centimeters, and the existing miniature audio system only has a speaker unit and does not have The audio signal processing unit must be driven by the consumer electronic product itself or externally before it can produce sound. In addition, the existing miniature audio system is limited by the space for consumer electronics products, and cannot combine the speaker unit with the resonant cavity and/or the reflection holes corresponding to different audio frequencies like ordinary speakers. The overall listening effect cannot be compared with external speakers of general size.

综上所述,如何提供一种能同时兼顾扬声器体积与聆赏效果的微型音响系统,实为相关领域的业者亟待解决的课题。To sum up, how to provide a miniature audio system that can take both the volume of the speaker and the listening effect into account is an urgent problem to be solved by the industry in related fields.

发明内容 Contents of the invention

鉴于上述现有技术的缺点,本发明提供一种微型音响系统,包括:扬声器;电路板,与该扬声器耦接;以及音腔,包覆该扬声器与该电路板,且具有共振空间,并于对应该扬声器的发声位置具有开孔,其中,该音腔的体积为10立方公分以下。In view of the above-mentioned shortcomings of the prior art, the present invention provides a micro-acoustic system, comprising: a speaker; a circuit board coupled to the speaker; There is an opening corresponding to the sound emitting position of the loudspeaker, wherein the volume of the sound cavity is less than 10 cubic centimeters.

其次,本发明还提供一种微型音响系统,包括:扬声器;电路板,与该扬声器耦接;以及音腔,于对应该电路板的位置具有容置并连接该电路板的第一开孔,该音腔与该电路板包覆该扬声器,且具有共振空间,并于对应该扬声器的发声位置具有第二开孔,其中,该音腔的体积为10立方公分以下。Secondly, the present invention also provides a micro-acoustic system, including: a speaker; a circuit board coupled to the speaker; and a sound cavity, which has a first opening at a position corresponding to the circuit board to accommodate and connect the circuit board, The sound cavity and the circuit board cover the speaker, have a resonance space, and have a second opening corresponding to the sound emitting position of the speaker, wherein the volume of the sound cavity is less than 10 cubic centimeters.

再者,本发明还提供一种微型音响系统,包括:扬声器;电路板,与该扬声器耦接;以及音腔,对应该扬声器的发声位置具有第一开孔,并于该扬声器与该电路板耦接的位置具有第二开孔,且包覆该扬声器,并具有共振空间,其中,该音腔的体积为10立方公分以下。Furthermore, the present invention also provides a miniature audio system, including: a speaker; a circuit board coupled to the speaker; The coupling position has a second opening, covers the speaker, and has a resonance space, wherein the volume of the sound cavity is less than 10 cubic centimeters.

于前述的本发明的任一型态中,该电路板具有:接收声音信号的信号接收模块;对该声音信号接收模块所接收的声音信号进行滤波,并输出特定频率的声音信号的信号滤波模块;以及对通过该特定频率的声音信号进行功率放大或衰减并输出至该扬声器的功率调整模块。In any one of the aforementioned forms of the present invention, the circuit board has: a signal receiving module for receiving sound signals; a signal filtering module for filtering the sound signals received by the sound signal receiving module and outputting sound signals of a specific frequency ; and a power adjustment module that amplifies or attenuates the power of the sound signal passing through the specific frequency and outputs it to the speaker.

于前述的本发明的任一型态中,该音腔及/或该电路板可选择性地具有至少一个反射孔。反射孔较佳地为高音、中音及/或低音反射孔。In any one of the aforementioned forms of the present invention, the sound chamber and/or the circuit board may optionally have at least one reflective hole. The reflex holes are preferably treble, midrange and/or bass reflex holes.

于前述的本发明的任一型态中,该音腔的体积为5立方公分以下。In any one of the aforementioned forms of the present invention, the sound chamber has a volume of less than 5 cubic centimeters.

于前述的本发明的任一型态中,本发明的微型音响系统还可选择性的包括可例如为由泡棉、硅胶或橡胶等的间隔件。In any of the above-mentioned forms of the present invention, the micro-acoustic system of the present invention may also optionally include a spacer made of foam, silica gel or rubber, for example.

