CN101466240B - Radiating device - Google Patents

Abstract

A heat dissipation device for dissipating heat from an electronic component, comprising a heat conduction plate attached to the electronic component, a plurality of heat dissipation fins and heat pipes connecting the heat conduction plate and the heat dissipation fins, and a plurality of heat dissipation fins are formed between the heat dissipation fins The air duct, the heat dissipation device further includes a wind guide cover, the wind guide cover includes a top plate and two baffles connected to the top plate, the top plate is fixed on the top of the heat dissipation fin, and the baffle plate surrounds the top of the heat dissipation fin. At both ends, the two fans are fixed on the air guide cover and placed on both sides of the heat dissipation fins and at the inlet and outlet of the air passage. There are mounting parts extending from both sides of each baffle plate of the air guide cover. The two fans are fixed on these mounting parts. Because the heat dissipation fins and the double fan structure are arranged around the wind guide cover, the convection intensity of the air in the air passage of the heat dissipation fins is greatly enhanced, and the heat dissipation efficiency of the heat dissipation device is improved.

Description

heat sink

technical field

The invention relates to a cooling device, in particular to a cooling device for cooling electronic components.

Background technique

High-power electronic components such as computer central processing unit, north bridge chip, and graphics card will generate a lot of heat during operation. If the heat cannot be effectively dissipated, the temperature will directly rise sharply, which will seriously affect the normal operation of electronic components. . For this reason, a heat sink is needed to dissipate heat from these electronic components.

A traditional cooling device usually includes a base, a heat sink set, a heat pipe connecting the base and the heat sink set, and a fan fixed on one side of the heat sink set. The heat generated by the electronic components is first transferred to the base, and then absorbed by the bottom of the heat pipe; the heat pipe transfers the heat to its end through the phase change of the working fluid inside, and the heat at the end of the heat pipe is then dissipated to the surrounding air through the heat sink group . The fan can increase the heat exchange speed of the heat sink, thereby improving the cooling efficiency.

In the above heat dissipation device, the airflow blown by the fan flows along the intervals between the heat sinks, and leaves the heat sink group in a very short time, the utilization rate of cold air is low, so that the heat dissipation efficiency is low; and the above heat dissipation device Since the fixation of the fan requires complex structural erection, the fan can only be installed on one side of the heat sink, resulting in weak air flow on the other side of the heat sink group, resulting in reduced heat dissipation efficiency of the entire heat sink.

Contents of the invention

In view of this, it is necessary to provide a heat dissipation device with an air guide cover, which has a strong air guide capacity and high heat dissipation efficiency.

A heat dissipation device for dissipating heat from an electronic component, comprising a heat conduction plate attached to the electronic component, a plurality of heat dissipation fins and heat pipes connecting the heat conduction plate and the heat dissipation fins, and a plurality of heat dissipation fins are formed between the heat dissipation fins The air duct, the heat dissipation device further includes a wind guide cover, the wind guide cover includes a top plate and two baffles connected to the top plate, the top plate is fixed on the top of the heat dissipation fin, and the baffle plate surrounds the top of the heat dissipation fin. At both ends, the two fans are fixed on the air guide cover and placed on both sides of the heat dissipation fins and at the inlet and outlet of the air passage. There are mounting parts extending from both sides of each baffle plate of the air guide cover. The two fans are fixed on these mounting parts.

In the above heat dissipation device, the heat dissipation fins and the double fan structure are adopted in the air guide cover, which greatly enhances the convection intensity of the air in the air passage of the heat dissipation fins, and improves the heat dissipation efficiency of the heat dissipation device.

The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

Description of drawings

Fig. 1 is a combination diagram of the heat sink of the present invention.

FIG. 2 is a partially exploded view of FIG. 1 .

FIG. 3 is an exploded view of the heat sink assembly of the heat sink in FIG. 2 .

FIG. 4 is an exploded view of the air guide cover and the fan of the heat dissipation device in FIG. 2 .

