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CN101513142B - Electronic component placing apparatus and electronic component mounting method - Google Patents

Electronic component placing apparatus and electronic component mounting method Download PDF

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Publication number
CN101513142B
CN101513142B CN200780033718.9A CN200780033718A CN101513142B CN 101513142 B CN101513142 B CN 101513142B CN 200780033718 A CN200780033718 A CN 200780033718A CN 101513142 B CN101513142 B CN 101513142B
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CN
China
Prior art keywords
electronic component
paste
solder
component
film
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Expired - Fee Related
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CN200780033718.9A
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Chinese (zh)
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CN101513142A (en
Inventor
冈本一男
西昭一
森田健
日吉正宜
友保和彦
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Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006245228A external-priority patent/JP4797895B2/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority claimed from PCT/JP2007/067779 external-priority patent/WO2008032755A1/en
Publication of CN101513142A publication Critical patent/CN101513142A/en
Application granted granted Critical
Publication of CN101513142B publication Critical patent/CN101513142B/en
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Abstract

提供一种可以防止在通过焊接安装易于发生翘曲变形的电子元件时出现虚焊的电子元件放置设备和电子元件安装方法。在用于将下表面上形成有多个焊料隆起(16a)的电子元件(16)放置在板上的电子元件放置设备中，基于表示电子元件回流工序中的翘曲变形状态的元件翘曲信息，在膏剂传送单元(24)中形成具有膜厚度分布的膜(7a)，用于根据翘曲变形状态向所述多个焊料隆起中的每个传送期望传送量的焊膏。从而，可以通过向每个焊料隆起(16a)额外地供应正好足量的焊料，来防止在通过焊接安装易于发生翘曲变形的电子元件时出现的虚焊。

Figure 200780033718

Provided are an electronic component placement device and an electronic component mounting method capable of preventing false soldering from occurring when electronic components prone to warping deformation are mounted by soldering. In an electronic component placement apparatus for placing an electronic component (16) having a plurality of solder bumps (16a) formed on a lower surface on a board, based on component warpage information indicating a state of warpage deformation in an electronic component reflow process , forming a film (7a) having a film thickness distribution in a paste delivery unit (24) for delivering a desired delivery amount of solder paste to each of the plurality of solder bumps according to a warpage deformation state. Thus, it is possible to prevent false soldering that occurs when electronic components prone to warping deformation are mounted by soldering by additionally supplying just enough solder to each solder bump (16a).

Figure 200780033718

Description

Electronic component placing apparatus and electronic component mounting method
Technical field
The present invention relates to electronic component placing apparatus and electronic component mounting method, be used for the electronic component that is formed with bump placed onboard and by this electronic component of welded and installed.
Background technology
The method that will be installed in such as the electronic component of semiconductor device on the circuit board is used with the form that semiconductor package part is installed, and wherein, semiconductor device is installed on the resin plate via the bump on the circuit board by welding.Be used for via bump electronic component being attached to the solder joint of plate, bump drops on following state on the electrode of plate, that is, and and to the solder joint auxiliary agent of bump supply such as solder flux or soldering paste.Therefore, the device that is used for transmitting solder flux or soldering paste is arranged on electronic component placing apparatus (for example, referring to patent documentation 1).
[patent documentation 1] JP-A-2005-305806
Along with electronic component dimensions progress littler, with better function in recent years, the electronic component that is building up in the electronics needs higher packing density, and becomes littler and thinner.Therefore, circuit board or the semiconductor package part that is placed on this circuit board have lower rigidity, thereby cause buckling deformation easily when being heated.Therefore, in the reflow process after the semiconductor package part that is formed with bump on lower surface is placed onboard, the bump in the position of buckling deformation occurring be easy to float and cause and plate electrode between the gap.
Adding soldering paste is effective for resisting the unsteady of bump.Yet, in the paste membrane formation device in the example of superincumbent patent documentation, soldering paste is supplied to all bumps as the film with uniform thickness, therefore, depend on the degree of floating that causes because of buckling deformation, even, may can not cover bump and gaps between electrodes by transmitting paste.As a result, bump can not normally link by the connection electrode on welding and the plate, may produce such as being electrically connected rosin joint defective or that joint strength is not enough.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of electronic component placing apparatus and electronic component mounting method that can prevent from the time may producing the electronic component of buckling deformation, to occur rosin joint by welded and installed.
According to the present invention, a kind of electronic component placing apparatus is provided, be used for the electronic component that is formed with a plurality of bumps (solder bump) on the lower surface is placed onboard, this electronic component placing apparatus comprises: element supply department is used for the supplies electrons element; The plate maintaining part is used for keeping and locating described plate; Placement head is used for taking out electronic component and electronic component being placed on the plate that is held in the plate maintaining part from element supply department; Head moving device is used to make placement head to move between element supply department and plate maintaining part; Component warp information storage section is used for the component warp information of storage representation at the reflow process buckling deformation state of electronic component; Paste transfer unit, be arranged on the mobile route of placement head, be used for by on film formation face, forming the film of the soldering paste wait to be sent to bump, and make the electronic component that is maintained in the placement head drop to film to form face, and soldering paste is sent to a plurality of bumps; And control part, be used to control paste transfer unit; It is characterized in that, paste transfer unit has scraper plate, this scraper plate is driven by squeegee drive part, being used on film formation face executive level moves the film that combines with vertical moving and forms operation, control part is controlled squeegee drive part based on component warp information, have the film that film thickness distributes with formation, be used for to expect that according to the buckling deformation state of electronic component the soldering paste of conveying capacity is sent to each bump in described a plurality of bump.
In addition, according to the present invention, provide a kind of electronic component mounting method, be used for electronic component placing apparatus, be used for the electronic component that is formed with a plurality of bumps on the lower surface is placed and installed onboard, this electronic component placing apparatus comprises: element supply department is used for the supplies electrons element; The plate maintaining part is used for keeping and locating described plate; Placement head is used for taking out electronic component and electronic component being placed on the plate that is held in the plate maintaining part from element supply department; Head moving device is used to make placement head to move between element supply department and plate maintaining part; Component warp information storage section is used for the component warp information of buckling deformation state of the reflow process of storage representation electronic component; Paste transfer unit is arranged on the mobile route of placement head, is used for forming on film formation face by scraper plate the film of the soldering paste of waiting to be sent to bump, and its middle scraper executive level on film formation face moves the film that combines with vertical moving and forms operation; And control part, be used to control paste transfer unit; This electronic component mounting method is characterised in that and comprises: the step of taking out electronic component with placement head from element supply department; Soldering paste is sent to the paste transfer step of bump by making the electronic component that is maintained in the placement head drop to the film formation face of paste transfer unit; And electronic component placed onboard so that bump is placed step via the element that soldering paste drops on the plate electrode; Wherein, the film that carried out before the paste transfer step forms in the operation, control part is controlled the squeegee drive part that is used to drive scraper plate based on component warp information, have the film that film thickness distributes with formation, be used for transmitting the soldering paste of expectation conveying capacity according to buckling deformation state each bump in described a plurality of bumps of electronic component.