相较于现有技术,本发明的微型音响系统在音腔的体积为10立方公分,甚至5立方公分以下,整合信号处理单元、扬声单元及音频共振结构,故能同时兼顾扬声器体积与聆赏效果。Compared with the prior art, the miniature audio system of the present invention has a volume of 10 cubic centimeters, or even less than 5 cubic centimeters, and integrates signal processing unit, speaker unit and audio resonance structure, so it can take into account both the volume of the speaker and the listening ability. Reward effect.

以下结合附图和具体实施例对本发明进行详细描述,但不作为对本发明的限定。The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

附图说明 Description of drawings

图1A至图1D为本发明的微型音响系统的第一实施例的结构示意图;1A to 1D are schematic structural views of the first embodiment of the micro-acoustic system of the present invention;

图2A至图2C为本发明的微型音响系统的第二实施例的立体分解示意图;2A to 2C are three-dimensional exploded schematic diagrams of the second embodiment of the miniature audio system of the present invention;

图3A至图3C为本发明的微型音响系统的第三实施例的立体分解示意图;3A to 3C are three-dimensional exploded schematic diagrams of the third embodiment of the micro-acoustic system of the present invention;

图4A至图4C为本发明的微型音响系统的第四实施例的立体分解示意图;4A to 4C are three-dimensional exploded schematic diagrams of the fourth embodiment of the micro-acoustic system of the present invention;

图5A至图5C为本发明的微型音响系统的第五实施例的立体分解示意图;以及5A to 5C are three-dimensional exploded schematic diagrams of the fifth embodiment of the micro-acoustic system of the present invention; and

图6A至图6C为本发明的微型音响系统的第六实施例的立体分解示意图。6A to 6C are perspective exploded schematic diagrams of the sixth embodiment of the miniature sound system of the present invention.

其中,附图标记Among them, reference signs

10扬声器10 speakers

101发声位置101 voice position

11电路板11 circuit board

111线路Line 111

12音腔12 cavity

13间隔件13 spacers

120共振空间120 resonance space

121第一开孔121 first opening

122第二开孔122 second opening

22音腔22 cavity

220共振空间220 resonance space

221第一开孔221 first opening

222第二开孔222 second opening

32音腔32 cavity

320共振空间320 resonance space

321第一开孔321 first opening

322第二开孔322 second opening

323反射孔323 reflective holes

具体实施方式 Detailed ways

以下通过特定的具体实例说明本发明的实施方式,本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其它优点与功效。Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

第一实施例:First embodiment:

请参阅图1A至图1D,其分别用以显示本发明的微型音响系统的第一实施例的结构示意图,如图所示,本发明的微型音响系统包括扬声器10、电路板11及音腔12。Please refer to FIG. 1A to FIG. 1D , which are respectively used to show a schematic structural view of the first embodiment of the miniature audio system of the present invention. As shown in the figure, the miniature audio system of the present invention includes a loudspeaker 10, a circuit board 11 and a sound cavity 12 .

扬声器10,具有发声位置101,扬声器10可例如但不限定地为高音扬声单体、中音扬声单体或低音扬声单体。The speaker 10 has a sound emitting position 101, and the speaker 10 may be, for example but not limited to, a treble speaker unit, a midrange speaker unit or a woofer unit.

电路板11,与扬声器10耦接。于本实施例中,电路板11可例如图1D所示,具有接收声音信号的信号接收模块(未图标),对该声音信号接收模块所接收的声音信号进行滤波,并输出特定频率的声音信号的信号滤波模块(未图标),以及对通过该特定频率的声音信号进行功率放大或衰减并输出至该扬声器的功率调整模块(未图标),并通过线路111与外部装置耦接。电路板11可例如为硬质印刷电路板、软质印刷电路板或集成电路板。The circuit board 11 is coupled with the speaker 10 . In this embodiment, the circuit board 11 may, for example, as shown in FIG. 1D, have a signal receiving module (not shown) for receiving a sound signal, filter the sound signal received by the sound signal receiving module, and output a sound signal of a specific frequency A signal filtering module (not shown), and a power adjustment module (not shown) that amplifies or attenuates the sound signal passing through the specific frequency and outputs it to the speaker, and is coupled to an external device through a line 111 . The circuit board 11 can be, for example, a rigid printed circuit board, a flexible printed circuit board or an integrated circuit board.

