CN101459165A - Electronic component wafer module, manufacturing method thereof and electronic information device - Google Patents
Electronic component wafer module, manufacturing method thereof and electronic information device Download PDFInfo
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- CN101459165A CN101459165A CN200810181800.2A CN200810181800A CN101459165A CN 101459165 A CN101459165 A CN 101459165A CN 200810181800 A CN200810181800 A CN 200810181800A CN 101459165 A CN101459165 A CN 101459165A
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- 238000004519 manufacturing process Methods 0.000 title abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 115
- 239000011347 resin Substances 0.000 claims abstract description 115
- 230000003287 optical effect Effects 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 34
- 239000011521 glass Substances 0.000 claims description 37
- 238000005520 cutting process Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 23
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 239000006059 cover glass Substances 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 230000005693 optoelectronics Effects 0.000 claims description 11
- 230000004075 alteration Effects 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 6
- 238000012937 correction Methods 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 133
- 239000000758 substrate Substances 0.000 description 50
- 238000009434 installation Methods 0.000 description 34
- 238000003825 pressing Methods 0.000 description 18
- 230000006870 function Effects 0.000 description 16
- 238000012545 processing Methods 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000035699 permeability Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000002146 bilateral effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 108091092195 Intron Proteins 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 238000013144 data compression Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention relates to an electronic element wafer module, manufacture method thereof and electronic information device, concretely relates to an electronic element wafer module, an electronic element module, a sensor wafer module, a sensor module, a lens array plate and manufacture method of the sensor module and an electronic information device. The electronic element wafer module comprises: an electronic element wafer arranged with a plurality of electronic elements having a through hole electrode; a resin adhesion layer formed in a predetermined area on the electronic element wafer; a transparent cover member covering the electronic element wafer and fixed on the resin adhesion layer; and a plurality of resin optical elements adhered and fixed on the transparent cover member to be integrated in such a manner to correspond to the respective plurality of electronic elements.
Description
This non-provisional application is advocated under 35U.S.C. § 119 (a) priority of the number of patent application 2007-322627 that number of patent application 2007-322626 that on December 13rd, 2007 was submitted in Japan and on December 13rd, 2007 submit in Japan, and their whole content is incorporated this paper into by quoting thus.
Technical field
The present invention relates to electronic component wafer module, electronic wafer module, sensor wafer module, sensor assembly and sensor assembly manufacture method, lens array plate and electronic message unit.Electronic component wafer module is by a plurality of lens and image capturing component modularizations (integrated) that are used to focus on incident light are formed, and this image capturing component is corresponding to each lens and have a plurality of light-receiving members and be used to carry out opto-electronic conversion and catch image light from object; Or by being used to make optical functional element and the radiated element of emergent light straight ahead and crooked in a predetermined direction and guiding incident light and being used to receive that the light receiving element modularization (integrated) of incident light forms a plurality of, this each optical functional element of radiated element correspondence also generates emergent light.Made electronic component modular by the cutting electronic components wafer module.The sensor wafer module is to form by image capturing component that will have a plurality of light-receiving members and lens moduleization (integrated), light-receiving member is used to carry out opto-electronic conversion and catches image light from object, and lens are used to make incident light to form image on the image capturing component.Sensor assembly forms by cutting sensor wafer module.Lens array plate is used for sensor assembly.Electronic message unit comprises: for example, digital camera (for example, digital video camera and digital quiet shooting camera), image input camera (for example, in-vehicle camera), the mobile telephone equipment and the PDA(Personal Digital Assistant) of scanner, facsimile machine, outfit camera, it has as the pick device in the electronic component modular in the sensor assembly of the image input device that uses in the image-capture portion part or use information record and the reproduction block.
Background technology
Such conventional sensors module of electronic component modular effect is played in use, has been used to be equipped with the mobile telephone equipment of camera and PDA(Personal Digital Assistant) and has also had as the cassette camera of camera model etc.Such sensor assembly is provided with solid-state image and catches chip and support component.Solid-state image is caught chip and is had image capturing component and support component, image capturing component plays to be had a plurality of light-receiving members and is used to carry out opto-electronic conversion and catches effect from the electronic component of the image light of object, support component fix the condenser lens that is used to make incident light to form the image on the image capturing component, and the two all is arranged on image capturing component and support component on the installation base plate of being made up of ceramic, as to contain epoxy resin glass etc.Under such a case, solid-state image is caught chip and is set on the installation base plate and has carried out lead-in wire bonding (wire bonding).In addition, between condenser lens and the image capturing component accurately still image form distance and form image on the image capturing component to make incident light exactly, thereby can obtain clearly image.
Next, United States Patent (USP) reference paper 1 has proposed the example as graphic conventional electrical component module 100 among Figure 19.Electronic component modular 100 is configured to pick device.Installation base plate 102 has been installed optical electron element 101, it is that radiated element also is a light receiving element simultaneously, to be used to guarantee that the spacer substrate 103 in space is laminated to installation base plate 102, and the hermetic sealing substrate 105 that is provided with optical functional element 104 subsequently is laminated on the spacer substrate 103 thereafter.Optical electron element 101 has the configuration that wherein wiring contact 106 is drawn out to the sealing outside.Spacer substrate 103 has the form that the inside comprises inclined surface 107.Inclined surface 107 has applied reflectance coating.Optical functional element 104 has optical function, and such as directly exporting light to the outside from radiated element, and crooked and guiding comprises the reverberation from the information of CD etc.Can make a plurality of electronic component modulars 100 simultaneously by the cutting electronic components wafer module, stacked installation base plate 102, spacer substrate 103 and hermetic sealing substrate 105 in electronic component wafer module.
In addition, according to United States Patent (USP) reference paper 2, as graphic among Figure 20, the substrate 204 that is formed with lens 203 on it is formed with the substrate 202 tops alignment of lens 201 thereon, and the bonded layer of substrate 204 and substrate 202 205 is vertically stacked and bonding to be formed integrally as multistage lens module 200.In addition, according to United States Patent (USP) reference paper 3, as graphic among Figure 21, substrate 304 is via at interval 303 and be formed with the substrate 302 tops alignment of a plurality of lens 301 thereon, and substrate 304 and substrate 302 usefulness tackifying resins and vertically stacked and bonding (adhere) are to be formed integrally as lens module 300.United States Patent (USP) reference paper 3 has proposed a kind of being used at cutting position 305 these integral lens modules 300 of cutting so that make the method for each lens module simultaneously.
According to reference paper 4, a plurality of glass optical components (lens) comprise the lenticular unit that forms by with upper die and lower die compression molding soften glass, tubulose (tubular) pillar (leg) parts that also extend downwards from the periphery bending of lenticular unit at the compression molding place, with from the not only outwardly-bent and horizontally extending flat board member of tubular leg, be used for another tubular leg parts coupling with lenticular unit.The chip component of wherein integrated a plurality of glass optical components is adhered to the cover glass on the substrate, and this substrate has a plurality of imageing sensors disposed thereon makes each imageing sensor corresponding to each lenticular unit.Cut such chip component and be used for each imageing sensor.