Rely on the present invention, the film that carried out before the paste transfer step that soldering paste is sent to bump forms in the operation, can form by the soldering paste that transmits the expectation conveying capacity according to each bump in described a plurality of bumps of the buckling deformation state in the electronic component reflow process and have the film that film thickness distributes, prevent the rosin joint that when being easy to take place the electronic component of buckling deformation by welded and installed, occurs.
Description of drawings
Fig. 1 illustrates the block diagram of the structure of electronic component mounting system according to an embodiment of the invention.
Fig. 2 is used for explaining the key-drawing of the solder printing of electronic component mounting system according to an embodiment of the invention.
Fig. 3 is the plane graph of electronic component placing apparatus according to an embodiment of the invention.
Fig. 4 is used for explaining the key-drawing of the structure of the paste transfer unit of electronic component placing apparatus according to an embodiment of the invention.
Fig. 5 A to 5D is used for explaining the key-drawing of the operation of the paste transfer unit of electronic component placing apparatus according to an embodiment of the invention.
Fig. 6 is the block diagram that the structure of the control system in the electronic component placing apparatus according to an embodiment of the invention is shown.
Fig. 7 A and 7B are used for explaining the component warp information of electronic component mounting method and the key-drawing of scraper plate mobile data according to an embodiment of the invention.
Fig. 8 illustrates the flow chart of electronic component mounting method according to an embodiment of the invention.
Fig. 9 A to 9C illustrates the key-drawing of the operation of electronic component mounting method according to an embodiment of the invention.
Figure 10 A to 10C illustrates the key-drawing of the operation of electronic component mounting method according to an embodiment of the invention.
Figure 11 A and 11B are illustrated in the key-drawing that concerns between the soldering paste conveying capacity and cold joint in the electronic component mounting method according to an embodiment of the invention.
Figure 12 is the block diagram that the structure of the control system in the electronic component placing apparatus according to another embodiment of the present invention is shown.
Figure 13 A and 13B are the views that the data organization of the paste transfer information library in the electronic component placing apparatus according to another embodiment of the present invention is shown.
Figure 14 illustrates the flow chart of electronic component mounting method according to another embodiment of the present invention.
Embodiment
Embodiments of the invention are described with reference to the accompanying drawings.
With reference to Fig. 1, at first will be described below electronic component mounting system.In Fig. 1, electronic component mounting system has the electronic component hookup wire 1 that connects via communication network 2, this electronic mounting line is made of printing equipment M1, inspection apparatus M2, electronic component placing apparatus M3 and refluxing unit M4, in these equipment each is electronic component mounting apparatus, and controlled fully by supervisory computer 3.In this embodiment, by these a plurality of electronic component mounting apparatus, on lower surface, be formed with a plurality of electronic components that are used to be connected to outside bump onboard, to make mounting panel by welded and installed.Electronic component mounting apparatus can connect via communication network 2, and need not use and management computer 3.
The screen printed with solder paste that printing equipment M1 will be used to make electronic component be attached to the electrode that forms corresponding to the bump array of electronic component is to the plate as installation targets.Inspection apparatus M2 checks printing state by the plan position approach that the image that picks up the plate behind the solder printing is discerned soldering paste.Electronic component placing apparatus M3 utilizes placement head that electronic component is placed on the plate that is printed with soldering paste.Refluxing unit M4 is by heating the plate that is placed with electronic component and bump and soldering paste are fused because of being heated, and electronic component is welded on the plate.
Fig. 2 illustrates the solder printing that carries out among the printing equipment M1.Printing equipment M1 comprises screen mask 6 and scraping plate mechanism 8.Plate maintaining part (not shown) positions and holds it in the below of screen mask 6 to the plate 5 that electronic component is installed.The electrode 5a and the 5b that are connected with electronic component as installation targets are arranged on the upper surface of plate 5.Scraping plate mechanism 8 is arranged on the top of screen mask 6, and in scraping plate mechanism 8, two scrapers 9 can move up under the effect of hoisting mechanism 10 or move down.Scraping plate mechanism 8 can move horizontally under the effect of horizontal mobile mechanism (not shown).By contacting with the lower surface of screen mask 6 at plate 5 and soldering paste 7 is fed under the state on the upper surface of screen mask 6, scraping plate mechanism 8 is moved horizontally, scraper 9 is slided on the upper surface of screen mask 6, and soldering paste 7 is printed on electrode 5a and the 5b via being punched in the pattern hole (not shown) in the screen mask 6.
Referring now to Fig. 3, the structure of electronic component placing apparatus M3 will be described below.In Fig. 3, transport path 12 and extend along directions X (sheet conveyance direction) at the central part of pedestal 11.Transport path 12 and transport the plate 5 of installing and maintaining electronic component, and plate 5 is positioned at the electronic component installation site.Therefore, transport path 12 as being used to keep the also plate maintaining part of location-plate 5.First 13A of element supply department of supplies electrons element and second 13B of element supply department are arranged on the both sides of transporting path 12.
A plurality of tape feeders 14 are arranged among first 13A of element supply department.These tape feeders are presented by pitch and are being kept electronic component () band for example, terminal chip type element, and electronic component is fed to the take-off location of placement head is as following described.Two disc type feeders 15 parallel setting in second 13B of element supply department.These two disc type feeders 15 are fed to different types of electronic component 16 take-off location of placement head with the form of grid array.Electronic component 16 comprises that semiconductor device is installed in semiconductor package part on the slim resin plate (for example, BGA) and have a small components of protuberance.In this embodiment, electronic component 16 is connected with plate via a plurality of bumps that are formed on the lower surface, for example semiconductor package part.
Y-axis workbench 17A and Y-axis guiding device 17B are arranged on two ends along directions X of pedestal 11.X-axis workbench 18 is installed between Y-axis workbench 17A and the Y-axis guiding device 17B.In addition, placement head 19 is attached on the X-axis workbench 18.Placement head 19 is to have the compound of a plurality of unit placement head 20, and whole mobile with plate identification camera 21.
