CN101402839B - Adhesive for aluminum honeycomb composite board and preparation method thereof - Google Patents
Adhesive for aluminum honeycomb composite board and preparation method thereof Download PDFInfo
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- CN101402839B CN101402839B CN2008102191807A CN200810219180A CN101402839B CN 101402839 B CN101402839 B CN 101402839B CN 2008102191807 A CN2008102191807 A CN 2008102191807A CN 200810219180 A CN200810219180 A CN 200810219180A CN 101402839 B CN101402839 B CN 101402839B
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- 239000002131 composite material Substances 0.000 title claims abstract description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000000853 adhesive Substances 0.000 title abstract description 7
- 230000001070 adhesive effect Effects 0.000 title abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 22
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 8
- 150000001412 amines Chemical class 0.000 claims abstract description 6
- 239000007822 coupling agent Substances 0.000 claims abstract description 6
- -1 phenolic aldehyde Chemical class 0.000 claims abstract description 6
- 230000008719 thickening Effects 0.000 claims abstract description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 14
- 230000001413 cellular effect Effects 0.000 claims description 11
- 238000003756 stirring Methods 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 239000004902 Softening Agent Substances 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000012856 packing Methods 0.000 claims description 4
- 239000010456 wollastonite Substances 0.000 claims description 4
- 229910052882 wollastonite Inorganic materials 0.000 claims description 4
- 229910002012 Aerosil® Inorganic materials 0.000 claims description 3
- 239000005083 Zinc sulfide Substances 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 3
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 239000002253 acid Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 239000003513 alkali Substances 0.000 abstract 1
- 239000003085 diluting agent Substances 0.000 abstract 1
- 229910021485 fumed silica Inorganic materials 0.000 abstract 1
- 239000000049 pigment Substances 0.000 abstract 1
- 239000004014 plasticizer Substances 0.000 abstract 1
- 239000012745 toughening agent Substances 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 description 5
- 229920006335 epoxy glue Polymers 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229920006305 unsaturated polyester Polymers 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 206010021703 Indifference Diseases 0.000 description 1
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 235000019633 pungent taste Nutrition 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000012940 solvent-free polyurethane adhesive Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to an adhesive for an aluminum honeycomb composite board and a preparation method thereof, wherein the adhesive is composed of A, B two components, wherein the weight percentage of the raw materials of the component A comprises 45-55% of epoxy resin, 2-5% of diluent, 30-42% of functional pigment and filler, 1.5-2.5% of KH-560 coupling agent, 6-20% of Qishi toughening agent and 2-3% of thickening anti-settling agent fumed silica; the component B comprises 60-80 wt% of phenolic aldehyde modified amine curing agent, 8-15 wt% of curing accelerator and 10-20 wt% of plasticizer. A. The sum of the weight percentages of the raw materials of the two components B is 100 percent. The adhesive for the aluminum honeycomb composite board is cured at normal temperature, has good acid and alkali resistance, low curing shrinkage rate, no pollution, high bonding strength after curing, high temperature resistance and low price.
Description
Technical field:
The present invention relates to the Chemicals adhesive area, relate in particular to composition boards such as a kind of aluminium honeycomb core and aluminium, glass reinforced plastic, calcium silicate board with microporous and stick with glue agent and preparation method thereof.
Technical background:
In recent years, the application of perforated plate composite structure in aerospace and construction and decoration more and more widely, honeycomb composite plate not only has magnificent outward appearance, and have in light weight, intensity is high, the characteristics of acoustic insulation shock-proof.Therefore being used for the glue of bonding honeycomb core and panel also becomes more and more important; A lot of enterprises come bonding with tackiness agent such as unsaturated polyester, urethane; But a lot of defectives in the compound process, all occur: the unsaturated polyester type tackiness agent is not ageing-resistant, and bonding strength promptly begins to reduce after the some months; And the unsaturated polyester adhesive curing is rapid, and several minutes is promptly accomplished curing, so impregnation and the bad control of gluing, the actually operating difficulty; The unsaturated polyester tackiness agent also contains certain amount of solvent, and solvent evaporates can be brought toxicity and pungency, and solvent evaporates can cause volumetric shrinkage simultaneously, can cause big string stress during cure shrinkage, influences the bonding strength of matrix material.Solvent-free polyurethane adhesive is non-refractory then, and general use temperature is-40 ℃-70 ℃, and resistance to boiling water is poor, and honeycomb planar stretch cohesive strength and stripping strength are all lower, can not be applied to the occasion that bonding strength is had relatively high expectations, and price are higher.Therefore the perforated plate industry is badly in need of a kind of various performance and is all satisfied honeycomb composite demand and the more cheap tackiness agent of price.
Summary of the invention:
The objective of the invention is to overcome the deficiency of above tackiness agent, provide a kind of ambient cure, resistance to acids and bases good, cure shrinkage is low, pollution-free, solidify that the back bonding strength is high, ability comparatively high temps and the lower adhesion agent for aluminum cellular composite board of price.
