CN101453839B - Printed circuit board and making method thereof - Google Patents
Printed circuit board and making method thereof Download PDFInfo
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- CN101453839B CN101453839B CN 200710171718 CN200710171718A CN101453839B CN 101453839 B CN101453839 B CN 101453839B CN 200710171718 CN200710171718 CN 200710171718 CN 200710171718 A CN200710171718 A CN 200710171718A CN 101453839 B CN101453839 B CN 101453839B
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Abstract
The invention discloses a method for manufacturing a printed circuit board. The method comprises the following steps: manufacturing at least one hollow and sealed optical channel structural member with one size according to sizes of optical fiber interconnection, wherein the optical channel structural member is used to embed an optical fiber; manufacturing a first stack layer which comprises at least one layer of a substrate sheet of the printed circuit board; forming at least one opening in the first stack layer; placing the optical channel structural members with different sizes into corresponding openings in the first stack layer; forming a second stack layer which comprises at least one layer of the substrate sheet of the printed circuit board on the stacks of the first stack layer; and forming an optical fiber inlet and an optical fiber outlet which are communicated with the optical channel structural members respectively at both ends facing to the optical channel structural member of the first stack layer on the second stack layer. The invention also provides the printed circuit board. The optical channel structural members are embedded in stack layers; and the optical fiber is embedded after manufacturing the printed circuit board to conduct optical connection. The printed circuit board prevents the process technology of the printed circuit board from influencing the optical fiber.
Description
Technical field
The present invention relates to printed circuit board (PCB), relate in particular to optical fiber flush type printed circuit board (PCB) and preparation method thereof.
Background technology
Printed circuit board (PCB) (PCB) is the basic components that connect electronic component.PCB is made of multilayer board matrix substrate and the conductor layer between each layer printed circuit board matrix substrate.Described multilayer board matrix substrate is as electric insulation and mechanical support, and conductor layer is used for to the signal of telecommunication interconnection between power supply of the electronic unit on the PCB or electronic unit.
Along with generation information equipment towards ultra broadband, at a high speed, the development of big capacity and low-power consumption, the shortcoming of signal of telecommunication interconnection displays gradually, such as when the transmit high-speed signals, shortcomings such as signal can produce shake, delays time, crosstalks, skewed clock, anti-interference difference, so will further improve the transmission bandwidth of signal, must break through " electronics " bottleneck of electrical transmission.
Light is as information carrier, has very high bandwidth, and advantage such as have little, the no cross-talk of distorted signals, no clock skew, energy consumption is low, transmission range is long, interconnection density is high, antijamming capability is strong, optical interconnection technology such as the highdensity optical fiber network back board of bandwidth have obtained application in the multimachine optical interconnection.Using optical fiber on traditional pcb board is to connect at pcb board surface optical patchcord, and volume is big but the pcb board that adopts this technology to form takes up room, and is unfavorable for the interconnection of high density light.
Prior art also discloses and another kind of optical fiber to be integrated in technology on the PCB.Be illustrated with reference to Fig. 1, be made of printed circuit board (PCB) matrix substrate 220,210,208,206,204,214 successively on the printed circuit board (PCB) 200, printed circuit board (PCB) matrix substrate 210,208,206,204 constitutes the structural core of bracing or strutting arrangement.Between printed circuit board (PCB) matrix substrate 210 and 220 and printed circuit board (PCB) matrix substrate 220 lower surfaces be formed with lead 218 and 222; Between printed circuit board (PCB) matrix substrate 204 and printed circuit board (PCB) matrix substrate 214 and the upper surface of printed circuit board (PCB) matrix substrate 214 be formed with lead 212 and 216.Between printed circuit board (PCB) matrix substrate 206 and printed circuit board (PCB) matrix substrate 204, be formed with optical fiber 224, in the optics 226 and 228 positions that face toward on the printed circuit board (PCB) 200, in printed circuit board (PCB) matrix substrate 214 and 204, be formed with optical channel 230,232, optics 226 links to each other with optical fiber 224 by optical channel 230,232 with 228, and simultaneously optical redirector 234 and 236 is used for the light that optical channel 230 and 232 receives from optical fiber 224 being turned to the PCB surface and being used for the light from optical channel 230 and 232 is turned to into optical fiber 224.
In being 200480027102 Chinese patent application, application number can also find more information relevant with technique scheme.
In technique scheme, directly optical fiber is imbedded among the PCB, yet pcb board needs to experience lamination, mask-making technology such as spray tin etc. before application, and technologies such as electronics assembling such as reflow soldering, have influence on the optical fiber properties of direct implantation easily.