By driving X-axis workbench 18 and Y-axis workbench 17A, placement head 19 moves on the XY direction.Electronic component is taken out from first 13A of element supply department and second 13B of element supply department by the adsorption nozzle 20a (referring to Fig. 9) of unit placement head 20, and be placed on the location and remain on the plate 5 that transports on the path 12.X-axis workbench 18 and Y-axis workbench 17A are configured for making placement head 19 at first 13A of element supply department and second 13B of element supply department and transport the head moving device that moves between the path 12.
Linear array camera (line camera) 23, nozzle stocker 22 and paste transfer unit 24 are arranged on the mobile route that transports the placement head 19 between the path 12 and second 13B of element supply department.When the placement head 19 of picking up electronic component from each element supply department was passed through with the way that arrives plate 5 above linear array camera 23, the electronic component that remains in the placement head 19 was identified.
Nozzle stocker 22 is held multiple adsorption nozzle according to the kind that is placed on the electronic component on the plate 5.When placement head 19 visit nozzle stocker 22, select and the attached adsorption nozzle of going up according to electronic component to be placed.Paste transfer unit 24 has the function that forms the soldering paste film, makes the soldering paste film have viscosity by on film formation face solder compositions being mixed into solder flux.Form face by the film that makes the electronic component that remains in the placement head 19 drop to paste transfer unit 24, soldering paste is transmitted and be supplied to a plurality of bumps that are formed on the electronic component lower surface.The transmission of soldering paste and supply are intended to improve by the amount that increases scolder when the electrode with bump and plate 5 welds together the reliability of solder joint.
With reference to Fig. 4, below description is arranged on the formation of the paste transfer unit 24 among the electronic component placing apparatus M3.In Fig. 4, smooth film forms face 25a and is arranged on the upper surface of base portion 25.Form operation by the film that spreads out (spread) soldering paste 7 with scraper plate 28, the film 7a that waits to transmit and be supplied to the soldering paste 7 of the bump 16a that is formed on the electronic component 16 is formed on film and forms on the face 25a.
Base portion 25 is provided with vertical movement mechanism 26 and horizontal mobile mechanism 27, is used to allow scraper plate 28 to carry out film and forms operation.Scraper plate 28 is attached on the horizontal mobile mechanism 27.Vertical movement mechanism 26, horizontal mobile mechanism 27 and scraper plate 28 are driven by squeegee drive part 35 (referring to Fig. 6).That is, by driving horizontal mobile mechanism 27 scraper plate 28 is moved horizontally, and scraper plate 28 is integrally moved up or down with horizontal mobile mechanism 27 by driving vertical movement mechanism 26.Therefore, scraper plate 28 is driven to form at film by squeegee drive part 35 and moves horizontally the film that combines with vertical moving on the face 25a and form operation.Thus, the film of soldering paste 7 is formed on the film formation face 25a.
Fig. 5 A to 5D illustrates the pattern example that scraper plate 28 performed films form operation.Fig. 5 A illustrates following state: the soldering paste 7 by the film thickness t1 that at first begins on the upper surface upper berth of film formation face 25a with scraper plate 28 forms the film 7a with uniform films thickness on film formation face 25a.Subsequently, begin to be used to the film that the film thickness that obtains to expect distributes and form operation.Promptly, by by vertical movement mechanism 26 and horizontal mobile mechanism 27, make scraper plate 28 move the film that combines with vertical moving and form operation with predetermined pattern executive level, in the preset range of film 7a, form film thickness change section 7b, the shape of this film thickness change section 7b forms soldering paste 7 and is swiped in the cross section of expectation, shown in Fig. 5 B and 5C.In the example shown in Fig. 5 D, the film thickness that film thickness change section 7b has a central part is that the film thickness of t2 and periphery is that the film thickness of t1 distributes.The pattern that paste transfer unit 24 can form operation by the film that changes scraper plate 28 forms the film 7a with any film thickness distribution.
Structure below with reference to Fig. 6 description control system.Control part 30 is the master control portions with CPU, controls the operation or the process of each part, and is as described below.Place the required data of placement operation of data store 31 storage control placement head 19, for example installation data.Component warp information storage section 32 storages are about the data of the state of buckling deformation in the reflow process of target electronic element.33 storages of scraper plate mobile data storage part form the pattern of operating with the corresponding film of carrying out by mobile scraper 28 of component warp information, that is, and and the operation pattern that the level of scraper plate 28 and vertical moving combine.Drive division 34 drives and is used to placement head drive motors 19M that placement head 19 is moved.Vertical direction drive motors 26M and horizontal direction drive motors 27M that squeegee drive part 35 drives as the drive source of vertical movement mechanism 26 and horizontal mobile mechanism 27.
With reference to Fig. 7 A and 7B, component warp information and scraper plate mobile data will be described below.The main semiconductor package part such as BGA that is made of slim resin plate, the electronic component 16 as present embodiment has following characteristics: may deform because of being heated in reflow process, buckling deformation particularly takes place easily.That is, electronic component 16 is flat at normal temperatures on the whole, shown in (i) among Fig. 7 A, but buckling deformation upwards may take place when being heated at both ends.At this moment, depend on various factors, the planar dimension of electronic component 16, thickness and plate structure for example, promptly different deformational behaviors may appear in resin material and internal wiring situation, in Fig. 7 A (ii), (iii) and (iv).
Electronic component 16A (ii) has the deformation characteristics that the less relatively and both ends of buckling deformation only upwards are out of shape a small deformation amount d1, and the electronic component 16B (iii) has the deformation characteristics that the big and both ends of buckling deformation upwards are out of shape a deflection d2 bigger than d1.In addition, the electronic component 16C shown in (iv) has the little and deformation characteristics of the local deflection d3 of rising in both ends only of the distortion of central part.
The kind that depends on element, this buckling deformation has variety of way, as previously mentioned.Warp direction may be opposite with the direction shown in Fig. 7 A.That is, exist electronic component relatively to raise and whole deformational behavior protruding upward in some cases at central part from both ends.By whenever with reflow process in actual measurement deflection during heating target electronic element under the identical heating condition, obtain component warp information, and with in this component warp information write element warp information storage part 32.When this information obtained as given data, it passed through supervisory computer 3 via in the communication network 2 write element warp information storage parts 32.
Therefore, when electronic component demonstrates the buckling deformation behavior in reflow process, the bump that is formed on the lower surface is shifted along the direction of leaving plate electrode, thereby, be not combined into one during being printed on the scolder fusion of fusion welding in reflow process of the fusion welding of the soldering paste fusion on the plate electrode and bump fusion, cause so-called " sealing-off " thus, hinder in some cases to be welded to connect normally.
