CN101540465B - chip socket - Google Patents

Abstract

The invention relates to a chip socket, which can contain a chip, and comprises: a base, a floating platform, a plurality of probes and a fixing device. The base can be connected to a chip tester: the floating platform is arranged on the base and comprises a positioning surface, and the positioning surface is provided with a plurality of positioning holes; the probe is arranged in the positioning hole; the fixing device is used for fixing the chip. By the chip socket, the chip can be flatly attached to a positioning surface, so that the contact condition of the contact point of the chip and the contact condition of the probe are consistent, the test stability can be improved, meanwhile, the chip socket can fix the chip, the chip can be prevented from being taken up by a chip taking and placing head, and the chip socket is very practical.

Description

chip socket

technical field

The invention relates to a chip socket, in particular to a chip socket which can increase the stability of the test and can also prevent the chip from being picked up by the chip pick-and-place head.

Background technique

With the advancement of semiconductor technology, miniaturized and lightweight electronic components have gradually become the mainstream of future electronic components. However, the miniaturization and weight reduction of electronic components also cause many problems in the testing process of electronic components.

Please refer to FIG. 1 , which is a schematic side view showing a conventional chip socket. The chip (a chip is a chip, referred to herein as a chip) socket 100 includes a base 110 , a positioning frame 120 and a plurality of probes (pogopins) 130 . The positioning frame 120 is disposed on the base 110 for positioning the position of the chip 50 . The plurality of probes 130 are disposed on the base 110 , one end can contact the contact 51 of the chip 50 , and the other end is connected to a testing instrument. Wherein, the pick-and-place of the chip 50 is carried out by the chip pick-and-place head 60 by vacuum suction, and the chip 50 is moved to the chip socket 100 for testing. After the test is completed, the chip 50 is moved out of the chip socket 100 .

Along with the miniaturization and weight reduction of electronic components, using the above-mentioned chip socket 100 for testing is prone to unstable problems. The above-mentioned chip socket 100 is positioned by using the hole shape of the positioning frame 120 and the shape of the chip 50. The chip to be completed After the location of 50, chip 50 is tested again, because chip 50 can't flat paste, therefore easily cause the contacts 51 of chip 50 and the contact condition of probe 130 to be inconsistent, and then cause the instability of test; For example, when chip 50 packaging forms When it is a ball array type (BGA type), it is easy to cause unstable testing by adopting the shape of the chip 50 for positioning; in addition, when the size of the chip 50 is small, the chip pick-and-place head 60 will easily lift the chip 50 and cause The test is unstable.

It can be seen that the above-mentioned existing chip socket obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently. In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general products do not have a suitable structure to solve the above-mentioned problems. urgent problem to be solved. In view of the shortcomings of the above prior art, it is necessary to propose a chip socket, the chip can be flatly attached to a positioning surface, so that the contacts of the chip and the probes are in the same contact state, which can increase the stability of the test. At the same time, the chip socket can be fixed chip, to prevent the chip from being picked up by the chip pick and place head. Therefore, how to create a chip socket with a new structure that meets the needs is one of the current important research and development topics, and has become a goal that the industry needs to improve.

In view of the defects of the above-mentioned existing chip sockets, the inventor actively researches and innovates based on years of rich practical experience and professional knowledge engaged in the design and manufacture of such products, and cooperates with the application of academic theories, in order to create a chip with a new structure The socket can improve the general existing chip socket to make it more practical. Through continuous research, design, and after repeated trial samples and improvements, the present invention with practical value is finally created.

Contents of the invention

The purpose of the present invention is to overcome the defects of the existing chip socket and provide a chip socket with a new structure. The technical problem to be solved is to make the chip flat on a positioning surface, so that the contact of the chip and the probe The contact status is consistent, which can increase the stability of the test. At the same time, the chip socket can fix the chip and prevent the chip from being picked up by the chip pick-and-place head, which is very suitable for practical use.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. According to a chip socket proposed by the present invention, the chip socket can accommodate a chip, and the chip socket includes: a base, the base can be connected to a chip testing machine; a platform, the platform is set on the base, The platform includes a positioning surface, the positioning surface has a plurality of positioning holes; a plurality of probes, the probes are arranged in the positioning holes; and a fixing device is used to fix the chip.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned chip socket, the chip can be flatly attached to the positioning surface.

In the aforementioned chip socket, the position of the positioning hole corresponds to a contact point of the chip.

In the aforementioned chip socket, the chip includes a plurality of ball joints, and the ball joints can be accommodated in the positioning holes.

In the aforementioned chip socket, the platform is a floating platform, and a plurality of elastic elements are arranged between the floating platform and the base.

In the aforementioned chip socket, the fixing device includes at least one slider, and the slider can push the chip.