According to non-patent references 1, disclose: through hole and wafer front are set on silicon wafer and the wafer rear surface is electrically connected mutually via through hole.
Reference paper 1: U.S. Patent number 7224856 B2 (Fig. 1)
Reference paper 2: U.S. Patent number 6049430
Reference paper 3: U.S. Patent number 6096155
Reference paper 4: Japanese publication number 2003-277085
Non-patent references 1:2004 Tokyo solid state device and material international conference (the2004International Conference on Solid State Devices and Material) 276-277 page or leaf " Application of Hight Reliable Silicon Thru-Via to Image Sensor CSP ".
Summary of the invention
Yet if use installation base plate in the routine techniques of Shuo Ming reference paper 1 in the above, the module height increases.In addition, the increase in man-hour that need be used for the element of installation base plate itself and be used to make.In addition, not only need a kind of erecting device, and the man-hour that need be used for erecting device so that optical element is installed to installation base plate, increased manufacturing expense thus.
And conventional reference paper 2 and 3 has been discussed the method that is used for forming condenser lens in substrate.Because this method is used substrate, then need a kind of like this substrate itself.Because substrate, the module height increases.In addition, the increase in man-hour that need be used for the element of substrate itself and be used to make.In addition, not only need a kind of erecting device, and the man-hour that need be used to install so that optical element is installed to installation base plate, increased manufacturing expense thus.Thereby, by using substrate, the thickness effect of condenser lens substrate its optical design, prolonged optical length thus.In addition; although the space that conventional reference paper 3 uses interval (spacer) to guarantee the condenser lens between the substrate; then not only at interval the processing of itself need man-hour, and the assembling that is inserted into the interval between the substrate also needs man-hour, increased manufacturing expense thus.
In addition, although exist a kind of method to be used for forming condenser lens by the back of etching substrate, the method has produced the lens shape of low precision.In addition, although conventional reference paper 4 is by having formed a plurality of lenticular units from top and bottom compression molding soften glass, the method has produced the lens shape of low precision, and therefore can not obtain accurate lens function.In addition, because the method then needs high-temperature and high pressure from top and the such soften glass of bottom compression molding.In addition, if glass temperature quickly falls to its low temperature from its high-temperature, glass may break, and therefore, the processing of lens is coarse.
In addition, according to the non-patent references 1 of routine, thereby be provided with the through hole wafer front and the wafer rear surface is electrically connected mutually via through hole.By using through hole, between sensor chip and installation base plate, will not need the bonding that goes between.Yet only in this way a kind of configuration does not allow by cutting sensor wafer module and obtains a plurality of modules with good accuracy and quality simultaneously that this sensor wafer module is the wafer scale electronic component wafer with the lens that adhere to.
This aspect is intended to solve above-mentioned general issues.The purpose of this invention is to provide electronic component wafer module, it does not need conventional installation base plate, substrate or interval, reduced the man-hour and installation elements and the interval man-hours requirement that are used to make module, reduced the height of each module and good precision and quality is provided.Another purpose of the present invention provides the electronic component modular of making by the cutting electronic components wafer module, the sensor wafer module, by cutting sensor wafer module sensor assembly of making and the manufacture method that is used for sensor assembly, be used in the lens array plate of sensor assembly and image-capture portion part or information record and the reproduction block use electronic component modular as the electronic message unit of image entering apparatus.
Electronic component wafer module according to the present invention comprises: the electronic component wafer that is furnished with a plurality of electronic components that possess through hole electrode; Be formed on the resin bonded laminate in the presumptive area on the electronic component wafer; The overlay electronic element wafer also is fixed on transparency cover element on the resin bonded laminate; With a plurality of resin optical components, it is bonding and be fixed on the transparency cover element, integrated in mode corresponding to corresponding a plurality of electronic components, realized above-mentioned purpose thus.
Preferably, the resin bonded laminate in electronic component wafer module forms at a plurality of electronic components of electronic component wafer and is in the semitight state around each according to the present invention.That is, electronic component wafer module according to the present invention comprises: the electronic component wafer that is furnished with a plurality of electronic components that possess through hole electrode; A plurality of electronic components of electronic component wafer each around the resin bonded laminate that forms with the semitight state; The overlay electronic element wafer also is fixed on transparency cover element on the resin bonded laminate; With a plurality of optical elements, it is mounted to bonding (adhere) in the mode corresponding to corresponding a plurality of electronic components and is fixed on the transparency cover element, has realized above-mentioned purpose thus.More preferably, a plurality of optical elements in electronic component wafer module form by integrated according to the present invention.In addition, according to electronic component wafer module of the present invention, electronic component wafer is furnished with a plurality of electronic components that possess through hole electrode; A plurality of electronic components of electronic component wafer each around the resin bonded laminate that forms with the semitight state; With the overlay electronic element wafer and be fixed on transparency cover element on the resin bonded laminate, realized above-mentioned purpose thus.
More preferably, in electronic component wafer module according to the present invention, the adhesive layer that a plurality of optical elements are inserted between the optical element around the core in plan view is laminated in.
More preferably, in electronic component wafer module according to the present invention, the adhesive layer that is used for bonding optical element also has the light shield function.
More preferably, in electronic component wafer module according to the present invention, be used for determining that the solid in space is comprised in the adhesive layer that is used for bonding optical element.
More preferably, in electronic component wafer module according to the present invention, optical element is made up of one or more lens.
More preferably, in electronic component wafer module according to the present invention, lens are provided with lens area and are provided with the distance member of predetermined thickness around the lens area at core.
More preferably, in electronic component wafer module according to the present invention, lens are condenser lenses.
More preferably, in electronic component wafer module according to the present invention, lens are aberration correction lens, diverging lens and condenser lens, and have predetermined thickness and be arranged on each lens distance member on every side stacked by the order of aberration correction lens, diverging lens and condenser lens.
More preferably, in electronic component wafer module according to the present invention, distance member has the position and determines function.
More preferably, in electronic component wafer module according to the present invention, the position of distance member determines that function is to be caused by recessed portion and projection with tapering (taper) or alignment mark.
More preferably, in electronic component wafer module according to the present invention, optical element be used to make the emergent light straight ahead, and crooked incident light to allow that it is along the optical functional element of determining that direction enters.
More preferably, in electronic component wafer module according to the present invention, resin bonded laminate has groove, and this groove shaped becomes the space segment of a plurality of electronic components on each is communicated to the outside.
More preferably, in electronic component wafer module according to the present invention, resin bonded laminate has groove, and this groove shaped becomes the space segment via other, and the space segment of a plurality of electronic components on each is communicated with the outside.
More preferably, in electronic component wafer module according to the present invention, resin bonded laminate is positioned to each that is used for a plurality of electronic components, and also is placed in the zone that is different from the electronic component zone and in the zone that is different from cutting area between the adjacent electronic elements.