Summary of the invention
The problem that the present invention solves provides a kind of printed circuit board (PCB) and preparation method thereof of optical fiber flush type of high density parallel optical interconnecting.
For addressing the above problem, the invention provides a kind of manufacture method of printed circuit board (PCB), comprise the steps: size according to optical fiber interconnections, make the hollow of at least a size and the light channel structure spare of sealing, described light channel structure spare is used for built-in fiber; Making comprises first stack layer of at least one layer printed circuit board matrix substrate; Form at least one first opening in first stack layer, the size of described first opening is corresponding with light channel structure spare Outside Dimensions to be inserted; Different size light channel structure spare correspondence is inserted in first opening in first stack layer; Piling up second stack layer that formation comprises at least one layer printed circuit board matrix substrate on first stack layer; Repeat above-mentioned steps, be included in and form at least one second opening on second stack layer, insert the light channel structure spare correspondence of different size in all second openings in second stack layer and on second stack layer, form the 3rd stack layer step; Until forming at least one n opening on the n stack layer, the light channel structure spare correspondence of different size is inserted in the n opening in the n stack layer and form the n+1 stack layer on the n stack layer, described n is a natural number; On the n+1 stack layer, face toward first stack layer, second stack layer ... the end positions of the light channel structure spare of n stack layer forms optical fiber access port and the optical fiber exit that is connected with light channel structure spare respectively.
Alternatively, described printed circuit board (PCB) matrix substrate is the synthetic material of glass fibre and resin, and the light channel structure spare of described hollow and sealing is for breathing freely but impermeable resin structure.
Alternatively, described light channel structure spare is made of light channel structure spare main body and cover plate, and the roughness of contact-making surface is less than 1 micron between described light channel structure spare main body and the cover plate.
Alternatively, described light channel structure spare is high pressure resistant, high temperature resistant and the corrosion resistance material.
Alternatively, described light channel structure spare is metal or resin material.
Alternatively, light channel structure spare is inserted in first stack layer, second stack layer ... first opening of n stack layer, second opening ... also comprised before in the n opening outer surface of light channel structure spare is made alligatoring, cleaning and dried step.
Alternatively, described size according to the light interconnection is determined the size of light channel structure spare, comprises the total optical fiber cable footpath and the space transmission range of light interconnection.
Alternatively, described optical fiber access port and optical fiber exit adopt milling technology to form.
Alternatively, in described optical fiber access port and the optical fiber exit and the bending radius of light channel structure spare inner fiber be not less than 3mm.
Alternatively, light channel structure spare is inserted in first stack layer, second stack layer ... first opening of n stack layer, second opening ... also comprised first stack layer, second stack layer before in the n opening with light channel structure spare, optical fiber access port and position, optical fiber exit ... electric isolation processing step is done on conductor layer and stratum in the n+1 stack layer.
Alternatively, described isolation processing comprises the electric conducting material of removing all light channel structure spares, optical fiber access port and optical fiber exit position conductor layer and stratum.
Alternatively, after forming optical fiber access port and optical fiber exit, also be included in and assemble electric component, photoelectric conversion part and electric light converting member step on the printed circuit board (PCB).
Alternatively, also comprise optical fiber is implanted in the light channel structure spare.
Alternatively, also being included in the optical fiber access port links to each other the electric light converting member and the step that photoelectric conversion part linked to each other with optical fiber in the optical fiber exit with optical fiber.
The present invention also provides a kind of manufacture method of printed circuit board (PCB), comprises the steps: the size according to optical fiber interconnections, makes the hollow of at least a size and the light channel structure spare of sealing, and described light channel structure spare is used for built-in fiber; Making comprises first stack layer of at least one layer printed circuit board matrix substrate; Form at least one opening in first stack layer, the size of described first opening is corresponding with light channel structure spare Outside Dimensions to be inserted; Different size light channel structure spare correspondence is inserted in the opening in first stack layer; Piling up second stack layer that formation comprises at least one layer printed circuit board matrix substrate on first stack layer; The end positions that faces toward the light channel structure spare of first stack layer on second stack layer forms optical fiber access port and the optical fiber exit that is connected with light channel structure spare respectively.
Alternatively, described printed circuit board (PCB) matrix substrate is the synthetic material of glass fibre and resin, and the light channel structure spare of described hollow and sealing is for breathing freely but impermeable resin structure.
Alternatively, described light channel structure spare is made of light channel structure spare main body and cover plate, and the roughness of contact-making surface is less than 1 micron between described light channel structure spare main body and the cover plate.
Alternatively, described light channel structure spare is high pressure resistant, high temperature resistant and the corrosion resistance material.
Alternatively, described light channel structure spare is metal or resin material.
