CN101533063B - IC heating device - Google Patents

Abstract

The invention discloses an IC heating device, which is used for providing proper heat energy to an IC to be tested on a burn-in board for burn-in test of the IC to be tested. The heating block houses at least one heating tube and temperature sensor therein to provide a near uniform heating surface for contacting the IC under test. The contact part of the fixed seat and the upper cover plate is provided with a first heat insulation sheet, and the bottom of the base is provided with a second heat insulation sheet for reducing the heat energy loss of the heating device.

Description

IC heating device

technical field

The present invention relates to a heating device, in particular to an IC heating device used for burn-in testing of integrated circuit elements (IC).

Background technique

After the packaged integrated circuit device (IC) is still required to conduct an electrical test at a preset high temperature to understand its stability, this procedure is usually called burn-in. During the burn-in procedure, it is necessary to heat and control the temperature of the IC under test, sensors, and other related components. This system of heating operation has been widely implemented for many years. The system usually includes a heater, a temperature sensor, and a comparison detector, which is proportional to the difference between the voltage measured by the temperature sensor and a reference voltage. Energy is supplied to a heater so that the differential voltage is lowered to adjust the heating temperature. In the prior art, such a test socket with a heater and a sensor, as disclosed in U.S. Patent No. 5,164,661 and US5,911,897, directly contacts the IC under test with the heater to provide the appropriate temperature of the IC under test. temperature. However, in actual operation, the heat energy of the heater is often dissipated to nearby zero components, or is affected by the ambient temperature, making the IC temperature unstable, resulting in invalid testing, and even retesting, which is time-consuming and costly.

Contents of the invention

In view of this, in order to solve the unsatisfactory parts of the above-mentioned prior art, the present invention provides a kind of IC heating device, in order to provide suitable and stable thermal energy to give the tested IC on a burner board, for the burning of tested IC Machine test use. The IC heating device at least includes an upper cover plate, a fixed seat, a heating block and a base, and at least one heating tube and temperature sensor are housed inside the heating block to provide a nearly uniform heating surface for contacting IC under test. The lower central part of the upper cover is locked to the heating block, and the lower peripheral part of the upper cover is locked to the upper part of the fixing seat through a locking element. The fixing seat is hollow so as to allow the heating block to be exposed downward, and a first heat insulating sheet is provided at the contact part between the fixing seat and the upper cover to reduce the heat conduction between the heating block and the fixing seat. The base is also hollow, and is arranged under the heating block, so as to allow the heating block to expose downwards to contact the IC under test. The bottom of the base is provided with a second heat insulating sheet to reduce the heat energy of the heating device from dissipating to the burner. board.

Therefore, the main purpose of the present invention is to provide an IC heating device, in which a heating tube and a temperature sensor are installed in the heating block, so that the temperature of the heating block can be detected in real time.

The secondary purpose of the present invention is to provide an IC heating device, in which a heating tube and a temperature sensor are installed in the heating block, which can detect the temperature of the IC under test in real time.

Another object of the present invention is to provide an IC heating device, in which a first heat insulating sheet is provided between the fixing base and the upper cover to reduce heat energy dissipation from the heating block to the fixing base.

Another object of the present invention is to provide an IC heating device, in which a second heat insulating sheet is provided at the bottom of the base to reduce heat dissipation to the burner board.

Description of drawings

FIG. 1A is a structure diagram according to a preferred embodiment of the present invention, which is a structure with an IC element heating device.

FIG. 1B is a schematic diagram of a heating device with an IC element according to a preferred embodiment of the present invention.

[Description of main component symbols]

Heating device 100

Upper cover 11

Fixed seat 12

Windshield 121

Heating block 13

Base 14

Fastening groove 141

Heating pipe 15

Temperature sensor 16

Locking Elements 17

The first insulation sheet 18

Second insulation sheet 19

Fastening elements 20

Screw components 21

Cable buckle 22

Burn-in Board 200

Tested IC 300

Detailed ways

Since the present invention discloses an IC heating device required for a burn-in test, the basic principle of the burn-in test used therein has been understood by those with ordinary knowledge in the relevant technical field, so the following description is not complete describe. At the same time, the diagrams compared below are structural representations related to the features of the present invention, and are not and need not be completely drawn according to the actual size, so please describe first.

Please refer to Fig. 1A, it is a preferred embodiment provided according to the present invention, it is a kind of IC heating device 100, in order to provide suitable thermal energy to give the tested IC 300 on the burner board 200, for the tested IC 300 Burn-in test use. The IC heating device 100 mainly includes an upper cover 11 , a fixing seat 12 , a heating block 13 and a base 14 . The inside of the heating block 13 accommodates at least one heating tube 15 and a temperature sensor 16 to provide a nearly uniform heating surface to contact the tested IC 300 and transfer heat energy to the tested IC 300.

The above-mentioned heating block 13 is locked on the lower central portion of the upper cover 11 , and an appropriate part of the lower peripheral edge of the upper cover 11 is locked to the fixing seat 12 through a locking element 17 (such as a screw, a spring). The fixing seat 12 is hollow, so as to allow the heating block 13 to be exposed downward, and the contact part between the fixing seat 12 and the upper cover plate 11 is provided with a first heat insulating sheet 18, which is used to reduce the heat energy of the heating block 13 from being transferred to the upper surface through heat conduction. The cover plate 11 is used to ensure that the thermal energy of the heating device 100 can make the temperature tend to be stable at the set value.