信号接收模块可例如为排线、软性电路板或连接插头。信号滤波模块为低通滤波器、高通滤波器及/或带通滤波器。The signal receiving module can be, for example, a cable, a flexible circuit board or a connecting plug. The signal filtering module is a low-pass filter, a high-pass filter and/or a band-pass filter.

音腔12,包覆扬声器10与电路板11,且具有共振空间120,并于对应扬声器10的发声位置具有第一开孔121,而于对应电路板11的位置具有第二开孔122,依据实际需要提供信号接收模块、声音信号的信号滤波模块及/或功率调整模块贯穿音腔12,并与外部装置耦接,外部装置可例如为提供电源予信号接收模块、信号滤波模块、功率调整模块与扬声器模块的电源供应模块(未图标)。于本实施例中,通过信号接收模块与该电源供应模块耦接,亦即,信号接收模块除能接收声音信号外,还能接收电源供应模块所提供的操作电源,并将电源提供信号滤波模块及功率调整模块。于其它实施例中,音腔具有第三开孔(未图标),且电源供应模块通过第三开孔与电路板耦接。The sound cavity 12 covers the speaker 10 and the circuit board 11, and has a resonance space 120, and has a first opening 121 at the position corresponding to the sound of the speaker 10, and has a second opening 122 at the position corresponding to the circuit board 11, according to It is actually necessary to provide a signal receiving module, a signal filtering module of the sound signal and/or a power adjustment module to pass through the sound cavity 12, and to be coupled with an external device. The external device can, for example, provide power to the signal receiving module, signal filtering module, and power adjustment module Power supply module (not shown) with the speaker module. In this embodiment, the signal receiving module is coupled with the power supply module, that is, the signal receiving module can not only receive the sound signal, but also receive the operating power provided by the power supply module, and provide the power to the signal filter module and power adjustment module. In other embodiments, the sound chamber has a third opening (not shown), and the power supply module is coupled to the circuit board through the third opening.

较佳者,本发明的微型音响系统可选择性的包括间隔件13,间隔件13可例如为由泡棉、硅胶或橡胶等,具有垫高扬声器10、令扬声器10与电路板11绝缘、能吸收扬声器10与电路板11所产生的震动及/或能阻隔扬声器10的不同侧于发声时所产生的微幅气流对流效果的材料所组成。Preferably, the micro-acoustic system of the present invention may optionally include a spacer 13. The spacer 13 may be, for example, made of foam, silica gel or rubber, etc., and has the functions of raising the speaker 10, insulating the speaker 10 from the circuit board 11, and The material is composed of materials that can absorb the vibration generated by the speaker 10 and the circuit board 11 and/or can block the micro-amplitude air convection effect generated when different sides of the speaker 10 produce sound.

于本实施例中,音腔的体积为10立方公分以下,更佳者,音腔的体积为5立方公分以下。第一开孔121可由单个开孔或由数个开孔所组成的如网状的开孔。In this embodiment, the volume of the sound chamber is less than 10 cubic centimeters, more preferably, the volume of the sound chamber is less than 5 cubic centimeters. The first opening 121 may be a single opening or a mesh-like opening composed of several openings.

第二实施例:Second embodiment:

请参阅图2A至2C图,其分别用以显示本发明的微型音响系统的第二实施例的结构示意图,如图所示,本发明的微型音响系统与第一实施例的结构大致相同,其差异在于本实施例具有二个扬声器10,故电路板11需同时与二个扬声器10耦接,另一方面,音腔12具有二个分别对应扬声器10的发声位置的第一开孔121。Please refer to Figures 2A to 2C, which are respectively used to show a schematic structural view of the second embodiment of the miniature sound system of the present invention, as shown in the figure, the structure of the miniature sound system of the present invention is roughly the same as that of the first embodiment, and The difference is that this embodiment has two speakers 10 , so the circuit board 11 needs to be coupled with the two speakers 10 at the same time. On the other hand, the sound chamber 12 has two first openings 121 corresponding to the sound emitting positions of the speakers 10 .