Alternatively, also comprised before in light channel structure spare being inserted the first stack layer split shed outer surface of light channel structure spare is made alligatoring, cleaning and dried step.
Alternatively, described size according to the light interconnection is determined the size of light channel structure spare, comprises the total optical fiber cable footpath and the space transmission range of light interconnection.
Alternatively, described optical fiber access port and optical fiber exit adopt milling technology to form.
Alternatively, in described optical fiber access port and the optical fiber exit and the bending radius of light channel structure spare inner fiber be not less than 3mm.
Alternatively, before light channel structure spare being inserted the first stack layer split shed, also comprise conductor layer in first stack layer of light channel structure spare, optical fiber access port and position, optical fiber exit and stratum are done electric isolation processing step.
Alternatively, described isolation processing comprises the electric conducting material of removing all light channel structure spares, optical fiber access port and optical fiber exit position conductor layer and stratum.
Correspondingly, the present invention also provides a kind of printed circuit board (PCB), comprising: first stack layer, second stack layer that contain at least one layer printed circuit board matrix substrate ... the n+1 stack layer; Also comprise: lay respectively in first stack layer, second stack layer ... at least one first opening in the n stack layer, second opening ... the n opening, and lay respectively at first opening, second opening ... the hollow in the n opening and the light path structural member of semitight, described n is a natural number, and described light path structural member is relevant with the size of optical fiber interconnections; Be positioned on the n+1 stack layer respectively facing to first stack layer, second stack layer ... optical fiber access port that is connected with light channel structure spare and optical fiber exit that the end positions of the light channel structure spare in the n stack layer forms.
Alternatively, described printed circuit board (PCB) matrix substrate is the synthetic material of glass fibre and resin, and the light channel structure spare of described hollow and sealing is for breathing freely but impermeable resin structure.
Alternatively, described light channel structure spare is made of light channel structure spare main body and cover plate, and the roughness of contact-making surface is less than 1 micron between described light channel structure spare main body and the cover plate.
Alternatively, described light channel structure spare is high pressure resistant, high temperature resistant and the corrosion resistance material.
Alternatively, described light channel structure spare is metal or resin material.
Alternatively, described light channel structure spare and first stack layer, second stack layer ... conductor layer in the n stack layer and stratum electricity mutually isolate, and first stack layer, second stack layer ... optical fiber access port in the n stack layer and optical fiber exit and first stack layer, second stack layer ... conductor layer in the n stack layer and stratum electricity isolation mutually.
Alternatively, in described optical fiber access port and the optical fiber exit and the bending radius of optical fiber in the light channel structure spare be not less than 3mm.
Alternatively, the size of described optical fiber interconnections comprises the total optical fiber cable footpath and the space transmission range of light interconnection.
Compared with prior art, the technical program has the following advantages: by piled up embedding light channel structure spare in the stack layer that forms by the printed circuit board (PCB) matrix substrate, after finishing the printed circuit board (PCB) processing procedure, implant optical fiber to do the light interconnection, prevented of the influence of printed circuit board (PCB) making technology optical fiber property.
Compare with the direct wire jumper connection in traditional optical fiber connector surface,, can cooperate the photoelectric device of high-performance, low-power consumption to be implemented in the interior high density interconnect of small space owing to adopted the version of imbedded fiber path.
Description of drawings
Fig. 1 is the embedding optical fiber printed circuit board arrangement schematic diagram of prior art;
Fig. 2 is the schematic flow sheet of the embodiment of formation printed circuit board (PCB) of the present invention;
Fig. 3 is the light channel structure spare perspective view of one embodiment of the present of invention;
Fig. 4 is the light channel structure spare perspective view of an alternative embodiment of the invention;
Fig. 5 is the layout of light channel structure spare in printed circuit board (PCB) of one embodiment of the present of invention;
Fig. 6 to Fig. 8 is the structural representation of the formation printed circuit board (PCB) of one embodiment of the present of invention;
Fig. 9 is along the generalized section of B-B ' direction among Fig. 8;
Figure 10 to Figure 12 is the structural representation of the formation printed circuit board (PCB) of another embodiment of the present invention;
Figure 13 is the generalized section of Figure 12 along C-C ' direction;
Figure 14 is the schematic diagram of the printed circuit board (PCB) of finishing electricity assembling and optical interconnection of one embodiment of the present of invention.
Embodiment
The present invention is being piled up embedding light channel structure spare in the stack layer that forms by the printed circuit board (PCB) matrix substrate, implant optical fiber to do the light interconnection after finishing the printed circuit board (PCB) processing procedure, has prevented that the printed circuit board (PCB) making technology from exerting an influence to optical fiber property.