In order to prevent this rosin joint, in this embodiment, degree according to the component warp distortion that causes because of the heating in the reflow process, promptly, bump 16a is in the degree of the direction superior displacement that deviates from electrode 5a, soldering paste 7 is transmitted and is supplied to bump 16a extraly, to prevent " sealing-off ".The Extra Supply of this soldering paste 7 is performed such: the film 7a that the electronic component 16 that remains in the unit placement head 20 is dropped to form by paste transfer unit 24 so that bump 16a contact with film 7a.
At this moment, transmit and supply the soldering paste 7 that prevents the appropriate amount that " sealing-off " is required to each bump 16a.That is, according to the bump 16a that is shifted because of buckling deformation *And the difference in height Δ h between the bump 16a of average level by the film formation operation of scraper plate 28, sets up and is formed on the film thickness distribution that film forms the film 7a on the face 25a, shown in Fig. 7 B.The scraper plate 28 performed films that the scraper plate mobile data represents to be used to form the film 7a with such film thickness distribution form the pattern of operating.If component warp information is written in the component warp information storage section 32, then it also is written in the scraper plate mobile data storage part 33 simultaneously.
For example, electronic component 16 with less buckling deformation, the electronic component 16 shown in (i) among Fig. 7 A is formed with the uniform film 7a with overall film thickness t0, shown in (i) among Fig. 7 B, make and the soldering paste 7 of expectation supply can be sent to each bump 16a equably.On the contrary, demonstrate the electronic component of the buckling deformation of complete case of bending, in Fig. 7 A (ii) and electronic component 16A and the 16B (iii), according to warpage degree, be displacement d1, the d2 at both ends, at first be formed with film 7a with overall film thickness t1, t2, then according among Fig. 7 B (ii) and the complete case of bending (iii), be formed with film thickness change section 7b, make that the film thickness distribution can be consistent with the difference in height Δ h between each bump 16a.In addition, have small deformation and only have the electronic component of local buckling deformation at central part at both ends, as among Fig. 7 A (iv) shown in electronic component 16C, be formed with film 7a with overall film thickness t3 according to displacement d3, then according to deformation state, be formed with film thickness change section 7b, as among Fig. 7 B (iv) shown in.
With reference to the flow chart of Fig. 8, below description is used in the electronic component mounting method in this electronic component mounting system.This electronic component mounting method comprises that the electronic component 16 that will be formed with a plurality of bump 16a on the lower surface is placed on the plate 5, and it is installed.At first, by placement head 19 electronic component 16 is taken out (ST1) from second 13B of element supply department.
Form face 25a by the film that makes the electronic component 16 that remains in the placement head 19 drop to paste transfer unit 24, soldering paste 7 is sent to bump 16a (paste transmission operation) (ST2), shown in Fig. 9 A.Promptly, by making the electronic component 16 that remains in the unit placement head 20 drop to film 7a, and each bump 16a is contacted with film 7a, shown in Fig. 9 B, thereby the soldering paste 7 that will expect conveying capacity is sent to each bump 16a of electronic component 16, shown in Fig. 9 C.
The film that carried out before this paste transmits operation forms in the operation, kind according to electronic component to be installed, read the component warp information that is stored in the component warp information storage section 32, and further from scraper plate mobile data storage part 33, read the scraper plate mobile data corresponding with this component warp information.And, control part 30 is based on this scraper plate mobile message control squeegee drive part 35, carry out the film formation operation that is used to form film to drive scraper plate 28, thereby will expect that according to the warp information of electronic component the soldering paste 7 of conveying capacity is sent to each (referring to the Fig. 5) among a plurality of bump 16a with film thickness distribution.
Thus, shape is formed on the film 7a based on the film thickness change section 7b of the component warp information of electronic component 16.Promptly, control part 30 is controlled the squeegee drive part 35 that is used to drive scraper plate 28 based on component warp information, have the film 7a that film thickness distributes with formation, be used for to expect that according to the state of the buckling deformation of electronic component the soldering paste of conveying capacity is sent to each of a plurality of bump 16a.
Electronic component 16 is placed on (ST3) on the plate 5.That is, the unit placement head 20 that after transmitting soldering paste 7 placement head 19 is moved will keep electronic component 16 is positioned on the plate 5, so that bump 16a aims at the electrode 5a of plate 5, shown in Figure 10 A.Then, electronic component 16 is descended and place on the plate 5, thereby bump 16a is dropped on via soldering paste 7 on the electrode 5a of plate 5, shown in Figure 10 B (element placement operation).
Subsequently, the plate 5 that is placed with electronic component 16 is transported among the refluxing unit M4.Then, together with electronic component 16 plate 5 is heated until solder fusing temperature or higher, so that the solder compositions in bump 16a and the soldering paste 7 fusing and link by electronic component 16 and plate 5 are welded, (reflow process) (ST4) shown in Figure 10 C.At this moment, electronic component 16 is through temperature distortion, and has the deformational behavior of the warpage that makes progress in the outer edge, and the bump 16a that is positioned at the outer edge thus is with electronic component 16 displacements, thereby increases the gap with electrode 5a.
Even in this case, component warp information based on electronic component 16, the soldering paste 7 of expectation conveying capacity is transmitted and be supplied to each bump 16a extraly, be used for the position that the gap of amount of solder between electrode 5a and bump of solder protuberance 16a and electrode 5a increase because of buckling deformation thus and also do not have deficiency so.Promptly, the solder compositions of the bump 16a fusion of electronic component 16, solder compositions together with the fusion of the scolder in the soldering paste 7, usually all bump 16a and electrode 5a are coupled together, make and formed the solder joint 16b that electronic component 16 is electrically connected with electrode 5a admirably, and can not produce such as being electrically connected rosin joint defective or that joint strength lacks, shown in Figure 10 C.
Figure 11 A and 11B illustrate the example of the rosin joint that may occur when by welded and installed thin semiconductor packaging part.The electronic component 16 that Figure 11 A is illustrated under the situation of not supplying soldering paste 7 extraly warpage that both ends may be made progress places the example of reflow process.In this case, when buckling deformation occurring in the reflow process, be positioned at the bump 16a of central part and the electrode 5a of plate and weld admirably, but the position deficiency of the bump 16a that the amount of soldering paste 7 may be both ends near.As a result, be used for fully connecting the formation well of solder joint 16b of electronic component 16 and electrode 5a, cause having the not rosin joint of linking portion C.
In addition, Figure 11 B illustrates the example of supplying the soldering paste 7 of identical conveying capacity to each bump 16a of this electronic component 16 extraly.In this case, when buckling deformation occurring in the reflow process, the position welding spot forming of bump 16a both ends near is good, this be because, it is suitable by interpolation the quantitative change of soldering paste 7 to be got, and stark suitable amount is more but the amount of soldering paste 7 is compared to the bump 16a that is positioned at central part.As a result, the too much scolder of molten condition flows in this scope, thereby produces adjacent electrode 5a by the interconnective weldering bridge of scolder B.
