CN101493214B - Multi-wavelength light-emitting module with high-density electrical connections - Google Patents
Multi-wavelength light-emitting module with high-density electrical connections Download PDFInfo
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- CN101493214B CN101493214B CN2008100085201A CN200810008520A CN101493214B CN 101493214 B CN101493214 B CN 101493214B CN 2008100085201 A CN2008100085201 A CN 2008100085201A CN 200810008520 A CN200810008520 A CN 200810008520A CN 101493214 B CN101493214 B CN 101493214B
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- light emitting
- emitting diode
- wavelength light
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- integrated circult
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Abstract
The invention relates to a multi-wavelength light emitting module with high-density electrical connection, comprising: a driving integrated circuit structure and a multi-wavelength light emitting diode array structure. The upper surface of the driving integrated circuit structure is provided with a driving integrated circuit unit, and the driving integrated circuit unit is provided with a plurality of driving integrated circuit bonding pads. The multi-wavelength light emitting diode array structure is arranged on the upper surface of the driving integrated circuit structure, and the outer surface of the multi-wavelength light emitting diode array structure is provided with a conductive track unit which is electrically connected with the driving integrated circuit unit. The conductive trace unit comprises a plurality of light emitting diode conductive traces respectively formed on the upper surface of each single-wavelength light emitting diode array and a plurality of light emitting diode bonding pads respectively formed on the two side surfaces of each single-wavelength light emitting diode array, so that each light emitting diode grain is electrically connected to each driving integrated circuit bonding pad through each light emitting diode conductive trace and each light emitting diode bonding pad in sequence.
Description
Technical field
The present invention relates to a kind of multi-wavelength luminous module, particularly a kind of multi-wavelength luminous module (multi-wavelength light-emitting module) with high density electric connection.
Background technology
Generally speaking,, there be a kind of being used on sensitive film by its exposure is formed image as the method that forms photochrome or chromatograp, such as the method for picture or character.Several dissimilar sensitive films are arranged, for example, use the sensitive film of multi layer colour developing method, three layers of emulsion that wherein have different color sensitive degree are laminated on the supporting pieces, thereby form sensitive piece; Use a kind of sensitive film of film, wherein each emulsion layer contains pigment and developer, makes film to be exposed and development simultaneously, and similar sensitive film.
In addition, also have another kind to be called the sensitive film of " microcapsules colored medium ", as shown in Figure 1, wherein use the microcapsules (cyliths) (3a, 3b, 3c) that contain different chromogen substances and different light trigger as photosensitive material.In microcapsules colored medium 1a, for example the thin support 2a that is made by polyester is covered with the photosensitive material layer 4a that contains very little in a large number microcapsules.When exposure, the microcapsules sclerosis, make that it is effective having only the microcapsules of particular color, and owing to pressure makes microcapsules rupture, develop then, so as to forming predetermined color images, other sensitive film has different colour development principles, but all need by the exposure of the light of the light of the colour of image or its complementary colours, so that form image.
Moreover, in the method that widely-used above-mentioned sensitive film exposes, white light is separated into three kinds of primary colours by filter, and uses various primary colours to form images, then, thus these images are combined on light-sensitive medium and form the predetermined colored image or the image of its complementary colours.
In addition, another kind of technology has been proposed in recent years, described in Japanese Unexamined Patent Publication No No.Hei5-211666 and Hei 5-278260, wherein use the light emitting diode (LED) send RGB light or laser instrument as light emitting source, and control light emitting source like this, make on sensitive film, to form predetermined colored image.So as to making the sensitive film exposure.