须特别说明的是,于本发明的其它实施例中,扬声器10的数量可以超过二个。电路板11则需同时与数个扬声器10耦接,且音腔12具有数个分别对应扬声器10的发声位置的第一开孔121。It should be noted that in other embodiments of the present invention, the number of speakers 10 may exceed two. The circuit board 11 needs to be coupled with several speakers 10 at the same time, and the sound chamber 12 has a plurality of first openings 121 respectively corresponding to sound emitting positions of the speakers 10 .

数个扬声器10之间除可通过电路板11耦接外,还可通过排线、绞线、单芯线、多心线及/或连接插头相互连接。The several speakers 10 can be connected to each other not only through the circuit board 11 , but also through flat wires, stranded wires, single-core wires, multi-core wires and/or connecting plugs.

第三实施例:Third embodiment:

请参阅图3A至图3C,其分别用以显示本发明的微型音响系统的第三实施例的结构示意图,如图所示,本发明的微型音响系统与第一实施例的结构大致相同,并能与第一实施例的结构相互结合,其差异在于本实施例的音腔22于对应电路板11的位置具有容置并连接电路板11的第一开孔221,音腔22与电路板11包覆扬声器10,且具有共振空间220,并于对应扬声器10的发声位置101具有第二开孔222。Please refer to FIG. 3A to FIG. 3C , which are respectively used to show a schematic structural view of the third embodiment of the miniature sound system of the present invention. As shown in the figure, the structure of the miniature sound system of the present invention is roughly the same as that of the first embodiment, and It can be combined with the structure of the first embodiment, the difference is that the sound chamber 22 of this embodiment has a first opening 221 at the position corresponding to the circuit board 11 to accommodate and connect the circuit board 11, the sound chamber 22 and the circuit board 11 It covers the speaker 10 and has a resonant space 220 , and has a second opening 222 corresponding to the sound emitting position 101 of the speaker 10 .

具体言之,于本实施例中,音腔22与电路板11共同形成共振空间220,故能减少电路板11与音腔22重叠所占用的空间与材料成本。Specifically, in this embodiment, the sound cavity 22 and the circuit board 11 jointly form the resonance space 220 , so the space and material cost occupied by the overlap of the circuit board 11 and the sound cavity 22 can be reduced.

第四实施例:Fourth embodiment:

请参阅图4A至图4C,其分别用以显示本发明的微型音响系统的第四实施例的结构示意图,如图所示,本发明的微型音响系统与第三实施例的结构大致相同,并能与第二实施例的结构相互结合,其差异在于本实施例具有二个扬声器10,故电路板11需同时与二个扬声器10耦接,另一方面,音腔22具有二个分别对应扬声器10的发声位置的第二开孔222。Please refer to FIG. 4A to FIG. 4C , which are respectively used to show a schematic structural view of the fourth embodiment of the miniature sound system of the present invention. As shown in the figure, the structure of the miniature sound system of the present invention is roughly the same as that of the third embodiment, and Can be combined with the structure of the second embodiment, the difference is that this embodiment has two speakers 10, so the circuit board 11 needs to be coupled with the two speakers 10 at the same time, on the other hand, the sound chamber 22 has two corresponding speakers The second opening 222 at the sound emitting position of 10.

相同之处在于音腔22于对应电路板11的位置具有容置并连接电路板11的第一开孔221,音腔22与电路板11包覆二个扬声器10,且具有共振空间220,并于对应二个扬声器10的发声位置101具有第二开孔222。The same thing is that the sound cavity 22 has a first opening 221 at the position corresponding to the circuit board 11 to accommodate and connect the circuit board 11, the sound cavity 22 and the circuit board 11 cover the two speakers 10, and have a resonance space 220, and There is a second opening 222 at the sound emitting position 101 corresponding to the two speakers 10 .

具体言之,于本实施例中,音腔22与电路板11共同形成共振空间220,故能减少电路板11与音腔22重叠所占用的空间与材料成本。Specifically, in this embodiment, the sound cavity 22 and the circuit board 11 jointly form the resonance space 220 , so the space and material cost occupied by the overlap of the circuit board 11 and the sound cavity 22 can be reduced.

须特别说明的是,于本发明的其它实施例中,扬声器10的数量可以超过二个。电路板11则需同时与数个扬声器10耦接,且音腔22具有数个分别对应扬声器10的发声位置的第二开孔222。It should be noted that in other embodiments of the present invention, the number of speakers 10 may exceed two. The circuit board 11 needs to be coupled with several speakers 10 at the same time, and the sound chamber 22 has several second openings 222 respectively corresponding to the sound emitting positions of the speakers 10 .