More preferably, in electronic component wafer module according to the present invention, groove forms diagonal angle (diagonal) straight line, S shape or labyrinth shape with respect to the quadrangle edge direction of resin bonded laminate in the plan view.
More preferably, in electronic component wafer module according to the present invention, resin bonded laminate has the material configuration that can be connected with inside on meaning in kind.
More preferably, in electronic component wafer module according to the present invention, the transparency cover element is transparent resin plate or glass plate.
More preferably, in electronic component wafer module according to the present invention, the transparency cover element is provided with IR (infrared ray) coating or AR (antireflection) coating from the teeth outwards.
More preferably, in electronic component wafer module according to the present invention, electronic component has image capturing component, and it possesses a plurality of light-receiving members and is used to carry out opto-electronic conversion and catches image light from object.
More preferably, in electronic component wafer module according to the present invention, electronic component has the light receiving element that is used to generate the radiated element of emergent light and is used to receive incident light.
A kind of electronic component modular according to the present invention cuts into single or many groups from electronic component wafer module according to the present invention, has realized above-mentioned purpose thus.
Preferably, in electronic component modular according to the present invention, the cutting side of electronic component modeling piece or have the light shield function or installed (is provided with) light shield function.
Sensor wafer module according to the present invention comprises: the sensor wafer that is furnished with a plurality of sensor chip parts that possess through hole electrode; Be formed on the resin bonded laminate in the presumptive area on the sensor wafer; The covering sensor wafer also is fixed on transparency cover element on the resin bonded laminate; With a plurality of resin focusing lens array plates, it is mounted to bonding in the mode corresponding to corresponding a plurality of image capturing component and is fixed on the transparency cover element, each is provided with the image capturing component that possesses a plurality of light-receiving members in wherein a plurality of sensor chip parts, light-receiving member is used to carry out opto-electronic conversion and catches image light from object, has realized above-mentioned purpose thus.In addition, sensor wafer module according to the present invention comprises: the sensor wafer that is furnished with a plurality of sensor chip parts that possess through hole electrode; A plurality of electronic components of sensor wafer each around the resin bonded laminate that forms with the semitight state; The covering sensor wafer also is fixed on transparency cover element on the resin bonded laminate; With a plurality of condenser lenses, it is mounted to bonding in the mode corresponding to corresponding a plurality of electronic components and is fixed on the transparency cover element, wherein as electronic component, the sensor chip parts are provided with the image capturing component that possesses a plurality of light-receiving members, light-receiving member is used to carry out opto-electronic conversion and catches image light from object, has realized above-mentioned purpose thus.
Sensor assembly according to the present invention is cut into single or many groups from sensor wafer module according to the present invention.
A kind of method that is used to make according to sensor assembly of the present invention may further comprise the steps: form resin bonded laminate on around each of a plurality of image capturing component that are furnished with a plurality of sensor chips; Cover glass is adhered on the resin bonded laminate; Each sensor chip is formed a plurality of through holes, and the rear surface of described through hole sensor wafer is penetrated into front surface and arrives the pad rear surface; On the rear surface of sensor wafer, form wiring through through hole; Distance member place around the lens area of each resin lens plate is adhered to one or more resin lens plates on the cover glass surface; Cut sensor wafer, cover glass and lens simultaneously and obtain one or more sensor chip parts; And at least one cutting part, form light shielding layer, realized above-mentioned purpose thus.In addition, a kind of method that is used to make according to sensor assembly of the present invention may further comprise the steps: the resin bonded laminate that forms the semitight state in a plurality of image capturing component of the sensor wafer that is furnished with a plurality of sensor chip parts around each; Cover glass is adhered on the resin bonded laminate: the back side of attenuate sensor wafer; Form a plurality of through holes for each sensor chip parts, described through hole is penetrated into front surface and arrives the pad rear surface from the rear surface of sensor wafer; On the rear surface of transducer, form wiring through through hole; One or more lens boards are adhered on the surface of cover glass; Cut sensor wafer, cover glass and lens simultaneously and obtain one or more sensor chip parts; And at least one cutting part, form light shielding layer, realized above-mentioned purpose thus.
Preferably, in a kind of method of making according to sensor assembly of the present invention, cutting step uses laser or line cutting (wire saw).
Use from the electronic component modular of electronic component wafer module cutting according to the present invention according to electronic message unit of the present invention,, realized above-mentioned purpose thus as the sensor element in the image-capture portion part.
Electronic message unit according to the present invention uses the electronic component modular that cuts from the electronic component wafer module according to claim 23 in information record and reproduction block, realized above-mentioned purpose thus.
Sheet form lens array plate according to the present invention comprises a plurality of lens, each lens core is provided with the distance member that is provided with predetermined thickness around lens area and the lens area, these a plurality of lens are integrated in the matrix, have realized above-mentioned purpose thus.
Will be described hereinafter function of the present invention with said structure.
Shared the device substrate (electronic component chip part) of the circuit board that has on it electronic component that forms and conventional installation base plate, and made through hole so that form wiring, thereby will not need conventional installation base plate from front surface to rear surface piercing elements substrate.In addition, do not use conventional substrate.Alternatively, used condenser lens, for example, the condenser lens that accurately forms by the resin molded technology of resin molded lens, it plays the optical element effect.As a result, the distance member (edge member) around condenser lens can accurately be guaranteed the space.
As mentioned above, no longer need to be used for installing the conventional installation base plate of electronic component chip part by the lead-in wire bonding, be used to make the man-hour of substrate itself and the man-hour that is used to install electronic component thereby can reduce, reduced manufacturing expense thus and realized the low profile of installation base plate amount of thickness.
In addition, no longer need to be used to install the conventional substrate of lens, be used to make the man-hour of substrate itself and the man-hour that is used to install lens, reduced manufacturing expense thus and realized the low profile of substrate thickness amount thereby reduced.In addition, no longer need to be used to keep the interval in space between the substrate that lens are installed, thereby reduced the man-hour that is used to make at interval man-hour own and is used for installing installation interval in the lensed substrate thereon, reduced manufacturing expense thus.
In addition, do not use conventional substrate.Alternatively, used condenser lens, for example, by being used for the resin molded technology of resin molded lens and the condenser lens that accurately forms, it plays the optical element effect.As a result, the distance member (edge member) around condenser lens can accurately be guaranteed the space.
That is, if used conventional substrate and interval, then by the variation of substrate, the variation and the variation addition at interval of resin have been caused total variation.As a result, on short transverse, caused significant change degree.On the other hand, in the present invention, only problem can be the dimensional variations of each lens board when forming lens board.Particularly, as mentioned above, get a distinct image with accurately between condenser lens plate and image capturing component fixedly image-forming range, and exactly incident light is focused into image on the image capturing component, be very important.This precision on the vertical direction (z direction) is very high.