The present invention for the technical scheme that solves above technical problem and take is: a kind of adhesion agent for aluminum cellular composite board; It is made up of A, the two components of B, and the weight percentage of A component raw material consists of epoxy resin 45-55%, thinner 2-5%, functional color stuffing 30-42%, KH-560 coupling agent 1.5-2.5%, strange scholar's toughner 6-20%, thickening anti-settling agent aerosil 2-3%; The weight percentage of B component raw material consists of phenol aldehyde modified amine curing agent 60-80%, curing catalyst 8-15%, softening agent 10-20%.A, B two components the weight percentage sum of raw material separately are 100%.
Above-mentioned aluminium honeycomb composite plate is used epoxy glue, and the epoxy resin in the said A component is liquid bisphenol A type epoxy resin during for room temperature.
Above-mentioned adhesion agent for aluminum cellular composite board, described liquid bisphenol A type epoxy resin is E-44 epoxy resin, CYD-128 epoxy resin or their mixture.
Above-mentioned adhesion agent for aluminum cellular composite board, the functional color stuffing in the said A component is the mixture of drying-type silica powder, talcum powder, needle shape wollastonite powder, zinc sulfide white.
Above-mentioned adhesion agent for aluminum cellular composite board; Toughner in the said A component is strange scholar's toughner; It can dissolve each other with bisphenol A type epoxy resin, and can make cured article form the epoxy alloy with " island structure ", thereby several times improve fracture toughness property and bonding strength.
The preparation method of tackiness agent is:
The preparation of A component: the toughner that will account for coupling agent, the 6-20% of reactive thinner, the 1.5-2.5% of bisphenol A type epoxy resin, the 2-5% of weight part 45-55% earlier adds in the high speed dispersor and stirs; The functional color stuffing that adds 30-42% again; Dispersed with stirring is even, and the thickening material that adds 2-3% is at last regulated viscosity, carries out vacuum defoamation after material all stirs and handles; Discharging, packing promptly gets A component finished product;
The preparation of B component: will account for the solidifying agent of weight part 60-80%, the curing catalyst of 8-15%, the softening agent of 10-20% adds in the stirrer respectively and stirs, filters, and discharging, packing promptly gets B component finished product.
Adhesion agent for aluminum cellular composite board of the present invention; In the A component, added strange scholar's toughner QS-BC; It is the malleableize properties-correcting agent that is exclusively used in epoxy resin and phenol aldehyde modified amine system, and it can dissolve each other with epoxy resin, and in solidification process, can form the epoxy alloy with " island structure "; Thereby several times improve fracture toughness property, increase substantially bonding strength.Simultaneously,, introduce benzene ring structure in the molecule, improved the resistance toheat of cured article because of solidifying agent is phenol aldehyde modified amine.Common toughner can reduce the thermotolerance of cured article, and the adding of QS-BC can keep the cured article higher heat resistance, makes it in-40 ℃～140 ℃ scopes, to use.Therefore compare with common epoxy glue, the bonding strength of aluminium honeycomb composite epoxy glue of the present invention improves, and resistance toheat improves.Simultaneously; Functional color stuffing such as needle shape wollastonite powder, platy talc are mixed use with the granular quartz powder; And particle diameter is different; Can realize the most closely piling up between particle, the performance of each filler grain can be complementary, thereby play thermal stresses and the effect of volumetric shrinkage in enhancings, toughness reinforcing, the reduction curable adhesive layer process.Compare with liquid nbr carboxyl terminal toughening modifying epoxy glue; The preparation technology of the composite epoxy glue among the present invention is simple, and toughner and epoxy resin can any mixed, and do not need and the epoxy resin pre-reaction; Shortened the process time; Simultaneously, have big cost advantage because cost of material is cheap, and its honeycomb planar stretch bonding strength and stripping strength indifference almost.
Below in conjunction with embodiment the present invention is described further:
Embodiment:
In high speed dispersor by weight adding 26% E-44 epoxy resin, 26% CYD-128 epoxy resin, 3% reactive thinner, 2% KH560 coupling agent, strange scholar's toughner of 8%; Stirred 10 minutes; Add 24% silica powder, 5% needle shape wollastonite powder, 2.5% talcum powder, 1.5% zinc sulfide white again; Dispersed with stirring 30 minutes adds 2% aerosil, the even final vacuum deaeration of dispersed with stirring 20 minutes at last.Filter discharging and promptly get 100 parts of A components.
In reaction kettle, add 75% modified phenolic amine hardener, 10% amine curing catalyst, 15% softening agent, stirred 30 minutes, filter discharging and promptly get 100 parts of B components.
Aluminium honeycomb composite adhesive of the present invention in use, by weight with 5 parts of A components, the B component weighs up for 1 part; Mix, blade coating or roller coating on the bonding panel assemble honeycomb in treating; Exert pressure, be about to treat that bonding panel and honeycomb core bond together securely after the composite gum reaction is solidified.