数个扬声器10之间除可通过电路板11耦接外,还可通过排线、绞线、单芯线、多心线及/或连接插头相互连接。The several speakers 10 can be connected to each other not only through the circuit board 11 , but also through flat wires, stranded wires, single-core wires, multi-core wires and/or connecting plugs.

第五实施例:Fifth embodiment:

请参阅图5A至图5C,其分别用以显示本发明的微型音响系统的第五实施例的结构示意图,如图所示,本发明的微型音响系统与第一或第三实施例的结构大致相同,并能与第一或第三实施例的结构相互结合,其差异在于本实施例的音腔32对应扬声器10的发声位置101具有第一开孔321,并于扬声器10与电路板11耦接的位置具有第二开孔322,且包覆扬声器10,并具有共振空间320。具体言之,于本实施例中,电路板11位于音腔32的外侧,并通过第二开孔322与扬声器10耦接。Please refer to Fig. 5A to Fig. 5C, which are respectively used to show the structure diagram of the fifth embodiment of the miniature sound system of the present invention. The same, and can be combined with the structure of the first or third embodiment, the difference is that the sound cavity 32 of this embodiment corresponds to the sound emitting position 101 of the speaker 10 with a first opening 321, and is coupled between the speaker 10 and the circuit board 11 The connected position has a second opening 322 , and covers the speaker 10 , and has a resonant space 320 . Specifically, in this embodiment, the circuit board 11 is located outside the sound chamber 32 and coupled to the speaker 10 through the second opening 322 .

第六实施例:Sixth embodiment:

请参阅图6A至图6C,其分别用以显示本发明的微型音响系统的第六实施例的结构示意图,如图所示,本发明的微型音响系统与第一、第三或第五实施例的结构大致相同,并能与第一至第五实施例其中任一者的结构相互结合。以下将以结合第五实施例予以说明,与第五实施例相较,其差异在于本实施例的音腔32还包括反射孔323。Please refer to Fig. 6A to Fig. 6C, which are respectively used to show the schematic structural diagram of the sixth embodiment of the miniature sound system of the present invention, as shown in the figure, the miniature sound system of the present invention and the first, third or fifth embodiment The structures are substantially the same, and can be combined with the structure of any one of the first to fifth embodiments. The fifth embodiment will be described below. Compared with the fifth embodiment, the difference is that the sound chamber 32 of this embodiment further includes a reflection hole 323 .

于不同的实施例中,反射孔323除可开设于音腔32外,还能开设于电路板11或同时开设于电路板11与音腔32。In different embodiments, the reflective hole 323 can not only be set on the sound cavity 32 , but also can be set on the circuit board 11 or both on the circuit board 11 and the sound cavity 32 .

须特别说明的是,本案所属技术领域中具有通常知识者,于阅读上述第一至第六实施例的说明后,能在本发明的申请专利范围内予以等效变更或替换。It should be noted that those with ordinary knowledge in the technical field of this case can make equivalent changes or replacements within the scope of the patent application of the present invention after reading the descriptions of the first to sixth embodiments above.

综上所述,本发明的微型音响系统在音腔的体积为10立方公分,甚至5立方公分以下,整合信号处理单元、扬声单元及音频共振结构,故能同时兼顾扬声器体积与聆赏效果。To sum up, the miniature audio system of the present invention has a volume of 10 cubic centimeters, or even less than 5 cubic centimeters, and integrates signal processing unit, speaker unit and audio resonance structure, so it can take into account both the volume of the speaker and the listening effect .