On the contrary, in the electronic component mounting method of this embodiment, as previously mentioned, based on the component warp information of storing according to the kind of electronic component, buckling deformation state according to electronic component, the soldering paste 7 of expectation conveying capacity is sent in described a plurality of bump each, makes that thus the amount of soldering paste 7 is just right for each bump 16a in reflow process.Thereby, can prevent to occur rosin joint when the thin semiconductor packaging part that will be easy to buckling deformation in reflow process is installed onboard by welding.
Another embodiment of various details.With reference to Figure 12, below with the structure of description control system.Control part 130 is the master control portions with CPU, controls the operation or the operation of each part, and is as described below.Place data store 131 and store the required data of placement operation that are used to control placement head 19, for example installation data.The paste that component data storage part 133 and scraper plate mobile data storage part 134 are configured for storing every kind of electronic component transmits the paste transfer information library 132 of information, and wherein said paste transmission information is used for being controlled at the film that paste transfer unit 24 carries out and forms operation.
Drive division 135 drives and is used to placement head drive motors 119M that placement head 19 is moved.Vertical direction drive motors 126M and horizontal direction drive motors 127M that squeegee drive part 136 drives as the drive source of vertical movement mechanism 126 and horizontal mobile mechanism 127.The view data that 137 pairs of plate identification cameras 121 in identification part and component recognition camera 123 are obtained is discerned processing, with the position and the identification electronic component 16 of identification plate 5, and detect the position that is in the electronic component under the state that is maintained in the placement head 19.
With reference to Figure 13 A and 13B, the data organization of paste transfer information library 132 will be described below.Figure 13 A illustrates the component data that is stored in the component data storage part 133, for each component kind A, B, C, D ..., memory element warp information 133a and paste transfer pattern 133b.Component warp information 133a represents the state of buckling deformation in the reflow process of electronic component, and paste transfer pattern 133b represents to distribute to the film thickness that a plurality of bumps transmit the soldering paste of expectation conveying capacities according to the state of buckling deformation.
And the scraper plate that 134 storages of scraper plate mobile data storage part are associated with paste transfer pattern 133b moves pattern 134a, shown in Figure 13 B.Scraper plate moves pattern 134a and is used for making scraper plate 28 to move the data that the film that combines with vertical moving forms the operation pattern of operation at paste transfer unit 24 executive level on film formation face 25a, to realize the indicated film thickness distribution by paste transfer pattern 133b.Component warp information 133a, paste transfer pattern 133b and scraper plate move pattern 134a and constitute paste transmission information.
With reference to Fig. 8, the concrete example of component warp information 133a will be described below.The main semiconductor package part such as BGA that is made of slim resin plate as the electronic component 16 of this embodiment, has because of the heating easy deformation in the reflow process and particularly is easy to take place the characteristics of buckling deformation.And the trend of this buckling deformation is not uniformly, but depends on various factors, and for example the planar dimension of electronic component 16, thickness and plate are constructed, and promptly different deformational behaviors may appear in resin material and internal wiring situation, and is as described below.
That is, the electronic component 16A (component kind A) shown in (i) among Fig. 8 A has following characteristics: integral body almost is flat, and buckling deformation does not take place, and wherein, component warp information 133a is defined as " not having warpage ".
Among Fig. 8 A (ii) shown in electronic component 16B (component kind B) have following characteristics:, both ends upward displacement less relatively with buckling deformation be the form of a small deformation amount d1 only, the almost completely buckling deformation of curved shape has taken place, and among Fig. 8 A (iii) shown in electronic component 16C (component kind C) have following characteristics: the almost completely buckling deformation of curved shape has taken place equally, but form to be buckling deformation big and the both ends upward displacement deflection d2 bigger than d1.The component warp information 133a of these component kind B and C is defined as " being bent upwards warpage (little) " and " being bent upwards warpage (greatly) " respectively.In addition, among Fig. 8 A (iv) shown in electronic component 16D have following deformation characteristics: the distortion of central part is less, part, the both ends deflection d3 that raise only, wherein component warp information 133a is defined as " end make progress warpage ".
As previously mentioned, according to the kind of element, buckling deformation has variety of way.Warp direction can be opposite with the direction shown in Fig. 8 A.That is, in some cases, exist electronic component relatively to raise and whole deformational behavior protruding upward at central part from both ends.By with reflow process in a plurality of target electronic elements are heated under the identical heating condition and come the actual measurement deflection, obtain component warp information.Collect the data obtained as database data, and directly via communication network 2 it is write the paste transfer information library 132 from the guidance panel of electronic component placing apparatus M3 or by supervisory computer 3.
The paste transfer pattern 133b of the storage that is associated with component warp information 133a will be described below.When electronic component demonstrates the buckling deformation behavior in reflow process, the bump edge that is formed on the lower surface deviates from the direction displacement of the electrode of plate, thereby, be not combined into one during being printed on the scolder fusion of fusion welding in reflow process of the fusion welding of the soldering paste fusion on the plate electrode and bump fusion, cause so-called " sealing-off " thus, hinder in some cases to be welded to connect normally.
In order to prevent this rosin joint, in this embodiment, degree according to the component warp distortion that causes because of the heating in the reflow process, promptly, bump 16a is in the degree of the direction superior displacement that deviates from electrode 5a, soldering paste 7 is transmitted and is supplied to bump 16a extraly, to prevent " sealing-off ".The Extra Supply of this soldering paste 7 is performed such: the film 7a that the electronic component 16 that remains in the unit placement head 20 is dropped to form by paste transfer unit 24 so that bump 16a contact with film 7a.
At this moment, transmit and supply the soldering paste 7 that prevents the appropriate amount that " sealing-off " is required to each bump 16a.That is, according to the bump 16a that is shifted because of buckling deformation *And the difference in height Δ h between the bump 16 of average level sets up and is formed on the film thickness distribution that film forms the film 7a on the face 25a, shown in Fig. 8 B.Paste transfer pattern 33b has determined that this film forms the pattern that distributes.
For example, have the electronic component 16 of less buckling deformation, the electronic component 16A shown in (i) among Fig. 8 A is sent to bump 16a equably with the soldering paste 7 of expecting supply.Promptly, set up to be used to transmit and had the paste transfer pattern P1 (uniform films pattern) of soldering paste that overall film thickness is the uniform films 7a of t0, shown in (i) among Fig. 8 B, and in component data storage part 33, store this paste transfer pattern P1 and it is associated with component kind A.