In addition, be the resin of close encapsulation although ideal situation is a resin, be difficult to realize the resin of close encapsulation, and the possibility of resin water inlet is arranged.If the air vent hole that is formed by groove does not then form the possibility of condensing owing to the water that enters the inside exists.If exist the air vent hole that forms by groove, then can use the binder resin that possesses gas permeability, widened resin choice thus.Consider this meaning, might improve processing accuracy and quality.
In addition, if a plurality of electronic components of electronic component wafer each around with the semitight state (for example, the air vent hole that forms by groove, with binder resin with gas permeability) form resin bonded laminate and, even if in a single day water enter the space segment of a plurality of electronic components, can the air flue (for example, existing the air vent hole that forms by groove) by this semitight state control or prevent that these water from forming and condense, kept good quality thus.
In addition, can keep processing accuracy and quality subtly.
In addition, no longer need conventional installation base plate, thereby might make the module of chip size (optical element dimension), make also that thus the installation region minimizes.
According to the present invention who possesses above-mentioned configuration, when making a large amount of module simultaneously, do not have as in the past, to be used to install the installation base plate of electronic component, substrate and the interval that is used to install lens.As a result, reduced the man-hour that is used to make installation base plate, substrate or interval.Be used for significantly having reduced the man-hour that is used to make thus with no longer needing optical element being installed on the installation base plate or being used in substrate, installing lens and the equipment of installation interval and the man-hour that relates to this equipment.In addition,, can control the height of each module of attenuate and also have the thickness of whole lens element, realize processing accuracy and quality thus subtly because no longer need installation base plate or substrate.
In addition, do not use conventional substrate.Alternatively, used condenser lens, for example, by being used for the resin molded technology of resin molded lens and the condenser lens that accurately forms, it plays the optical element effect.As a result, the distance member (edge member) around condenser lens can accurately be guaranteed space (secure a space).
In addition, because the present invention forms lens simultaneously, only problem can be the change of each lens sizes.As a result, this precision on the vertical direction (z direction) can be very high.
In addition, if a plurality of electronic components of electronic component wafer each around with the semitight state (for example, the air vent hole that forms by groove, with binder resin with gas permeability) the formation resin bonded laminate, even if in a single day water enter the space segment of a plurality of electronic components, air flue that can be by this semitight state (for example, air vent hole that is formed by groove and the binder resin that possesses gas permeability) is controlled or is prevented that these water from forming and condenses, and has kept good quality thus.Under such a case, widened resin choice, and might improve processing accuracy and quality.
In addition, no longer need conventional installation base plate, thereby might make the module of chip size (optical element dimension), make also that thus the installation region minimizes.
Those skilled in the art are when reading with reference to the accompanying drawings and understanding following detailed description, and these and other advantage of the present invention will be apparent.
Description of drawings
Fig. 1 is the longitudinal cross-section view that illustrates according to the exemplary basic structure of the sensor assembly of the embodiment of the invention 1.
Fig. 2 is a schematic illustrations among Fig. 1 by the longitudinal cross-section view of the exemplary basic structure of bonding through hole wafer of resin bonded laminate and glass plate.
Fig. 3 is a schematic illustrations is placed in the plan view of each lip-deep resin bonded laminate of the image capturing component of the through hole wafer among Fig. 1.
Fig. 4 is the longitudinal cross-section view along the line A-A ' of resin bonded laminate among Fig. 3.
The longitudinal cross-section view of the cellular construction of Fig. 5 is the schematic illustrations lens board among Fig. 1.
Fig. 6 has been the schematic illustrations longitudinal cross-section view of the moulded pattern state when the moulded resin adhesive layer.
Fig. 7 is the major part cross sectional view that illustrates the step of adhesive glass plate, and wherein glass plate is adhered to through hole wafer among Fig. 2 by resin bonded laminate.
Fig. 8 is the major part cross sectional view that illustrates polishing step, and wherein the through hole wafer among Fig. 2 is from surface finish thereafter.
Fig. 9 illustrates the major part cross sectional view that forms the first step of through hole in the rear surface of the through hole wafer in Fig. 2.
Figure 10 illustrates the major part cross sectional view that forms second step of through hole in the rear surface of the through hole wafer in Fig. 2.
Figure 11 illustrates the major part cross sectional view that forms the step of insulation film in the rear surface of the through hole wafer in Fig. 2.
Figure 12 is the major part cross sectional view that illustrates the step of stacked metal line material on the rear surface of the through hole wafer in Fig. 2.
Figure 13 is the major part cross sectional view that the rear surface that illustrates the through hole wafer in Fig. 2 forms the step of metal line material.
Figure 14 illustrates the major part cross sectional view that forms the step of solder resist in the rear surface of the through hole wafer in Fig. 2.
Figure 15 illustrates the major part cross sectional view that forms the step of soldered ball in the rear surface of the through hole wafer in Fig. 2.
Figure 16 illustrates the major part cross sectional view of using pressing mold (stamper) to make the step of lens arra of the present invention.
Figure 17 is the major part cross sectional view that illustrates the step of a plurality of lens array plates among bonding Figure 18.
Figure 18 is the exemplary diagram list structure that illustrates the electronic message unit of the embodiment of the invention 2 of having used solid-image capturing device, and solid-image capturing device is included in the image-capture portion part sensor assembly according to the embodiment of the invention 1.
The major part cross sectional view of disclosed conventional Optical devices in United States Patent (USP) reference paper 1 that Figure 19 has been a schematic illustrations.
Figure 20 is the major part cross sectional view of disclosed conventional Optical devices in United States Patent (USP) reference paper 2.
Figure 21 is the major part cross sectional view of disclosed conventional Optical devices in United States Patent (USP) reference paper 3.
1 through hole wafer
1A, 1A ' sensor wafer
2 resin bonded laminates
3 glass plates
4 lens boards
The 4a lens resin material
51,52 lens adhesive layers
6 light shield elements
10 sensor assemblies
11 image capturing component
12 through holes
12a photoresist film (resist film)
The 12b insulation film
12c metal line material
The 12d metal line
13 pads
14 insulation films
15 wiring layers (metal line 12d)
16 solder resists
17 soldered balls
21 grooves
22 inner spaces
23 area of space
41 condenser lenses
42 diverging lens
43 aberration correction lens
44 lens area cores
45 peripheral part as distance member
46 patrix patterns
47 counterdie patterns
48f pressing mold initial pattern
48g nickel (Ni) material
48g ' Ni pressing mold
The 48h lens resin material
48i silica (solid-state) and/or separating ball (at interval)
The last pattern pressing mold of 48j
48k, the 48m lens array plate
The 48n adhesive layer
Embodiment
Hereinafter, as embodiment 1, by cutting electronic component wafer module according to the present invention electronic component modular that produces and the manufacture method that is used for electronic component modular, be applied to the sensor assembly of making by cutting sensor wafer module and be used for the manufacture method of sensor assembly, and will describe embodiment 1 with reference to the accompanying drawings in detail.Subsequently, as embodiment 2, use the finished product of this electronic component modular be applied to use according to the sensor assembly of embodiment 1 as the electronic message unit of image-capture portion part or for example using the electronic message unit of other electron component module in information record and the reproduction block, and will describe embodiment 2 with reference to the accompanying drawings in detail.