Detailed ways

Please refer to Fig. 1 and Fig. 2 at the same time, it is the heat dissipation device of the first embodiment of the present invention, the heat dissipation device is installed on a circuit board (not shown in the figure) and is used for dissipating the heat generated by the electronic components (not shown in the figure) on the circuit board. heat. The heat dissipation device includes a radiator assembly 10 , an air guide cover 20 assembled on the radiator assembly 10 , and two fans 30 installed on opposite sides of the air guide cover 20 .

Please also refer to FIG. 3 , the heat sink assembly 10 includes a heat conduction plate 12, a heat dissipation fin group 14, three heat pipes 16 arranged in parallel for connecting the heat conduction plate 12 and the heat dissipation fin group 14, and fixed on the heat dissipation fins. The fixed plate 18 at the top of the sheet group 14, wherein:

The heat conduction plate 12 is roughly in the shape of a rectangular plate, and three parallel grooves 124 are formed on the bottom thereof. The two installation frames 13 are fixed on opposite ends of the bottom of the heat conducting plate 12 by screws 133 , and lugs 132 protrude from opposite ends of each installation frame 13 . The heat conducting plate 12 is connected to the circuit board through four fasteners (not shown) passing through the lugs 132 and keeps in close contact with the electronic components.

Each heat pipe 16 is U-shaped and includes a horizontal heat absorbing portion 160 and two parallel heat releasing portions 162 extending vertically upward from both ends of the heat absorbing portion 160 . The heat absorbing portion 160 is accommodated in the groove 124 of the heat conducting plate 12, and its bottom surface is coplanar with the bottom surface of the heat conducting plate 12, so as to form a flat bottom surface with the bottom of the heat conducting plate 12 to be pasted on the top surface of the electronic component to absorb heat from heat from electronic components. The two heat radiation portions 162 pass through the heat radiation fin set 14 , so that the heat radiation fin set 14 is placed on the heat radiation portion 162 of the heat pipe 16 .

The cooling fin set 14 is composed of a plurality of parallel cooling fins 140 stacked and arranged from top to bottom. Each cooling fin 140 is in a wave shape and generally parallel to the heat conducting plate 12 as a whole. Two sides of each cooling fin 140 are respectively provided with three through holes 142 arranged side by side, and these through holes 142 are used for accommodating the heat radiation portion 162 of the heat pipe 16 . Each cooling fin 140 extends from the edge of these through holes 142 with a ring wall 146 to increase the contact surface area between the cooling fins 140 and the heat radiation portion 162, and to separate adjacent cooling fins 140 by a certain distance to form an air passage. (not shown). Four through holes 144 distributed in a rectangular shape are disposed in the middle of each heat dissipation fin 140 , and these through holes 144 are disposed between the through holes 142 . The through holes 144 of the multi-layer heat dissipation fins 140 can form threaded holes for the screws 19 to screw in.

The fixing plate 18 is arranged in the shape of a rectangular plate, and its four corners are respectively provided with a through hole 180. These through holes 180 correspond to the through holes 144 of the heat dissipation fins 140, so that the screws 19 can pass through and fix the fixing plate 18 on the heat dissipation fin group 14. top. Two screw holes 185 are defined in the middle of the fixing plate 18 for fixing the wind deflector 20 .

Please refer to FIG. 4 , the air guide cover 20 is in an inverted U shape and includes a top plate 22 and two baffle plates 24 vertically extending from two ends of the top plate 22 . The width of the top plate 22 and the baffle plate 24 is equal to the width of the cooling fin set 14 . Two through holes 220 are defined in the middle of the top plate 22 , and the two through holes 220 correspond to the screw holes 185 of the above-mentioned fixing plate 18 . Two mounting portions 26 for mounting the fan 30 are formed on opposite sides of each baffle plate 24 , and each mounting portion 26 defines a pair of mounting holes 260 for fixing the fan 30 .

The profile of each fan 30 is substantially square, and it includes two front and rear flat plates 32, 34 with openings, wherein the flat plate 32 of one fan 30 is installed close to the two mounting parts 26 on the same side of the air guide cover 20, and the other The flat plate 34 of the fan 30 is mounted on the two mounting portions 26 on the other side of the air guide cover 20 .