In the aforementioned chip socket, at least one elastic element is provided on one side of the slider, and the elastic element can provide the force for the slider to push the chip.

In the aforementioned chip socket, the fixing device includes a release hole, and when a release column is inserted into the release hole, the fixing device can release the chip.

In the above-mentioned chip socket, the release post is arranged on a chip pick-and-place head, and the chip pick-and-place head is used to pick and place the chip.

Compared with the prior art, the present invention has obvious advantages and beneficial effects. As can be seen from the above, in order to achieve the above purpose, the present invention provides a chip socket, which can accommodate a chip, and the chip socket includes: a base, a floating platform and a plurality of pogopins. The base can be connected to a chip testing machine: the floating platform is set on the base, the floating platform includes a positioning surface, and the positioning surface has a plurality of positioning holes; the probe is set in the positioning hole.

According to an embodiment of the present invention, the plurality of positioning holes are used to accommodate the ball joints of the chip for positioning. Since the chip can be flatly attached to the aforementioned positioning surface, the contact conditions of the chip contacts and the probes can be consistent. ; In addition, the chip socket includes a fixing device for fixing the chip, which can prevent the chip from being picked up by the chip pick-and-place head.

With the above-mentioned technical solution, the chip socket of the present invention has at least the following advantages and beneficial effects: With the chip socket of the present invention, the chip can be flatly attached to a positioning surface, so that the contact state of the chip and the probe are consistent, thereby It can increase the stability of the test, and at the same time, the chip socket can fix the chip, which can prevent the chip from being picked up by the chip pick-and-place head, which is very suitable for practical use.

To sum up, the present invention relates to a chip socket, which can accommodate a chip. The chip socket includes: a base, a floating platform, a plurality of probes and a fixing device. The base can be connected to a chip testing machine: the floating platform is set on the base, the floating platform includes a positioning surface, and the positioning surface has a plurality of positioning holes; the probes are set in the positioning holes; The fixing device is used to fix the chip. The invention can increase the stability of the test, and at the same time, the chip socket can fix the chip, which can prevent the chip from being picked up by the chip pick-and-place head, and is very suitable for practical use. The present invention has the above-mentioned many advantages and practical value, it has great improvement no matter in product structure or function, has remarkable progress in technology, and has produced easy-to-use and practical effects, and has more advantages than existing chip sockets. The outstanding function of promotion is more suitable for practical use, and it is a novel, progressive and practical new design.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

FIG. 1 is a schematic side view showing a conventional chip socket.

FIG. 2A and FIG. 2B are a schematic perspective view and a schematic perspective cross-sectional view showing a chip socket according to a preferred embodiment of the present invention.

FIG. 2C is a schematic cross-sectional view showing the chip socket in FIG. 2A .

50: Chip 51: Contact

60: chip pick and place head 61: release column

100: chip socket 110: base

120: Positioning frame 130: Probe

200: chip socket 210: base

220: floating platform 221: positioning surface

222: positioning hole 230: probe

240: Fixture 241: Slider

242: Spring 243: Release hole

Detailed ways

In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, features and effects of the chip socket proposed according to the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments. The description is as follows.

The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. Through the description of the specific implementation mode, when the technical means and functions adopted by the present invention to achieve the predetermined purpose can be obtained a deeper and more specific understanding, but the accompanying drawings are only for reference and description, and are not used to explain the present invention be restricted.

Some embodiments of the present invention will be described in detail as follows. However, in addition to the following descriptions, the present invention can also be widely implemented in other embodiments, and the scope of the present invention is not limited by the embodiments, and the patent scope shall prevail. Furthermore, in order to provide a clearer description and a better understanding of the present invention, various parts in the drawings have not been drawn according to their relative sizes, and some dimensions have been exaggerated compared with other relevant dimensions; irrelevant details have not been fully drawn. out, in order to simplify the schema.

Please refer to FIG. 2A and FIG. 2B , which are a schematic perspective view and a schematic perspective cross-sectional view of a chip socket according to a preferred embodiment of the present invention. The chip socket 200 can accommodate a chip, and the chip socket 200 includes: a base 210 , a floating platform 220 , a plurality of probes 230 and a fixing device 240 .

The above-mentioned base 210 can be connected to a chip testing machine;

The above-mentioned floating platform 220 is arranged on the base 210, and a plurality of springs (not shown) are arranged between the floating platform 220 and the base 210, so that when the chip testing machine is pressed down to test the chip , the floating platform 220 can keep in close contact with the chip. The floating platform 220 includes a positioning surface 221, and the positioning surface 221 has a plurality of positioning holes 222;

The above-mentioned probes 230 are arranged in the positioning holes 222, and the aforementioned plurality of positioning holes 222 are used to accommodate the ball joints of the chip for positioning;

The above-mentioned fixing device 240 is used to fix the chip.