On the contrary, demonstrate the electronic component of the buckling deformation of complete case of bending, in Fig. 8 A (ii) and electronic component 16B and the 16C (iii), according to warpage degree, be displacement d1, the d2 at both ends, at first be formed with film 7a with overall film thickness t1, t2, then according among Fig. 8 B (ii) and the complete case of bending (iii), be formed with film thickness change section 7b, make that the film thickness distribution can be consistent with the difference in height Δ h between each bump 16a, transmit paste thus.In this case, set up paste transfer pattern P2 (little bending pattern) and paste transfer pattern P3 (macrobending pattern), and in component data storage part 133, stored described paste transfer pattern P2 and paste transfer pattern P3 respectively and they are associated with component kind B and C respectively.
In addition, have small deformation and only have the electronic component of local buckling deformation at central part at both ends, as among Fig. 8 A (iv) shown in electronic component 16D, be formed with film 7a with overall film thickness t3 according to displacement d3, then according to deformation state, be formed with film thickness change section 7b, transmit paste thus, as among Fig. 8 B (iv) shown in.In this case, set up paste transfer pattern P4 (end increases the thickness pattern), and in component data storage part 133, stored this paste transfer pattern P4 and it is associated with component kind D.
Therefore, based on paste transfer pattern P1, the P2, P3, the P4... that set up with aforementioned manner, generate scraper plate and move pattern S1, S2, S3, S4....That is, control part 130 generates control data, is used for controlling scraper plate 28 by driving vertical drive mechanism 26 and horizontal drive mechanism 27 and forms the film that has by the represented film thickness distribution of each above-mentioned paste transfer pattern.These control datas are stored in the scraper plate mobile data storage part 134, and are associated with paste transfer pattern P1, P2, P3, P4... in scraper plate mobile data storage part 134.
Each data in the paste transfer information library 132 are associated in the above-mentioned example in order to make, component warp information 133a and paste transfer pattern 133b are associated with component kind, and in scraper plate mobile data storage part 134, make scraper plate move pattern 134a to be associated with paste transfer pattern 133b.Yet the correlating method between each data can be arbitrarily, can directly be associated with component kind thereby scraper plate moves pattern 134a.
In this embodiment, transmit information based on the recognition result of the 137 pairs of electronic components in identification part and from the paste that paste transfer information library 132 reads, control part 130 control squeegee drive part 135, form operation to allow scraper plate 28 to carry out film, has the film 7a that film thickness distributes thereby form on each in paste transfer unit 24 in a plurality of bump 16a, be used for transmitting the soldering paste 7 of expectation conveying capacity according to the buckling deformation state of electronic component, as described below.
With reference to the flow chart of Figure 14, below description is used in the electronic component mounting method in the electronic component mounting system.This electronic component mounting method comprises that the electronic component 16 that will be formed with a plurality of bump 16a on the lower surface is placed on the plate 5 and it is installed.At first, take out electronic component 16 (ST11) by placement head 19 from second 13B of element supply department.
Next, the kind (ST12) of identification electronic component.That is, the mobile route that moves to plate 5 along placement head 19 when placement head 19 above component recognition camera 123 by the time, component recognition camera 123 picks up the image of the Electrofax 16 that remains on the placement head 19.In addition, the 137 pairs of images that obtained in identification part are discerned processing, with the kind of identification electronic component 16.If the erection sequence of element installation exercise is redefined for constant and in the kind of determining electronic component on the sequential program in each fitting operation, then determined kinds of electronic components here can be used as recognition result.
Based on recognition result, control part 130 is by obtaining the paste transfer pattern (ST13) corresponding to this component kind from component data storage part 133 reading of data.And control part 130 moves pattern (ST14) by the scraper plate that obtains corresponding to this paste transfer pattern from scraper plate mobile data storage part 134 reading of data.Then, move pattern based on this scraper plate, control part 130 control squeegee drive part 136 form operation (ST15) to allow scraper plate 28 to carry out film according to paste transfer pattern.Promptly, form in the operation at this film that before paste transmits operation, carries out as described below, control part 130 is controlled squeegee drive part 136 based on the recognition result of electronic component 16 with from the paste transmission information that paste transfer information library 132 reads, make to form in described a plurality of bump 16a each to have the film 7a that film thickness distributes, be used for transmitting the soldering paste 7 of expectation conveying capacity according to the buckling deformation state of electronic component.
Next, form face 25a and soldering paste 7 is sent to bump 16a (paste transmission operation) (ST16) by the film that makes the electronic component 16 that remains in the placement head 19 drop to paste transfer unit 24, shown in Fig. 9 A.That is, make the electronic component 16 that remains in the unit placement head 20 drop to film 7a, shown in Fig. 9 B, thereby will expect that the soldering paste 7 of conveying capacity is sent to each bump 16a of electronic component 16, shown in Fig. 9 C so that each bump 16a contacts with film 7a.
Next, electronic component 16 is placed on (ST17) on the plate 5.That is,, placement head 19, and make the unit placement head 20 that is keeping soldering paste 7 electronic component 16 after transmitting be positioned at the top of plate 5, shown in Figure 10 A so that bump 16a aims at the electrode 5a of plate 5 by being moved.Then, electronic component 16 is descended, and place it on the plate 5, so that bump 16a drops on via soldering paste 7 on the electrode 5a of plate 5, shown in Figure 10 B (element is placed operation).
Subsequently, the plate 5 that is placed with electronic component 16 is transported among the refluxing unit M4.Then, together with electronic component 16 plate 5 is heated until solder fusing temperature or higher, so that the solder compositions in bump 16a and the soldering paste 7 fusing and link by electronic component 16 and plate 5 are welded, (reflow process) (ST18) shown in Figure 10 C.At this moment, electronic component 16 is through temperature distortion, and has the deformational behavior of the warpage that makes progress in the outer edge, and the bump 16a that is positioned at the outer edge thus is with electronic component 16 displacements, thereby increases the gap with electrode 5a.
Even in this case, component warp information based on electronic component 16, the soldering paste 7 of expectation conveying capacity is transmitted and be supplied to each bump 16a extraly, and the gap of amount of solder between electrode 5a and bump that is used for solder protuberance 16a and electrode 5a thus just do not have deficiency so because of the position that buckling deformation increases.Promptly, the solder compositions that scolder fused out of the solder compositions that the bump 16a of electronic component 16 is fused out in soldering paste 7 couples together all bump 16a and electrode 5a usually, make and formed the solder joint 16b that electronic component 16 is electrically connected with electrode 5a admirably, and can not produce such as being electrically connected rosin joint defective or that joint strength lacks, shown in Figure 10 C.