(embodiment 1)
Fig. 1 is the longitudinal cross-section view that illustrates according to the exemplary basic structure of the sensor assembly of the embodiment of the invention 1.
In Fig. 1, be provided with image capturing component 11 with as electronic component according to the surface of sensor assembly 10 wafer chip of embodiment 1, image capturing component 11 has a plurality of light-receiving members, and they are the photoelectric conversion parts (photodiode) corresponding to a plurality of pixels.Sensor assembly 10 also comprises: what have the through hole wafer penetrates wafer 1, and wherein through hole 12 is arranged between front surface and the rear surface and they are electrically connected; Be formed on the resin bonded laminate 2 of image capturing component 11 peripheries of through hole wafer 1; Play the glass plate 3 of the cover glass effect of covering resin adhesive layer 2; Be arranged on the lens board 4 on the glass plate 3, stacked a plurality of lens boards 41 to 43 on glass plate 3 play the optical element effect that is used for focusing on incident light on image capturing component 11; Be used for bonding and lens adhesive layer 51 and 52 fixed lens plate 41 to 43; With the light shield element 6 that is used for opening wide lens board 41 centers, light shield element 6 is positioned at lens board 41 to 43 tops, as circular light inlet (light intake) and be used to shield the lateral parts of other surface portion and lens board 41 to 43 and glass plate 3.On through hole wafer 1, glass plate 3 and lens board 4 are neat and by bonding top and bottoms such as resin bonded laminate 2, lens adhesive layer 51 and 52 with this ordered pair.Sensor assembly 10 according to embodiment 1 is scribed for thirty years of age by the sensor wafer module of cut crystal level respectively, wherein through hole wafer 1, resin bonded laminate 2, glass plate 3, a plurality of lens board 41 to 43, be bonded together to lens adhesive layer 51 and 52, and subsequently light shield element 6 be attached to the sensor wafer module from the top.
Before the cutting, the sensor wafer module is provided with a plurality of image capturing component 11 (for each image capturing component is provided with a plurality of light-receiving members, they constitute a plurality of pixels), this image capturing component 11 forms matrix on the front surface side of the sensor wafer 1A that is provided with a plurality of through hole wafers 1.The thickness of through hole wafer 1 is in the scope of from 100 to 200 μ m.Illustrated in Fig. 2, a plurality of through holes 12 are arranged to be penetrated into from the rear surface of through hole wafer 1 front surface of pad 13 belows.The sidewall of through hole 12 and rear surface side are insulated film 14 and cover, and the wiring layer 15 that contacts with pad 13 is formed into the rear surface via through hole 12.Solder resist 16 be formed on the wiring layer 15 and the rear surface of through hole 1 on.With regard to the position that on wiring layer 15, forms soldered ball, solder resist 16 formation openings and soldered ball are formed to be exposed to a kind of like this mode in outside.Each layer can form by the technology that is used for conventional semiconductor technology, such as photoetching, etching, gold-plated, CVD method.After cut crystal, sensor base plate (as the sensor chip parts of electronic component chip part) is configured to through hole wafer 1, and sensor base plate has element area.
Resin bonded laminate 2 is formed on the precalculated position on the through hole wafer 1 by common photoetching technique, and glass plate 3 is adhered on the resin bonded laminate 2.Be not limited to this, except photoetching technique, resin bonded laminate 2 can form by method for printing screen or distribution method (dispense method).Resin bonded laminate 2 has formed shallow grooves 21 (air flue) on a part of surface on the side of having fixed glass plate 3, and is graphic as Fig. 3 and Fig. 4 institute.Groove 21 can form by photoetching technique when resin bonded laminate 2 forms simultaneously.The thickness of resin approximately from 30 μ m to 300 mu m ranges, and the degree of depth of groove 21 approximately from 3 μ m to 20 mu m ranges.Use groove 21 to prevent from when semi-conductive surface is sealed by the inner space 22 of glass plate 3 coverings and sensor region, in inner space 22, to form condense (condensation), wherein on through hole wafer 1, be provided with the image capturing component 11 that plays the electronic component effect.Groove 21 also has the structure in the accumulation volume zone 23 (area of storage spaces) in the middle of groove, thereby when the sensor wafer module is cut into each module, cutting fluid (cutting water), slurry etc. will be difficult to enter the inner space 22 of sensor region and be adhered to sensor surface.Be used to form the area of space 22 that is in the semitight state and 23 groove 21 (air flue) and form straight line, S shape, labyrinth shape (groove is the diagonal angle straight line) or their any combination here, so that certain distance is provided.
In addition, resin bonded laminate 2 not only makes wherein the groove 21 that forms be used on each of a plurality of image capturing component 11 area of space 22 being connected to the outside, and makes outside the groove 21 that wherein forms is used for via another area of space 23 that connects with groove 21 area of space 22 is connected to.In addition, for each image capturing component 11 is provided with resin bonded laminate 2, and be arranged on except image capturing component 11 zones the zone in and the zone the cutting area between adjacent image capture element 11.Be not limited to the groove 21 of resin bonded laminate 2, other air flue can be provided.Alternatively, this configuration can be provided with and have the material that can be connected with the inside (having the material of coarse (rough) material granule or water can be outside and the material that passes through between the inside).
Herein, the method that explanation is used to make sensor assembly 10 has the sensor assembly 10 of said structure with manufacturing.
The method that is used to make sensor assembly 10 comprises: form resin bonded laminate 2 around each image capturing component 11 of the sensor wafer 1A with a plurality of image capturing component 11, and glass plate 3 is adhered to step (Fig. 7) on the resin bonded laminate 2, wherein glass plate 3 is cover glass (cover glass); The back side of polishing sensor wafer 1A is thin layer so that form the step (Fig. 8) of the thin sensor wafer 1A ' with predetermined thickness; By using photoresist film 12a to carry out etching,, each sensor chip parts (cutting hole wafer 1) are penetrated into the step (Fig. 9 and Figure 10) that the through hole 12 of pad 13 back is gone up on the surface for forming a plurality of rear surfaces from transducer 1A as mask; Insulation film 12b (Figure 11) is being set on the rear surface of sensor wafer 1A ', is forming metal line material film 12c on the insulation film 12b and on the rear surface of sensor wafer 1A ', forming the step of metal line 12d (Figure 12 and Figure 13), metal line 12d through pad 13 cablings to through hole 12; Forming solder resist 16 on the wiring layer 15 and on the rear surface at wafer, and to the step (Figure 14) of part opening with the soldered ball of formation solder resist 16, wherein wiring layer 15 is metal line 12d; On wiring layer 15, form the step (Figure 15) of soldered ball 17; Use the distance member of lens area periphery, the lens board 4 of forming one or more resin lens is bonded in the lip-deep step of glass plate 3; Cut stacked sensor wafer 1A ', glass plate 3 and lens board 4 simultaneously, obtain the step of one or more sensor chip parts (through hole wafer 1); And the step (Fig. 1) that at least one cutting part, forms light shield element 6.