Yet, in the use light emitting diode (LED) or the exposure device of laser instrument described in Japanese Unexamined Patent Publication No No.Hei 5-211666 and Hei 5-278260 as light source, use lens combination that the light that sends from light emitting diode (LED) or laser instrument is converged on the medium, for the color in the unit, control point, need to use the optical system of expensive and big installing space, scanning optics for example, microlens array etc.Microlens array and the set of lenses that constitutes scanning optics have optical transmission loss, make to have only the part of the light that sends from light emitting diode (LED) or laser instrument can arrive on the sensitive film (medium).Therefore, in some cases, light emitting diode (LED) can not provide the luminous quantity that is enough to make the sensitive film exposure.In other cases, must reduce print speed printing speed and increase printing time, so that guarantee the sufficiently long time for exposure.In addition, use the optical system of lens to require big installing space, and the cost height, make printing equipment cost height, volume is big.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of and has the multi-wavelength luminous module (multi-wavelength light-emitting module) that high density electrically connects, and multi-wavelength luminous module of the present invention can be the LED array structure module.In addition, this LED array structure module is a kind of smooth output module (light exposure module), and it can be applicable to scanner (scanner), and (Electrophotography is EPG) in the printer with the photoelectronic imaging formula.
In addition, technical characterstic of the present invention is: (1) at first, upper surface in drive integrated circult structure (drive ICstructure) forms a plurality of drive integrated circult pads (drive IC pad), and a plurality of light emitting diode conductive traces (LED conductive trace) and a plurality of light emitting diode pad (LEDpad) is formed at the upper surface and the both side surface of each single wavelength light emitting diode matrix respectively; (2) a plurality of single wavelength light emitting diode matrixs are arranged at respectively on this drive integrated circult structure, so that a plurality of LED crystal particles of each single wavelength light emitting diode matrix are respectively by described a plurality of light emitting diode conductive traces and this light emitting diode pad, to be electrically connected at described a plurality of drive integrated circult pad.Therefore, but the present invention's shorten product sizes, the material cost that reduces, and reduce because of high density and electrically connect required production cost.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of multi-wavelength luminous module (multi-wavelength light-emitting module) that high density electrically connects that has is provided, and it comprises: drive integrated circult structure (drive IC structure) and multi-wave length illuminating diode array structure (multi-wavelength LED array structure).Wherein, the upper surface of this drive integrated circult structure has drive integrated circult unit (drive IC unit), and wherein this drive integrated circult unit has a plurality of drive integrated circult pads.This multi-wave length illuminating diode array structure is arranged at the upper surface of this drive integrated circult structure, this multi-wave length illuminating diode array structure has a plurality of single wavelength light emitting diode matrixs, each single wavelength light emitting diode matrix comprises a plurality of LED crystal particles with identical wavelength, and the outer surface of this multi-wave length illuminating diode array structure has the conductive traces unit (conductive trace unit) that is electrically connected at this drive integrated circult unit.Wherein this conductive traces unit comprises a plurality of being formed separately in the light emitting diode conductive traces on the upper surface of each single wavelength light emitting diode matrix and a plurality of light emitting diode pad that is formed separately on the both side surface of each single wavelength light emitting diode matrix, so that each LED crystal particle is electrically connected at each drive integrated circult pad by each light emitting diode conductive traces and each light emitting diode pad in regular turn.
Therefore, the present invention can solve traditional handicraft and adopt one one to carry out that routing engages and the defective that produces tediously long technology, and then to reach shorten product sizes, reduce material cost, and to reduce the advantage that electrically connects required production cost because of high density.
Reach technology, means and the effect that predetermined purpose is taked in order further to understand the present invention, see also following about detailed description of the present invention and accompanying drawing, believe that purpose of the present invention, feature and characteristics can obtain deeply and concrete understanding thus, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Fig. 1 is for representing the schematic diagram of microcapsules colored medium with the form of amplifying;
Fig. 2 is the stereogram of drive integrated circult structure of the present invention;
Fig. 3 has the stereogram of the multi-wavelength luminous module (multi-wavelengthlight-emitting module) of high density electric connection for the present invention;
Fig. 4 has the top view of the multi-wavelength luminous module (multi-wavelengthlight-emitting module) of high density electric connection for the present invention; And
Fig. 5 has the side view of the multi-wavelength luminous module (multi-wavelengthlight-emitting module) of high density electric connection for the present invention.