With reference to figure 2, the invention provides a kind of schematic flow sheet of embodiment of printed circuit board (PCB), comprise the steps: execution in step S101, according to the size of optical fiber interconnections, make the hollow of at least a size and the light channel structure spare of sealing, described light channel structure spare is used for built-in fiber; Execution in step S102 makes first stack layer that comprises at least one layer printed circuit board matrix substrate; Execution in step S103 forms at least one first opening in first stack layer, the size of described first opening is corresponding with light channel structure spare Outside Dimensions to be inserted; Execution in step S104 inserts different size light channel structure spare correspondence in first opening in first stack layer; Execution in step S105 is piling up second stack layer that formation comprises at least one layer printed circuit board matrix substrate on first stack layer; Execution in step S106, repeat above-mentioned steps, be included in and form at least one second opening on second stack layer, insert the light channel structure spare correspondence of different size in all second openings in second stack layer and on second stack layer, form the 3rd stack layer step; Until forming at least one n opening on the n stack layer, the light channel structure spare correspondence of different size is inserted in the n opening in the n stack layer and form the n+1 stack layer on the n stack layer, described n is a natural number; Execution in step S107 faces toward first stack layer, second stack layer on the n+1 stack layer ... the end positions of the light channel structure spare of n stack layer forms optical fiber access port and the optical fiber exit that is connected with light channel structure spare respectively.
Below in conjunction with accompanying drawing embodiments of the invention are described, in the present embodiment, in order to clearly demonstrate the manufacture method of printed circuit board (PCB), n is taken as 1.
At first, with reference to Fig. 3, be the perspective view of the light channel structure spare of one embodiment of the present of invention.Described light channel structure spare 100 is hollow and hermetically-sealed construction, described hollow and sealing are meant that light channel structure spare 100 is seen as sealing from mechanical angle, but be seen as ventilative but impermeable external resin structure from microstructure, with guarantee follow-up when carrying out laminating technology air can discharge, but guarantee to have resin to flow into and blocking channel again.As shown in Figure 3, shown in light channel structure spare 100 have two ends 100a and 100b, these two ends 100a and 100b can be removed the structure that makes light channel structure spare 100 become the hollow two open ends in the time of follow-up formation optical fiber access port and light exit.
Fig. 4 provides the perspective view of the light channel structure spare of another embodiment of the present invention, the light channel structure spare of present embodiment 101 is made of two parts, comprise light channel structure spare main body 101a and cover plate 10b, light channel structure spare main body 101a is used to place optical fiber, and cover plate 101b is covered on the light channel structure spare main body.Printed circuit half matrix substrate forms for the synthetic material by laminated glass fiber and resin, because resin belongs to the macromolecular structure material, and has certain viscosity under 180 ℃, so as long as can the infiltration resin material less than the size of pore.For this reason, in the present embodiment in order to realize that slit between light channel structure spare main body 101a and the cover plate 10b is less than pore, need to have enough fineness and roughness between light channel structure spare main body 101a and the cover plate 10b, its roughness is less than 1 micron, less than capillarity needed minimum clearance taking place with interface between assurance light channel structure spare 101a and the cover plate 10b, thereby can stop the capillary infiltration of resin.But because the air molecule structure is little, fluidity is big, can be from the discharge at the interface between structural member main body 101a and the cover plate 10b when being heated in inside.
Above-mentioned light channel structure spare 101 whole two parts that are divided into; can also be out of shape to some extent; such as only forming two openings and the two cover plates that covers on two openings such as two ends in light channel structure spare part; perhaps on light channel structure spare, form one or more opening and cover one or polylith cover plate on one or more opening, in this too much limiting protecting scope not.
Owing to follow-uply will carry out lamination, technologies such as spray tin, Reflow Soldering, so light channel structure spare 100 or 101 will adopt high pressure resistant, high temperature resistant, corrosion resistance material.Make such as adopting metal or resin (such as polyimides).
As an execution mode of present embodiment, described light channel structure spare 100 or 101 adopts metal A 1 to make.
As another execution mode of present embodiment, described light channel structure spare 100 or 101 adopts polyimides to make.
Before making light channel structure spare, total external diameter of optical fiber and space transmission range according to the light interconnection, determine the size of light channel structure spare, consider the processing dimension of printed circuit board (PCB) matrix substrate, thickness is to cost, the influence of technology difficulty and take into account the integrated circuit layout and consider, pre-determine the position of light channel structure spare in printed circuit board (PCB), as Fig. 5 is light channel structure spare 100 (perhaps 101, in order to simplify herein and hereinafter only to illustrate 100) layout in printed circuit board (PCB) 400, frame of broken lines 401 is the light access port and the position, optical fiber exit of follow-up formation among Fig. 5, the size of its opening is respectively d1 and d2, and Fig. 6 is along the generalized section of A-A ' direction among Fig. 5.