Herein, by detailed description being divided into step (1) to (5), to be each chip manufacturing sensor assembly 10, the lens array plate of sheet moulding is by forming with the form of array a plurality of lens with distance member (edge member) that are coupled at the periphery of lens area from the lens array plate of making the sheet moulding in explanation.
(1) step (step S1) of formation nickel (Ni) pressing mold (stamper)
At first, as a kind of method that is used to make the initial pattern of pressing mold, on glass or metallic plate, accurately cut and process a plurality of patterns.
On pressing mold initial pattern 48f, electroplate and shift pressing mold initial pattern 48f surface by electrical forming with nickel (Ni) material 48g.As metal lens pattern, formed nickel pressing mold 48g ' (lens shape) with meticulous demoulding.Measure measuring of pressing mold essential part and be used for checking, and carry out emulation and feed back to the moulded section step to prevent that measuring machine from can move bad and providing.
(2) step (step S2) of formation lens array plate
Next, as graphic among Figure 16, use pressing mold 48g ' to be applied to bottom pattern pressing mold 48g ' as bottom pattern pressing mold 48g ' and with lens resin material 48h.Silica (silica) (nanometer silica) is included among the lens resin material 48h and does not worsen as filler and transmissivity, so that keep lens shape.Use bilateral pressue device (not shown),, keep being applied to the lens resin material 48h of bottom pattern pressing mold 48g ', so that with the thickness of High Accuracy Control lens blooming with the top pattern pressing mold 48j that the mode that is similar to bottom pattern pressing mold 48g ' is made.In addition, use the bilateral pressue device, top pattern pressing mold 48j and bottom pattern pressing mold 48g ' are separated from each other so that the demoulding and shift out lens array plate 48k, and lens array plate comprises the resin lens of coupling.The lens arra 48k that shifts out is carried out thermal annealing with softening internal stress, and form lens array plate 48k.Measure measuring of lens array plate 48k essential part and be used for checking, and carry out the emulation of measuring to prevent based on the measurement function operation of lens array plate 48k amount of contraction bad (for example, shrinking).So, provide and feed back to the step that the optical design system is used to form main mould, thus the design of main mould 48a and to measure can be correctable.
(3) step (step S3) of formation lens array plate
In addition, as graphic among Figure 17, polytype lens arra is with only integrated by a plurality of lens of making through the moulded lens resin, and promptly lens array plate 48k and lens array plate 48m align mutually and be bonding mutually.Play the solid silica of interval action and/or the resin space that separating ball 48i keeps adhesive layer 48n equably herein.
(4) Gou Zao step (step S4)
Formed the lens element of combination by bonding multiple lens array plate (by being connected the plate that a plurality of lens with edge member of sheet form form) such as lens array plate 48k and lens array plate 48m, and the lens element of combination on glass plate to align corresponding to the mode at each center of image capturing component 11 and bonding.As a result, formed the electronic component wafer module of wafer scale.
Herein, viscous resin layer 2 is adhered on the precalculated position of glass plate 3 in advance by silk screen printing.In addition, determined exactly by transmission parts the compound lens element on glass plate 3 in the location of X and Y direction, transmission parts transmits the compound lens element on the glass plate 3 with alignment mark as a reference, and the compound lens element is provided on the glass plate 3.
(5) Gou Zao step (step S5)
Silicon, the glass material of glass plate 3 and the lens resin material of compound lens element of forming through hole wafer 1 (sensor wafer 1A), all stacked and be integrated into the electronic component wafer module of wafer scale, they are cut by line or the laser emission cutting together.
According to embodiment 1, no longer need conventional installation base plate, substrate or interval with said structure.Therefore, reduced and be used to make their man-hour and be used for installation elements and insert man-hour at interval.In addition, reduced the height of each module and meticulous precision and quality can be provided.
(embodiment 2)
Figure 18 is the exemplary diagram list structure that illustrates the electronic message unit of the embodiment of the invention 2 of having used solid-image capturing device, and solid-image capturing device is included in the image-capture portion part sensor assembly according to the embodiment of the invention 1.
In Figure 18, comprise: be used for carrying out various signal processing so that obtain the solid-image capturing device 91 of color picture signal from image lock-on signal according to the sensor assembly 10 of embodiment 1 according to the electronic message unit 90 of embodiments of the invention 2; The color picture signal from solid-image capturing device 91 is carried out after the predetermined signal processing memory member 92 of this color picture signal of data record (for example, recording medium) for record; For demonstration the color picture signal from solid-image capturing device 91 is carried out after the predetermined signal processing, be used for going up the display unit 93 (for example, color liquid crystal display arrangement) that shows this color picture signal at display screen (for example, LCDs); For transmission the color picture signal from solid-image capturing device 91 is carried out after the predetermined signal processing, transmit the communication component 94 (for example, send and receiving device) of this color picture signal; And carry out after the predetermined signal processing for printing, print image output device 95 from the color picture signal of solid-image capturing device 91.Thereby, can comprise memory member 92, display unit 93, communication component 94 and image output device 95 according to the electronic message unit 90 of embodiment 2.Without any restriction, electronic message unit can comprise any at least parts in these parts to this.
As electronic message unit 90, can envision electronic message unit with image entering apparatus, such as digital camera (for example, digital video camera and digital quiet shooting camera), the mobile telephone equipment of image input camera (for example monitoring camera, door-phone camera, in-vehicle camera and TV camera), scanner, facsimile machine and outfit camera.
Therefore, according to embodiments of the invention 2, color picture signal from solid-image capturing device 91 can be: be presented on the display screen by display unit 93 subtly, use image output device 95 and on paper, print the communication data that transmits exactly as using the communication component 94 wired or wireless electricity of process; Be stored in memory member 92 places exactly by carrying out the tentation data compression to handle; And can carry out various data processing exactly.
In addition, to as mentioned above according to the electronic message unit 90 of embodiment 2 without limits, electronic message unit can for example be the pick device of use electronic component modular of the present invention in information record and reproduction block.Under such a case, the optical element of pick device is to be used for linear advancement and emitting output light, and optical functional element (for example, hologram optical element) crooked in a predetermined direction and the guiding incident light.In addition, the electronic component of pick device has radiated element (for example, semiconductor Laser device or laser chip) that is used to generate emergent light and the light receiving element (for example, optic integrated circuit) that is used to receive incident light.
Although undeclared in the foregoing description 1, IR (infrared ray) coating or AR (antireflection) coating can be arranged on the surface of the glass plate 3 that plays the effect of transparency cover element.The IR coated film is the coated film of reflected infrared ray.The AR coated film is an antireflective film.