Claims (4)
1. adhesion agent for aluminum cellular composite board; Constitute by A, B two components; It is characterized in that: the weight percentage of A component raw material consists of epoxy resin 45-55%, thinner 2-5%, functional color stuffing 30-42%, KH-560 coupling agent 1.5-2.5%, strange scholar's toughner 6-20%, thickening anti-settling agent aerosil 2-3%, and wherein functional color stuffing is the mixture of drying-type silica powder, talcum powder, needle shape wollastonite powder, zinc sulfide white; The weight percentage of B component raw material consists of phenol aldehyde modified amine curing agent 60-80%, curing catalyst 8-15%, softening agent 10-20%, and A, B two components the weight percentage sum of raw material separately are 100%.
2. adhesion agent for aluminum cellular composite board according to claim 1 is characterized in that: the epoxy resin in the said A component is liquid bisphenol A type epoxy resin during for room temperature.
3. adhesion agent for aluminum cellular composite board according to claim 2 is characterized in that: described liquid bisphenol A type epoxy resin is E-44 epoxy resin, CYD-128 epoxy resin or their mixture.
4. the preparation method of the said adhesion agent for aluminum cellular composite board of claim 1 is characterized in that:
The preparation of A component: the toughner that will account for coupling agent, the 6-20% of reactive thinner, the 1.5-2.5% of bisphenol A type epoxy resin, the 2-5% of weight part 45-55% earlier adds in the high speed dispersor and stirs; The functional color stuffing that adds 30-42% again; Dispersed with stirring is even, and the thickening material that adds 2-3% is at last regulated viscosity, carries out vacuum defoamation after material all stirs and handles; Discharging, packing promptly gets A component finished product;
The preparation of B component: will account for the solidifying agent of weight part 60-80%, the curing catalyst of 8-15%, the softening agent of 10-20% adds in the stirrer respectively and stirs, filters, and discharging, packing promptly gets B component finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102191807A CN101402839B (en) | 2008-11-18 | 2008-11-18 | Adhesive for aluminum honeycomb composite board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102191807A CN101402839B (en) | 2008-11-18 | 2008-11-18 | Adhesive for aluminum honeycomb composite board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101402839A CN101402839A (en) | 2009-04-08 |
| CN101402839B true CN101402839B (en) | 2012-05-09 |
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| CN2008102191807A Active CN101402839B (en) | 2008-11-18 | 2008-11-18 | Adhesive for aluminum honeycomb composite board and preparation method thereof |
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| CN102070994A (en) * | 2010-11-25 | 2011-05-25 | 武汉理工大学 | Semisolid-state reaction-type epoxy adhesive |
| CN102093671B (en) * | 2010-12-30 | 2012-12-26 | 株洲南车时代电气股份有限公司 | Epoxy resin composite and pouring method thereof |
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| CN104387728A (en) * | 2014-11-21 | 2015-03-04 | 芜湖市宝艺游乐科技设备有限公司 | A kind of wollastonite powder modified epoxy resin composite material and its preparation method |
| CN104845041A (en) * | 2015-01-14 | 2015-08-19 | 无锡龙舜实业有限公司 | G-20 type epoxy casting agent |
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| CN107502255A (en) * | 2017-08-25 | 2017-12-22 | 佛山市壹诺板材科技有限公司 | A kind of aluminium honeycomb composite plate epoxy adhesive and its preparation method and application method |
| CN109555283A (en) * | 2019-01-14 | 2019-04-02 | 杨永峰 | A kind of cladding composite board and its preparation method and application |
| CN111471422A (en) * | 2020-04-24 | 2020-07-31 | 淮阴工学院 | A kind of highly elastic anti-aging waterproof glue and preparation system and preparation method thereof |
| CN111909644A (en) * | 2020-07-21 | 2020-11-10 | 上海康达化工新材料集团股份有限公司 | Epoxy composition for bonding honeycomb sandwich structure |
| CN112358838A (en) * | 2020-11-16 | 2021-02-12 | 三友（天津）高分子技术有限公司 | Two-component epoxy structural adhesive |
| CN112852367B (en) * | 2021-03-08 | 2023-05-12 | 广西珀源新材料有限公司 | Double-component silicon rod splicing adhesive and preparation method thereof |
| CN113956613A (en) * | 2021-10-20 | 2022-01-21 | 贵州省材料产业技术研究院 | High-toughness antistatic epoxy resin foam material and preparation method thereof |
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Effective date of registration: 20201106 Address after: 510700 No.22, Pubei Road, YUNPU Industrial Zone, Huangpu District, Guangzhou City, Guangdong Province Patentee after: GUANGZHOU LUSHAN NEW MATERIALS Co.,Ltd. Patentee after: Jiangsu Lushan New Material Co.,Ltd. Address before: 303, room 2, building 22, 510530 Pu Po Road North, Guangzhou, Whampoa, Guangdong Patentee before: GUANGZHOU LUSHAN NEW MATERIALS Co.,Ltd. |