当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (45)

1. a micro sound system is characterized in that, comprising:
Loud speaker;
Circuit board couples with this loud speaker; And
The sound chamber coats this loud speaker and this circuit board, and has resonant space, and in sounding position that should loud speaker is had first perforate, and in position that should circuit board is had second perforate.
2. micro sound system according to claim 1 is characterized in that, this circuit board has: the signal receiving module that receives voice signal; The voice signal that this voice signal receiver module is received carries out filtering, and the signal filtering module of the voice signal of output characteristic frequency; And the voice signal by this characteristic frequency carried out power amplification or decay and export the power regulation module of this loud speaker to.
3. micro sound system according to claim 2 is characterized in that, this circuit board couples with the power supply module that provides power supply to give this signal receiving module, this signal filtering module, this power regulation module and this loudspeaker module.
4. micro sound system according to claim 2 is characterized in that, this sound chamber has the 3rd perforate, and this power supply module couples by the 3rd perforate and this circuit board.
5. micro sound system according to claim 2 is characterized in that, this signal receiving module is winding displacement, flexible circuit board or attachment plug.
6. micro sound system according to claim 2 is characterized in that, this signal filtering module is low pass filter, high pass filter and/or band pass filter.
7. micro sound system according to claim 1 is characterized in that, comprises several loud speakers.
8. micro sound system according to claim 7 is characterized in that, uses this circuit board, winding displacement, twisted wire, single-core line, split conductor and/or attachment plug to interconnect between these several loud speakers.
9. micro sound system according to claim 1 is characterized in that, this circuit board is hard printed circuit board, soft printed circuit board (PCB) or surface-mounted integrated circuit.
10. micro sound system according to claim 1 is characterized in that, this sound chamber and/or this circuit board have at least one reflection hole.
11. micro sound system according to claim 10 is characterized in that, this reflection hole is high pitch, middle pitch and/or bass reflex hole.
12. micro sound system according to claim 1 is characterized in that, the volume in this sound chamber is below 10 cubic centimeters.
13. micro sound system according to claim 1 is characterized in that, this first perforate is made up of several perforates.
14. micro sound system according to claim 1 is characterized in that, also comprises distance piece, is arranged between this loud speaker and this circuit board.
15. micro sound system according to claim 14 is characterized in that, this distance piece is that foam, silica gel or rubber constitute part.
16. a micro sound system is characterized in that, comprising:
Loud speaker;
Circuit board couples with this loud speaker; And
The sound chamber, in position that should circuit board being had ccontaining and connecting first perforate of this circuit board, this sound chamber and this circuit board coat this loud speaker, and have resonant space, and in sounding position that should loud speaker is had second perforate.
17. micro sound system according to claim 16 is characterized in that, this circuit board has: the signal receiving module that receives voice signal; The voice signal that this voice signal receiver module is received carries out filtering, and the signal filtering module of the voice signal of output characteristic frequency; And the voice signal by this characteristic frequency carried out power amplification or decay and export the power regulation module of this loud speaker to.
18. micro sound system according to claim 17 is characterized in that, this circuit board couples with the power supply module that provides power supply to give this signal receiving module, this signal filtering module, this power regulation module and this loudspeaker module.
19. micro sound system according to claim 17 is characterized in that, this sound chamber has the 3rd perforate, and this power supply module couples by the 3rd perforate and this circuit board.
20. micro sound system according to claim 17 is characterized in that, this signal receiving module is winding displacement, flexible circuit board or attachment plug.
21. micro sound system according to claim 17 is characterized in that, this signal filtering module is low pass filter, high pass filter and/or band pass filter.
22. micro sound system according to claim 16 is characterized in that, comprises several loud speakers.
23. micro sound system according to claim 22 is characterized in that, uses this circuit board, winding displacement, twisted wire, single-core line, split conductor and/or attachment plug to interconnect between these several loud speakers.
24. micro sound system according to claim 16 is characterized in that, this circuit board is hard printed circuit board, soft printed circuit board (PCB) or surface-mounted integrated circuit.
25. micro sound system according to claim 16 is characterized in that, this sound chamber and/or this circuit board have at least one reflection hole.
26. micro sound system according to claim 25 is characterized in that, this reflection hole is high pitch, middle pitch and/or bass reflex hole.
27. micro sound system according to claim 16 is characterized in that, the volume in this sound chamber is below 10 cubic centimeters.
28. micro sound system according to claim 16 is characterized in that, this first perforate is made up of several perforates.
29. micro sound system according to claim 16 is characterized in that, also comprises distance piece, is arranged between this loud speaker and this circuit board.
30. micro sound system according to claim 29 is characterized in that, this distance piece is that foam, silica gel or rubber constitute part.
31. a micro sound system is characterized in that, comprising:
Loud speaker;
Circuit board couples with this loud speaker; And
The sound chamber has first perforate to sounding position that should loud speaker, and has second perforate in the position that this loud speaker and this circuit board couple, and coats this loud speaker, and has resonant space.
32. micro sound system according to claim 31 is characterized in that, this circuit board has: the signal receiving module that receives voice signal; The voice signal that this voice signal receiver module is received carries out filtering, and the signal filtering module of the voice signal of output characteristic frequency; And the voice signal by this characteristic frequency carried out power amplification or decay and export the power regulation module of this loud speaker to.
33. micro sound system according to claim 32 is characterized in that, this circuit board couples with the power supply module that provides power supply to give this signal receiving module, this signal filtering module, this power regulation module and this loudspeaker module.
34. micro sound system according to claim 32 is characterized in that, this sound chamber has the 3rd perforate, and this power supply module couples by the 3rd perforate and this circuit board.
35. micro sound system according to claim 32 is characterized in that, this signal receiving module is winding displacement, flexible circuit board or attachment plug.
36. micro sound system according to claim 32 is characterized in that, this signal filtering module is low pass filter, high pass filter and/or band pass filter.
37. micro sound system according to claim 31 is characterized in that, comprises several loud speakers.
38. according to the described micro sound system of claim 37, it is characterized in that, use this circuit board, winding displacement, twisted wire, single-core line, split conductor and/or attachment plug to interconnect between these several loud speakers.
39., it is characterized in that this circuit board is hard printed circuit board, soft printed circuit board (PCB) or surface-mounted integrated circuit according to the described micro sound system of claim 38.
40. micro sound system according to claim 31 is characterized in that, this sound chamber and/or this circuit board have at least one reflection hole.
41., it is characterized in that this reflection hole is high pitch, middle pitch and/or bass reflex hole according to the described micro sound system of claim 40.
42. micro sound system according to claim 31 is characterized in that, the volume in this sound chamber is below 10 cubic centimeters.
43. micro sound system according to claim 31 is characterized in that, this first perforate is made up of several perforates.
44. micro sound system according to claim 31 is characterized in that, also comprises distance piece, is arranged between this loud speaker and this circuit board.
45., it is characterized in that this distance piece is that foam, silica gel or rubber constitute part according to the described micro sound system of claim 44.
CN200810084039A 2008-03-18 2008-03-18 Miniature sound system Pending CN101540942A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200810084039A CN101540942A (en) 2008-03-18 2008-03-18 Miniature sound system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200810084039A CN101540942A (en) 2008-03-18 2008-03-18 Miniature sound system