Therefore, in electronic component mounting method according to this embodiment, as previously mentioned, transmit information based on the paste that is stored at every kind of electronic component in the paste transfer information library 132, buckling deformation state according to electronic component, the soldering paste 7 of expectation conveying capacity is sent among described a plurality of bump 16a each, makes that soldering paste 7 is all just in time enough for each bump 16a in reflow process.Thus, can prevent to occur rosin joint when the thin semiconductor packaging part that will be easy to buckling deformation in reflow process is installed onboard by welding.
Industrial applicibility
Electronic component placing apparatus of the present invention and electronic component mounting method have following effect: rosin joint occurs in the time of can preventing being easy to take place the electronic component of buckling deformation by welded and installed, and be effective for the thin semiconductor packaging part encapsulation field onboard that will be formed with bump by welding.

Claims (4)

1.一种电子元件放置设备，用于将下表面上形成有多个焊料隆起的电子元件放置在板上，该电子元件放置设备包括：1. An electronic component placement apparatus for placing an electronic component having a plurality of solder bumps formed on a lower surface on a board, the electronic component placement apparatus comprising: 元件供应部，用于供应所述电子元件；a component supply unit for supplying the electronic components; 板保持部，用于保持并定位所述板；a board holding portion for holding and positioning the board; 放置头，用于从所述元件供应部取出电子元件并将所述电子元件放置在被保持于所述板保持部中的板上；a placement head for taking out electronic components from the component supply part and placing the electronic components on a board held in the board holding part; 头移动装置，用于使所述放置头在所述元件供应部与板保持部之间移动；a head moving device for moving the placement head between the component supply part and the board holding part; 元件翘曲信息存储部，用于存储表示在所述电子元件的回流工序中翘曲变形状态的元件翘曲信息；a component warpage information storage unit for storing component warpage information indicating a state of warpage deformation in a reflow process of the electronic component; 膏剂传送单元，设置在所述放置头的移动路径上，用于通过在膜形成面上形成待传送至所述焊料隆起的焊膏的膜，并使被保持在所述放置头中的电子元件下降至所述膜形成面，而将焊膏传送至多个焊料隆起；和a paste transfer unit provided on a moving path of the placement head for forming a film of solder paste to be transferred to the solder bump on a film forming surface and causing the electronic component held in the placement head to descending to the film forming surface to deliver solder paste to a plurality of solder bumps; and 控制部，用于控制所述膏剂传送单元；a control unit for controlling the paste delivery unit; 其中，所述膏剂传送单元具有刮板，该刮板由刮板驱动部驱动，用于在所述膜形成面上执行水平移动和垂直移动相结合的膜形成操作，所述控制部基于所述元件翘曲信息控制所述刮板驱动部，以形成具有膜厚度分布的膜，用于根据所述电子元件中的所述翘曲变形状态，将期望传送量的焊膏传送至所述多个焊料隆起中的每个焊料隆起。Wherein, the paste conveying unit has a scraper, which is driven by a scraper driving part, and is used to perform a film forming operation combining horizontal movement and vertical movement on the film forming surface, and the control part is based on the The component warpage information controls the squeegee driving section to form a film having a film thickness distribution for delivering a desired delivery amount of solder paste to the plurality of Each solder bump in a solder bump. 2.一种电子元件放置设备，用于将下表面上形成有多个焊料隆起的电子元件放置在板上，该电子元件放置设备包括：2. An electronic component placement device for placing an electronic component having a plurality of solder bumps formed on a lower surface on a board, the electronic component placement device comprising: 元件供应部，用于供应所述电子元件；a component supply unit for supplying the electronic components; 板保持部，用于保持并定位所述板；a board holding portion for holding and positioning the board; 放置头，用于从所述元件供应部取出电子元件并将所述电子元件放置在被保持于所述板保持部中的板上；a placement head for taking out electronic components from the component supply part and placing the electronic components on a board held in the board holding part; 头移动装置，用于使所述放置头在所述元件供应部与板保持部之间移动；a head moving device for moving the placement head between the component supply part and the board holding part; 膏剂传送单元，设置在所述放置头的移动路径上，用于通过在膜形成面上形成待传送至所述焊料隆起的焊膏的膜，并使被保持在所述放置头中的电子元件下降至所述膜形成面，而将焊膏传送至多个焊料隆起；a paste transfer unit provided on a moving path of the placement head for forming a film of solder paste to be transferred to the solder bump on a film forming surface and causing the electronic component held in the placement head to descending to the film forming surface to deliver solder paste to a plurality of solder bumps; 控制部，用于控制所述膏剂传送单元；和a control section for controlling the paste delivery unit; and 膏剂传送信息库，对于每种电子元件存储膏剂传送信息，该膏剂传送信息包括表示在所述电子元件的回流工序中翘曲变形状态的元件翘曲信息、表示膜厚度分布以根据所述翘曲变形状态将期望传送量的焊膏传送至所述多个焊料隆起的膏剂传送图案、以及用于使刮板在所述膏剂传送单元中在所述膜形成面上执行水平移动和垂直移动相结合的膜形成操作以实现所述膜厚度分布的刮板移动数据；a paste delivery information library storing paste delivery information for each electronic component, the paste delivery information including component warpage information indicating a state of warpage deformation in a reflow process of the electronic component, indicating a film thickness distribution according to the warpage The deformed state combines a paste transfer pattern for transferring a desired transfer amount of solder paste to the plurality of solder bumps, and for causing a squeegee to perform horizontal movement and vertical movement on the film forming surface in the paste transfer unit. Squeegee movement data of a film forming operation to achieve said film thickness profile; 其中，所述控制部基于所述电子元件的识别结果和从所述膏剂传送信息库读取的膏剂传送信息，来控制用于驱动所述刮板以执行所述膜形成操作的刮板驱动部，以在所述膏剂传送单元中形成具有膜厚度分布的膜，用于根据所述电子元件中的所述翘曲变形状态，向所述多个焊料隆起中的每个焊料隆起传送期望传送量的焊膏。wherein the control section controls a squeegee driving section for driving the squeegee to perform the film forming operation based on the identification result of the electronic component and the paste transfer information read from the paste transfer information library , to form a film having a film thickness distribution in the paste transfer unit for transferring a desired transfer amount to each of the plurality of solder bumps according to the warpage deformation state in the electronic component of solder paste. 3.