And each description of reference numerals in the above-mentioned accompanying drawing is as follows:
1 drive integrated circult structure
10 drive integrated circult unit
100 drive integrated circult pads
2 multi-wave length illuminating diode array structures
2A, 2B, the single wavelength light emitting diode matrix of 2C
20A, 20B, 20C LED crystal particle
20 conductive traces unit
200 light emitting diode conductive traces
201 light emitting diode pads
The specific embodiment
See also Fig. 2 to shown in Figure 5, its be respectively drive integrated circult structure of the present invention stereogram, and the present invention have stereogram, top view and the side view of the multi-wavelength luminous module (multi-wavelengthlight-emitting module) that high density electrically connects.By among described a plurality of figure as can be known, the invention provides a kind of multi-wavelength luminous module (multi-wavelengthlight-emitting module) that high density electrically connects that has, it comprises: drive integrated circult structure (drive IC structure) 1 and multi-wave length illuminating diode array structure (multi-wavelength LED array structure) 2.
In addition, the upper surface of this drive integrated circult structure 1 has drive integrated circult unit (drive ICunit) 10, and this drive integrated circult unit 10 has a plurality of drive integrated circult pads (drive ICpad) 100, and wherein said a plurality of drive integrated circult pads 100 are divided into six rows drive integrated circult pad 100 arranged side by side.
Moreover, this multi-wave length illuminating diode array structure 2 is arranged at the upper surface of this drive integrated circult structure 1, and (2A, 2B, 2C) formed this multi-wave length illuminating diode array structure 2 by three single wavelength light emitting diode matrixs (single wavelength LED array), and described a plurality of single wavelength light emitting diode matrixs (2A, 2B, 2C) have different emission wavelength (emission wavelength).In addition, each single wavelength light emitting diode matrix (2A, 2B, 2C) comprises a plurality of LED crystal particles (LED die) (20A, 20B, 20C) with identical wavelength.
In addition, the outer surface of this multi-wave length illuminating diode array structure 2 has the conductive traces unit (conductive trace unit) 20 that is electrically connected at this drive integrated circult unit 10, and this conductive traces unit 20 comprises a plurality of each single wavelength light emitting diode matrix (2A that are formed at respectively, 2B, the light emitting diode conductive traces of upper surface 2C) (LED conductive trace) 200 and a plurality of each single wavelength light emitting diode matrix (2A that is formed at respectively, 2B, the light emitting diode pad of both side surface 2C) (LED pad) 201, therefore described a plurality of LED crystal particle (20A, 20B, 20C) the conductive traces unit 20 by this multi-wave length illuminating diode array structure 2 is to be electrically connected at described a plurality of drive integrated circult pad 100 respectively.
In other words, with the disclosed embodiment of the present invention, a part of LED crystal particle 20A of this list wavelength light emitting diode matrix 2A is described a plurality of light emitting diode conductive traces 200 and described a plurality of light emitting diode pads 201 of the upper surface by being formed at this list wavelength light emitting diode matrix 2A and left-hand face (left lateral surface) respectively, to be electrically connected at described a plurality of drive integrated circult pads 100 of first row (leftmost side).In addition, another part LED crystal particle 20A of this list wavelength light emitting diode matrix 2A is described a plurality of light emitting diode conductive traces 200 and described a plurality of light emitting diode pads 201 of the upper surface by being formed at this list wavelength light emitting diode matrix 2A and right lateral surface (right lateral surface) respectively, to be electrically connected at described a plurality of drive integrated circult pads 100 of second row.
