CN101481815B - Fixture for single-film plating used in an inert environment - Google Patents

Abstract

The invention relates to a jig used in a single-side electroforming in the inert environment, which comprises two main parts which are a holding cavity and a piston. One side of the holding cavity is provided with a trap sample treatment window, the inner side of which is provided with a lower sealing ring. The piston and the holding cavity are connected by a screw thread. The contact position of the piston and the holding cavity is provided with an upper sealing ring. The interior of the piston is provided with an electrode terminal post. The lower end surface of the electrode terminal post is in one plane with the bottom surface of the piston. The upper end of the electrode terminal post is connected with an external circuit by the jig. The electrode terminal post and the piston are tightly encapsulated. The electrode terminal post is provided with an inner sealing ring. The jig has the beneficial effects that the jig can be used conveniently, can provide electrode passage when the sample of a thin film needs one-sided treatment; the jig is used for electroplating film samples with different thickness and does not affect the sealing effect thereof; the jig can be used for the encapsulation and testing of the samples in the simple conditions of a laboratory without needing other accessory appliances; the samples are very flexible.

Description

Fixture for single-film plating used in an inert environment

technical field

The invention belongs to the technical field of electrodeposition, and relates to a jig for single-film electroplating used in an inert environment.

technical background

Electroplating is an important means of material surface engineering and is currently widely used in various industrial fields. Due to the diversity of electrochemical reactions and the flexible and diverse characteristics of electrocrystallization and electrodeposition, the current electroplating process has shifted from the traditional metal field to non-metallic such as semiconductors, functional composite materials and other emerging fields. Preparation of semiconductor materials, including thin-film semiconductor components, flat-panel display devices, large-area cheap solar cells, photosensitive resistors, capacitors, photoconductors, conductance, magnetic conductance and memory components, as well as some special components, such as light-emitting and fluorescent components, etc. . In the field of research, many electrodeposition processes, such as electrodeposition of Group IA and IIA metals or their compounds, often need to occur in an oxygen-free and water-free inert environment because these materials are very sensitive to water and oxygen environments, and the deposited The materials need to be formed on one side of the film, and the samples can be taken out under non-destructive conditions for further material structure characterization, performance testing and other analysis.

Contents of the invention

The object of the present invention is to provide a jig for single-film electroplating used in an inert environment, and a jig capable of taking out samples non-destructively. The technical solution of the present invention is: 1. The clamp for single-film electroplating used in an inert environment, including two main parts of the accommodating cavity and the piston, one side of the accommodating cavity is provided with a stepped sample processing window, and the inner side of the window is provided There is a lower sealing ring, the piston and the accommodation cavity are threadedly connected, an upper sealing ring is provided at the contact between the piston and the accommodation cavity, and an electrode pole is placed inside the piston, and the lower end surface of the electrode pole is kept in contact with the bottom surface of the piston. On a plane, the upper end of the electrode pole extends to the outside of the piston and is provided with a nut, which is directly connected to the external circuit through a clamp. The electrode pole and the piston are tightly packaged, and an inner sealing ring is placed on the electrode pole. The electrode pole is made of copper or stainless steel, the accommodating cavity is a cuboid or cylinder, and the material of the accommodating cavity is polytetrafluoroethylene. The sample is loaded into the containing cavity, and only the pretreated surface is exposed through the sample window, and the unexposed part is tightly assembled with the containing cavity to achieve the purpose of no liquid leakage and no air leakage. The other side of the fixture is equipped with a pole that can form a current path with the external circuit, and the electrode pole and the box are also in sealed contact. The electrode pole not only plays a conductive role, but also can move up and down in the axial direction of the electrode pole to meet the tight packaging of samples with different film thicknesses. Surface contact is used between the electrode pole and the non-treated surface of the membrane sample. Compared with the traditional electrical contact, it can ensure the stability of the electrical contact between the two to the greatest extent, and can also make the contact between the two closer to reduce the contact. resistance.

The beneficial effects of the present invention are: it can provide electrode access when the film sample needs to be processed on one side, it can electroplate film samples of different thickness without affecting its sealing effect; it can package and test the sample under simple conditions in the laboratory, It does not need other auxiliary tools, and it is very flexible for samples; it can not only be used for electrodeposition and electrocrystallization of film samples under inert conditions, but also very suitable for various surface treatments that require special atmospheres and special processes.

Description of drawings

The present invention will be further described with reference to the accompanying drawings.

Fig. 1 is a schematic sectional assembly diagram of the present invention.

Fig. 2 is a schematic three-dimensional cross-sectional view of the overall structure of the present invention.

In the figure: 1. Accommodating cavity, 2. Piston, 3. Nut, 4. Electrode pole, 5. Inner sealing ring, 6. Lower sealing ring, 7. Upper sealing ring.

Detailed ways

The present invention comprises two main parts of accommodating cavity 1 and piston 2, accommodating cavity 1, accommodating cavity 1 is a hollow ring structure, and piston 2 is a ring structure. There is a stepped sample processing window on one side of the accommodation cavity 1, and a lower sealing ring 6 is arranged on the inner side of the window. The main function of the sealing ring is to isolate the plating solution environment from the non-treated surface; , for the entry of the piston 2, and the movement of the piston 2 makes the sample tightly pressed against the stepped window. The surface of the coating sample exposed in the window is the pretreatment surface, and the surface enclosed in the cavity is the non-treatment surface. The piston 2 and the housing cavity 1 are threaded. In order to further maintain the sealing effect, an upper sealing ring 7 is provided at the contact between the piston 2 and the housing cavity 1 to prevent the plating solution from entering the non-treatment area of the plating piece. The inside of the piston 2 is equipped with an electrode pole 4 made of stainless steel, and the lower end surface of the electrode pole 4 is kept on a plane with the bottom surface of the piston 2, so that the sample can form a current path with the electrode pole 4 through surface contact. The upper end of the column 4 extends to the outside of the piston 2 and is provided with a nut 3, which is directly connected to the external circuit through a clamp. In order to ensure the sealing effect, the electrode pole 4 and the piston 2 are tightly packaged, and an internal The sealing ring 5 further ensures the tightness.

Claims (4)

1. the fixture for single-sided membrane electroplating that under inert environments, uses, it is characterized in that, comprise ccontaining cavity (1) and piston (2), one side of ccontaining cavity (1) is provided with notch cuttype sample preparation window, the window inboard is provided with lower seal (6), between piston (2) and the ccontaining cavity (1) for being threaded, piston (2) is provided with sealing-ring (7) with ccontaining cavity (1) contact position, the inside of piston (2) is equipped with electrode pole (4), the lower surface of electrode pole (4) and piston (2) bottom surface keep in one plane, electrode pole (4) upper end extends to piston (2) outside and is provided with nut (3), directly link to each other by anchor clamps with external circuit, be tight encapsulation between electrode pole (4) and the piston (2), on electrode pole (4), be equipped with inner seal ring (5).

2. the fixture for single-sided membrane electroplating that uses under inert environments according to claim 1 is characterized in that, described electrode pole (4) is copper or stainless steel.

3. the fixture for single-sided membrane electroplating that uses under inert environments according to claim 1 is characterized in that, described ccontaining cavity (1) is rectangular parallelepiped or right cylinder.

4. the fixture for single-sided membrane electroplating that uses under inert environments according to claim 1 is characterized in that, described ccontaining cavity (1) material is a tetrafluoroethylene.

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