With reference to Fig. 6, make first stack layer 310 that comprises at least one layer printed circuit board matrix substrate.In the present embodiment, described first stack layer 310 comprises first, second printed circuit board (PCB) matrix substrate 300 and 302.Described first, second printed circuit board (PCB) matrix substrate 300 and 302 is the synthetic material of glass fibre and resin.The first printed circuit board (PCB) matrix substrate 300 be not formed with conductor layer 301 with the superimposed side of the second printed circuit board (PCB) matrix substrate 302, between the first printed circuit board (PCB) matrix substrate 300 and the second printed circuit board (PCB) matrix substrate 302, also be formed with conductor layer 301 simultaneously.Described conductor layer 301 is for to be made of metal Cu.
Simultaneously, in order to prevent short circuit, electric isolation processing will be done in conductor layer 301 and stratum in first stack layer 310 of light channel structure spare, optical fiber access port and position, optical fiber exit, promptly in first stack layer 310 of light channel structure spare, optical fiber access port and position, optical fiber exit all signals layers is comprised that electrical signal layer and optical signalling layer do to forbid that wiring handles.Described isolation processing comprises removes all light channel structures, optical fiber access port and the conductor layer of position, optical fiber exit or the electric conducting material on stratum.
Form at least one opening 303a in first stack layer in 310, the size of described opening 303a is corresponding with described light channel structure spare Outside Dimensions; The position of described opening 303a for placing light channel structure spare adopts the annular broken frame table to show the position in place first stack layer 310 of light channel structure spare among Fig. 6.The degree of depth of described opening 303a can be greater than or less than or equal the insert depth of light channel structure spare.
Before embedding light channel structure spare 100 in first stack layer 310, also comprise the outer surface of light channel structure spare 100 is made alligatoring, cleaning and dried step.
As Fig. 7 for light channel structure spare 100 correspondences being inserted the structural representation in first stack layer 310.
With reference to Fig. 8, on first stack layer 310, pile up second stack layer 311 that formation comprises at least one layer printed circuit board matrix substrate.
In the present embodiment, described second stack layer 311 comprises the 3rd, the 4th printed circuit board (PCB) matrix substrate 303 and 304, and described the 3rd, the 4th printed circuit board (PCB) matrix substrate 303 and 304 is the synthetic material of glass fibre and resin.The 4th printed circuit board (PCB) matrix substrate 304 be not formed with conductor layer 301 with the superimposed side of the 3rd printed circuit board (PCB) matrix substrate 303, between the 3rd printed circuit board (PCB) matrix substrate 303 and the 4th printed circuit board (PCB) matrix substrate 304, also be formed with conductor layer 301 simultaneously.Described conductor layer 301 is for to be made of metal Cu.
Then, form optical fiber access port 305 and the optical fiber exit 306 that is connected with light channel structure spare 100 at second stack layer 311 facing to the end positions of the light channel structure spare 100 in first stack layer 310.For clear diagram, Fig. 9 provides along the structural representation of B-B ' direction among Fig. 8.Form described light channel structure spare 100 for adopting machining process.Described optical fiber access port 305 and optical fiber exit 306 adopt milling technology to carry out milling, and the degree of depth arrives the hollow degree of depth of light channel structure spare 100 at least, and it is connected with light channel structure spare 100.
The bending radius that reaches the optical fiber of light channel structure spare in described optical fiber access port 305 and the optical fiber exit 306 is not less than 3mm, prevent to implant after the optical fiber, because the lateral dimension of optical fiber access port 305 and optical fiber exit 306 is too small and longitudinal size is too small, cause the fibre-optical bending angle excessive and influence the propagation of light signal, serious may fracture fully.
Behind above-mentioned process implementing, form printed circuit board (PCB) 400 of the present invention, as Fig. 8 and shown in Figure 9, described printed circuit board (PCB) 400 comprises: first stack layer 310 that contains at least one layer printed circuit board matrix substrate; Also comprise: lay respectively at least one opening in first stack layer 310, and lay respectively at the interior hollow of opening and the light path structural member 100 of sealing; Be arranged in the optical fiber access port 305 that is connected with light channel structure spare 100 and the optical fiber exit 306 of the end positions formation of the light channel structure spare 100 that faces toward first stack layer 310 respectively on second stack layer.