Moreover, a part of LED crystal particle 20B of this list wavelength light emitting diode matrix 2B is described a plurality of light emitting diode conductive traces 200 and described a plurality of light emitting diode pads 201 of the upper surface by being formed at this list wavelength light emitting diode matrix 2B and left-hand face (left lateralsurface) respectively, to be electrically connected at described a plurality of drive integrated circult pads 100 of the 3rd row.In addition, another part LED crystal particle 20B of this list wavelength light emitting diode matrix 2B is described a plurality of light emitting diode conductive traces 200 and described a plurality of light emitting diode pads 201 of the upper surface by being formed at this list wavelength light emitting diode matrix 2B and right lateral surface (right lateral surface) respectively, to be electrically connected at described a plurality of drive integrated circult pads 100 of the 4th row.
In addition, a part of LED crystal particle 20C of this list wavelength light emitting diode matrix 2C is described a plurality of light emitting diode conductive traces 200 and described a plurality of light emitting diode pads 201 of the upper surface by being formed at this list wavelength light emitting diode matrix 2C and left-hand face (left lateralsurface) respectively, to be electrically connected at described a plurality of drive integrated circult pads 100 of the 5th row.In addition, another part LED crystal particle 20C of this list wavelength light emitting diode matrix 2C is described a plurality of light emitting diode conductive traces 200 and described a plurality of light emitting diode pads 201 of the upper surface by being formed at this list wavelength light emitting diode matrix 2C and right lateral surface (right lateral surface) respectively, to be electrically connected at described a plurality of drive integrated circult pads 100 of the 6th row (rightmost side).
Whereby, each LED crystal particle (20A, 20B, 20C) is in regular turn by corresponding light emitting diode conductive traces 200 and corresponding light emitting diode pad 201, to be electrically connected at corresponding drive integrated circult pad 100.
Yet; above-mentioned disclosed three single wavelength light emitting diode matrixs (2A, 2B, 2C) are non-in order to limit the present invention; such as one or more single wavelength light emitting diode matrixs all can be applicable to the present invention; and, be the category that the present invention protects so long as a plurality of light emitting diode pads are formed at the application of the both side surface of single wavelength light emitting diode matrix respectively.
In sum, multi-wavelength luminous module of the present invention can be the LED array structure module.In addition, this LED array structure module is a kind of smooth output module (light exposure module), and it can be applicable to scanner (scanner), and (Electrophotography is EPG) in the printer with the photoelectronic imaging formula.
In addition, technical characterstic of the present invention is: (1) at first, upper surface in drive integrated circult structure (driveIC structure) forms a plurality of drive integrated circult pads (drive IC pad), and a plurality of light emitting diode conductive traces (LED conductive trace) and a plurality of light emitting diode pad (LED pad) is formed at the upper surface and the both side surface of each single wavelength light emitting diode matrix respectively; (2) a plurality of single wavelength light emitting diode matrixs are arranged at respectively on this drive integrated circult structure, so that a plurality of LED crystal particles of each single wavelength light emitting diode matrix are respectively by described a plurality of light emitting diode conductive traces and this light emitting diode pad, to be electrically connected at described a plurality of drive integrated circult pad.Therefore, but the present invention's shorten product sizes, the material cost that reduces, and reduce because of high density and electrically connect required production cost.
Therefore, the present invention can solve traditional handicraft and adopt one one to carry out that routing engages and the defective that produces tediously long technology, and then to reach shorten product sizes, reduce material cost, and to reduce the advantage that electrically connects required production cost because of high density.
But the above only is the detailed description and the accompanying drawing of the specific embodiment of one of the best of the present invention, feature of the present invention is not limited thereto, be not in order to restriction the present invention, all scopes of the present invention should be as the criterion with the claim of enclosing, all embodiment that accords with the spirit variation similar with it of claim of the present invention all should be contained in the category of the present invention, and variation that any those skilled in the art can think deeply in the field of the invention easily or modification all can be encompassed in the following claim of the present invention.