As mentioned above, by using preferred embodiment 1 to 2 illustration the present invention.Yet the present invention should not be interpreted as only based on the foregoing description 1 to 2.It will be appreciated that category of the present invention only should be interpreted as based on claim.It will be appreciated that also based on explanation of the present invention and from the common practise of the explanation of detailed preferred embodiment 1 to 2 of the present invention, those skilled in the art can implement the technical scope of equivalence.And, it will be appreciated that any patent of quoting in this specification, any patent application and any list of references Ying Yiyu herein specially the identical mode of content in the explanation integrated with this specification by quoting.
Industrial usability
The present invention can be applicable to following field: electronic component wafer module, electronic wafer module, biography Sensor wafer module, sensor assembly and sensor assembly manufacture method, lens array plate and electricity Sub-information equipment. Electronic component wafer module be by with a plurality of lens for focusing on incident light with Image capturing component modularization (integrated) and form, this image capturing component is saturating corresponding to each Mirror and have a plurality of be used to carrying out opto-electronic conversion and catching light reception section from the image light of object Part; Or by with a plurality of be used to making emergent light straight ahead and in a predetermined direction crooked and guiding The optical functional element of incident light and radiated element and the light reception element that is used for receiving incident light Modularization (integrated) and form, corresponding each optical functional element of this radiated element also generates Penetrate light. Made electronic component modular by the cutting electronic components wafer module. Sensor wafer Module is by the image capturing component that will have a plurality of light-receiving members and lens module (collection Become) and form, light-receiving member is used for carrying out opto-electronic conversion and catches image light from object, Lens are used for incident light is formed image in image capturing component. Sensor assembly is by cutting Cutting the sensor wafer module forms. Use lens array plate to be used for sensor assembly. E-mail Breath equipment comprises: for example, and digital camera (for example, digital video camera and digital quiet bat Camera), image input camera (for example, in-vehicle camera), scanner, facsimile machine, outfit phase The mobile phone equipment of machine and personal digital assistant (PDA), it uses the sensor assembly conduct Use in the image input equipment that in the image-capture portion part, uses or the information recording and reconstruction parts Electronic component modular pick up device. According to the present invention, when making a large amount of module simultaneously, do not have As used as in the past the installation base plate that is used for installing electronic elements, the substrate that is used for mounted lens and The interval. As a result, reduced man-hour for the manufacture of installation base plate, substrate or interval. To no longer need To be used for the optics element being installed or being used for mounted lens and clipping room in substrate at installation base plate Every equipment and the man-hour that relates to this equipment, significantly reduced thus for the manufacture of man-hour. In addition because no longer need installation base plate or substrate, can control the height that subtracts thin each module and The thickness that also has whole lens element has been realized processing accuracy and quality thus attentively.
In addition, do not use conventional substrate. Alternatively, used the focusing lens, for example, by Be used for the resin molded technology of resin molded lens and the focusing lens that accurately form, it plays optics The element effect. As a result, can be accurate at the interval parts (edge member) of the periphery that focuses on lens The space is guaranteed on ground.
In addition, because the present invention forms lens simultaneously, unique problem can be the change of each lens sizes Moving. As a result, this precision on the vertical direction (z direction) can be very high.
In addition, if a plurality of electronic components of electronic component wafer each around with the semitight shape Attitude (passage that for example, is formed by groove and the binder resin with gas permeability) forms resin Bonding layer even if in a single day water enter the space part of a plurality of electronic components, can pass through this semitight The air path of state (passage that for example, is formed by groove and the bonding tree that possesses gas permeability Fat) control or prevent that these water from forming and condense, kept thus good quality. In the case, Might improve processing accuracy and quality.
In addition, no longer need conventional installation base plate, thereby might make chip size (optics Component size) module is thus also so that the installation region minimumization.
Those skilled in the art is as can be known clear and definite and can carry out easily various other modifications, and Do not leave category and the aim of this aspect. Therefore, be not the intention model of claims herein Limit in explanation as described herein on the farmland, but claim will be by extensive interpretation.
Claims (35)
1. electronic component wafer module comprises:
Be furnished with the electronic component wafer of a plurality of electronic components that possess through hole electrode;
Be formed on the resin bonded laminate in the presumptive area on the electronic component wafer;
The overlay electronic element wafer also is fixed on transparency cover element on the resin bonded laminate; With
A plurality of resin optical components, it is bonding and be fixed on the transparency cover element and integrated in the mode corresponding to corresponding a plurality of electronic components.
2. electronic component wafer module comprises:
Be furnished with the electronic component wafer of a plurality of electronic components that possess through hole electrode;
A plurality of electronic components of electronic component wafer each around the resin bonded laminate that forms with the semitight state;
The overlay electronic element wafer also is fixed on transparency cover element on the resin bonded laminate; With
Be mounted to bonding and be fixed to a plurality of optical elements on the transparency cover element in mode corresponding to corresponding a plurality of electronic components.
3. electronic component wafer module according to claim 1 and 2, wherein a plurality of optical elements are integrated to be configured.
4. electronic component wafer module according to claim 1 and 2, wherein at the periphery of plan view core, the adhesive layer that a plurality of optical elements are inserted between optical element is laminated in.
5. electronic component wafer module according to claim 1 and 2, the adhesive layer that wherein is used for bonding optical element also has the light shield function.
6. electronic component wafer module according to claim 1 and 2 is used for wherein determining that the solid in space is comprised in the adhesive layer that is used for bonding optical element.
7. electronic component wafer module according to claim 1 and 2, wherein optical element comprises one or more lens.
8. electronic component wafer module according to claim 7, wherein lens are provided with lens area and are provided with the distance member of predetermined thickness at the lens area periphery at core.
9. electronic component wafer module according to claim 7, wherein lens are condenser lenses.
10. electronic component wafer module according to claim 1 and 2, wherein lens are aberration correction lens, diverging lens and condenser lens, and have predetermined thickness and be arranged on the distance member of each lens perimeter stacked by the order of aberration correction lens, diverging lens and condenser lens.
11. electronic component wafer module according to claim 8, wherein distance member has the position and determines function.
12. electronic component wafer module according to claim 11, wherein the position of distance member determines that function is to be formed by recessed portion with tapering or alignment mark and projection.
13. electronic component wafer module according to claim 1 and 2, wherein optical element is to be used to make emergent light straight ahead, and the optical functional element of crooked incident light to allow that it enters along predetermined direction.
14. electronic component wafer module according to claim 1 and 2, wherein resin bonded laminate has groove, and this groove shaped becomes the space segment on each in a plurality of electronic components is communicated to the outside.
15. electronic component wafer module according to claim 1 and 2, wherein resin bonded laminate has groove, and this groove shaped becomes by other space segment and is communicated with the outside, is communicated with by the space segment on each in groove and a plurality of electronic components.
16. electronic component wafer module according to claim 1 and 2, wherein resin bonded laminate is set, and resin bonded laminate is arranged on also in the zone that is different from the electronic component zone and is different from the zone of the cutting area between the adjacent electronic elements in a plurality of electronic components each.