一种电子元件安装方法，用于电子元件放置设备中，用于将下表面上形成有多个焊料隆起的电子元件放置并安装在板上，所述电子元件放置设备包括：元件供应部，用于供应所述电子元件；板保持部，用于保持并定位所述板；放置头，用于从所述元件供应部取出电子元件并将所述电子元件放置在被保持于所述板保持部中的板上；头移动装置，用于使所述放置头在所述元件供应部与板保持部之间移动；元件翘曲信息存储部，用于存储表示在所述电子元件的回流工序中翘曲变形状态的元件翘曲信息；膏剂传送单元，设置在所述放置头的移动路径上，用于借助刮板在膜形成面上形成待传送至所述焊料隆起的焊膏的膜，所述刮板在所述膜形成面上执行水平移动和垂直移动相结合的膜形成操作；和控制部，用于控制所述膏剂传送单元；3. An electronic component mounting method used in an electronic component placement device for placing and mounting an electronic component having a plurality of solder bumps formed on a lower surface on a board, the electronic component placement device comprising: a component supply part , for supplying the electronic components; a board holding part, for holding and positioning the board; a placement head, for taking out electronic components from the component supply part and placing the electronic components on the board held a board in the holding section; a head moving device for moving the placement head between the component supply section and the board holding section; a component warpage information storage section for storing information indicating reflow of the electronic component Component warpage information of a warpage deformation state in a process; a paste transfer unit provided on a moving path of the placement head for forming a film of solder paste to be transferred to the solder bump on a film forming surface by means of a scraper , the scraper performs a film forming operation combining horizontal movement and vertical movement on the film forming surface; and a control section for controlling the paste conveying unit; 所述电子元件安装方法包括：The electronic component installation method includes: 用放置头从所述元件供应部取出电子元件的步骤；a step of taking out electronic components from said component supply part with a placement head; 在所述膏剂传送单元中通过使被保持在所述放置头中的电子元件下降至所述膜形成面而将焊膏传送至所述焊料隆起的膏剂传送步骤；和a paste transfer step of transferring solder paste to the solder bump by lowering the electronic component held in the placement head to the film forming surface in the paste transfer unit; and 将所述电子元件放置在所述板上以使所述焊料隆起经由所述焊膏落在所述板的电极上的元件放置步骤；a component placement step of placing said electronic component on said board such that said solder bumps are dropped on electrodes of said board via said solder paste; 其中，在所述膏剂传送步骤之前进行膜形成操作，所述控制部基于所述元件翘曲信息控制用于驱动所述刮板的刮板驱动部，以形成具有膜厚度分布的膜，用于根据所述电子元件中的翘曲变形状态向所述多个焊料隆起中的每个焊料隆起传送期望传送量的焊膏。wherein the film forming operation is performed before the paste transfer step, the control section controls a squeegee driving section for driving the squeegee based on the element warpage information to form a film having a film thickness distribution for A desired delivered amount of solder paste is delivered to each of the plurality of solder bumps based on a state of warpage in the electronic component. 4.一种电子元件安装方法，用于电子元件放置设备中，用于将下表面上形成有多个焊料隆起的电子元件放置并安装在板上，所述电子元件放置设备包括：元件供应部，用于供应所述电子元件；板保持部，用于保持并定位所述板；放置头，用于从所述元件供应部取出电子元件并将所述电子元件放置在被保持于所述板保持部中的板上；头移动装置，用于使所述放置头在所述元件供应部与板保持部之间移动；膏剂传送单元，设置在所述放置头的移动路径上，用于借助刮板在膜形成面上形成待传送至所述焊料隆起的焊膏的膜，所述刮板在所述膜形成面上执行水平移动和垂直移动相结合的膜形成操作；和控制部，用于控制所述膏剂传送单元；以及膏剂传送信息库，对于每种电子元件存储膏剂传送信息，该膏剂传送信息包括表示在所述电子元件的回流工序中翘曲变形状态的元件翘曲信息、表示膜厚度分布以根据所述翘曲变形状态将期望传送量的焊膏传送至所述多个焊料隆起的膏剂传送图案、以及用于使刮板在所述膏剂传送单元中在所述膜形成面上执行水平移动和垂直移动相结合的膜形成操作以实现所述膜厚度分布的刮板移动数据；4. An electronic component mounting method used in an electronic component placement device for placing and mounting an electronic component having a plurality of solder bumps formed on a lower surface on a board, the electronic component placement device comprising: a component supply part , for supplying the electronic components; a board holding part, for holding and positioning the board; a placement head, for taking out electronic components from the component supply part and placing the electronic components on the board held a board in the holding part; a head moving device for moving the placement head between the component supply part and the board holding part; a paste delivery unit provided on a moving path of the placement head for a squeegee forming a film of solder paste to be transferred to the solder bump on a film forming surface on which the squeegee performs a film forming operation in combination of horizontal movement and vertical movement; and a control section with for controlling the paste transfer unit; and a paste transfer information library storing paste transfer information for each electronic component, the paste transfer information including component warpage information indicating a state of warpage deformation in a reflow process of the electronic component, indicating a film thickness distribution to transfer a desired transfer amount of solder paste to the plurality of solder bumps according to the warpage deformation state, and a paste transfer pattern for making a squeegee on the film forming surface in the paste transfer unit performing a film forming operation combining horizontal movement and vertical movement to achieve the squeegee movement data of the film thickness distribution; 所述电子元件安装方法包括：The electronic component installation method includes: 用放置头从所述元件供应部取出电子元件的步骤；a step of taking out electronic components from said component supply part with a placement head; 在所述膏剂传送单元中通过使被保持在所述放置头中的电子元件下降至所述膜形成面而将焊膏传送至所述焊料隆起的膏剂传送步骤；和a paste transfer step of transferring solder paste to the solder bump by lowering the electronic component held in the placement head to the film forming surface in the paste transfer unit; and 将所述电子元件放置在所述板上以使所述焊料隆起经由所述焊膏落在所述板的电极上的元件放置步骤；a component placement step of placing said electronic component on said board such that said solder bumps are dropped on electrodes of said board via said solder paste; 其中，在所述膏剂传送步骤之前进行的所述膜形成操作中，所述控制部基于所述电子元件的识别结果和从所述膏剂传送信息库中读取的膏剂传送信息，控制用于驱动所述刮板的刮板驱动部，以形成具有膜厚度分布的膜，用于根据所述电子元件中的所述翘曲变形状态，向所述多个焊料隆起中的每个焊料隆起传送期望传送量的焊膏。Wherein, in the film forming operation performed prior to the paste transfer step, the control section controls the drive for driving based on the identification result of the electronic component and the paste transfer information read from the paste transfer information library. A squeegee driving portion of the squeegee to form a film having a film thickness distribution for transmitting a desired solder bump to each of the plurality of solder bumps according to the warpage deformation state in the electronic component. delivered amount of solder paste.
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