The base 14 is also hollow, arranged below the heating block 13, pivotally connected to one side of the base 14, and positioned closest to the burner board 200, so as to allow the heating block 13 to expose downward to contact the tested IC 300 under test, And prevent the IC 300 under test from being over-pressurized, because when the heating device 100 is over-pressurized due to malfunction, the base 14 can resist the burner board, preventing the IC 300 under test from being damaged due to over-pressurization by the heating block 13. The bottom of the base 14 is provided with a second heat insulating sheet 19 for reducing the heat energy of the heating device 100 from dissipating to the burner plate 200 , thereby ensuring that the heat energy of the heating device 100 can be kept at a set value. Wherein the second heat insulating sheet 19 can be fastened to the base 14 by screw elements 21 .

Further, the heating device 100 may include a fastening element 20 (for example: a guide rod, a screw, a spring), which is pivotally arranged on one side of the fixing seat 12, and the base 14 is provided with a corresponding fastening groove 141 to facilitate the fastening of the element 20. The base 14 is fastened, and the base 14 and the fixing seat 12 can be fastened or opened by operating the fastening element 20 . The fixing seat 12 can be further provided with a windshield 121 (please refer to FIG. 1B ), which is used to block the ambient air flow in the burner furnace from blowing the upper cover plate 11 by convection, causing the heating block 13 connected to the upper cover plate 11 to have a higher temperature. reduce. During the actual operation of the burn-in test, multiple heating devices 100 will be used at the same time, and some of the heating devices 100 are set close to the air outlet of the burn-in test machine, so a windshield 121 is further provided on the fixing seat 12, which can The heat energy loss of the upper cover plate 11 is reduced. The fixing base 12 can further be provided with a wire buckle 22 (please refer to FIG. 1B ) for accommodating wires extending from the heating tube 15 and the temperature sensor 16 .

The above-mentioned heating tube 15 is preferably provided with a pair, and the temperature sensor 16 is arranged at the center of the pair of heating tubes 15, and runs through the heating block 13 and then extends to the bottom of the heating block 13, thereby obtaining the closest Measure the temperature of IC 300.

According to the present invention, the heating temperature given by the heating block 13 to the tested IC 300 is between 110 and 150 degrees Celsius, so that the variation of the heating temperature can be controlled within 10%, which is far superior to the temperature variation of more than 20% in the prior art . Among them, the materials of the first heat insulating sheet 18 and the second heat insulating sheet 19 can be selected from heat-resistant materials with low thermal conductivity, such as glass fiber or heat-resistant rubber plastics, or can be changed to more high-temperature-resistant ceramics as required. Material.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of rights of the present invention. At the same time, the above description should be clear and implementable for those who are familiar with the technical field, so other equivalent changes or modifications that do not deviate from the spirit disclosed by the present invention should be included in the claims. within range.

Claims (10)

1. An IC heating device, which is used to provide appropriate heat energy to an IC on a burner board for use in the burner test of the IC. The device at least includes an upper cover plate, a fixing seat, a heating block and a base , at least one heating tube and a temperature sensor are housed inside the heating block to provide a nearly uniform heating surface to contact the IC under test; it is characterized in that: The lower central part of the upper cover is locked to the heating block, and the lower peripheral part of the upper cover is locked to the fixing seat through a locking element; The fixing seat is hollow so as to allow the heating block to be exposed downward, and a first heat insulating sheet is provided at the contact part between the fixing seat and the upper cover to reduce the heat energy of the heating block from dissipating to the fixing seat; as well as The base is also hollow and is arranged under the heating block to allow the heating block to expose downwards to contact the tested IC. The bottom of the base is provided with a second heat shield to reduce the heating device Heat energy dissipates to the burner plate. 2 . The IC heating device according to claim 1 , wherein the fixing base is pivotally connected to one side of the base, and a pair of heating tubes are provided. 3 . 3. The IC heating device according to claim 2, further comprising a fastening element operable to fasten and open the base and the fixing seat, and the fastening element is pivotally connected to the fixing seat On one side, the base is provided with a corresponding fastening groove. 4. The IC heating device according to claim 2, wherein the temperature sensor is disposed at the center of the pair of heating tubes and extends to the bottom of the heating block. 5 . The IC heating device according to claim 1 , wherein the fixing seat is further provided with a windshield to prevent the ambient air flow from convecting the heat energy of the upper cover plate from escaping. 6 . 6 . The IC heating device according to claim 1 , wherein the fixing seat is further provided with a wire buckle for accommodating the wires extending from the heating tube and the temperature sensor. 7 . 7 . The IC heating device according to claim 1 , wherein the second heat insulating sheet is fastened to the base by screw elements. 7 . 8 . The IC heating device according to claim 1 , wherein the heating temperature given by the heating block to the tested IC is between 110 and 150 degrees Celsius, and the variation of the heating temperature is within 10%. 9. The IC heating device according to claim 1, wherein the material of the first insulation sheet is any one of glass fiber, rubber, plastic or ceramic material. 10. The IC heating device according to claim 1, wherein the material of the second insulation sheet is any one of glass fiber, rubber, plastic or ceramic material.

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