As shown in FIG. 2B , it is a perspective cross-sectional view showing the chip socket in FIG. 2A . Wherein the probe 230 is arranged in the positioning hole 222, when the chip is accommodated in the chip socket 200, the chip can be flatly attached to the positioning surface 221; the position of the positioning hole 222 is a contact point corresponding to the chip, when the chip packaging form is In the BGA type, the chip includes a plurality of ball joints, and the ball joints are accommodated in the positioning holes 222 .

The fixing device 240 includes at least one slide block 241 and a spring 242; the spring 242 is arranged at one end of the slide block 241 to push the slide block 241 towards the direction of the chip, so that the slide block 241 can be pushed up The side of the chip, so as to fix the chip. The slider 241 includes a release hole 243 , and when a release post (not shown) is inserted into the release hole 243 , the slider 241 can move outward to release the chip.

According to this embodiment, the slider 241 is arranged on both sides of the chip, but it is not limited thereto. The slider 241 can also be arranged around the chip to fix the chip by pushing the side of the chip .

Please refer to FIG. 2C , which is a schematic cross-sectional view of the chip socket shown in FIG. 2A . The chip pick-and-place head 60 includes at least one release column 61 , the chip 50 is a ball array chip, and the chip 50 includes a plurality of ball contacts 51 .

Now with the chip socket 200 of the present invention, the test steps of the chip 50 are specifically described as follows:

First, move the chip 50 to the top of the chip socket 200 by the vacuum suction of the chip pick-and-place head 60; secondly, insert the release post 61 of the chip pick-and-place head 60 into the release hole 243 of the slider 241, so that the slider 241 Move outwards, and expose the space that can accommodate chip 50; Then, chip pick-and-place head 60 moves down, and chip 50 is placed into the space that accommodates chip 50, and the ball joint of chip 50 is accommodated in the positioning hole 222 at this moment, thereby Carry out positioning, when the chip 50 is flat on the positioning surface 221, the chip pick-and-place head 60 stops moving downward, because the chip 50 is flat on the positioning surface 221, so the ball joint of the chip 50 and the probe 230 produce stable contact; finally , the chip pick-and-place head 60 cancels the vacuum suction and moves upward. When the release column 61 of the chip pick-and-place head 60 breaks away from the release hole 243, the slider 241 pushes the side of the chip 50 by the force of the spring 242, thereby fixing the chip 50 , can prevent the chip 50 from being taken up by the chip pick-and-place head 60 .

After the chip 50 is tested, the release column 61 of the chip pick-and-place head 60 is inserted into the release hole 243 of the slide block 241, so that the slide block 241 moves outward, so that there is an appropriate gap between the slide block 241 and the chip 50, and then The chip 50 is sucked up by the chip pick-and-place head 60 with vacuum suction.

With the chip socket of the present invention, the chip can be flatly attached to a positioning surface, so that the contacts of the chip and the probes are in the same contact state, thereby increasing the stability of the test. At the same time, the chip socket can also fix the chip, which can prevent the chip from being caught by the chip. Take and put the headband up.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, can use the technical content disclosed above to make some changes or modify equivalent embodiments with equivalent changes, but all the content that does not depart from the technical solution of the present invention, according to the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence still belong to the scope of the technical solutions of the present invention.

Claims (8)

1. chip carrier socket, this chip carrier socket can hold a chip, it is characterized in that this chip carrier socket comprises:

One pedestal, this pedestal can be connected to a chip testing machine:

One platform, this platform is arranged at this pedestal, and this platform comprises a locating surface, and this locating surface has the location hole of plural number;

The probe of plural number, these probes are arranged in this location hole; And

One fixture, in order to fix this chip, wherein, this fixture comprises at least one slide block, but this this chip of slide block ejection.

2. chip carrier socket according to claim 1 is characterized in that wherein said chip can smooth this locating surface.

3. chip carrier socket according to claim 1, the position that it is characterized in that wherein said location hole are to a contact that should chip.

4. chip carrier socket according to claim 1 is characterized in that wherein said chip comprises the spherical contact of plural number, and these spherical contacts can be contained in these location holes.

5. chip carrier socket according to claim 1 is characterized in that wherein said platform is a floating type platform, is provided with a plurality of flexible members between this floating type platform and this pedestal.

6. chip carrier socket according to claim 1 is characterized in that a side of wherein said slide block is provided with at least one flexible member, and this flexible member can provide the strength of this this chip of slide block pushing tow.

7. chip carrier socket according to claim 1 is characterized in that wherein said fixture comprises a release aperture, and when a release post inserted this release aperture, this fixture can discharge this chip.

8. chip carrier socket according to claim 7 is characterized in that wherein said release post is to be arranged at a chip to pick and place head, and it is in order to pick and place this chip that this chip picks and places head.

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