Present embodiment is by being piled up embedding light channel structure spare in the stack layer that forms by the printed circuit board (PCB) matrix substrate, being used to implant optical fiber interconnects as light, after finishing the printed circuit board (PCB) processing procedure, implant optical fiber, prevented that the printed circuit board (PCB) making technology from exerting an influence to optical fiber property.
The size of the light channel structure spare in the foregoing description 100 only illustrates one, in actual applications, can be of different sizes, and the size of corresponding opening, optical fiber access port and optical fiber exit is to change simultaneously.Above-mentioned light channel structure spare and in stack layer the corresponding opening shape may be out of shape to some extent; such as being horn shape for circle or two ends; and light channel structure spare is not straightline propagation on the optical signal transmission direction, but broken line or crooked the propagation all fall into protection scope of the present invention.Above-mentioned first stack layer 310 and second stack layer 311 can include several layers printed circuit matrix substrate and be formed with the conductor layer that is used to import power supply and electricity transmission between each printed circuit matrix substrate, and two layer printed circuit matrix substrates only draw in the foregoing description.Above-mentioned first opening can be for a plurality of, and corresponding, it is how right that the optical fiber access port of formation and optical fiber exit can have, and should too much not limit protection scope of the present invention at this.Simultaneously, on first stack layer 310, can also form the stack layer that multilayer contains light channel structure spare.Be illustrated with reference to the accompanying drawings.
At first make light channel structure spare 100, as shown in Figure 3, a kind of size only is shown with first size and second size.
With reference to Figure 10, make first stack layer 501, described first stack layer 501 contains at least one layer printed circuit matrix substrate and conductor layer (not shown).Then form at least one and have first opening 505 of first size on first stack layer 501, form described first opening for passing through the precision optical machinery processing method, milling is shaped.The size of described first opening 505 is corresponding with the Outside Dimensions of light channel structure spare to be embedded 100.
With reference to Figure 11, first opening 505 is mid-goes into light channel structure spare 100 having.
Then, form second stack layer 502 on first stack layer 501, described second stack layer 502 contains at least one layer printed circuit matrix substrate and conductor layer (not shown).
Form second opening 506 with at least one second size on second stack layer 502, the size of described second opening 506 is corresponding with the Outside Dimensions of light channel structure spare 100.
At last, with reference to Figure 12, go into light channel structure spare 100 in that second opening 506 is mid-.On second stack layer 501, form the 3rd stack layer 503 then, the position that on the 3rd stack layer 503, faces toward the light channel structure spare 100 in first stack layer 501 and second stack layer 502, form the first optical fiber access port 504a, the first optical fiber exit 504b respectively, the second optical fiber access port 505a, the second optical fiber exit 505b.As shown in figure 13, be the cross-sectional view of Figure 12 along C-C ' direction.C-C ' hatching does not switch to second opening, 506 positions among Figure 12, and in order to show the relativeness between them, also with dashed lines is shown among Figure 13.
Based on above-mentioned technology, form the printed circuit board (PCB) of present embodiment, comprising: first stack layer 501 and second stack layer 502 that contain at least one layer printed circuit board matrix substrate; Also comprise: lay respectively at least one first opening with different size, at least one second opening in first stack layer 501 and second stack layer 502, and lay respectively at the hollow in first opening, second opening and the light path structural member 100 of sealing; Be arranged in the first optical fiber access port 504a that is connected with light channel structure spare 100, the first optical fiber exit 504b that form facing to the end positions of the light channel structure spare 100 of the light channel structure spare 100 of first stack layer 501, second stack layer 502 respectively on the 3rd stack layer 503, the second optical fiber access port 505a, the second optical fiber exit 505b.
The described first optical fiber access port 504a and the first optical fiber exit 504b, the second optical fiber access port 505a and the second optical fiber exit 505b's is that the bending radius of guaranteeing to penetrate and pass the optical fiber of light channel structure spare is not less than 3mm along the lateral dimension of optical fiber direction and along the longitudinal size of vertical fiber direction, prevent follow-up after light channel structure spare is implanted into optical fiber, because the lateral dimension of optical fiber access port 305 and optical fiber exit 306 is too small and longitudinal size is too small, cause the fibre-optical bending angle excessive and influence the propagation of light signal, serious may fracture fully and can not transmission signals.
After forming optical fiber access port and optical fiber exit, also be included in assembling electric component step on the printed circuit board (PCB).
Then, optical fiber is implanted in the light channel structure spare, and the electric light converting member is linked to each other with optical fiber, the electric light converting member is linked to each other with optical fiber in the optical fiber exit at the optical fiber access port.