When assembling the heat sink, first the heat dissipation fin group 14 is welded on the heat release portion 162 of the heat pipe 16, and the adjacent heat dissipation fins 140 form an air passage, and the heat conducting plate 12 is welded to the heat absorption portion 160 of the heat pipe 16 so that the heat pipe 16 The heat absorbing portion 160 is accommodated in the groove 124 of the heat conduction plate 12 ; the two ends of the bottom of the heat conduction plate 12 are fixed to the mounting frame 13 , and the top of the cooling fin group 14 is mounted with a fixed plate 18 . Then the heat sink assembly 10 is fixed on the circuit board by the fastener and closely contacts the electronic components. Then the wind deflector 20 and the fan 30 installed on both sides of the wind deflector 20 are installed together on the radiator assembly 10 from top to bottom, so that the baffle plate 24 of the wind deflector 20 surrounds the heat dissipation fin group 14. At both ends, two fans 30 are respectively placed on both sides of the cooling fin group 14 and placed at the inlet and outlet of the air duct. Finally, screw the screw 50 with a second hand through the through hole 220 of the top plate 22 of the air guide cover 20 and screw it on the fixing plate 18, and the installation of the entire heat dissipation device is completed.

When the electronic components work, the heat generated by them is delivered to the heat dissipation fin group 14 by the heat conduction plate 12 and the heat pipe 16, and part of the heat is dissipated to the air in the ventilation channel by the heat dissipation fin group 14; The fan 30 on one side of the heat dissipation fin group 14 sucks out the hot air in the heat dissipation fin group 14 air passage, and the fan 30 on the other side blows cold air into the air passage of the heat radiation fin group 14, increasing the heat dissipation of the cold air. convective exchange. Because the two baffles 24 of the air guide cover 20 surround the two sides of the cooling fin group 14, the cold air sent by the fan will not overflow to both sides in the air passage of the cooling fin group 14, which improves the utilization rate of the cold air ; and double fans 30 are used at the same time, which greatly enhances the convection intensity of the air and improves the heat dissipation efficiency; finally, because the fan 30 can be pre-installed on the wind guide cover 20, only need to manually unscrew the screw 50 when dismounting The wind guide cover 20 is drawn out together with the fan 30, without disassembling the fan 30, which is convenient and quick.

Claims (9)

1. A heat dissipation device is used to dissipate heat to an electronic component, comprising a heat conduction plate attached to the electronic component, some heat dissipation fins and heat pipes connecting the heat conduction plate and the heat dissipation fins, between the heat dissipation fins A plurality of air passages are formed, and it is characterized in that: the heat dissipation device further includes a wind guide cover, the wind guide cover includes a top plate and two baffles connected to the top plate, the top plate is fixed on the top of the cooling fins, the baffle plate Surrounding the two ends of the heat dissipation fins, two fans are fixed on the air guide cover and placed on both sides of the heat dissipation fins and at the inlet and outlet of the air passage, and the two sides of each baffle plate of the air guide cover Installing parts are extended, and the two fans are fixed on these installing parts. 2 . The heat dissipation device according to claim 1 , wherein a fixing plate is fixed on the top of the heat dissipation fins, and the top plate of the air guide cover is fixed on the fixing plate. 3 . 3 . The heat dissipation device according to claim 2 , wherein a through hole is formed in the middle of each heat dissipation fin, and the through holes of these heat dissipation fins form threaded holes for screwing to fix the fixing plate. 4 . 4 . The heat dissipation device according to claim 3 , wherein two through holes are provided on the top plate of the air guide cover, through which second-hand screws pass through the top plate and screwed to the fixing plate. 5 . 5. The heat dissipation device according to claim 1, wherein the wind guide cover is U-shaped. 6. The heat dissipation device according to claim 1, wherein the fans rotate in the same direction. 7. The heat dissipation device according to claim 1, wherein the heat pipe comprises a heat absorbing portion and two heat releasing sections connected to the heat absorbing portion, and a groove is provided at the bottom of the heat conducting plate to accommodate the heat absorbing portion of the heat pipe department. 8. The heat dissipation device according to claim 7, wherein the bottom surface of the heat absorbing portion of the heat pipe is coplanar with the bottom surface of the heat conducting plate. 9. The heat dissipation device according to claim 8, wherein the heat pipe is arranged in a U shape.

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