Claims (1)
1. one kind has the multi-wavelength luminous module that high density electrically connects, and it is characterized in that, comprising:
The drive integrated circult structure, its upper surface has the drive integrated circult unit, and wherein this drive integrated circult unit has a plurality of drive integrated circult pads; And
The multi-wave length illuminating diode array structure, it is arranged at the upper surface of described drive integrated circult structure, this multi-wave length illuminating diode array structure has a plurality of single wavelength light emitting diode matrixs, each single wavelength light emitting diode matrix comprises a plurality of LED crystal particles with identical wavelength, and the outer surface of described multi-wave length illuminating diode array structure has the conductive traces unit that is electrically connected at described drive integrated circult unit;
Wherein this conductive traces unit comprises a plurality of being formed separately in the light emitting diode conductive traces on the upper surface of each single wavelength light emitting diode matrix and a plurality of light emitting diode pad that is formed separately on the both side surface of each single wavelength light emitting diode matrix, so that each LED crystal particle is electrically connected at each drive integrated circult pad by each light emitting diode conductive traces and each light emitting diode pad in regular turn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100085201A CN101493214B (en) | 2008-01-23 | 2008-01-23 | Multi-wavelength light-emitting module with high-density electrical connections |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100085201A CN101493214B (en) | 2008-01-23 | 2008-01-23 | Multi-wavelength light-emitting module with high-density electrical connections |
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| Publication Number | Publication Date |
|---|---|
| CN101493214A CN101493214A (en) | 2009-07-29 |
| CN101493214B true CN101493214B (en) | 2011-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008100085201A Expired - Fee Related CN101493214B (en) | 2008-01-23 | 2008-01-23 | Multi-wavelength light-emitting module with high-density electrical connections |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101853615A (en) * | 2010-05-20 | 2010-10-06 | 广东威创视讯科技股份有限公司 | LED display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4633280A (en) * | 1984-07-20 | 1986-12-30 | Sanyo Electric Co., Ltd. | Unit of light emitting diode arrays |
| EP1453111A2 (en) * | 2003-02-28 | 2004-09-01 | Noritsu Koki Co., Ltd. | Light source unit |
| CN1740630A (en) * | 2004-08-25 | 2006-03-01 | 上海力保科技有限公司 | High-density light-emitting diode array lamp board |
| CN200986120Y (en) * | 2006-12-11 | 2007-12-05 | 环隆电气股份有限公司 | Lighting module |
-
2008
- 2008-01-23 CN CN2008100085201A patent/CN101493214B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4633280A (en) * | 1984-07-20 | 1986-12-30 | Sanyo Electric Co., Ltd. | Unit of light emitting diode arrays |
| EP1453111A2 (en) * | 2003-02-28 | 2004-09-01 | Noritsu Koki Co., Ltd. | Light source unit |
| CN1740630A (en) * | 2004-08-25 | 2006-03-01 | 上海力保科技有限公司 | High-density light-emitting diode array lamp board |
| CN200986120Y (en) * | 2006-12-11 | 2007-12-05 | 环隆电气股份有限公司 | Lighting module |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2000-127493A 2000.05.09 |
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| CN101493214A (en) | 2009-07-29 |
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Owner name: HUANXU ELECTRONICS CO., LTD. Free format text: FORMER OWNER: HUANLONG ELECTRIC CO LTD Effective date: 20110216 Owner name: HUANHONG SCIENCE + TECHNOLOGY CO., LTD. |
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Free format text: CORRECT: ADDRESS; FROM: NANTOU COUNTY, TAIWAN PROVINCE, CHINA TO: 201203 NO. 1558, ZHANGDONG ROAD, ZHANGJIANG HIGH-TECH. PARK, SHANGHAI |
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Effective date of registration: 20110216 Address after: 201203 Shanghai Zhangjiang hi tech park, Zhang Road No. 1558 Co-patentee after: Universal Global Scientific Industries Co., Ltd. Patentee after: Huanxu Electronics Co., Ltd. Address before: Taiwan Nantou County Chinese Patentee before: Huanlong Electric Co., Ltd. |
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Granted publication date: 20110202 Termination date: 20180123 |
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