Figure 14 is for being assembled with the schematic diagram of the printed circuit board (PCB) of electric component and optics on its of one embodiment of the present of invention.Have 12 tunnel optical fiber in the light channel structure spare 100 on the printed circuit board (PCB) 400 among Figure 14 as the light interconnection, connect transmitting terminal and receiving terminal, transmitting terminal is formed with optical fiber access port 401a, transmitting terminal be assembled with electric component E1, E2 ... E12, and with photoelectric conversion part D1, the D2 of its corresponding electrical connection ... D12.Receiving terminal is formed with optical fiber exit 401b, receiving terminal be assembled with electric light converting member D1 ', D2 ' ... D12 ', and with electric component R1, the R2 of its corresponding electrical connection ... R12.Photoelectric conversion part D1, the D2 of transmitting terminal ... D12 in optical fiber access port 401a position by electric light converting member D1 ', the D2 ' of optical fiber and receiving terminal ... D12 ' is connected.
It is simple in structure, compact to adopt technical scheme of the present invention to have, and preferably resolves deficiency and electromagnetic interference (EMI) that message transmission rate reaches Gbps transmission range of printed circuit board (PCB) plain conductor when above, radio frequency interference problems such as (RFI).Compare with the direct wire jumper connection in traditional optical fiber connector surface,, can cooperate the photoelectric device of high-performance, low-power consumption to be implemented in the interior high density interconnect of small space owing to adopted the version of imbedded fiber path.With directly optical fiber being imbedded printed circuit board technology and compare of prior art, prevented of the influence of follow-up formation printed circuit board technology to optical fiber property.
Though oneself discloses the present invention as above with preferred embodiment, the present invention is defined in this.Any those skilled in the art without departing from the spirit and scope of the present invention, all can do various changes and modification, so protection scope of the present invention should be as the criterion with claim institute restricted portion.
Claims (21)
1. the manufacture method of a printed circuit board (PCB) is characterized in that, comprises the steps:
According to the size of optical fiber interconnections, make the hollow of at least a size and the light channel structure spare of sealing, described light channel structure spare is used for built-in fiber;
Making comprises first stack layer of at least one layer printed circuit board matrix substrate;
Form at least one first opening in first stack layer, the size of described first opening is corresponding with light channel structure spare Outside Dimensions to be inserted;
Light channel structure spare correspondence is inserted in first opening in first stack layer;
Piling up second stack layer that formation comprises at least one layer printed circuit board matrix substrate on first stack layer;
Repeat above-mentioned steps, be included in and form at least one second opening on second stack layer, insert light channel structure spare correspondence in all second openings in second stack layer and on second stack layer, form the 3rd stack layer step;
......
Until forming at least one n opening on the n stack layer, light channel structure spare correspondence is inserted in the n opening in the n stack layer and form the n+1 stack layer on the n stack layer, described n is a natural number;
On the n+1 stack layer, face toward first stack layer, second stack layer ... the end positions of the light channel structure spare of n stack layer forms optical fiber access port and the optical fiber exit that is connected with light channel structure spare respectively.
2. the manufacture method of printed circuit board (PCB) according to claim 1, described printed circuit board (PCB) matrix substrate is the synthetic material of glass fibre and resin, the light channel structure spare of described hollow and sealing is ventilative but impermeable resin structure.
3. the manufacture method of printed circuit board (PCB) according to claim 2, described light channel structure spare is made of light channel structure spare main body and cover plate, and the roughness of contact-making surface is less than 1 micron between described light channel structure spare main body and the cover plate.
4. according to the manufacture method of the arbitrary described printed circuit board (PCB) of claim 1 to 3, described light channel structure spare is high pressure resistant, high temperature resistant and the corrosion resistance material.
5. the manufacture method of printed circuit board (PCB) according to claim 4, described light channel structure spare is metal or resin material.
6. according to the manufacture method of the arbitrary described printed circuit board (PCB) of claim 1 to 3, light channel structure spare is inserted in first stack layer, second stack layer ... first opening of n stack layer, second opening ... also comprised before in the n opening outer surface of light channel structure spare is made alligatoring, cleaning and dried step.
7. according to the manufacture method of the arbitrary described printed circuit board (PCB) of claim 1 to 3, described size according to the light interconnection is determined the size of light channel structure spare, comprises the total optical fiber cable footpath and the space transmission range of light interconnection.
8. according to the manufacture method of the arbitrary described printed circuit board (PCB) of claim 1 to 3, described optical fiber access port and optical fiber exit adopt milling technology to form.
9. the manufacture method of printed circuit board (PCB) according to claim 8, in described optical fiber access port and the optical fiber exit and the bending radius of light channel structure spare inner fiber be not less than 3mm.