Publications (1)

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CN101540942A true CN101540942A (en) 2009-09-23

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103916721A (en) * 2013-01-08 2014-07-09 三星电子株式会社 Terminal having speaker and method of manufacturing the same
CN104640027A (en) * 2015-02-11 2015-05-20 常州英耐尔电子有限公司 Directional sound wave emission system
CN107197398A (en) * 2017-06-21 2017-09-22 广东欧珀移动通信有限公司 Loudspeaker assembly and mobile terminal
CN112629455A (en) * 2020-12-15 2021-04-09 广东小天才科技有限公司 Battery deformation detection method and device, detection equipment and storage medium

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103916721A (en) * 2013-01-08 2014-07-09 三星电子株式会社 Terminal having speaker and method of manufacturing the same
CN103916721B (en) * 2013-01-08 2018-11-30 三星电子株式会社 The method of terminal and the manufacture terminal with loudspeaker
CN104640027A (en) * 2015-02-11 2015-05-20 常州英耐尔电子有限公司 Directional sound wave emission system
CN107197398A (en) * 2017-06-21 2017-09-22 广东欧珀移动通信有限公司 Loudspeaker assembly and mobile terminal
CN107197398B (en) * 2017-06-21 2023-09-29 Oppo广东移动通信有限公司 Speaker assembly and mobile terminal
CN112629455A (en) * 2020-12-15 2021-04-09 广东小天才科技有限公司 Battery deformation detection method and device, detection equipment and storage medium
CN112629455B (en) * 2020-12-15 2022-08-26 广东小天才科技有限公司 Battery deformation detection method and device, detection equipment and storage medium

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Application publication date: 20090923