17. electronic component wafer module according to claim 14, its further groove forms diagonal angle straight line, S shape or labyrinth shape with respect to the quadrangle edge direction of resin bonded laminate in the plan view.
18. electronic component wafer module according to claim 15, its further groove forms diagonal angle straight line, S shape or labyrinth shape with respect to the quadrangle edge direction of resin bonded laminate in the plan view.
19. electronic component wafer module according to claim 1 and 2, wherein resin bonded laminate has the material configuration that can be connected with inside on meaning in kind.
20. electronic component wafer module according to claim 1 and 2, wherein the transparency cover element is transparent resin plate or glass plate.
21. electronic component wafer module according to claim 1 and 2, wherein the transparency cover element is provided with IR (infrared ray) coating or AR (antireflection) coating from the teeth outwards.
22. electronic component wafer module according to claim 1 and 2, wherein electronic component has image capturing component, and it possesses and is used to carry out opto-electronic conversion and catches a plurality of light-receiving members from the image light of object.
23. electronic component wafer module according to claim 1 and 2, wherein electronic component has the light receiving element that is used to generate the radiated element of emergent light and is used to receive incident light.
24. electronic component modular that will cut into single or multiple groups according to the electronic component wafer module of claim 1 or 2.
25. electronic component modular according to claim 24, wherein the cutting side of electronic component modular has the light shield function or has installed the light shield function.
26. a sensor wafer module comprises:
Be furnished with the sensor wafer of a plurality of sensor chip parts that possess through hole electrode;
Be formed on the resin bonded laminate in the presumptive area on the sensor wafer;
The covering sensor wafer also is fixed on transparency cover element on the resin bonded laminate; With
Be mounted to bonding and be fixed to a plurality of resin focusing lens array plates on the transparency cover element in mode corresponding to corresponding a plurality of image capturing component,
Each of wherein a plurality of sensor chip parts is provided with the image capturing component that possesses a plurality of light-receiving members, and light-receiving member is used to carry out opto-electronic conversion and catches image light from object.
27. a sensor wafer module comprises:
Be furnished with the sensor wafer of a plurality of sensor chip parts that possess through hole electrode;
A plurality of electronic components of sensor wafer each around the resin bonded laminate that forms with the semitight state;
The covering sensor wafer also is fixed on transparency cover element on the resin bonded laminate; With
Be mounted to bonding and be fixed to a plurality of condenser lenses on the transparency cover element in mode corresponding to corresponding a plurality of electronic components.
Wherein as electronic component, the sensor chip parts are provided with the image capturing component that possesses a plurality of light-receiving members, and light-receiving member is used to carry out opto-electronic conversion and catches image light from object.
28. sensor assembly that will cut into single or multiple groups according to the sensor wafer module of claim 26 or 27.
29. a method that is used to make sensor assembly comprises the following steps:
Form resin bonded laminate on around each of a plurality of image capturing component that are furnished with a plurality of sensor chips;
Cover glass is adhered on the resin bonded laminate;
The back side of attenuate sensor wafer;
For each sensor chip forms a plurality of through holes, described through hole is penetrated into front surface and arrives the pad rear surface from the rear surface of sensor wafer;
On the rear surface of sensor wafer, form wiring through through hole;
Distance member place at the lens area periphery of each resin lens plate is adhered to one or more resin lens plates on the cover glass surface;
Cut sensor wafer, cover glass and lens simultaneously and form one or more sensor chip parts; And
On at least one cutting part, form light shielding layer.
30. a method that is used to make sensor assembly comprises the following steps:
Form the resin bonded laminate of semitight state around each in a plurality of image capturing component of the sensor wafer that is furnished with a plurality of sensor chip parts;
Cover glass is adhered on the resin bonded laminate;
The back side of attenuate sensor wafer;
For each sensor chip parts forms a plurality of through holes, described through hole is penetrated into front surface and arrives the pad rear surface from the rear surface of sensor wafer;
On the rear surface of sensor wafer, form wiring through through hole;
One or more lens boards are adhered on the surface of cover glass;
Cut sensor wafer, cover glass and lens simultaneously and form one or more sensor chip parts; And
On at least one cutting part, form light shielding layer.
31. according to claim 29 or the 30 described methods that are used to make sensor assembly, wherein cutting step uses laser or wire cutting machine.
32. an electronic message unit, it uses the sensor assembly of electronic component modular conduct the image-capture portion part that cuts from the electronic component wafer module according to claim 22.
33. an electronic message unit, it uses the electronic component modular that cuts from the electronic component wafer module according to claim 23 in information record and reproduction block.
34. a sheet form lens array plate comprises a plurality of lens, each lens is provided with lens area and is provided with the distance member of predetermined thickness at the lens area periphery at core, and these a plurality of lens are integrated in the matrix.
35. an electronic component wafer module comprises:
Be furnished with the electronic component wafer of a plurality of electronic components that possess through hole electrode;
A plurality of electronic components of electronic component wafer each around the resin bonded laminate that forms with the semitight state; With
The overlay electronic element wafer also is fixed on transparency cover element on the resin bonded laminate.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-322627 | 2007-12-13 | ||
| JP2007322626A JP4891214B2 (en) | 2007-12-13 | 2007-12-13 | Electronic element wafer module, electronic element module, sensor wafer module, sensor module, lens array plate, sensor module manufacturing method, and electronic information device |
| JP2007-322626 | 2007-12-13 | ||
| JP2007322627 | 2007-12-13 | ||
| JP2007322626 | 2007-12-13 | ||
| JP2007322627A JP4800291B2 (en) | 2007-12-13 | 2007-12-13 | Method for manufacturing sensor module and method for manufacturing electronic information device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101459165A true CN101459165A (en) | 2009-06-17 |
| CN101459165B CN101459165B (en) | 2011-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810181800.2A Expired - Fee Related CN101459165B (en) | 2007-12-13 | 2008-12-12 | Electronic component wafer module, manufacturing method thereof and electronic information device |
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| Country | Link |
|---|---|
| JP (1) | JP4891214B2 (en) |
| CN (1) | CN101459165B (en) |
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| CN102193115A (en) * | 2010-03-10 | 2011-09-21 | 富士胶片株式会社 | Wafer lens array and method for manufacturing the same |
| CN103219343A (en) * | 2012-01-23 | 2013-07-24 | 奥普蒂兹公司 | Multi-layer polymer lens and method of making same |
| CN103858230A (en) * | 2011-08-10 | 2014-06-11 | 七边形微光学私人有限公司 | Optoelectronic module and method for producing the same |
| CN104272143A (en) * | 2012-05-11 | 2015-01-07 | 柯尼卡美能达株式会社 | Imaging device, lens array laminate and manufacturing method thereof |
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2007
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Also Published As
| Publication number | Publication date |
|---|---|
| JP4891214B2 (en) | 2012-03-07 |
| CN101459165B (en) | 2011-05-04 |
| JP2009147092A (en) | 2009-07-02 |
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