10. according to the manufacture method of the arbitrary described printed circuit board (PCB) of claim 1 to 3, light channel structure spare is inserted in first stack layer, second stack layer ... first opening of n stack layer, second opening ... also comprised first stack layer, second stack layer before in the n opening ... electric isolation processing step is done on conductor layer and stratum in the n+1 stack layer with light channel structure spare, optical fiber access port and position, optical fiber exit.
11. the manufacture method of printed circuit board (PCB) according to claim 10, described isolation processing comprise the electric conducting material of removing all light channel structure spares, optical fiber access port and optical fiber exit position conductor layer and stratum.
12. the manufacture method of printed circuit board (PCB) according to claim 1 also is included in after forming optical fiber access port and optical fiber exit and assembles electric component, photoelectric conversion part and electric light converting member step on the printed circuit board (PCB).
13. the manufacture method of printed circuit board (PCB) according to claim 1 also comprises optical fiber is implanted in the light channel structure spare.
14. the manufacture method of printed circuit board (PCB) according to claim 13 also is included in the optical fiber access port electric light converting member is linked to each other with optical fiber and the step that photoelectric conversion part linked to each other with optical fiber in the optical fiber exit.
15. a printed circuit board (PCB) comprises:
First stack layer, second stack layer that contain at least one layer printed circuit board matrix substrate ... n+1 stack layer;
It is characterized in that, also comprise:
Lay respectively in first stack layer, second stack layer ... at least one first opening in the n stack layer, second opening ... n opening, and lay respectively at first opening, second opening ... the hollow in the n opening and the light channel structure spare of semitight, described n is a natural number, and described light channel structure spare is relevant with the size of optical fiber interconnections;
Be positioned on the n+1 stack layer respectively facing to first stack layer, second stack layer ... optical fiber access port that is connected with light channel structure spare and optical fiber exit that the end positions of the light channel structure spare in the n stack layer forms.
16. printed circuit board (PCB) according to claim 15, described light channel structure spare is made of light channel structure spare main body and cover plate, and the roughness of contact-making surface is less than 1 micron between described light channel structure spare main body and the cover plate.
17. according to the arbitrary described printed circuit board (PCB) of claim 15 to 16, described light channel structure spare is high pressure resistant, high temperature resistant and the corrosion resistance material.
18. printed circuit board (PCB) according to claim 17, described light channel structure spare is metal or resin material.
19. printed circuit board (PCB) according to claim 15, described light channel structure spare and first stack layer, second stack layer ... conductor layer in the n stack layer and stratum electricity mutually isolate, and first stack layer, second stack layer ... optical fiber access port in the n stack layer and optical fiber exit and first stack layer, second stack layer ... the electricity isolation mutually of conductor layer in the n stack layer and stratum.
20. printed circuit board (PCB) according to claim 15, the bending radius that reaches the optical fiber in the light channel structure spare in described optical fiber access port and the optical fiber exit is not less than 3mm.
21. printed circuit board (PCB) according to claim 15, the size of described optical fiber interconnections comprise the total optical fiber cable footpath and the space transmission range of light interconnection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710171718 CN101453839B (en) | 2007-12-04 | 2007-12-04 | Printed circuit board and making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710171718 CN101453839B (en) | 2007-12-04 | 2007-12-04 | Printed circuit board and making method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101453839A CN101453839A (en) | 2009-06-10 |
| CN101453839B true CN101453839B (en) | 2011-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710171718 Expired - Fee Related CN101453839B (en) | 2007-12-04 | 2007-12-04 | Printed circuit board and making method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101453839B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111666783A (en) * | 2019-03-05 | 2020-09-15 | 印象认知（北京）科技有限公司 | Substrate structure, sensor module, electronic device and mounting method |
| CN211604129U (en) * | 2019-04-15 | 2020-09-29 | 印象认知（北京）科技有限公司 | Sensor module and electronic equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7125176B1 (en) * | 2003-09-30 | 2006-10-24 | Stafford John W | PCB with embedded optical fiber |
| US7136551B2 (en) * | 2004-08-25 | 2006-11-14 | Information and Communication Univerity Research and Industrial Cooperation Group | Optical printed circuit board and optical interconnection block using optical fiber bundle |
-
2007
- 2007-12-04 CN CN 200710171718 patent/CN101453839B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7125176B1 (en) * | 2003-09-30 | 2006-10-24 | Stafford John W | PCB with embedded optical fiber |
| US7136551B2 (en) * | 2004-08-25 | 2006-11-14 | Information and Communication Univerity Research and Industrial Cooperation Group | Optical printed circuit board and optical interconnection block using optical fiber bundle |
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| Publication number | Publication date |
|---|---|
| CN101453839A (en) | 2009-06-10 |
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